First Steps in Manufacturing Cybersecurity for Non-Security Professionals

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Date
- (3:00 - 4:00pm CST)

This webinar is designed to provide non-professional cybersecurity specialists with the facts and awareness they need. No extensive knowledge of cybersecurity is required. Topics include:
•    The possibility you may be the target of a cyber attack.
•    Why attack countermeasures and manufacturing members of the production floor seem so far away.
•    The efforts and limitations of IT engineers.
•    The essence of Zero Trust Architecture.
•    The role of manufacturing members on the shop floor.
•    Balancing the cost of countermeasures versus profits within the manufacturing industry.
•    Discussion of IPC-1792

Hiroyuki Watanabe webinar December 6

Speaker Bio

Hiroyuki Watanabe is engaged in activities to disseminate and enlighten the future of the manufacturing industry from the perspective of security and the international economy. He's published two Japanese books and one English book to support security measures in small and medium-sized factories. He presents logical findings leading to know-how and the necessity of security measures for factories and supply chains at the Counterfeit Symposium and APEX.

Since 2018, he has been a visiting researcher at the Center for Rule Formation Strategy, Tama University. Hiroyuki Watanabe is currently the Executive Director of Global Security at NEC Corporation. In 2020, he joined the IPC Board of Directors and is a chair of IPC-1792 Cybersecurity Standard.

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New Microelectronics and Advanced Packaging Roadmap Guides U.S. Electronics Ecosystem

IPC, part of MAPT Roadmap Extended Executive Committee provides data on next generation advanced packaging, materials, substrates, and supply chain future needs

Today, IPC, in collaboration with other industry organizations and representatives from academia and government, celebrate the release of the Semiconductor Research Corporation’s (SRC) Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap.

The MAPT Roadmap extends the work of SRC’s and Semiconductor Industry Association’s (SIA) 2030 Decadal Plan for Semiconductors. The Decadal Plan identified five seismic shifts in the industry related to smart sensing, memory and storage, communication, security, and energy efficient computing. The MAPT Roadmap summarizes the key drivers of technology progress, provides guidance for how to achieve the technical challenges outlined in the Decadal Plan, and strategizes for developing the workforce required to realize the promises of these innovations. These advances build upon breakthroughs in advanced packaging, 3D monolithic and 2.5D/3D heterogeneous integration, electronic design automation, analog and mixed signal processing, nanoscale manufacturing, new materials, photonics and MEMS integration, and energy-efficient computing.

SRC Chief Scientist and Director of the MAPT Roadmap, Dr. Victor Zhirnov, commented, “The commitment demonstrated by such a wide array of scientists, engineers, and researchers to the development and production of the MAPT Roadmap indicates the importance of such an effort.”

The MAPT Roadmap is framed around fundamental and practical limits of information and communications technology sustainability: energy, environmental, and workforce sustainability. “

"SRC has been and continues to be a tremendous resource for semiconductor R&D and workforce development. The MAPT Roadmap directly supports the CHIPS and Science Act, led by the U.S. Department of Commerce, in efforts to develop a robust domestic ecosystem,” remarked Dr. Todd Younkin, president and CEO of SRC.

Added Matt Kelly, IPC chief technology officer and vice president of technology solutions and co-chair of roadmap chapter 8 committee on materials, substrates, and supply chain, “The MAPT Roadmap, a critically important effort, will guide the next decade of microelectronic needs and advancements.  As the U.S. electronics sector faces significant challenges within the global market, it is crucial to develop strategies that foster growth, innovation, and competitiveness across this vital global industry – this roadmap provides this vision.”

Visit https://srcmapt.org/ to download MAPT Roadmap.

IPC Releases IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards

Changes address advances in rigid printed board fabrication processes

IPC has released IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards. This document is the base standard for addendums covering military and space requirements, medical requirements, and automotive requirements.

IPC-6012 provides requirements for the qualification and performance of rigid printed boards based on constructions and /or technologies such as; single-sided, double-sided printed boards with and without plated-through holes (PTH), multilayer printed boards with PTHs with or without buried/blind vias/microvias, active/passive embedded circuitry printed boards with distributive capacitive planes and/or capacitive or resistive components and metal core printed boards with or without an external metal heat frame, which may be active or non-active.

Among the many additions to IPC-6012F, are expanded requirements in the following areas: printed board cavities, copper wrap plating, “Intermediate” target lands, solderability testing, dewetting, microsection evaluation, internal plated layers, dielelctric spacing and reliability issues with microvia structures.

