Unlocking Funding for IPC’s Registered Apprentice Program: Electronics Manufacturing
Date
-

Join Victoria Hawkins and Cory Blaylock as they explain the funding landscape for IPC's registered apprentice program. This session is for the electronics industry and IPC members who seek to improve their workforce training but are hindered by workforce development costs, specifically as it relates to apprenticeship. 

This webinar will describe available apprenticeship funding opportunities to support your workforce development costs. We aim to demystify these funding opportunities and make them more accessible. We understand that navigating the labyrinth of government funding can be overwhelming, which is how IPC can help.

Webinar Key Takeaways

  • Understanding Funding Sources: Learn about the various federal, state, and local funding programs available for apprenticeships. 
  • Navigating the Funding Process: Gain insights into the intricacies of this process. Our experts will guide you through the steps involved, from initial research to receiving reimbursement for workforce training expenditures.
  • Best Practices and Strategies: Discover strategies to optimize funding opportunities.  We will share tips on articulating your training needs effectively and demonstrating the potential impact of the funding on your workforce.
  • Q&A Session: Have your questions answered by our panel of experts. This is your opportunity to seek advice specific to your organization’s needs.
Presenter Bios

Victoria Hawkins 

Vickie Hawkins

As the Director of Workforce Grants and Proposals at IPC International, I am leading impactful initiatives, leveraging my extensive expertise in the field. My professional journey, deeply rooted in the realm of Education, has provided me with diverse opportunities to support the workforce landscape.  
Throughout my career, I have had the privilege of collaborating with National Associations in Accreditation and State committees, actively contributing to the development of state early learning standards, Quality Rated Indicator Systems, and several workforce training initiatives on a state and national level. Working closely with both State and non-profit agencies, I have successfully written and managed a variety of funding opportunities, including federal grants. This experience has not only honed my grant writing and management skills but has also allowed me to make a tangible impact on educational and workforce development programs.
Over the past several years, I have taken immense pleasure in providing direct support and instruction to public, private, and non-profit entities. Whether securing grant funds or engaging in advocacy and legislative efforts, my commitment to excellence has remained unwavering.
I eagerly anticipate the opportunity to contribute to the workforce development landscape and am committed to making a meaningful impact on our future. 
 

Cory Blaylock 

Cory Blaylock Headshot

With a wealth of experience, I currently serve as the Director of Workforce Partnerships at IPC, where I've been leading impactful initiatives since April 2023. In my 8-month tenure, I've showcased expertise in CTE, grant funding, project management, apprenticeship navigation, technical training, leadership, and workforce development. 

Before IPC, my career at Lockheed Martin spanned 8 years, where I excelled in project management and planning operations. My responsibilities included apprenticeship navigation, STEM initiatives, community outreach, and overall workforce development. I held roles as a Sr. Training & Development Representative. Technical Trainer and Engineering Planner, contributing significantly to the company's success. 
Before Lockheed Martin, I contributed my skills to STEMscopes by Accelerate Learning, Inc. as a Contributing Writer/Consultant for 6 years. During this time, I also served as an Educator in Texas Independent School Districts for twelve years, specializing in bilingual education, instructional technology, teacher mentoring, and science education.

My journey in workforce development is deeply rooted in a passion for education and a commitment to fostering impactful collaborations between industry and academia. 
 

IPC Masters 2024
Date
- (Jul 7, 2024 | 8:30pm - Jul 10, 2024 | 4:00am CDT)

To meet the needs of China's electronics industry, IPC Asia and Pudong New Area Association For Quality And Technology Shanghai, will jointly organize a comprehensive skill competition event – IPC Masters 2024 in Shanghai, China. IPC Masters will include Hand Soldering Competition (HSC), Cable and Wire Harness Assembly Competition (CWAC), BGA/BTC (Ball Grid Array/Bottom Termination Components) Rework Competition and IPC Standard Knowledge Competition.

IPC Masters aims to provide a valuable platform for operators in the electronic industry across China to enhance their skills and showcase their talents. Through this competition, contestants will have the opportunity to learn and apply their skills, contributing to the promotion of quality and technical standards in China's electronics manufacturing industry. The event also plays a pivotal role in talent development, enabling participants to step onto the international stage and demonstrate the strength and charm of China's skilled craftsmen.

