Component-to-System Level Packaging - Addressing Integration Challenges for Automotive & Industrial Applications
Sponsorship Packages are available for the workshop on Component-to-System Level Packaging - Addressing Integration Challenges for Automotive and Industrial Applications.
Advanced Packaging to System Integration – Trends and Challenges
Advanced Packaging to System Integration – Trends and Challenges Speaker:Dr. Devan Iyer, Chief Strategist, Advanced Packaging, IPC
IPC WorksAsia-AI & Factory of the Future
AI and IPC standards empower future factories - building a new smart manufacturing ecosystem.
IPC Taiwan Member Appreciation Dinner
IPC Taiwan Member Appreciation Dinner
IPC EMS Advocacy Day and Public Policy Roundtable
Date: September 8-9, 2025September 8 | 3:00 pm – 6:00 pm: Issues Roundtable (venue TBA)6:00 pm – 8:00 pm Networking Dinner (venue TBA)
IPC Builds-Standards Development Committee Meetings
We can’t wait to welcome you to IPC Builds, September 13-18, 2025 at the Embassy Suites by Hilton Denton Convention Center in Denton, Texas.