IPC WorksAsia Vietnam 2024

Date

Aug 7, 2024 | 9:00am - 4:00pm +07 (Aug 6, 2024 | 9:00pm - Aug 7, 2024 | 4:00am CDT)

IPC WorksAsia – Quality & High Reliability Conference Viet Nam

Get practical methodologies that can be deployed today to enhance your operations

Quality & High Reliability are critical when electronics assemblies are working in harsh environments where there is high temperature difference, vibration; and components get smaller and demand for high reliability products increases. IPC has brought together an international panel of experts for this inaugural conference in the heart of Southeast Asia to discuss:

Critical areas of the assembly process and
How design and materials choices will affect cost, reliability and turnaround time.

These important one-day events will focus on advanced research results, practical methodologies and standards in the automotive, industrial and other electronic fields — critical information for engineers and managers responsible for reliability.

Date: August 7th, 2024
Time: 8:30 – 16:30
Venue: Ballroom 2 – 3
Place: Eastin Grand Hotel Saigon - 253 Nguyen Van Troi St., Ho Chi Minh, Vietnam

For more information, please contact: Henry Ton, HenryTon@ipc.org

Conference Agenda

8:15 – 9:00 Registration & Morning’s snack with Coffee/ Tea
9:10 – 9:30 Welcome Activity & Opening Speech
Mr. Raymond Foo – Director, IPC Southeast Asia
9:30 – 10:15 Breakthrough Cleaning Challenge For Advanced Packaging
  Mr. Tan Lip Sin - Application Manager, Zestron South Asia
10:15 – 11:00 The Trend to Low Temperature Solder (LTS) Assembly and the Development Strategy for Tin-Bismuth based High Reliability LTS solder
  Mr. Takatoshi Nishimura - Technical Manager, Nihon Superior Co., Ltd.
11:25 – 12:10 Optimizing Under-Stencil Fluid Delivery Settings for Superior SMT Printing Results
  Mr. TC Loy, B.Eng. - Regional Manager of North Malaysia, Kyzen Corporation
12:15 – 13:15 Networking Buffet Luncheon
13:20 – 14:05 Testing and Calibration Technology to Improve Manufacturing Quality
  Mr. Nam Nguyen - Sales Application Manager, Fluke Corporation
14:30 – 15:10 Reliability of Automotive Electronics: How IPC Standards Help the Industry
  Mr. David W. Bergman - VP Standards & Technology/ Executive Director WHMA, IPC
15:10 – 15:25 Coffee & Tea Break
15:25 – 16:15 IPC Standards & Training Program – Updates & Case Studies
Mr. Phuong Dang Ho - Master IPC Trainer, IPC Southeast Asia
16:15 – 16:25 Conclusion & Group photo
16:25 – 16:50 Networking Session/ Demonstration

IPC reserves the right to select participants and final explanation.
Guest speakers and topics content are subject to change without notice.
The program is conducted in English, without interpretation.

Conference Presenters

	Mr. Tan Lip Sin Application Manager of Zestron South Asia Tan Lip Sin has his professional interests focused on high precision cleaning, plasma etching, wet chemical etching in the Wafer Fabrication and Semiconductor Industry. He is an active member of the SMTA and has been with ZESTRON since Year 2020. Mr. Tan received his Bachelor’s Degree in Chemistry from the University of Science Malaysia.
	Mr. Takatoshi Nishimura Technical Manager, Nihon Superior Co., Ltd, Osaka, Japan Takatoshi Nishimura has been working in Nihon Superior since 2012. He is a technical manager and engaging to solve the customer’s soldering technical issues in assembly service. Recently the speaker has also been actively involved and directed the low temperature soldering material and process development.
	Mr. TC Loy, B.Eng. Regional Manager for North Malaysia, Kyzen Corporation Loy graduated with honors from Liverpool John Moore’s University in Electronics Engineering and has 19 years of experience in the Electronics and Semiconductor Assembly Industry. He is based in Penang and supports Electronics and Semiconductor manufacturers in Northern Malaysia in developing and maintaining cleaning processes.
	Mr. Nam Nguyen Sales Application Manager, Fluke Corporation Nam is well-versed in industrial process maintenance and calibration. He has consulted maintenance, instrumentation & control teams across the regions since 2012. His recent interest in calibration technology led him to further exploration in process and pressure calibration. Customer’s success motivates him to finding new solutions for new challenges.
	Mr. David Bergman Vice President of Standards and Technology - IPC/ Executive Director WHMA David W. Bergman is Vice President of Standards and Technology for IPC and has been with the organization for over 40 years and is currently responsible for IPC’s Global Standardization Program, Standards Validation and IPC’s trade shows in USA. David also serves as Executive Director of the Wiring Harness Manufacturer’s Association (WHMA) an IPC council of IPC.
	Mr. Phuong Dang Ho Master IPC Trainer, IPC Southeast Asia Over 19 years working experience in process engineering, new product development, engineering consultancy and training. Extensive knowledge of electronics industry such as SMT technology, through hole technology, conformal coating, clean room, ESD control, MSD control, component identification, manual soldering, 5S, and IPC Standards. Mr. HO has been conducting IPC Training for more than 13 years.