Organizers

IPC and Pudong logos

Strategic Partner

MESSE logo

Venue 

Shanghai New International Expo Center
electronica China 2024
IPC Booth Number: Hall C2-2900

Participants

Electronics enterprises in military, aerospace, rail transportation, automotive electronics, communication/consumer electronics, etc.

Competition Categories

  1. IPC Standards Knowledge Competition (Online)
  2. Hand Soldering and Rework Competition (HSRC)
  3. Cable and Wire Harness Assembly Competition (CWAC)
  4. BGA/BTC Device Rework Competition 

Premier Sponsor 

Supporting Sponsors 

For more information or event sponsorship, please contact marketingchina@ipc.org

electronica China

2345 Longyang Rd
ShiJi GongYuan
Pudong Xinqu
Shanghai Shi, 201204
China

IPC WorksAsia Thailand 2024
Date
- (Aug 8, 2024 | 9:00pm - Aug 9, 2024 | 4:00am CDT)

IPC WorksAsia – Quality & High Reliability Conference Thailand

Get practical methodologies that can be deployed today to enhance your operations

Quality & High Reliability are critical when electronics assemblies are working in harsh environments where there is high temperature difference, vibration; and components get smaller and demand for high reliability products increases. IPC has brought together an international panel of experts for this inaugural conference in the heart of Southeast Asia to discuss:

  • Critical areas of the assembly process and
  • How design and materials choices will affect cost, reliability and turnaround time.

These important one-day events will focus on advanced research results, practical methodologies and standards in the automotive, industrial and other electronic fields — critical information for engineers and managers responsible for reliability.

Date: August 9th, 2024
Time: 8:30 – 16:30
Place: Avani Sukhumvit Bangkok Hotel - 2089 Sukhumvit Rd, Prakanong Nua Watthana, Bangkok

Register for free! (Maximum 3 per company)
Closing Date for Registration: August 2, 2024

For more information, please contact: Tharinee Butmuang Jib, JibButmuang@ipc.org

Conference Agenda

8:20 – 9:10 Registration & Morning’s snack with Coffee/ Tea
9:20 – 9:30 Welcome/ Opening Address
            Mr. Raymond Foo – Director, IPC Southeast Asia
9:30 – 10:15 Breakthrough Cleaning Challenge For Advanced Packaging
            Mr. Tan Lip Sin - Application Manager, Zestron South Asia
10:15 – 11:00 The Trend to Low Temperature Solder (LTS) Assembly and the Development Strategy for Tin-Bismuth based High Reliability LTS solder
            Mr. Takatoshi Nishimura - Technical Manager, Nihon Superior Co., Ltd.
11:00 – 11:45 Optimizing Under-Stencil Fluid Delivery Settings for Superior SMT Printing Results
            Mr. TC Loy, B.Eng. - Regional Manager of North Malaysia, Kyzen Corporation
12:00 – 13:15 Buffet Lunch
13:30 – 14:15 Reliability of Automotive Electronics:  How IPC Standards Help the Industry
            Mr. David W. Bergman - VP Standards & Technology/ Executive Director WHMA, IPC
14:15 – 15:15 IPC Standards & Training Program – Updates & Case Studies
            Mr. Phuong Dang Ho - Master IPC Trainer, IPC Southeast Asia
15:15 – 15:40 Q&A Session, Conclusion & Group photo
15:40 – 16:30 Coffee & Tea Break/ Networking Session

  • IPC reserves the right to select participants and final explanation.
  • Guest speakers and topics content are subject to change without notice.
  • The program is conducted in English, without interpretation.

Conference Presenters

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Mr. Tan Lip Sin
Application Manager of Zestron South Asia

Tan Lip Sin has his professional interests focused on high precision cleaning, plasma etching, wet chemical etching in the Wafer Fabrication and Semiconductor Industry. He is an active member of the SMTA and has been with ZESTRON since Year 2020. Mr. Tan received his Bachelor’s Degree in Chemistry from the University of Science Malaysia.

