Components to Systems: Integration Needs, Gaps, Challenges, and Solutions
HIR Session with Joint Participation by IPC at 75th Electronic Components and Technology Conference (ECTC) May 27, 2025 - 3:30pm – 5:00pm
IPC EMS Advocacy Day and Public Policy Roundtable
Date: June 3-4, 2025June 3 | 3:00 pm – 6:00 pm: Issues Roundtable (venue TBA)6:00 pm – 8:00 pm Networking Dinner (venue TBA)
IPC Day Mil-Aero Toulouse
IPC Day Mil-Aero Toulouse – 4-5 June 2025Wednesday 4 June 13:00-17:00 and Thursday 5 June 9:00-13:00
Omnibus Package on Sustainability Reporting - What Should the Electronics Industry Expect
On 26 February 2025, the European Commission (EC) published the first ‘Omnibus’ package intended to simplify EU sustainability reporting rules related to the EU Green Deal.
Component-to-System Level Packaging - Addressing Integration Challenges for Automotive & Industrial Applications
Sponsorship Packages are available for the workshop on Component-to-System Level Packaging - Addressing Integration Challenges for Automotive and Industrial Applications.
Advanced Packaging to System Integration – Trends and Challenges
Advanced Packaging to System Integration – Trends and Challenges Speaker:Dr. Devan Iyer, Chief Strategist, Advanced Packaging, IPC