Gold Sponsors

Supporting Association

IPC CEMAC 2024

Date

Oct 24, 2024 | 8:30am - Oct 25, 2024 | 8:30pm CST (Oct 23, 2024 | 7:30pm - Oct 25, 2024 | 7:30am CDT)

IPC CEMAC 2024

IPC CEMAC（China Electronics Manufacturing Annual Conference）, as an exclusive annual event for members in the electronics manufacturing industry, aims to promote industry development and cooperation, facilitate the application and promotion of quality and technical standards in China's electronics manufacturing, and establish an efficient, professional, and high-value international exchange platform centered around IPC international industry standards.

To promote international exchange and cooperation in the field of electronics manufacturing and explore new paths for technological innovation and industrial transformation, IPC CEMAC 2024, with the theme "Make Your Imagination Reality," encourages participants to discuss how to transform limitless creativity into actual products and technologies using digital information technology tools, inspire more innovative thinking and practice, and promote the healthy and sustainable development and technological advancement of the electronics industry.

Event Information:

Event Name: 2024 IPC CEMAC
Event Date: October 24-25, 2024
Event Venue: Crowne Plaza Shanghai Jinxiu - 2nd Floor (399 Jinzun Road, Pudong New Area, Shanghai, China)
Event Website: www.ipccemac.org
Registration Link: https://go.ipc.org.cn/cemac2024

Event Highlights:

Technical Conference: Covering innovative technologies and trends in the industry, leading the future development direction, sparking thoughts and inspiration among attendees, and witnessing industry innovation and collaboration.
Committee Meetings: Deepen understanding of international standards, resolve technical difficulties, and cover key standard technologies in the electronics manufacturing field. Build a platform for professional knowledge exchange, advocating for cooperation between schools and enterprises, as well as inter-company collaboration, to accelerate the innovation of new productivity in the electronics manufacturing industry.
Special Events: A banquet will be held to entertain partners and committee members, with recognition of outstanding members and individuals who have made significant contributions to the industry.

Schedule Overview:

Technical Conference:

Opening Ceremony
Thursday | October 24 | 09:00-09:10 | Jinxiu Hall
Keynote Speech
Thursday | October 24 | 09:10-12:00 | Jinxiu Hall
Project Inauguration Ceremony
Thursday | October 24 | 11:30-12:00 | Jinxiu Hall
E-Mobility Forum
Thursday | October 24 | 13:30-16:50 | Jinxiu Hall A
ESG Forum
Thursday | October 24 | 13:30-16:50 | Jinxiu Hall B
Advanced Packaging Forum
Friday | October 25 | 09:00-11:50 | Jinxiu Hall A
Design Forum
Friday | October 25 | 09:00-11:50 | Jinxiu Hall B
IC Substrate and PCB Forum
Friday | October 25 | 13:30-16:50 | Jinxiu Hall A
Factory of the Future Forum
Friday | October 25 | 13:30-16:50 0 | Jinxiu Hall B

Committee Meetings:

Joint Meeting on Rail Transportation Addendum Standards of 620F & 620FR
Thursday | October 24 | 13:30-15:00 | Huagui Hall
Task Group Meeting on IPC-9541 SiP Acceptability Standards
Thursday | October 24 | 15:20-16:50 | Huagui Hall
Task Group Meeting on IPC-CFX-2591 Connected Factory Exchange(CFX)
Friday | October 25 | 09:00-10:00 | Huagui Hall
Task Group Meeting on IPC-6931 Requirements and Acceptance of Optical Module Printed Circuit Board
Friday | October 25 | 10:20-11:50 | Huagui Hall
Task Group Meeting on IPC/DAC-2552 General Electronic Components Model Based Definition (MBD) Standard
Friday | October 25 | 13:30-15:00 | Huagui Hall
Task Group Meeting on IGBT
Friday | October 25 | 15:20-16:50 | Huagui Hall
Task Group Meeting on IPC-9111 Troubleshooting for Printed Board Assembly Processes
Friday | October 25 | 13:30-15:00 | Huagui Hall
Task Group Meeting on IPC-1401 ESG Management System Standard
Friday | October 25 | 15:20-16:50 | Huagui Hall
IPC AESC Asia Education Steering Committee
Thursday | October 24 | 13:30-15:00 | Huamei Hall
IPC ASSC Asia Standards Steering Committee
Thursday | October 24 | 15:20-16:50 | Huamei Hall
IPC CAEC China Automotive Electronics Committee
Friday | October 25 | 09:00-10:00 | Huamei Hall
IPC CISMC China Intelligent Manufacturing Steering Committee
Friday | October 25 | 10:20-11:50 | Huamei Hall

Special Events:

Friendship Luncheon
Thursday | October 24 | 12:00-13:30
CIT Club
Friday | October 25 | 10:00-12:00 | Huafei Hall
Committee Reception
Friday | October 25 | 17:00-18:00 | Huafei Hall
IPC Asia Member Appreciation and Awards Dinner
Friday | October 25 | 18:00-20:15 | Jinxiu Hall

Note: The schedule is for reference only.

Sponsor List:

Premium Sponsors:

Quick Intelligent Equipment Co., Ltd.

Vayo (Shanghai) Technology Co., Ltd.

Indium Corporation (Suzhou) Co., Ltd.

Taiyo Ink (Suzhou) Co., Ltd.

ZESTRON North Asia Branch

Zhangdong Business Consulting Co., Ltd

Shanghai Lan Zuo Electronic Technology Co., Ltd.

Delta Electronics, Inc.

Supporting Sponsors:

Meixin Testing Technology Co., Ltd

Shenzhen SAM Electronic Equipment Co., Ltd.

Dongguan Weitai Electronics Co., Ltd.

Xiamen Jissyu Solder Co., Ltd.

TSUTSUMI

SUNSDA TECHNOLOGY CO., LTD.

Guangzhou GRG Metrology & Test Co., Ltd.

Reliability Assessment Solutions (Changzhou) Co., LTD.

JBC Soldering Tools (Shanghai) Co., Ltd.

Japan Unix Co., Ltd.

KNIPEX

For sponsorship inquiries, please contact: MarketingChina@ipc.org.

IPC APEX EXPO 2024 Offers More than 100 Technical Sessions in Electronics Manufacturing

Jan 23, 2024

The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO 2024, features cutting-edge technical content directly influencing the $2 trillion global electronics manufacturing industry. Attendees will have more than 100 opportunities to update their technical knowledge during sessions at IPC APEX EXPO 2024 from April 6-11, 2024, in Anaheim, Calif.

“Our technical conference and professional educational program feature the highest quality technical content from technical experts representing three continents,” said Julia Gumminger, IPC manager, professional development and events. “Industry experts representing global enterprises and small companies will present novel, unpublished data and share their innovations in a wide range of fundamental and emerging topics.”