“The hard work put in by the IPC D-33a Rigid Printed Board Performance Specifications Task Group over the past three years has resulted in a substantial revision to IPC-6012,” said John Perry, IPC’s director of printed board standards and technologies. Perry also stated, “IPC-6012F incorporates test coupon designs well suited to evaluate complex, interconnected via structures as part of an overall effort to address microvia reliability. Add to that new criterion for printed board cavities, hole registration, internal plated layers and dielectric spacings and you have a performance specification that addresses advances in rigid printed board fabrication processes.”

IPC-6012F is available for purchase in the IPC Store. For more information, visit www.ipc.org/ipc-standards.

Additively Manufactured Electronics Technology

WEBINAR REGISTRATION
Date
- (12:00 - 1:00pm CST)

Additively Manufactured Electronics (AME) adds another dimension to 3D printing – the ability to generate working circuit boards and high-performance electronic devices. Bring yourself up to speed with an overview of this emerging field:

  • What AME is and how does it differ from PE.
  • Present the inkjet manufacturing process.
  • Discuss materials.
  • Touch on embedded components.
  • Applications including formed components and design techniques.
  • Present D-67 committee task groups and standards activity
Dana Korf Rafael Del Rey November 15

Webinar Speakers 

Dana Korf is the AME Standards Manager at Nano Dimension. He is chair of IPC D-67 Additively Manufactured Electronics (AME) sub-committee, on the IPC-2581 committee, is a recipient of the IPC Presidents Award and has several IPC Special Recognition awards for his work in high-speed design standards and digital twin. Dana currently writes for the iConnect007 Design online magazine focusing on data transfer under the tagline “Dana on Data”. Prior to Nano Dimension, Dana was the Principal Consultant at Korf Consultancy based in Bremerton, WA, working with software companies, fabricators, OEMs, and IPC to improve the design to manufacturing data transfer quality since 2019. Dana has been in the industry for over 40 years. He recently spent over seven years living and working in China as the Multek Sr. Director of Central Manufacturing Engineering and NPI. He was previously the Director of PCB Technology at Huawei Technologies in Shenzhen, China. Prior to moving to China, he worked at Sanmina, HADCO, and Zycon as the Director of Product Engineering.

Dr. Rafael del Rey is the Director of Global Application Engineering at Nano Dimension with almost two decades of experience in High-Speed Hardware design. Formerly, he oversaw the electrical architecture of an experimental aircraft as lead system engineer at Volocopter, researched high-performance computing hardware at Continental Automotive, developed silicon reference boards for NXP and mission-critical server platforms at Intel. Rafael del Rey is a Doctor of Science in Electrical Engineering also holding a Master and a Bachelor of Science in Electronic Systems Design. Since 2014, he teaches Analog Electronics and board Design at the Master in Electronic Design at ITESO University in Mexico, where since 2018, he obtained the full professor title.

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IPC Electronics Forum - productronica 2023

Date
-

IPC returns to productronica with a brand-new program for you to celebrate and discover more about the electronics manufacturing industry. 

Productronica presents the entire range of technologies and solutions for electronics production and provides in-depth insights into the latest trends in practice-oriented forums and live demonstrations.

IPC Forum will take place at booth #A4-502 where presentations will cover a wide range of industry topics every day of the trade show. The goal of the forum is to facilitate knowledge exchange and networking within our community of electronics manufacturing professionals in a live and interactive environment.

The topics include: 

Technology Solutions

IPC works with the industry to develop strong global and regional manufacturing ecosystems and resilient supply chains. Advanced semiconductor packaging requires IC substrate fabrication and directly impacts future PCB technology and assembly processes. Keeping the supply chain from silicon-to-systems successful, IPC is the advocate for the industry bringing together a wide variety of technologies to remain healthy and strong.

Design

A new electronic product cannot be successful without a proper design creation process. This process requires close collaboration across the supply chain. The IPC Design Initiative aims to build a global forum where OEMs, PCB manufacturers, EMS, advanced packaging experts, and EDA software providers can collaborate, share and advance next-generation design approaches together.

Connected Factory Exchange (CFX)

IPC-CFX is an industry-developed open international standard forming the foundation/backbone of Factory of the Future applications. As a plug-and-play solution, it simplifies and standardizes machine-to-machine communication while also facilitating machine-to-business and business-to-machine applications.