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Mr. Takatoshi Nishimura
Technical Manager, Nihon Superior Co., Ltd, Osaka, Japan 

Takatoshi Nishimura has been working in Nihon Superior since 2012.

He is a technical manager and engaging to solve the customer’s soldering technical issues in assembly service. Recently the speaker has also been actively involved and directed the low temperature soldering material and process development.

A person in a suit and tie

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Mr. TC Loy, B.Eng.
Regional Manager for North Malaysia, Kyzen Corporation

Loy graduated with honors from Liverpool John Moore’s University in Electronics Engineering and has 19 years of experience in the Electronics and Semiconductor Assembly Industry.

He is based in Penang and supports Electronics and Semiconductor manufacturers in Northern Malaysia in developing and maintaining cleaning processes.

A person in a suit and tie

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Mr. David Bergman
Vice President of Standards and Technology - IPC/ Executive Director WHMA

 David W. Bergman is Vice President of Standards and Technology for IPC and has been with the organization for over 40 years and is currently responsible for IPC’s Global Standardization Program, Standards Validation and IPC’s trade shows in USA. David also serves as Executive Director of the Wiring Harness Manufacturer’s Association (WHMA) an IPC council of IPC.

A person wearing a tie

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Mr. Phuong Dang Ho
Master IPC Trainer, IPC Southeast Asia

Over 19 years working experience in process engineering, new product development, engineering consultancy and training. Extensive knowledge of electronics industry such as SMT technology, through hole technology, conformal coating, clean room, ESD control, MSD control, component identification, manual soldering, 5S, and IPC Standards. Mr. HO has been conducting IPC Training for more than 13 years. 

Gold Sponsors

Nihon Superior

Kyzen

Zestron

IPC WorksAsia Vietnam 2024
Date
- (Aug 6, 2024 | 9:00pm - Aug 7, 2024 | 4:00am CDT)

IPC WorksAsia – Quality & High Reliability Conference Viet Nam

Get practical methodologies that can be deployed today to enhance your operations

Quality & High Reliability are critical when electronics assemblies are working in harsh environments where there is high temperature difference, vibration; and components get smaller and demand for high reliability products increases. IPC has brought together an international panel of experts for this inaugural conference in the heart of Southeast Asia to discuss:

  • Critical areas of the assembly process and
  • How design and materials choices will affect cost, reliability and turnaround time.

These important one-day events will focus on advanced research results, practical methodologies and standards in the automotive, industrial and other electronic fields — critical information for engineers and managers responsible for reliability.

Date: August 7th, 2024
Time: 8:30 – 16:30
Venue: Ballroom 2 – 3
Place: Eastin Grand Hotel Saigon - 253 Nguyen Van Troi St., Ho Chi Minh, Vietnam

Register for free! (Maximum 3 per company)
Closing Date for Registration: August 1, 2024

For more information, please contact: Henry Ton, HenryTon@ipc.org

Conference Agenda

8:15 – 9:00 Registration & Morning’s snack with Coffee/ Tea
9:10 – 9:30 Welcome Activity & Opening Speech
            Mr. Raymond Foo – Director, IPC Southeast Asia
9:30 – 10:15 Breakthrough Cleaning Challenge For Advanced Packaging
            Mr. Tan Lip Sin - Application Manager, Zestron South Asia
10:15 – 11:00 The Trend to Low Temperature Solder (LTS) Assembly and the Development Strategy for Tin-Bismuth based High Reliability LTS solder
            Mr. Takatoshi Nishimura - Technical Manager, Nihon Superior Co., Ltd.
11:25 – 12:10 Optimizing Under-Stencil Fluid Delivery Settings for Superior SMT Printing Results
            Mr. TC Loy, B.Eng. - Regional Manager of North Malaysia, Kyzen Corporation
12:15 – 13:15 Networking Buffet Luncheon
13:20 – 14:05 Testing and Calibration Technology to Improve Manufacturing Quality
            Mr. Nam Nguyen - Sales Application Manager, Fluke Corporation
14:30 – 15:10 Reliability of Automotive Electronics:  How IPC Standards Help the Industry
            Mr. David W. Bergman - VP Standards & Technology/ Executive Director WHMA, IPC
15:10 – 15:25 Coffee & Tea Break
15:25 – 16:15 IPC Standards & Training Program – Updates & Case Studies
         
 Mr. Phuong Dang Ho - Master IPC Trainer, IPC Southeast Asia
16:15 – 16:25 Conclusion & Group photo
16:25 – 16:50 Networking Session/ Demonstration

  • IPC reserves the right to select participants and final explanation.
  • Guest speakers and topics content are subject to change without notice.
  • The program is conducted in English, without interpretation.