Unique to 2024, IPC APEX EXPO will host the Electronic Circuits World Convention (ECW16) Technical Conference, an expanded, global technical symposium featuring more than 70 presentations over nine technical tracks: PCB Fabrication and Materials; Design; Assembly Process and Materials; HDI uHDI and Substrates; Sustainability for Electronics; High Reliability; Factory of the Future; Emerging Technologies; and Quality, Reliability, Test and Inspection.

Authors from around the globe will present their new, unpublished results, to share developments and innovations in materials, techniques, processes across the spectrum of the electronics manufacturing supply chain. Two special technical sessions will feature invited speakers on advanced packaging and e-mobility and EV automotive. The technical conference will be held April 9-11.

IPC APEX EXPO 2024 will provide more than 30 professional development course sessions delivered by technical experts, corporate technologists, and peer leaders in the industry. The professional development courses, covering such topics as artificial intelligence, PWB design engineering, 3-D printing, Li-ion battery technology, and proactive design methods for approaching zero-field failures, will provide attendees the opportunity to build their professional and technical skills and increase their knowledge in techniques, materials, and trends in all aspects of the industry. Professional development courses will be held April 7-8, and April 11.

More information about IPC APEX EXPO 2024, including details on educational opportunities networking, schedule, travel and more is available at www.IPCAPEXEXPO.org.

Electronics Industry Welcomes Pentagon’s New National Defense Industrial Strategy

Jan 12, 2024

The following is a statement by Richard Cappetto, Senior Director, North American Government Relations at IPC, on the release of the National Defense Industrial Strategy (NDIS) yesterday by the U.S. Department of Defense. A fuller statement is in this IPC Blog.

“IPC is encouraged to see that the NDIS highlights several key priorities which we have been urging in recent years on behalf of the electronics industry. For example, the first pillar of the strategy sets forth eight actions to build resilient supply chains, including “continue and expand support for domestic production.” IPC believes all nations must ensure trusted, secure supply chains for essential electronics products.

“The second pillar of the strategy correctly identifies building a skilled workforce as a priority for a strong industrial base. Consistent with IPC’s policy agenda, the strategy calls for investments in upskilling and reskilling programs, better workforce pipelines into advanced manufacturing, and expansions of apprenticeship programs.”

Pentagon Releases First-Ever U.S. National Defense Industrial Strategy

Jan 11, 2024

by Richard Cappetto, senior director, North American government relations

This afternoon the U.S. Department of Defense (DOD) released a long anticipated National Defense Industrial Strategy (NDIS). This is the first such formal strategy ever published by the DOD, detailing a vision that will guide future engagement, policy development, and investments in the industrial base over the next five years. The strategy is built around the “four pillars” of Resilient Supply Chains, Workforce Readiness, Flexible Acquisition, and Economic Deterrence.

IPC is encouraged to see that the NDIS highlights several key priorities which we have been urging in recent years on behalf of the electronics industry. For example, the first pillar of the strategy sets forth eight actions to build resilient supply chains, including “continue and expand support for domestic production.” IPC believes all nations must ensure trusted, secure supply chains for essential electronics products.

The second pillar of the strategy correctly identifies building a skilled workforce as a priority for a strong industrial base. The need is heightened because of the national goals set out in the CHIPS and Science Act, which has spillover effects on electronics manufacturing. Consistent with IPC’s policy agenda, the strategy calls for investments in upskilling and reskilling programs, better workforce pipelines into advanced manufacturing, and expansions of apprenticeship programs.

The strategy does not offer any sector-specific recommendations, but in a presentation today at the Center for Strategic and International Studies (CSIS) in Washington, Assistant Secretary of Defense for the Industrial Base Policy Dr. Laura D. Taylor-Kale promised there will be follow-on implementation documents over the next few months.

Taylor-Kale also made clear how important it was for DOD to hear from industry. The four strategic priorities were developed by asking, “What is it that we have heard from industry, as well as seen ourselves through our data, through our research, and through constant conversation and dialogue with industry and with our stakeholders both domestically and international?”

IPC will continue to make the case for the U.S. government to take a “silicon to systems” approach to building up the electronics supply chain and the workforce. A healthy electronics ecosystem includes advanced packaging, IC substrates, printed circuit boards (PCBs), and electronics assembly. Assistant Secretary Taylor-Kale in her remarks today acknowledged “the need for the department to incentivize industry, and to send demand signals.” IPC agrees, and that is exactly what we’ve been communicating to Members of Congress and the Executive Branch.