Learn how you can implement IPC-CFX on your factory floor and begin to reap immediate benefits in advanced manufacturing and closed loop, data analytics, sustainability, quality improvement, and cost reductions.

Sustainability

Companies within electronics industry supply chains are under pressure to identify sustainability targets, achieve these targets, and fulfill regulatory reporting requirements. IPC’s Sustainability for Electronics Initiative is focused on supporting members as they incorporate industry tools — including standards, education, advocacy, and solutions — to achieve their sustainability objectives.

Wire Harness - WHMA

The Wiring Harness Manufacturer’s Association® (WHMA) was established in 1993 to serve the global cable and wire harness industry. WHMA is the ONLY trade association exclusively representing the cable and wire harness manufacturing industry including manufacturers, their suppliers, and customers. Now a council of IPC, WHMA provides our members technical support through standards and education, access to leading-edge technology, benchmarking, and the ability to network with the leaders in wire processing equipment, services, and manufacturing.

View IPC Forum presentation schedule here.

How to attend?

You will be granted free access to the trade show with a special voucher: prod2023_IPC_Europe

Click here to redeem your free ticket.

 

For more information, please contact Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org)

Messe München

Am Messesee 2
81829 Munich
Germany

Event Venue Website
https://messe-muenchen.de/

Messe München

Messe München
Am Messesee 2
Munich, 81829
Germany

IPC K-Fest 2023

Register Now
Date
- (Nov 8, 2023 | 10:00pm - Nov 9, 2023 | 2:30am CST)

IPC K-FEST 2023

IPC K-FEST is set to be IPC’s landmark event in Korea, bringing together industry peers to celebrate the advancements and contributions that have shaped the landscape of electronics standards and technology.

K-FEST represents Korea Festival of Electronics Standards and Technology. Organized by IPC Asia and IPC Korea Advisory Committee, IPC K-FEST 2023 is where innovation meets inspiration, where standards meet technology, and where the future of electronics comes alive.

Event Details:

  • Date: November 09, 2023 (Thursday) 13:00~17:30 11pm-3:30am
  • Location: Novotel Ambassador Suwon-2F Azalea Hall (902 Dukyoungdaero, Paldal-Gu, Suwon, South Korea,16622)

Event Highlights:

  • Announcement of 2024 IPC activity plan in Korea
  • Important technical seminars from industry leaders
  • An awards ceremony recognizing excellence in the electronics industry
  • Networking opportunities with industry experts and professionals

IPC K-FEST is not only an opportunity to celebrate achievements but also a platform to exchange ideas, foster collaboration, and shape the future of our industry. Whether you are a seasoned professional or a passionate newcomer, this is an opportunity to celebrate, learn, and network with the best in the business.

Register now for IPC K-FEST 2023, and together, let's shape the future of the electronics industry!

For inquiries and sponsorship opportunities, please contact: Tina Choi, IPC Korea Representative, 010-9997-8886/TinaChoi@ipc.org

See you at IPC K-FEST 2023!

IPC Asia Team

 

Event Agenda

Time

Subject

Presenter

12:30~13:00

On-site registration

 

13:00~13:40

Welcome Awards

John Mitchell,

IPC President & CEO

Jongwon Kwon,

General Project Director, 

De-facto Standard Forum

13:40~13:50

IPC Korea 2024 Activities

Tina Choi,

IPC Korea Representative

13:50~14:10

IPC Updates

Sydney Xiao,

IPC Asia President

14:10~14:30

Quality Issue & Countermeasure of E-less Sn Plating

Jin-ho Lee,

Research Fellow,

Korea Electronics Technology Institute

14:30~14:50

Basic Properties Evaluation of Soldering Materials

Sung-Gyun Cho,

CTS,

MacDermid Alpha Electronics Solutions.

15:10~15:30

Verification Process of SMT Mfg based on IPC

Kye-soo Jun,

Professional,

LG Innotek

15:30~16:00

Correlation between QML and PCBA Capability

Young-ho Hwang,

President,

Guru E&E Inc

16:00~16:20

Quiz and Gift Lottery

Tina Choi,

IPC Korea Representative

16:20~17:30

(7-31B-KR) IPC-A-610 RTG Technical Meeting

RTG Leaders

* Note: The above schedule may be adjusted based on actual circumstances.

