IPC Builds-Standards Development Committee Meetings

PRODUCT ASSURANCE

8:00 am-5:00 pm

Room 2C: 5-22A and 7-31B IPC-J-STD-001 and IPC-A-610 Task Groups
J-STD-001 and IPC-A-610 revision development for assembly soldering processes and acceptance.

Room 1D: D-33A and 7-31A IPC-6012 and IPC-A-600 Task Groups
IPC-6012 and IPC-A-600 revision development for printed board fabrication processes and acceptance.

PRODUCT ASSURANCE

8:00 am-10:00 am

Room 5: 7-31FHV IPC/WHMA-A-620 Task Group
Developing a standard for high voltage cable applications in the electric mobility industry.  

Room 7A: 7-32C Electrical Continuity Testing Task Group
IPC-9252 revision development for electrical continuity testing concepts and guidelines.

Room 6: D-33 Performance Standards Subcommittee
IPC-6011 revision development for printed board performance.

8:00 am-12:00 pm

Room 2C: 7-31F IPC/WHMA-A-620 Task Group  
IPC/WHMA-A-620 revision development for cable and harness processes and acceptance.

1:30 pm-3:00 pm

Room 4: 4-14F Final Finishes for Printed Boards – ENEPIG Task Group
Discussing development of requirements for ENEPIG finishes for printed boards.

Room 2C: 7-31FT IPC/WHMA-A-620 Training Committee
IPC/WHMA-A-620 Certification Program training materials discussion, development, evaluation and revision.

1:30 pm-5:00 pm

Room 8A: 7-31J Electronic Box Assemblies Task Group
IPC-A-630 revision development for electronic enclosures (box build).

ASSEMBLY AND JOINING

8:00 am-10:00 am

Room 8A: 5-21H Bottom Termination Components (BTC) Task Group
IPC-7093 revision development for design and assembly challenges for implementing Bottom Termination Components (BTCs).

Room 4: 5-23B Component and Wire Solderability Specification Task Group
J-STD-002 revision development for component lead, termination, lug, terminal and wire solderability.

10:15 am-12:00 pm

Room 4: 5-23A Printed Circuit Board Solderability Specifications Task Group
J-STD-003 revision development for printed board solderability.

10:00 am-5:00 pm

Room 5: 7-31BV J-STD-001 and IPC-A-610 Automotive Addendum Task Group
J-STD-001 and IPC-A-610 Automotive Addendum revision development.

BASE MATERIALS

8:00 am-12:00 pm

Room 3: 3-11A IPC-4101 Task Group
IPC-4101 revision development for base materials.

1:30 pm-3:00 pm

Room 3: 3-12D Woven Glass Reinforcement Task Group
IPC-4412 revision development for performance of woven glass fabrics and their effect on laminate and prepreg manufacture.

1:30 pm-5:00 pm

Room 1C: 5-33A Conformal Coating Task Group
IPC-CC-830 revising development for qualification and performance of electrical insulating compound for printed board assemblies and the associated test methods.

3:15 pm-5:00 pm

Room 3: 3-12E Base Materials Roundtable Task Group
Generate ideas for task groups involved in printed base materials.

CLEANING AND COATING

8:00 am-12:00 pm

Room 1C: 5-32G Residue Assessment Task Group
Discuss methods of evaluation and assessment of residues found on printed boards and printed board assemblies.

ELECTRONIC PRODUCT DATA DESCRIPTION

8:00 am-11:00 am

Room 8B: 2-17A and 2-17B IPC-2591 and IPC-HERMES-9852 Joint Task Group
IPC-HERMES-9852 revision development for omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.

8:00 am-12:00 pm

Room 1D: 2-18 Supplier Declaration Subcommittee
Discuss the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration.

11:00 am-12:00 pm

Room 8B: 2-12C Cybersecurity Protection Standard Task Group
IPC-1792 revision activities for cybersecurity management in the manufacturing industry supply chain.

3:15 pm-5:00 pm

Room 7B: 2-19A Critical Components Traceability Task Group
IPC-1782 revision development for manufacturing and supply chain traceability of electronic products.

