Registration Open for Electrical Wire Processing Technology Expo (EWPTE) 2024

Jan 26, 2024

Registration is now open for Electrical Wire Processing Technology Expo (EWPTE) an exclusive, free-of-charge* event for the electrical wire harness, wire, coil winding and cable processing industries, to be held at Baird Center May 14-16, 2024, in Milwaukee, Wis.

Produced by the Wiring Harness Manufacturer’s Association (WHMA) and IPC, EWPTE is the only trade association exclusively representing the cable and wire harness manufacturing industry including manufacturers, their suppliers and customers. EWPTE is where the industry comes together to find solutions to challenging wire problems through training and education and for the opportunity to network with industry leaders and subject matter experts.

With an even larger show floor than last year featuring the industry’s leading suppliers and product innovators, attendees will get exclusive access to new technologies and new suppliers to help find solutions to challenging wire problems. There will also be a range of professional development courses with content designed to deliver new information, skills, and techniques related to the cable and wire harness industry. Technical conference sessions presented by engineers, researchers, academics, technical experts, and industry leaders will provide new technical data, significant results from experiments and case studies and share new techniques and trends of interest. Attendees can also take advantage of networking opportunities and connect with industry leaders and subject matter experts.

“Attendees at all career stages can come to EWPTE and harness the future through courses, technical conference sessions, peer-to-peer networking opportunities on the show floor and events with exhibitors,” said Parker Garrett, incoming WHMA Board Chair. “We want participants to transform the ideas and innovations they acquire at the event into tangible real-world solutions and business opportunities.”

For more information on EWPTE, including full descriptions of educational content and *pricing on a special technical conference session or to register, visit www.electricalwireshow.com.

European Commission Focuses on Advanced Materials for Electronics

Jan 25, 2024

By Alison James, senior director, European government relations

IPC appreciated the opportunity to participate in a January 16, 2024 workshop organized by the European Commission to collect feedback on needs, challenges, and drivers for advanced materials. At the workshop, IPC highlighted the importance of advanced materials for electronics manufacturing and underlined the need for a comprehensive silicon-to-systems approach.

The European Commission expects in 2024 to issue a Communication on Advanced Materials for Industrial Leadership. This aligns with the 2024 priority announced by European Commission President Ursula Von Der Leyen in her State of the Union address in September 2023.

Advanced materials are described as “materials intentionally designed and engineered to offer a superior performance or special functional attributes to a product,” such as materials that will be important to the digital and green transitions in the EU. Advanced materials have numerous potential benefits, including substitution for critical raw materials, increased performance, and circularity.

Electronics has been identified as a sector in which advanced materials have major potential along with mobility, construction, and energy. The EU aims to develop and scale up advanced materials for industrial use in the longer term. This involves connecting research and innovation (R&I) with the needs of European industries.

In consultation with industry members and materials experts, IPC submitted a background note highlighting needs across the electronics manufacturing sector. Dr. Peter Tranitz, IPC’s senior director of technology solutions, highlighted the following points:

A silicon-to-systems approach taken for electronic materials assessment is necessary. This spans semiconductors through electronic packaging interconnected to printed circuit boards into final system assemblies.
Further road mapping of electronic materials is needed.
Quality, performance, and reliability of advanced materials selection should be balanced with availability, resiliency, design for sustainability, recyclability, and circularity.

IPC noted the functions on which material needs should focus to include: “Materials for electronics assembly and interconnection from silicon to systems, that increase the performance and reliability of electronic systems, improve production quality, while reducing manufacturing's environmental footprint.”

IPC invites you to let us know what your company needs to ensure availability of advanced materials in electronics manufacturing processes and products. We welcome additional input from our European members to ensure a research and innovation focus on advanced materials needed for industrial production in Europe.

IPC will report back once the Commission Communication is issued.

For further information, contact IPC’s technical expert PeterTranitz@ipc.org or for policy, contact me at AlisonJames@ipc.org.

