WHMA’s Annual Global Leadership Summit Offers Technical Education Workshop on Strategic Practices for Success

Participants will learn how to benefit from lucrative federal programs

Tyler Noesser, senior technical director at alliantgroup, a tax and business consultancy, will present a technical education workshop, “Strategic Practices for Success: Outpacing Competitors, Optimizing Bids and Nurturing Top Talent,” on February 13, 2024, from 3:00-5:00 pm, at WHMA's Annual Global Leadership Summit in Myrtle Beach, S.C.

Noesser will lead an interactive discussion on trends in the industry and provide practical advice on practices that manufacturers can implement immediately. He will detail recent legislative updates to powerful credits and incentives that have helped WHMA members claim millions in federal funds. Noesser will explain how these changes apply to wire harness manufacturers and how they can benefit from these lucrative federal programs.

“In today's competitive market, businesses must be strategic in their approach to remaining competitive, lowering bids, and retaining skilled workers,” said David Bergman, WHMA executive director. “We look forward to learning how the alliantgroup, can help company owners in the cable and wire harness industry take full advantage of federal and state tax credits, incentives, and deductions in order to successfully compete both in the U.S. and abroad.”

For more information on the leadership summit including schedule, exhibition, speaker profiles, sponsorship opportunities, or to register for event, visit https://annualconference.whma.org.

Statement of Support from IPC for New Actions to Strengthen America’s Supply Chains, Lower Costs for Families, and Secure Key Sectors

Statement attributed to Chris Mitchell, IPC Vice President of Global Government Relations

IPC welcomes the actions outlined today by the U.S. Government “to strengthen supply chains critical to America’s economic and national security.”

The COVID-era disruptions experienced by the U.S. electronics manufacturing industry spotlight the extent to which the United States has outsourced its industrial base impacting everything from automobiles to aircraft to consumer products. The investments being made under the CHIPS and Science Act, Defense Production Act, and Inflation Reduction Act must cover more than just a few key products such as semiconductors – they also need to include the full electronics manufacturing system that enables semiconductor chips to function including printed circuit boards (PCBs) and integrated circuits (IC) substrates.

We are pleased to see today’s actions complementing last week’s announcement of a National Advancing Packaging Strategy. In addition, IPC welcomes the creation of a Cabinet-level Council on Supply Chain Resilience and a new quadrennial review process to ensure a comprehensive approach to this vital issue. We also applaud the actions to solidify the U.S. defense industrial base and the emphasis on international cooperation.

 

North American PCB Industry Sales Up 3.9 Percent in October

IPC releases PCB industry results for October 2023

IPC announced today the October 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.97.

Total North American PCB shipments in October 2023 were up 3.9 percent compared to the same month last year. Compared to the preceding month, October shipments were up 6.3 percent.

PCB bookings in October were up 14.9 percent compared to the same month last year. October bookings were down 8.7 percent compared to the preceding month.

“PCB shipments for October were slightly better than expectations,” said Shawn DuBravac, IPC’s chief economist. “Weaker orders for the month suppressed the book-to-bill. Orders over the last three months are 20 percent below last year's levels.”

October PCB book to bill chart 1
October 2023 PCB book to bill ratio 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

North American EMS Industry Down 7.4 Percent in October

IPC releases EMS industry results for October 2023

IPC announced today the October 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.23.

Total North American EMS shipments in October 2023 were down 7.4 percent compared to the same month last year. Compared to the preceding month, October shipments decreased 0.5 percent.

EMS bookings in October decreased 19.5 percent year-over-year and decreased 4.8 percent from the previous month.

“EMS bookings were weak for the second consecutive month. The year-to-date trend for bookings declined to its lowest level of the year,” said Shawn DuBravac, IPC chief economist.

October 2023

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

IPC Applauds New U.S. Government Strategy for Advanced Packaging

$3 Billion in CHIPS Act Funding to Support Vital Electronics Technology

The U.S. Government’s announcement today of a national strategy for “advanced packaging” under the CHIPS for America Program is a big step toward ensuring the resiliency and security of the U.S. supply chain for advanced electronics.