Conference Presenters

A person in a white lab coatDescription automatically generated

Mr. Tan Lip Sin
Application Manager of Zestron South Asia

Tan Lip Sin has his professional interests focused on high precision cleaning, plasma etching, wet chemical etching in the Wafer Fabrication and Semiconductor Industry. He is an active member of the SMTA and has been with ZESTRON since Year 2020. Mr. Tan received his Bachelor’s Degree in Chemistry from the University of Science Malaysia.

A person in a suit and tieDescription automatically generated

Mr. Takatoshi Nishimura
Technical Manager, Nihon Superior Co., Ltd, Osaka, Japan 

Takatoshi Nishimura has been working in Nihon Superior since 2012.

He is a technical manager and engaging to solve the customer’s soldering technical issues in assembly service. Recently the speaker has also been actively involved and directed the low temperature soldering material and process development.

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Mr. TC Loy, B.Eng.
Regional Manager for North Malaysia, Kyzen Corporation

Loy graduated with honors from Liverpool John Moore’s University in Electronics Engineering and has 19 years of experience in the Electronics and Semiconductor Assembly Industry.

He is based in Penang and supports Electronics and Semiconductor manufacturers in Northern Malaysia in developing and maintaining cleaning processes.

Nam Nguyen

Mr. Nam Nguyen
Sales Application Manager, Fluke Corporation

Nam is well-versed in industrial process maintenance and calibration. He has consulted maintenance, instrumentation & control teams across the regions since 2012. His recent interest in calibration technology led him to further exploration in process and pressure calibration. Customer’s success motivates him to finding new solutions for new challenges.

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Mr. David Bergman
Vice President of Standards and Technology - IPC/ Executive Director WHMA

David W. Bergman is Vice President of Standards and Technology for IPC and has been with the organization for over 40 years and is currently responsible for IPC’s Global Standardization Program, Standards Validation and IPC’s trade shows in USA. David also serves as Executive Director of the Wiring Harness Manufacturer’s Association (WHMA) an IPC council of IPC.

A person wearing a tie</p>
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Mr. Phuong Dang Ho
Master IPC Trainer, IPC Southeast Asia

Over 19 years working experience in process engineering, new product development, engineering consultancy and training. Extensive knowledge of electronics industry such as SMT technology, through hole technology, conformal coating, clean room, ESD control, MSD control, component identification, manual soldering, 5S, and IPC Standards. Mr. HO has been conducting IPC Training for more than 13 years. 

Gold Sponsors

 

 

Supporting Association

Veia logo
IPC CEMAC 2024
Date
- (Oct 23, 2024 | 7:30pm - Oct 25, 2024 | 7:30am CDT)

IPC CEMAC 2024

IPC CEMAC(China Electronics Manufacturing Annual Conference), as an exclusive annual event for members in the electronics manufacturing industry, aims to promote industry development and cooperation, facilitate the application and promotion of quality and technical standards in China's electronics manufacturing, and establish an efficient, professional, and high-value international exchange platform centered around IPC international industry standards.

To promote international exchange and cooperation in the field of electronics manufacturing and explore new paths for technological innovation and industrial transformation, IPC CEMAC 2024, with the theme "Make Your Imagination Reality," encourages participants to discuss how to transform limitless creativity into actual products and technologies using digital information technology tools, inspire more innovative thinking and practice, and promote the healthy and sustainable development and technological advancement of the electronics industry.