IPC Launches Exclusive "Foreign Object Debris for Electronics Manufacturing" Course for Members

Jan 25, 2024

IPC, the leading association for electronics manufacturing, announces the launch of its new course titled "Foreign Object Debris (FOD) for Electronics Manufacturing," exclusively available for IPC members at no cost. Foreign Object Debris is a critical concern in electronics manufacturing that can compromise the functionality and reliability of manufactured products. The implications of FOD extend beyond the manufacturing floor, affecting product reliability, safety, and the manufacturer's bottom line.

Implementing fundamental training across electronics manufacturing and assembly can mitigate these risks, ensuring quality production and reliable electronics products.

IPC members can enroll in this course immediately via IPC EDGE. As an exclusive offering to our members, this course represents IPC's commitment to advancing the quality and reliability standards in the electronics manufacturing industry.

Foreign Object Debris (FOD) for Electronics Manufacturing Course Outline

Module 1: Introduction to Foreign Object Debris

Offers a deep dive into defining FOD and Foreign Object Damage (FOD), categorizing foreign object debris, and identifying its material composition and sources. The module also provides resources for FOD prevention and control.

Module 2: FOD Sensitive Areas

Focuses on classifying FOD areas, differentiating area signage, and understanding facility and environmental controls.

Module 3: Work Environment

Covers work environment controls, restricted personal items in FOD sensitive areas, and control measures for tools, hardware, and consumables in designated FOD areas.

Module 4: Procedures

Addresses documentation for FOD prevention, industry best practices, elements of a FOD control plan, and responsibilities of a FOD focal point. It also includes steps for FOD containment and removal.

Final Exam & Certificate

For more information or to enroll in the course, visit https://edu.ipc.org/membercourses.

The Hidden Threat in Electronics Manufacturing

Understanding the Impact of Foreign Object Debris (FOD)

Jan 24, 2024

| By Corey Lynn

In the intricate world of electronics manufacturing quality and precision are not just goals; they are necessities. Amidst the myriad of factors that can affect the quality and reliability of electronic products, one critical issue can go unnoticed – Foreign Object Debris (FOD). Though seemingly insignificant, FOD can have profound implications on the manufacturing process and the end products. This post delves into why managing FOD is pivotal in electronics manufacturing.

What is FOD?
Foreign Object Debris refers to any extraneous material that enters the manufacturing environment. It could be anything from a tiny speck of dust to a small screw that inadvertently becomes part of the manufacturing process. In an industry where components are getting increasingly miniaturized, even the smallest particle can cause significant problems.

The Consequences of FOD
The impact of FOD in electronics manufacturing can be far-reaching. It can cause short circuits, obstruct moving parts, or create micro-abrasions on sensitive surfaces. In severe cases, FOD can lead to product failure, posing safety risks, especially in critical applications like aerospace or medical devices. This not only affects the manufacturer's reputation but also leads to financial losses due to recalls and repairs.

The Financial Implications
The cost of ignoring FOD can be exorbitant. Apart from the direct costs associated with product recalls and repairs, there are indirect costs too. These include loss of customer trust, damage to brand reputation, and potential legal liabilities. In highly competitive markets, the inability to manage FOD effectively can be a significant disadvantage.

FOD Management Strategies

Cleanliness and Organization: Maintaining a clean and organized manufacturing environment is the first step in minimizing FOD. Regular cleaning schedules, clutter-free workspaces, and proper storage of materials are essential practices.
Use of Proper Tools and Equipment: Tools and equipment should be regularly inspected to ensure they are not contributing to FOD. This includes using lint-free wipes, cleanroom suits, and ensuring that all tools are accounted for after each process.
Employee Training and Awareness: Employees should be trained to understand the importance of FOD and how their actions can contribute to its prevention. Implement IPC’s FOD Training to keep your staff fully trained and aware of how to manage FOD.
Quality Control and Inspection: Incorporating FOD checks into the quality control process is crucial. Regular inspections and audits can help identify and address FOD-related issues promptly.
Collaboration with Suppliers: Ensuring that the supply chain also adheres to strict FOD prevention measures is essential. Collaboration with suppliers to implement FOD prevention practices can significantly reduce the risk of FOD entering the manufacturing environment.

