IPC, with the support of Research Fab Microelectronics Germany (FMD), is organizing the Workshop on Component-to-System Level Packaging – Addressing Integration Challenges for

On May 16, 2025, IPC hosted a high-level Industry Leaders Luncheon in Taipei, bringing together nearly 60 prominent representatives from government agencies, industry

“Made in India” was a central phrase at EWPTE 2024. The wire harness event hosted the inaugural “India Pavilion” which showcased Indian wire harness companies on the exhibit

WHMA's Annual Global Leadership Summit proved to be a resounding success, drawing in over 200 professionals from the wire harness and electronics industries to engage in

CES 2024 truly showcases the best of electronics innovation for today and tomorrow. It’s exciting to be here. One of my biggest takeaways from today is how absolutely

As CES kicks-off the new year in Las Vegas, the world looks forward to learning about the latest breakthrough electronic technologies that will shape our future.

To help the industry better address the challenges of Industry 4.0 and transition towards digital intelligent manufacturing, IPC, in collaboration with Continental Automotive

e-Mobility is a challenging new paradigm for electronics design. Regardless of industry, automotive, two-wheeler, vertical takeoff and landing (VTOL), rail, or marine, e