PROCESS CONTROL

8:00 am-12:00 pm

Room 7B: 7-31M Fiber Optic Cable Acceptability Task Group
IPC-A-640 and IPC-D-640 revision activity for optical fiber, optical cable and hybrid wiring harness assemblies.

MANAGEMENT

10:00 am-12:00 pm

Room 8A: V-TPAC IPC Training Program Advisory Committee
Advising IPC on the development, maintenance and creation of IPC Certification and Training programs and reviews, supports and aligns the activities of the IPC Certification and Training Committees with IPC strategy.

DATA GENERATION & TRANSFER/DOCUMENTATION

10:15 am-5:00 pm

Room 7A: 2-40 Electronic Documentation Technology Committee
Developing strategies and recommendations for the conversion of design and manufacturing information into electronic formats representing final product.

1:30 pm-5:00 pm

Room 8B: 2-18A Generic Requirements for Declaration Process Management Task Group
Developing the format and XML characteristics for material and substance declaration.

RIGID PRINTED BOARDS

10:15 am-12:00 pm

Room 6: D-33-AP Ultra HDI Subcommittee
Developing design and fabrication guidelines for printed board utilizing conductors and spacings below 50 µm and dielectric spacings below 75 µm as Ultra HDI within the Subcommittee) that are manufactured with semi-additive and modified semi-additive processing.

3:15 pm-5:00 pm

Room 6: D-35 Printed Board Storage and Handling Subcommittee
IPC-1601 revision activities printed board handling and storage guidelines.

PRINTED ELECTRONICS

1:30 pm-3:00 pm

Room 7B: D-61B and D-64B Rigid Printed Electronics Design Standard and Printed Electronics on Rigid Substrates Performance Specification Joint Meeting
IPC-2294 and IPC-6904 revision activities for design, qualification and performance of printed electronics on rigid substrates.

TERMS AND DEFINITIONS

1:30 pm-3:00 pm

Room 6: 2-30 Terms and Definitions Committee
IPC-T-50 revision activities for terms and definitions for interconnecting and packaging electronic circuitry.

FABRICATION PROCESSES

3:15 pm-5:00 pm

Room 4: 4-14B Final Finishes for Printed Boards - ENIG Task Group
IPC-4552 revision activities in the development of technical information, guidelines and testing techniques to evaluate electroless nickel / immersion gold (ENIG) as a surface finish for printed boards and interconnecting substrates.

3:00 pm -5:00 pm

Room 2C: 7-34B: IPC-7731 Task Group

3:15 pm-5:00 pm

Room D1: Faces of the Future

PRODUCT ASSURANCE

8:00 am-10:00 am

Room 8B: 7-34 Repairability Subcommittee
IPC-7711/21 revision development for rework, modification and repair.

9:30 am-12:00 pm

Room 3: 7-35 Assembly and Joining Handbook Subcommittee
IPC-AJ-820 revision development for a handbook on assembly and joining.

10:00 am-12:00 pm

Room 1C: 7-31BT IPC-A-610 Training Committee
IPC/WHMA-A-610- Certification Program training materials discussion, development, evaluation and revision.

1:30 pm-3:00 pm

Room 1C: 7-34T IPC-7711/21 Training Committee
IPC-7711/21- Certification Program training materials discussion, development, evaluation and revision.

ASSEMBLY AND JOINING

1:30 pm-3:00 pm

Room 1D: 5-22F IPC-HDBK-001 Task Group
IPC-HDBK-001 revision development for a handbook for J-STD-001.

Room 5: 5-24C Solder Alloy Task Group
J-STD-006 revision development for solder alloys.

BASE MATERIALS

8:00 am-10:00 am

Room 6: 3-12A Metallic Foil Task Group
IPC-4562 revision development for metal foil for printed wiring applications

10:15 am-12:00 pm

Room 8B: 3-14A IC Substrate Task Group
Development of IPC-6921 for IC substrates.

CLEANING AND COATING

8:00 am-10:00 am

Room 1C: 5-33F Potting and Encapsulation Task Group
IPC-HDBK-850 revision activities for guidelines for design, selection and application of potting materials and encapsulation processes used for printed board assemblies.