Conclusion
Foreign Object Debris is a critical concern in electronics manufacturing that demands attention. The implications of FOD extend beyond the manufacturing floor, affecting product reliability, safety, and the manufacturer's bottom line. Implementing a comprehensive FOD management strategy, can mitigate these risks and help ensure the production of high-quality, reliable electronic products. As technology continues to evolve and electronic components become even more sophisticated, the importance of FOD management will only increase, making it an indispensable part of electronics manufacturing and your organization’s training programs.

IPC Hand Soldering Competition Vietnam 2024

Date

Sep 11, 2024 | 9:00am - Sep 13, 2024 | 5:00pm CDT

IPC’s hand soldering competitions around the world are highly popular events generating a lot of attention, participation and publicity. The competition attracts the enthusiastic participation of thousands of professionals specializing in high-reliability products within the electronics industry such as defense, aerospace/aviation, rail transportation, automotive electronics, consumer electronics, etc. Operators continuously refine and enhance their skills through participation in IPC Skills Competitions, while participating companies elevate their process standards, reduce product costs, and significantly improve their competitive advantages.

Registration is free of charge. The number of participants is limited!

For more information or event sponsorship, please contact Mr. Henry Ton, HenryTon@ipc.org

I.C.E. Hanoi

91 Tran Hung Dao Street
Hanoi
Hanoi City 111000
Vietnam

I.C.E. Hanoi

I.C.E. Hanoi
91 Tran Hung Dao Street
Hanoi, HN 111000
Vietnam

IPC Hand Soldering Competition Thailand 2024

Date

Jun 19, 2024 | 9:00am - Jun 22, 2024 | 5:00pm CDT

Registration is free of charge. The number of participants is limited!

For more information or event sponsorship, please contact Ms. Tharinee Butmuang Jib, JibButmuang@ipc.org

BITEC Bang Na

4345 Sukhumvit Rd
Khet Bang Na, Krung Thep Maha Nakhon
Bangkok 10260
Thailand

BITEC Bang Na

BITEC Bang Na
4345 Sukhumvit Rd
Krung Thep Maha Nakhon, 10 10260
Thailand

IPC K-FEST 2024

Date

Oct 29, 2024 | 10:00am - 5:30pm KST (Oct 28, 2024 | 8:00pm - Oct 29, 2024 | 3:30am CDT)

IPC K-FEST (IPC Korea Festival Of Electronics Standards and Technology, as an exclusive annual event in Korea, aims to promote Korean electronics industry development and global cooperation.

Date：29th Oct, 2024

Time: 10:00~17:30 (KR time)

Location:

나인트리 프리미어 로카우스 호텔 서울 용산 6층 플로리스홀 (서울 용산구 한강대로23길 25)

Flouris Hall, Floor 6th , Nine Tree Premier ROKAUS Hotel Seoul Yongsan (25, Hangang-daero 23-gil, Yongsan-gu, Seoul, Republic of Korea)

Registration Link: https://go.ipc.org.cn/l/658623/2024-09-23/7z13t

Preview:

IPC offers essential services such as standard development, certification training, industry trend analysis, and environmental protection, helping to enhance the competitiveness and success of over 3,000 member companies worldwide through various industrial projects. To contribute to the growth of South Korea's electronics and manufacturing sectors and strengthen global competitiveness, IPC Korea will host the 2nd IPC K-FEST on October 29, 2024 (Tuesday). The event will feature vital standards and technology seminars, technical meetings for the IPC-A-610 standard revision committee (Korea), and a variety of engaging activities.