It will take persistent advocacy to break through and succeed over time. IPC has been bringing the message to policy makers for years, and we will continue to do so as the focus turns more in our direction. In the words of Assistant Secretary Taylor-Kale, “We can’t afford to wait. We have seen over the last few years the importance of why we need resilient supply chains ... The importance not just to us domestically, but also for our close allies and partners. We think the time for action is now.”

IPC at CES: Reinforcing our Industry’s Commitment to Sustainability

Jan 11, 2024

by John Mitchell, IPC president and CEO

CES 2024 truly showcases the best of electronics innovation for today and tomorrow. It’s exciting to be here. One of my biggest takeaways from today is how absolutely essential it is for the electronics industry to reinforce our commitment to sustainability – sustainability for smart cities and homes, vehicle technology, fitness and wearables.

As President of IPC, I meet with electronics companies from around the world. More than ever, I hear about a clear need for more standards, education, and advocacy support to ensure sustainability in the design of and materials sourcing for these innovative technologies.

However, we need to develop stronger mechanisms for uniform information collection and sharing about the energy, water, and materials needed across the electronics life cycle to make better design and to make sure innovative technologies are also less impactful. Accessing this information is complicated by business sensitive information and transparency challenges. I’d love to see technology help to address this data challenge and open up possibilities for better insights and better decisions that enable the industry to build electronics better.

Opportunities for innovation like we see at CES must include sustainability considerations including how we can access information that helps us all to be more efficient in how we select and use our resources including chemicals, materials, water and energy.

The electronics industry is keenly aware of the opportunity we have to find real sustainability solutions including improved energy efficiency, responsible recycling, and sustainable materials management. I am excited to continue our work at IPC and help our global members work together and meet these important goals.

IPC at CES: e-Mobility’s Road to Reliability

Jan 10, 2024

by John Mitchell, IPC president and CEO

As CES kicks-off the new year in Las Vegas, the world looks forward to learning about the latest breakthrough electronic technologies that will shape our future.

One area that has captured considerable interest in recent years at CES is e-Mobility. There will be more than 250 exhibitors in the mobility category, including Mercedes, VinFast, BMW, Honda, Kia, and Volkswagen. Also, present are EVs, autonomous cars, and personal-transport vehicles. Updates are planned on the OEM push for “software defined vehicles” including the incorporation of AI chatbots inside the car.

The automotive industry is undergoing tremendous transformational changes driven by electrification. For example:

Electronics will comprise approximately 55% of an EV bill of materials (BOM) cost up from 16% for an ICE 4-wheel vehicle. ¹
Engines are being replaced by battery packs. The battery pack is monitored and controlled by the addition of a battery management system (BMS).
The transmission is being replaced by motor and controller. Inverters and converters are being used to regulate voltage to the motor and for charging.
Cameras, radar, and lidar are being used to sense inside and outside of the vehicle and serve as advanced driver assistance systems (ADAS).
Wireless technologies are used to connect certain systems and reduce wiring.
New display and multimedia technologies are being added to enhance the ability of the driver to interface with the growing number of applications.

These transformational systems being showcased at CES truly are mesmerizing—so much so that it is often easy to overlook the incredible innovation in electronics manufacturing that makes these systems possible. Behind the name brands are thousands of manufacturers that are testing the limits of the possible to build the electronics of tomorrow.

This electronics manufacturing ecosystem is especially important in the automotive industry with a shift in requirements and reliability challenges due to electrification including “24/7 always-on” operating conditions, higher operating temperatures, the need for controlling temperature regimes, as well as higher voltages, and higher currents. The technology adoption is occurring at a rapid pace. But oversight is required to ensure the new electronic components maintain the expected high level of quality and reliability associated with Automotive.

