As a leading global trade association serving the electronics manufacturing industry, IPC works with the industry to develop a strong global and regional manufacturing eco-systems and resilient supply chains. Advanced semiconductor packaging requires IC substrate fabrication and directly impacts future PCB technology and assembly processes.
Keeping the supply chain from silicon-to-systems successful, IPC is the advocate for the industry bringing together a wide variety of technologies to remain healthy and strong.
Building Advanced Packaging Capabilities for the 21st Century
Advanced semiconductor packaging requires IC substrate fabrication and directly impacts future PCB technology and assembly processes.
Outsourced Semiconductor Assembly and Test (OSAT) requires expansion in capacity/capability to drive an end-to-end packaging ecosystem.
A healthy, capable assembly ecosystem is needed to combine various technologies to manufacture finished products. Any disruptions or bottlenecks within this end-to-end ecosystem can lead to delays in new products and innovations. Therefore, it takes all elements within the supply chain-from silicon to systems-to successfully produce electronic hardware products and meet customer and market demands.