Agenda:

Time	Content
09:30~10:00	현장 등록 Registration / Networking
10:00~10:05	일정 소개 Introduction of Agenda
10:05~10:10	환영사 / 축사 Welcome speech
10:10~12:10	Seminar Part I	IPC 표준 개발 동향 및 IPC CFX소개 IPC Standard Development Trend and IPC CFX	David Bergman IPC Vice President
		전기 자동차의 전자분야 도전과제 및 극복사례 Mastering Challenges in Electronics for Electric Vehicles	Udo Welzel Robert Bosch GmbH
		전장품 MLCC 이온마이그레이션에 대한 검증 및 예측 Verification and Prediction of MLCC Ionic Migration in Electronics	배희훈, 현대모비스 Hee-Hun Bae, Hyundai Mobis Co., Ltd
		Conformal Coating 재료 선정 및 기술 과제 해결 Material Selection and Technical Solution of Conformal Coating	김고진, 맥더미드 알파 Go-Jin Kim, MacDermid Alpha Electronics Solutions
12:10~12:20	Break Time / Photo Time
12:20~13:20	Luncheon	참석자 소개 Introduce attendees
		시상식 및 이벤트 IPC Korea Awards and small Events
		2025년 IPC Korea 활동 계획 IPC Korea Activity plan in 2025
13:20~13:30	Break Time
13:30~15:30	Seminar Part II	IPC Standard Case Study: PCB Design 단계에서 성능 완성도 향상 및 신뢰성 확보 Improving Performance and reliability at PCB Design Phase	이병엽, PCB DN Byeong-Yeop lee, PCBDN 박정민, LG전자 Jung-Min Park, LG Electronics
		IPC Standard Case Study: IPC-6921 반도체용 PCB (IC Substrate) 요구사항과 허용 기준 Requirements and Acceptance Specifications for Organic Packaging Substrates	TBD
		IPC Standard Case Study: 전자 제조 공정에서 주석도금과 합금층 관계 Relationship of the Sn plating and IMC at PCBA	황영호, (주) 구루이앤이 Hwang Young-Ho, Guru E&E Inc
15:30~15:50	Break Time / Networking
15:50~17:20	IPC-A-610K 표준 제/개정 위원회 기술회의 IPC-A-610K Regional Task Group Meeting		누구나 참석가능
17:20~17:30	Photo Time and Closed

*상기 내용은 당일 사정에 따라 변경될 수 있습니다.

본 행사에 후원하실 개인/회사에 대한 혜택과 후원방법 (물품)은 별도로 상담 드리겠습니다.
문의: IPC KOREA Representative/Tina Choi/010-9997-8886/tinachoi@ipc.org
주관: IPC Korea, IPC한국자문위원회

For more information or event sponsorship, please contact Ms. Tina Choi TinaChoi@ipc.org

Unlocking Funding for IPC’s Registered Apprentice Program: Electronics Manufacturing

Date

Feb 21, 2024 | 11:00am - 12:00pm CST

Join Victoria Hawkins and Cory Blaylock as they explain the funding landscape for IPC's registered apprentice program. This session is for the electronics industry and IPC members who seek to improve their workforce training but are hindered by workforce development costs, specifically as it relates to apprenticeship.

This webinar will describe available apprenticeship funding opportunities to support your workforce development costs. We aim to demystify these funding opportunities and make them more accessible. We understand that navigating the labyrinth of government funding can be overwhelming, which is how IPC can help.

Webinar Key Takeaways

Understanding Funding Sources: Learn about the various federal, state, and local funding programs available for apprenticeships.
Navigating the Funding Process: Gain insights into the intricacies of this process. Our experts will guide you through the steps involved, from initial research to receiving reimbursement for workforce training expenditures.
Best Practices and Strategies: Discover strategies to optimize funding opportunities. We will share tips on articulating your training needs effectively and demonstrating the potential impact of the funding on your workforce.
Q&A Session: Have your questions answered by our panel of experts. This is your opportunity to seek advice specific to your organization’s needs.