Event Information:

  • Event Name: 2024 IPC CEMAC
  • Event Date: October 24-25, 2024
  • Event Venue: Crowne Plaza Shanghai Jinxiu - 2nd Floor (399 Jinzun Road, Pudong New Area, Shanghai, China)
  • Event Website: www.ipccemac.org
  • Registration Link: https://go.ipc.org.cn/cemac2024

Event Highlights:

  • Technical Conference: Covering innovative technologies and trends in the industry, leading the future development direction, sparking thoughts and inspiration among attendees, and witnessing industry innovation and collaboration.
  • Committee Meetings: Deepen understanding of international standards, resolve technical difficulties, and cover key standard technologies in the electronics manufacturing field. Build a platform for professional knowledge exchange, advocating for cooperation between schools and enterprises, as well as inter-company collaboration, to accelerate the innovation of new productivity in the electronics manufacturing industry.
  • Special Events: A banquet will be held to entertain partners and committee members, with recognition of outstanding members and individuals who have made significant contributions to the industry.

Schedule Overview:

Technical Conference:

  • Opening Ceremony
    Thursday | October 24 | 09:00-09:10 | Jinxiu Hall
  • Keynote Speech
    Thursday | October 24 | 09:10-12:00 | Jinxiu Hall
  • Project Inauguration Ceremony
    Thursday | October 24 | 11:30-12:00 | Jinxiu Hall
  • E-Mobility Forum
    Thursday | October 24 | 13:30-16:50 | Jinxiu Hall A
  • ESG Forum
    Thursday | October 24 | 13:30-16:50 | Jinxiu Hall B
  • Advanced Packaging Forum
    Friday | October 25 | 09:00-11:50 | Jinxiu Hall A
  • Design Forum
    Friday | October 25 | 09:00-11:50 | Jinxiu Hall B
  • IC Substrate and PCB Forum
    Friday | October 25 | 13:30-16:50 | Jinxiu Hall A
  • Factory of the Future Forum
    Friday | October 25 | 13:30-16:50 0 | Jinxiu Hall B

Committee Meetings:

  • Joint Meeting on Rail Transportation Addendum Standards of 620F & 620FR  
    Thursday | October 24 | 13:30-15:00 | Huagui Hall
  • Task Group Meeting on IPC-9541 SiP Acceptability Standards 
    Thursday | October 24 | 15:20-16:50 | Huagui Hall
  • Task Group Meeting on IPC-CFX-2591 Connected Factory Exchange(CFX) 
    Friday | October 25 | 09:00-10:00 | Huagui Hall
  • Task Group Meeting on IPC-6931 Requirements and Acceptance of Optical Module Printed Circuit Board 
    Friday | October 25 | 10:20-11:50 | Huagui Hall
  • Task Group Meeting on IPC/DAC-2552 General Electronic Components Model Based Definition (MBD) Standard
    Friday | October 25 | 13:30-15:00 | Huagui Hall
  • Task Group Meeting on IGBT 
    Friday | October 25 | 15:20-16:50 | Huagui Hall
  • Task Group Meeting on IPC-9111 Troubleshooting for Printed Board Assembly Processes 
    Friday | October 25 | 13:30-15:00 | Huagui Hall
  • Task Group Meeting on IPC-1401 ESG Management System Standard 
    Friday | October 25 | 15:20-16:50 | Huagui Hall
  • IPC AESC Asia Education Steering Committee
    Thursday | October 24 | 13:30-15:00 | Huamei Hall
  • IPC ASSC Asia Standards Steering Committee
    Thursday | October 24 | 15:20-16:50 | Huamei Hall
  • IPC CAEC China Automotive Electronics Committee
    Friday | October 25 | 09:00-10:00 | Huamei Hall
  • IPC CISMC China Intelligent Manufacturing Steering Committee
    Friday | October 25 | 10:20-11:50 | Huamei Hall

Special Events:

  • Friendship Luncheon
    Thursday | October 24 | 12:00-13:30
  • CIT Club
    Friday | October 25 | 10:00-12:00 | Huafei Hall
  • Committee Reception
    Friday | October 25 | 17:00-18:00 | Huafei Hall
  • IPC Asia Member Appreciation and Awards Dinner
    Friday | October 25 | 18:00-20:15 | Jinxiu Hall

Note: The schedule is for reference only. 

Sponsor List:

            Premium Sponsors: 

Quick Intelligent Equipment Co., Ltd.