The “Vision for the National Advanced Packaging Manufacturing Program” (NAPMP), released today by the U.S. Commerce Department, says approximately $3 billion will be used to drive U.S. leadership in advanced packaging, with an initial funding opportunity to be announced in early 2024.

IPC has been the leading advocate for a “silicon-to-systems” approach to implementation of the CHIPS Act. A silicon-to-systems approach recognizes the importance of silicon fabrication, while underscoring the need for broader electronics manufacturing capabilities—including PCB fabrication and electronics assembly—to ensure that the U.S. can manufacture cutting edge technologies.  

“Advanced packaging” today is driving semiconductor innovation by introducing greater electronic interconnection within semiconductor packages. Electronic interconnection is a capability that has been marginalized in the U.S. but is now key to U.S. semiconductor leadership. 

“Indeed, advanced packaging is poised to play a major role in the development of chips for artificial intelligence, cloud computing, and medical applications, among many other next-generation technologies,” the Commerce Department stated earlier this year. 

However, a 2021 IPC report found the U.S. has only just begun to invest in advanced packaging, while nations in Asia have sprinted ahead to develop the lion's share of capabilities and capacity. The U.S. only accounts for 3% of global semiconductor packaging and lacks even state-of-the-practice capabilities.  

IPC has documented that an “ecosystem” approach covering several related electronics technologies is essential to achieving the goals of the CHIPS Act. For example, IPC believes the U.S. Government also must build up domestic capacity to produce advanced integrated-circuit (IC) substrates and printed circuit boards (PCBs).

“Bolstering chip production without commensurate growth in advanced packaging, PCB fabrication, and electronic assembly is likely to lengthen the supply chain and exacerbate glaring vulnerabilities in U.S. electronics manufacturing,” says Chris Mitchell, IPC VP of Global Government Relations.

For more information: Advanced Packaging Semiconductors | IPC Industry Initiatives

IPC Attains U.S. Dept. of Labor Approval of its National Apprenticeship Standards, First-Ever in U.S. Electronics Manufacturing Industry

Reports five-year growth in electronics workforce programs as it celebrates National Apprenticeship Week

The U.S. Department of Labor (DOL) approved IPC’s National Program Standards of Apprenticeship – the first-ever in the U.S. electronics manufacturing industry – in a move designed to expand the skilled workforce for this strategically vital industry.  

The recognition was bestowed during a ceremony yesterday as part of National Apprenticeship Week, November 13-19. The DOL’s action ensures that IPC’s Registered Apprentice programs are recognized nationally and align with the industry’s highest standards of proficiency in electronics manufacturing. IPC is now authorized to register with each state’s Eligible Training Provider List.

National Program Standards of Apprenticeship are occupational training standards developed and sponsored by an employer, an industry organization, labor organization, educational institution, or consortium. IPC’s apprenticeship standards cover two critically important occupations – electronics assemblers and printed circuit board fabricators – and provide valuable, hands-on experience with a defined pathway to secure, well-paying careers in electronics manufacturing.

“More than two-thirds of IPC’s U.S. members report that an inability to find and retain skilled workers is limiting their growth and global competitiveness,” said John W. Mitchell, IPC president and CEO and author of Fire Your Hiring Habits. “The Department of Labor’s endorsement of IPC’s apprenticeship standards will help foster a larger, more skilled, and more diverse workforce. We are excited about the positive impacts on workers, their communities, and the electronics manufacturing industry.”

IPC Celebrates National Apprenticeship Week

To mark National Apprenticeship Week, Mitchell issued a proclamation calling on IPC members to become Workforce Champions and expand workforce education programs. Six companies – ASMPT (Georgia, Massachusetts), Calumet Electronics (Michigan), Flex (Texas), Microboard (Connecticut), Out of the Box Manufacturing (Washington) and TTM Technologies (California) – have already endorsed the apprenticeship initiative to the DOL, signaling their interest in launching programs within their companies. 