Presenter Bios

Victoria Hawkins

As the Director of Workforce Grants and Proposals at IPC International, I am leading impactful initiatives, leveraging my extensive expertise in the field. My professional journey, deeply rooted in the realm of Education, has provided me with diverse opportunities to support the workforce landscape.
Throughout my career, I have had the privilege of collaborating with National Associations in Accreditation and State committees, actively contributing to the development of state early learning standards, Quality Rated Indicator Systems, and several workforce training initiatives on a state and national level. Working closely with both State and non-profit agencies, I have successfully written and managed a variety of funding opportunities, including federal grants. This experience has not only honed my grant writing and management skills but has also allowed me to make a tangible impact on educational and workforce development programs.
Over the past several years, I have taken immense pleasure in providing direct support and instruction to public, private, and non-profit entities. Whether securing grant funds or engaging in advocacy and legislative efforts, my commitment to excellence has remained unwavering.
I eagerly anticipate the opportunity to contribute to the workforce development landscape and am committed to making a meaningful impact on our future.

Cory Blaylock

With a wealth of experience, I currently serve as the Director of Workforce Partnerships at IPC, where I've been leading impactful initiatives since April 2023. In my 8-month tenure, I've showcased expertise in CTE, grant funding, project management, apprenticeship navigation, technical training, leadership, and workforce development.

Before IPC, my career at Lockheed Martin spanned 8 years, where I excelled in project management and planning operations. My responsibilities included apprenticeship navigation, STEM initiatives, community outreach, and overall workforce development. I held roles as a Sr. Training & Development Representative. Technical Trainer and Engineering Planner, contributing significantly to the company's success.
Before Lockheed Martin, I contributed my skills to STEMscopes by Accelerate Learning, Inc. as a Contributing Writer/Consultant for 6 years. During this time, I also served as an Educator in Texas Independent School Districts for twelve years, specializing in bilingual education, instructional technology, teacher mentoring, and science education.

My journey in workforce development is deeply rooted in a passion for education and a commitment to fostering impactful collaborations between industry and academia.

IPC Masters 2024

Date

Jul 8, 2024 | 9:30am - Jul 10, 2024 | 5:00pm CST (Jul 7, 2024 | 8:30pm - Jul 10, 2024 | 4:00am CDT)

To meet the needs of China's electronics industry, IPC Asia and Pudong New Area Association For Quality And Technology Shanghai, will jointly organize a comprehensive skill competition event – IPC Masters 2024 in Shanghai, China. IPC Masters will include Hand Soldering Competition (HSC), Cable and Wire Harness Assembly Competition (CWAC), BGA/BTC (Ball Grid Array/Bottom Termination Components) Rework Competition and IPC Standard Knowledge Competition.

IPC Masters aims to provide a valuable platform for operators in the electronic industry across China to enhance their skills and showcase their talents. Through this competition, contestants will have the opportunity to learn and apply their skills, contributing to the promotion of quality and technical standards in China's electronics manufacturing industry. The event also plays a pivotal role in talent development, enabling participants to step onto the international stage and demonstrate the strength and charm of China's skilled craftsmen.

Organizers

Strategic Partner

Venue

Shanghai New International Expo Center
electronica China 2024
IPC Booth Number: Hall C2-2900

Participants

Electronics enterprises in military, aerospace, rail transportation, automotive electronics, communication/consumer electronics, etc.

Competition Categories

IPC Standards Knowledge Competition (Online)
Hand Soldering and Rework Competition (HSRC)
Cable and Wire Harness Assembly Competition (CWAC)
BGA/BTC Device Rework Competition

Premier Sponsor

Supporting Sponsors

For more information or event sponsorship, please contact marketingchina@ipc.org

electronica China

2345 Longyang Rd
ShiJi GongYuan
Pudong Xinqu
Shanghai Shi, 201204
China

electronica China

electronica China
2345 Longyang Rd
Pudong Xinqu, SH 201204
China

IPC WorksAsia Thailand 2024

Date

Aug 9, 2024 | 9:00am - 4:00pm +07 (Aug 8, 2024 | 9:00pm - Aug 9, 2024 | 4:00am CDT)

IPC WorksAsia – Quality & High Reliability Conference Thailand

Get practical methodologies that can be deployed today to enhance your operations

Quality & High Reliability are critical when electronics assemblies are working in harsh environments where there is high temperature difference, vibration; and components get smaller and demand for high reliability products increases. IPC has brought together an international panel of experts for this inaugural conference in the heart of Southeast Asia to discuss:

Critical areas of the assembly process and
How design and materials choices will affect cost, reliability and turnaround time.

