Description Selective electrodeposition (brush plating) was successfully used to rework a solder-contaminated, hard gold-plated copper flag connector for a circuit card assembly (CCA). ... read more

Description The iNEMI flowers of sulfur (FoS) corrosion chamber was developed to study creep corrosion on printed circuit board assemblies(PCBAs). The chamber, typically run at 50 or 60oC, has corrosive sulfur and chlorine gases along with relative humidity controlled in the 11 to 90% range. ... read more

Description Environmental dust accumulation on electronic equipment can impact the performance and reliability of the equipment in various ways. ... read more

Description Inspection means have increasingly been incorporated into typical manufacturing of boards, substrates and/or systems. A significant number of automatic inspections rely on the analysis of images that are acquired by a multitude of means such as Optical, X-Ray, Infrared, Acoustic microscopy. ... read more

Description Digitalization changes everything, everywhere. It is inevitable, new business drivers are forcing the Electronics industry to rethink every element of their business. Virtually every company is talking about innovation and digitalization. And a major driver is the so-called Digital Twin. ... read more

Description As the reflow soldering process is the main energy consumer in a SMT assembly line, there is a high potential for cost reduction by significantly reducing the amount of energy needed. ... read more

Description As miniaturization trends continue in the electronics industry, System in Package (SiP) technology is gaining more and more traction. In many ways, some SiP modules are just surface mount technology in a high-density package. ... read more

Description The advance in technology and its relentless develop mentis delivering yet another surface mount assembly challenge. ... read more

Description Polymer coating materials protect electronics from harsh environments, assuring safe and reliable performance. To reach the highest level of reliability, coatings must be selectively applied to avoid keep out zones and critical components, such as connector pins, test points, and relays. ... read more

Description The development of an automated circuit card assembly(CCA)conformal coating process using a low outgassing polyurethane material was essential for meeting the increase in customer demand from 3,000 to 60,000 units per year. ... read more

Description Light-curable materials can provide significant benefits over conventional technologies, including lower operating costs driven by lower labor needs, space savings, lower energy demand, and higher throughput. ... read more

Description To support regulations on hazardous substances in materials and in products like the automotive EU End of Life Vehicle (ELV) directive, the Electronics and Electrical Equipment Restriction of Hazardous Substances (RoHS) regulations and the EU Registration Evaluation Authorization and restriction ... read more

Description Until recently, virtually all restricted materials in electronics were classified as either carcinogens (e.g. Pb) or reproductive toxins (e.g. phthalates). Two new categories of restricted materials have emerged -endocrine disrupting chemicals (EDCs) and persistent organic pollutants (POP). ... read more

Description The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measuring Dk and Df at high frequencies. ... read more

Description Earlier HDP User Group project work that has been completed and published compared the different types of high frequency test methods used in the industry for measuring Dk and Df at high frequencies. The HDP project test results being reported on in this paper are based upon that earlier work. ... read more

Description As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes. ... read more

Description This slide show presents solutions to the relevant Power Module question: "What has to be considered within a PCB, if currents with about 50 A and voltages above 500 V should be designed?"  The electrical and thermo-mechanical capabilities are critical constraints.  2D and 3D CAD models can be ut ... read more

Description The operation and reliability of any electronic assembly is very dependent on the performance, quality and consistency of the bare printed circuit board (PCB). ... read more

Description A number of similar Printed Wiring Assemblies (PWAs) had been subjected to final electrical tests on automated test equipment when a common test failure was recognized. ... read more

Description SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. ... read more

Description In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. ... read more

Description ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. ... read more

Description The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with reference to nickel corrosion. ... read more

Description This paper details the realization of a multi-layered, printed, conformable hybrid circuit. The circuit was created using silver(Ag) flake ink as a conductive layer and UV acrylic-based ink as a dielectric layer. ... read more

Description As is the case with many other markets where faster, highly capable technologies have resulted in more intelligent processes and products, the medical device sector is also undergoing a “smart” transformation. ... read more

Description -- ... read more

Description This Presentation discusses Improvements for signal integrity.  Signal integrity is based on the copper surface roughness, the oxides on the copper, and the Dielectric constant of the Dielectric material.  The Dielectric material dielectric constant is effected by the glass weave and the weave pa ... read more

Description This Slide show presents RF Cap Layers to normal FR4 Dielectric materials.  This material can be used in multiple configurations including Single sided, Double sided, and Hybrid.   This material contains different and enhanced Dielectric Frequencies for Radio Frequency PCBs.   ... read more

Description OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. ... read more

Description Electronic assembly processes range from simple to complex and involve a wide range of materials to produce. Each step in the process and each assembly material used will have some impact on the assembly, most affecting the cleaning process window. ... read more

Description Since the 1970s, ROSE testing was used to determine “clean enough.” In 2015, the J-STD-001 committee assigned a team to develop the next generation of “cleanliness” requirements. Section 8 defines the key concepts that drove the need for developing new cleanliness requirements. ... read more

Description A nano-Cu pressureless sinterable paste was developed for joint formation applications. The material was further engineered in both chemistry and process for enhanced oxidation resistance. ... read more

Description With the advancement in miniaturization, the die is getting thinner and the solder balls are getting smaller for BGAs. ... read more

Description Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. ... read more

Description Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping condition and user environment. ... read more

Description Increased demand for radar capabilities has required increasingly more efficient thermal management techniques. Simple cold plates using tubes or channels are frequently used to cool high power components but restrictions on size, weight, and power have restricted their effectiveness. ... read more

Description Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top side are mounted in hand held devices. ... read more

Description This presentation covers Stretchable hybrid electronics.  Stretchable electronics have the most industry uses in wearable technology and for mobile sensing and response devices.  Thermosetting resins are used in the layers of the flexible electronics.  A new thermosetting resin is tested for stre ... read more

Description This presentation covers additive manufacturing and the direct deposit of multiple metals.  This additive capability is best utilized for the production of complicated circuits such as Radar and antennas.  There are a lot of potential uses for additive manufacturing including prototyping and low ... read more

Description The defense industry has realized the importance of Additive Manufacturing (AM) and how this technology can be utilized where parts can be fabricated inexpensively with reduction in lead times. ... read more

Description Thermally conductive adhesives are widely implemented in a variety of electronic assemblies. These adhesives combine the function of mechanical fasteners and thermal interface materials into one product. ... read more

Description The trend of incorporating more and more electronic devices into our daily life is bringing challenges for the industry. The need for smaller and more powerful devices is also facing one problem: heat dissipation. ... read more

Description There is an increase in the number of optical sensors and cameras being integrated into electronics devices. These go beyond cell phone cameras into automotive sensors, wearables, and other smart devices. ... read more

Description The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. ... read more

Description The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional Sn3Ag0.5Cu (SAC305)solder. The many possible advantages and some disadvantages / challenges are discussed. ... read more

Description With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI)products migrating away from the current subtractive processes towards a more technically adept tech ... read more

Description The demand for miniaturization and higher density electronic products has continued steadily for years and this trend is expected to continue,  according to various semiconductor technology and applications roadmaps. ... read more

Description Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wire bond pads when inspected under 20X magnification. ... read more

Description This paper examines the development and classification of flexible and stretchable conductive pathways to carry power and data and details the technical challenges as well as the methodologies deployed to develop a robust and commercial solution. ... read more

Description The advent of electronic materials with the potential to undergo extreme deformation while maintaining conductivity has led to the development of advanced stretchable electronic systems. These systems have applications in vital industries ranging from consumer products to medicine and defense. ... read more