IPC Hosts Advanced Packaging Symposium in Tokyo

The IPC Advanced Packaging Symposium held in Tokyo on June 7, 2024, brought together leading experts, policy makers and other stakeholders from the semiconductor industry to discuss cutting-edge advancements and collaborative strategies shaping th

IPC Issues Call for Participation for IPC APEX EXPO 2025

IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2025.

EWPTE 2024 Draws Nearly 3,000 Attendees

This year, the cable and wire harness manufacturing industry came to “harness the future” at the Electrical Wire Processing Technology Expo (EWPTE), held May 14-16 at Baird Center in Milwaukee, Wis., and left inspired with access to new technologi

North American PCB Industry Sales Down 23.8 Percent in March

IPC releases PCB industry results for March 2024
IPC announced today the March 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.13.

Record Numbers of Exhibitors to Showcase their Products and Services at EWPTE 2024

WHMA/IPC announces that 215 exhibitors spanning over 50,000 nsf of exhibit space will introduce new product technologies, innovations and demonstrations of the electrical wire harness, wire, coil winding and cable processin

IPC Design Competition Champion Crowned at IPC APEX EXPO 2024

At IPC APEX EXPO 2024 in Anaheim, Calif., five competitors squared off to determine who was the best of the best at PCB design.