While these issues will likely take second fiddle at CES, they are a focus of IPC APEX EXPO this spring. Electronics design and manufacturing standards, created to enhance quality and reliability, is where IPC has served its members well for decades and will continue with the Automotive transformation to EVs. Electric and autonomous vehicles depend on various connectors, interconnects, and PCB assemblies for power transmission, data communication, and signal integrity. Maintaining reliable connections by addressing issues such as corrosion, wear, and vibration-induced failures is essential for overall e-Mobility system reliability.

IPC’s e-Mobility Initiative tackles these issues by collaborating with industry experts to identify best practices and solutions to advance Automotive’s quality and safety.

The core objectives of IPC’s e-Mobility Initiative include:

Assure strong design, materials, and process optimization and qualification solutions
Achieve reliability and quality while advancing innovation
Remain current with technological changes
Prevent future field failures

So, marvel at the automotive technologies at CES and prepare to roll up your sleeves at IPC APEX EXPO. As exciting as recent advancements in automotive are, I’m convinced that the most exciting developments are still ahead!

1 “Technology at the Forefront of Electric Vehicles,” Report by KPMG, April 2023, p.14

IPC to Host 3rd Annual Integrated Electronics Manufacturing & Interconnections (IEMI) Events in South Asia

Global electronics industry to gather in Penang, Malaysia on July 24-25 and Bangalore, India on July 29-30, 2024

Jan 9, 2024

IPC India will host the third annual Integrated Electronics Manufacturing & Interconnections (IEMI), the largest industry networking event in South Asia for the electronics industry, to be held in Penang, Malaysia, and Bangalore, India.

Malaysia is India’s third largest trading partner in the Association of Southeast Asian Nations (ASEAN), and India is the largest trading partner for Malaysia in South Asia. The bilateral trade between India and Malaysia in 2023 reached 20 billion dollars and is expected to increase to 25 billion dollars in the next three years. Malaysia hosts the second-largest Indian community in the world. There is growing engagement in all aspects of the bilateral relationship and IPC sees semiconductor and electronics manufacturing as key areas for potential collaboration.

IEMI events are focused on bringing together players in the electronics industry – OEMs, EMS, PCB manufacturers, cable and wire harness manufacturers, advanced packaging and semiconductor companies, and electronics industry suppliers. Vertical market OEMs from aerospace, defense, automotive, medical, industrial automation, railways and telecom will participate in the event. IEMI offers strategic alliances, export leads, business partnerships, investment promotion, source products and services, and an opportunity to gain technical knowledge. Pre-event activities start in January 2024 at various locations in India and other countries.

Key features of the IEMI events include product displays, presentations by industry leaders, panel discussions, a vendor development program, business matchmaking meetings with international delegates, standards development sessions, awards program, hand soldering competitions, and a world wire harness competition.

As the biggest industry networking event in South Asia for the electronics industry, IEMI 2024 is expected to significantly contribute to the sector's progress with themes like “advanced packaging of semiconductors” for IEMI 2024 Penang, Malaysia and “defence and aerospace” for IEMI 2024, Bangalore, India. The Penang event is organized in conjunction with Electronics Manufacturing Expo Asia – the largest electronics show in Malaysia attracting more than 8,000 visitors.

“IPC has participated in the India and Malaysia electronics manufacturing market for many years, and we have observed significant certification growth recently,” said John Mitchell, IPC president and CEO. “India and Malaysia are dynamic markets for the global electronics manufacturing industry, and IEMI 2024 provides opportunities for members to expand their business and supply chain.”

“IEMI 2023 events in India achieved great positive feedback from the industry. We hosted more than 1,000 attendees from more than 10 countries, 200 business-to-business meetings, and 10 additional educational/networking activities. The success of IEMI events lies with the audience profile, eminent industry speakers, sponsors and exhibitors and we are committed to the growth of IEMI 2024,” said Gaurab Majumdar, executive director of IPC’s regional office in India.

For more information on Integrated Electronics Manufacturing & Interconnections (IEMI), visit www.ipc.org/ipc-india-iemi or contact Gaurab Majumdar at GaurabMajumdar@ipc.org.