Mitchell will host a discussion this afternoon for North American industry executives with U.S. Rep. Suzanne Bonamici (D-OR), founder and co-chair of the bipartisan Congressional STEAM Caucus; co-chair of the Congressional Apprenticeship Caucus; and co-chair of the Congressional Career and Technical Education Caucus.

IPC is also sharing the results of its Workforce Champions initiative, launched in 2018 with a goal of expanding IPC’s education programs. Despite the COVID-19 pandemic, the following achievements were met over the last five years:

  • Jobs: Overall, the U.S. electronics industry added more than 75,000 jobs, exceeding the association’s 2018 projection by 50 percent.
  • Credentials: More than 300,000 individuals have earned career-enhancing credentials by participating in IPC education programs and earning IPC certifications.
  • Secondary and Post-Secondary Education: The IPC Education Foundation facilitated the completion of introductory courses by 4,000 college students; the exposure of 6,000 high school and college students to industry skills; and the distribution of $250,000 in scholarships and awards.

IPC also launched a pilot program to equip more than 200 high school students with essential skills for jobs in the electronics assembly sector. Aligned with DOL standards, this opportunity provides rigorous training through career and technical education (CTE) programs and encourages students to enter apprenticeship programs after high school. Looking ahead, IPC is scaling these programs to additional high schools, community colleges and universities across the country.   

More information about IPC’s apprentice programs and other educational programs can be found at:

Attendees Can Maximize Their Connections Through Networking Functions at IPC APEX EXPO 2024

IPC APEX EXPO 2024 attendees can expand their global network and meet with electronics industry innovators and connect with peers throughout the show floor, in technical conference sessions, professional development courses, standards development meetings, special networking events, and social receptions at the Anaheim Convention Center, April 6–11, 2024. Registration is now open.

“Together and under one roof for the first time in over a decade, IPC APEX EXPO 2024, host to the 16th Electronic Circuits World Convention (ECWC) technical conference, will be the largest gathering of industry leaders, manufacturing innovators, and subject matter experts in North America,” said Alicia Balonek, IPC’s senior director of trade show and events. “Thousands of attendees from 60+ countries will come together in Anaheim and experience extraordinary global networking and educational opportunities packed with insights to explore what’s next becomes now.

Among the highly anticipated special events are the newcomer’s reception; a new ECWC Welcome Reception;  the Women in Electronics reception featuring a panel discussion lead by IPC Hall of Famer, Karen McConnell, Northrop Grumman, who will cover work/life balance issues; three event luncheons with the Monday luncheon featuring a keynote presentation by IPC Chief Economist Shawn Dubravac and the Wednesday luncheon featuring IPC President and CEO John W. Mitchell who will give a keynote on the future of the human workforce; show floor events, and more.  

Added Balonek, “Special events at IPC APEX EXPO provide tremendous value for attendees. This is what makes IPC APEX EXPO a must-attend event.”

The event essentials pass as well as access to the exhibit hall is free to those who register by April 6, a savings of $50 on-site. Attendees who register by March 1 will save 20 percent off registration fees. In addition, attendees who register for the All-Access Package will receive a significant percentage – 70 percent off – a la carte options. Schedule and registration details are available at www.IPCAPEXEXPO.org.

Unpacking the TSCA PFAS Reporting Rule – Impacts on the Electronics Sector

Date
- (11:00am - 12:00pm CST)

This webinar will provide an overview of the new one-time EPA reporting rule on PFAS under the Toxic Substances Control Act. The new rule will have a significant impact on electronics producers and importers, because of (a) the widespread use of PFAS within the electronics supply chain; (b) the very expansive definition of PFAS in the rule, which includes commonly used polymers; and (c) EPA’s decision to include imported articles within the scope of the rule.

Speakers Ryan Carra and Russ LaMotte from law firm Beveridge & Diamond will provide an overview on:
• what the rule requires
• what it does not require
• some of the areas of remaining ambiguity, and
• strategies for the electronics sector to address these obligations and navigate those ambiguities.