Vayo (Shanghai) Technology Co., Ltd. 

Indium Corporation (Suzhou) Co., Ltd.

Taiyo Ink (Suzhou) Co., Ltd.

ZESTRON North Asia Branch

Zhangdong Business Consulting Co., Ltd

Shanghai Lan Zuo Electronic Technology Co., Ltd.

Delta Electronics, Inc. 

Supporting Sponsors: 

Meixin Testing Technology Co., Ltd

Shenzhen SAM Electronic Equipment Co., Ltd.

Dongguan Weitai Electronics Co., Ltd.

Xiamen Jissyu Solder Co., Ltd.

TSUTSUMI

SUNSDA TECHNOLOGY CO., LTD.

Guangzhou GRG Metrology & Test Co., Ltd.

Reliability Assessment Solutions (Changzhou) Co., LTD.

JBC Soldering Tools (Shanghai) Co., Ltd.

Japan Unix Co., Ltd.

KNIPEX

 

For sponsorship inquiries, please contact: MarketingChina@ipc.org.

 

IPC APEX EXPO 2024 Offers More than 100 Technical Sessions in Electronics Manufacturing

The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO 2024, features cutting-edge technical content directly influencing the $2 trillion global electronics manufacturing industry. Attendees will have more than 100 opportunities to update their technical knowledge during sessions at IPC APEX EXPO 2024 from April 6-11, 2024, in Anaheim, Calif.

“Our technical conference and professional educational program feature the highest quality technical content from technical experts representing three continents,” said Julia Gumminger, IPC manager, professional development and events. “Industry experts representing global enterprises and small companies will present novel, unpublished data and share their innovations in a wide range of fundamental and emerging topics.”

Unique to 2024, IPC APEX EXPO will host the Electronic Circuits World Convention (ECW16) Technical Conference, an expanded, global technical symposium featuring more than 70 presentations over nine technical tracks: PCB Fabrication and Materials; Design; Assembly Process and Materials; HDI uHDI and Substrates; Sustainability for Electronics; High Reliability; Factory of the Future; Emerging Technologies; and Quality, Reliability, Test and Inspection.

Authors from around the globe will present their new, unpublished results, to share developments and innovations in materials, techniques, processes across the spectrum of the electronics manufacturing supply chain. Two special technical sessions will feature invited speakers on advanced packaging and e-mobility and EV automotive. The technical conference will be held April 9-11.

IPC APEX EXPO 2024 will provide more than 30 professional development course sessions delivered by technical experts, corporate technologists, and peer leaders in the industry. The professional development courses, covering such topics as artificial intelligence, PWB design engineering, 3-D printing, Li-ion battery technology, and proactive design methods for approaching zero-field failures, will provide attendees the opportunity to build their professional and technical skills and increase their knowledge in techniques, materials, and trends in all aspects of the industry. Professional development courses will be held April 7-8, and April 11.

More information about IPC APEX EXPO 2024, including details on educational opportunities networking, schedule, travel and more is available at www.IPCAPEXEXPO.org.

Electronics Industry Welcomes Pentagon’s New National Defense Industrial Strategy

The following is a statement by Richard Cappetto, Senior Director, North American Government Relations at IPC, on the release of the National Defense Industrial Strategy (NDIS) yesterday by the U.S. Department of Defense. A fuller statement is in this IPC Blog.

“IPC is encouraged to see that the NDIS highlights several key priorities which we have been urging in recent years on behalf of the electronics industry. For example, the first pillar of the strategy sets forth eight actions to build resilient supply chains, including “continue and expand support for domestic production.” IPC believes all nations must ensure trusted, secure supply chains for essential electronics products.

“The second pillar of the strategy correctly identifies building a skilled workforce as a priority for a strong industrial base. Consistent with IPC’s policy agenda, the strategy calls for investments in upskilling and reskilling programs, better workforce pipelines into advanced manufacturing, and expansions of apprenticeship programs.”   

IPC will continue to make the case for the U.S. government to take a “silicon to systems” approach to building up the electronics supply chain and the workforce. A healthy electronics ecosystem includes advanced packaging, IC substrates, printed circuit boards (PCBs), and electronics assembly, not just semiconductor chips.