TTM Technologies, Inc. Earns IPC-1791 QML as a Trusted Electronic Designer, Fabricator and Assembler for 13th Site

Jan 5, 2024

IPC's Validation Services Program has awarded an IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements Qualified Manufacturers Listing (QML) to TTM Technologies, Inc.’s San Diego, Calif. facility. TTM, a global provider of printed circuit boards, has now earned a QML listing for 13 of its North American facilities.

Requirements for QML listing to IPC-1791 include product and quality system, supply chain risk management system (SCRM), a security system including compliance to NIST SP 800-171, Export Control Laws (ITAR and EAR), and a chain of custody system (ChoC) review.

Phil Titterton, COO of TTM Technologies, stated, “We are proud to participate in the IPC-1791 trusted standard qualification program inclusive of our design, PCB fabrication and assembly operations. We are equally proud of our 13 facilities achieving this rigorous validation in support of the U.S. DoD and our customer’s requirements and needs. A secure and trusted electronics supply base in North America is vital to national security.”

IPC's Validation Services QPL/QML Programs were developed to promote supply chain verification and recognition. It also provides auditing and qualification of electronics companies' products and identifies processes that conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes following IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize TTM Technologies, Inc.’s significant achievement of earning a QML for 13 of its North American facilities, ensuring a place on the list of IPC's network of trusted QML suppliers."

TTM’s facility locations that have earned an IPC-1791 QML:

Fabrication	Design	Assembly
TTM Technologies Inc. Anaheim, Calif.	TTM Technologies Inc. East Syracuse, N.Y.	TTM Technologies Inc. Denver East, Littleton, Colo.
TTM Technologies Inc. Chippewa Falls, Wis.	TTM Technologies Inc. Stafford Springs, Conn.	TTM Technologies Inc. East Syracuse, N.Y.
TTM Technologies Inc. Denver East, Littleton, Colo.		TTM Technologies Inc. Santa Clara, Calif.
TTM Technologies Inc. Forest Grove, Ore.		TTM Technologies Inc. Stafford Springs, Conn.
TTM Technologies Inc. Logan, Utah
TTM Technologies Inc. North Jackson, Ohio.
TTM Technologies Inc. San Diego, Calif.
TTM Technologies Inc. Santa Ana, Calif.
TTM Technologies Inc. Santa Clara, CA.
TTM Technologies Inc. Stafford Springs, CT.
TTM Technologies Inc. Sterling, VA.

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.

PCB Designers to Vie for Design Champion Title at IPC APEX EXPO 2024

Registration now open for virtual preliminary heat

Jan 4, 2024

For the third consecutive year, IPC is hosting an IPC Design Competition, inviting printed circuit board designers to compete to become the IPC Design Champion of 2024. The IPC Design Competition is composed of two heats – a virtual preliminary heat and an in-person layout final for the three top competitors on April 9, 2024, at IPC APEX EXPO in Anaheim, Calif.

The virtual preliminary heat will be held January 15 to February 9, allowing designers to use their preferred tools to complete a full board buildup within 25 days. Provided with only a schematic, a component BOM (bill of materials) and a use-case brief, competitors will be responsible for completing the board and exporting a documentation package via Gerber or IPC-2581, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology. Competitors will be judged on their implementation of design rules and layout per IPC standards as well as general implementation of design for excellent (DFX) principles.

“This year, we have placed emphasis on making the design easier to complete in the time allotted. The preliminary designs should take no longer than 10-12 hours for the average designer to complete,” said Patrick Crawford, manager, design standards and related industry programs. “Anyone with an interest in board design can register, but we’re recommending that hobbyists and professionals alike have several years of experience designing boards and a familiarity with and ability to implement IPC standards requirements.”

Three finalists will be invited to participate in the four-hour layout final at IPC APEX EXPO 2024 and will join the IPC India Design Competition Champion to compete. In the final round, competitors will be given a partially complete project file and will have four hours to complete a layout including design rule specification, routing, and component placement. Competitors will be provided complimentary short-term licenses of Altium Designer to use for the finals competition.

Registration for the IPC Design Competition is free and closes January 15, 2024. For more information, including eligibility requirements, information on preliminary and final heats and registration form, visit www.ipc.org/ipc-design-competition-2024.

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