These important one-day events will focus on advanced research results, practical methodologies and standards in the automotive, industrial and other electronic fields — critical information for engineers and managers responsible for reliability.

Date: August 9th, 2024
Time: 8:30 – 16:30
Place: Avani Sukhumvit Bangkok Hotel - 2089 Sukhumvit Rd, Prakanong Nua Watthana, Bangkok

For more information, please contact: Tharinee Butmuang Jib, JibButmuang@ipc.org

Conference Agenda

8:20 – 9:10 Registration & Morning’s snack with Coffee/ Tea
9:20 – 9:30 Welcome/ Opening Address
Mr. Raymond Foo – Director, IPC Southeast Asia
9:30 – 10:15 Breakthrough Cleaning Challenge For Advanced Packaging
  Mr. Tan Lip Sin - Application Manager, Zestron South Asia
10:15 – 11:00 The Trend to Low Temperature Solder (LTS) Assembly and the Development Strategy for Tin-Bismuth based High Reliability LTS solder
  Mr. Takatoshi Nishimura - Technical Manager, Nihon Superior Co., Ltd.
11:00 – 11:45 Optimizing Under-Stencil Fluid Delivery Settings for Superior SMT Printing Results
  Mr. TC Loy, B.Eng. - Regional Manager of North Malaysia, Kyzen Corporation
12:00 – 13:15 Buffet Lunch
13:30 – 14:15 Reliability of Automotive Electronics: How IPC Standards Help the Industry
  Mr. David W. Bergman - VP Standards & Technology/ Executive Director WHMA, IPC
14:15 – 15:15 IPC Standards & Training Program – Updates & Case Studies
  Mr. Phuong Dang Ho - Master IPC Trainer, IPC Southeast Asia
15:15 – 15:40 Q&A Session, Conclusion & Group photo
15:40 – 16:30 Coffee & Tea Break/ Networking Session

IPC reserves the right to select participants and final explanation.
Guest speakers and topics content are subject to change without notice.
The program is conducted in English, without interpretation.

Conference Presenters

	Mr. Tan Lip Sin Application Manager of Zestron South Asia Tan Lip Sin has his professional interests focused on high precision cleaning, plasma etching, wet chemical etching in the Wafer Fabrication and Semiconductor Industry. He is an active member of the SMTA and has been with ZESTRON since Year 2020. Mr. Tan received his Bachelor’s Degree in Chemistry from the University of Science Malaysia.
	Mr. Takatoshi Nishimura Technical Manager, Nihon Superior Co., Ltd, Osaka, Japan Takatoshi Nishimura has been working in Nihon Superior since 2012. He is a technical manager and engaging to solve the customer’s soldering technical issues in assembly service. Recently the speaker has also been actively involved and directed the low temperature soldering material and process development.
	Mr. TC Loy, B.Eng. Regional Manager for North Malaysia, Kyzen Corporation Loy graduated with honors from Liverpool John Moore’s University in Electronics Engineering and has 19 years of experience in the Electronics and Semiconductor Assembly Industry. He is based in Penang and supports Electronics and Semiconductor manufacturers in Northern Malaysia in developing and maintaining cleaning processes.
	Mr. David Bergman Vice President of Standards and Technology - IPC/ Executive Director WHMA David W. Bergman is Vice President of Standards and Technology for IPC and has been with the organization for over 40 years and is currently responsible for IPC’s Global Standardization Program, Standards Validation and IPC’s trade shows in USA. David also serves as Executive Director of the Wiring Harness Manufacturer’s Association (WHMA) an IPC council of IPC.
	Mr. Phuong Dang Ho Master IPC Trainer, IPC Southeast Asia Over 19 years working experience in process engineering, new product development, engineering consultancy and training. Extensive knowledge of electronics industry such as SMT technology, through hole technology, conformal coating, clean room, ESD control, MSD control, component identification, manual soldering, 5S, and IPC Standards. Mr. HO has been conducting IPC Training for more than 13 years.

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