 

Novotel Ambassador Suwon-2F Azalea Hall

902 Dukyoungdaero
Paldal-gu
Suwon-si
Gyeonggi-do
16622
South Korea

Novotel Ambassador Suwon-2F Azalea Hall

Novotel Ambassador Suwon-2F Azalea Hall
902 Dukyoungdaero
Suwon-si, 41 16622
South Korea

Register Now

John Deere Electronic Solutions Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing Recertification

IPC's Validation Services Program announces that John Deere Electronic Solutions, a manufacturer of custom, integrated electronics components based in Fargo, N.D., has become the first OEM company to be recertified a third time to the IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML). John Deere Electronic Solutions achieved the QML certification nine years ago and this year successfully demonstrated the Class 3 level work required for recertification on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.

“Their dedication to high reliability and meeting the requirements of Class 3 level work was demonstrated during the audit process,” stated Randy Cherry, IPC director of Validation Services.

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize John Deere Electronics Solutions for continuing to be a member of IPC's network of trusted QML suppliers."

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.   

IPC Hand Soldering Competition - Regional & World Championship - productronica 2023

Date
-

Join Regional Qualification for the IPC Hand Soldering Competition (HSC) being held at productroonica – Munich, Germany - Hall #A4, IPC Booth #A4-502 - on 14-17 November 2023.

Skilled soldering experts (F/M) will be competing for 60 minutes on a complex circuit board assembly in the regional competition (14-15 November 2023) to win the 2023 Regional title, earn a cash prize and a coveted spot at the IPC Hand Soldering World Championship.  (HSC World Final to take place on 16-17 November 2023 at productronica in Munich, Germany).

Competition for Professionals

The professional competitors will be judged by IPC Master Instructors (MIT) on soldering a complex printed circuit board with a maximum time of 60 minutes in accordance with IPC-A-610 Class 3 criteria. Additional criteria will include the quality of the results achieved and of the assembly process, the overall electrical functionality of the assembly as well as the speed at which the assembly was produced.

Prizes for Professionals

Cash prizes will be awarded to the professionals: the winner and two runners-up.

  • 1st place – 300€
  • 2nd place – 200€
  • 3rd place – 100€

IPC Hand Soldering World Championship: The winner at the regional competition at prouctronica will be invited to take part in the HSC World Finals, 16-17 November 2023, IPC booth #A4-502.

Hand Soldering Best Company Team Award: This year again, nominate a team to win the Hand Soldering Best Company Team Award. For any company enlisting 2 or 3 competitors, the highest combined scores of competitors from the same company will determine which company will receive the HSC Best Company Team Award.

Registration is free of charge.

You do not need to be an IPC member to take part.

You do not need to be IPC-certified to take part.

How to register?

Fill in the registration form and book your competition slot.

You will receive a confirmation email specifying your date and time to compete.

For more information, please contact Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org)

Delivering Engaging Presentations

WEBINAR REGISTRATION
Date
- (12:00 - 1:00pm CDT)

This webinar is for anyone giving or even contemplating giving a verbal presentation with associated slides. Specific topics will include: personal aspects, the venue, preparing the presentation, giving the presentation and dealing with questions.

Bev Christian October 31

Speaker Bio

Dr. Christian in his 30+ years in the electronics industry has worked for Nortel, BlackBerry and the University of Maryland (CALCE).  He currently works for the HDPUG consortium as a project facilitator.  He has received several awards including three Nortel President’s Awards for his environmental work, SMTA’s Member of Technical Distinction and International Leadership Awards, RIM’s Americas Environmental Champion and the Dieter Bergman IPC Fellowship Award.  Dr Christian has over 50 published papers.  His specific areas of interest include solderability, corrosion and environmental compliance.  Bev also sits on standards committees of the IPC and the IEC.  

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Highlights of IPC’s 2023 PCB Technology Trends Study

Register for webinar
Date
-

Michael Carano, IPC’s technical consultant, will present some of the key findings from IPC’s latest PCB Technology Trends study, published this past October. The study covers OEMs’ use of emerging technologies and PCB requirements today and projected out five years, along with PCB fabricators’ current and anticipated technical capabilities. The findings provide guidance to the electronics supply chain in meeting the current and future needs of OEMs, and the outlook for circuit board technology development through 2028.

During the webinar, Mike will present:

• industry’s current state of circuit board technology
• assessment on aspects of board design, performance, operating environment, capabilities, materials, special structures, and new technologies
• a brief outlook on future PCB technology developments through 2028

Register for webinar
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