10:00 am-12:00 pm

Room 7B: 5-33B Solder Mask Performance Task Group
IPC-SM-840 revision activities for qualification and performance of permanent solder mask and flexible cover materials and the associated test methods.

10:00 am-3:00 pm

Room 2C: 5-33C Conformal Coating Handbook Task Group
IPC-HDBK-830 revision activities for design, selection and application of conformal coatings guidelines.

ELECTRONIC PRODUCT DATA DESCRIPTION

7:30 am-9:30 am

Room 7A: 2-15F Obsolete and Discontinued Product Task Group
J-STD-048 revision activities for product discontinuance throughout the supply chain.

8:00 am-10:00 am

Room 4: 2-12B Model Based Definition (MBD) for Digital Twins Task Group
IPC-2552 revision activity for model-based design (MBD) for digital twin factories.

1:00 pm-3:00 pm

Room 8A: 2-19B Trusted Supplier Task Group
IPC-1791 revision activity for trusted electronic designer, manufacturer and assembler requirements.

1:30 pm-3:00 pm

Room 4: 2-18B Materials Declaration Task Group
IPC-1752 revision activity for materials declaration.

PROCESS CONTROL

10:00 am-12:00 pm

Room 5: 7-24B Printed Board Assembly Process Handbook Task Group
IPC-9111 revision activity for a printed board assembly process handbook providing problems, process causes and possible corrective actions that may be taken.

1:00 pm-3:00 pm

Room 7B: 7-24A Printed Board Process Effects Handbook Task Group
IPC-9121 revision activity for a printed board process handbook providing problems, process causes and possible corrective actions that may be taken.

DATA GENERATION & TRANSFER/DOCUMENTATION

9:30 am-12:00 pm

Room 7A: 2-18A Generic Requirements for Declaration Process Management Task Group
Developing the format and XML characteristics for material and substance declaration.

RIGID PRINTED BOARDS

7:30 am-9:30 am

Room 3: V-ESDS ESDS Control Plan
Developing an ESDS Control Plan for Electrostatic Discharge

8:00 am-12:00 pm

Room 1D: D-31B IPC-2221 2222 Task Group
IPC-2221 and IPC-2222 revision activities for generic printed board design requirements and for rigid organic printed boards.

Room 8A: 8-80 Lead Free Electronics Risk Management (PERM) Council
Discussing managing and mitigating the risks of lead-free electronics assemblies.

10:00 am-12:00 pm

Room 4: 2-12D Digital Sustainability Credentials Standard Task Group
Developing IPC-2553 for digital sustainability credentials.

2:00 pm-3:00 pm

Room 3: D-32 Thermal Stress Test Methodology Subcommittee
Maintenance of IPC-TM-650 Method 2.6.27 for thermal stress of bare printed board/test coupon samples by way of convection reflow assembly simulation.

PRINTED ELECTRONICS

1:00 pm-3:00 pm

Room 7A: D-67A Acceptability of Additively Manufactured Electronics Specification and Additively Manufactured Electronics Performance Specification Joint Task Group Meeting
Activity Developing IPC-6905 and IPC-6911 for qualification, performance and acceptability of additively manufactured electronics (AME).

PRODUCT RELIABILITY

10:00 am-12:00 pm

Room 6: 5-32E Conductive Anodic Filament (CAF) Task Group
Exploring Conductive Anodic Filament (CAF) growth and other ECM failure mechanisms within a printed board.    

1:30 pm-3:00 pm

Room 8B: 6-10D SMT Attachment Reliability Test Methods Task Group
IPC-9701 revision activities for maintaining and developing specific test and performance levels for solder attachment of surface mount devices to rigid, flexible and rigid-flex circuit structures.

EMBEDDED DEVICES

1:00 pm-3:00 pm

Room 6: D-55 and D-55A Embedded Devices Process Implementation Subcommittee and Embedded Circuity and Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task Group Joint Meeting
IPC-6017 and IPC-7092 revision activity for embedded circuitry.

PRODUCT ASSURANCE

8:00 am-10:00 am

Room 2C: 7-31FS IPC/WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
IPC/WHMA-A-620 Space and Military Addendum revision development for cables and harnesses.

10:15 am-12:00 pm

Room 8A: 7-31AT and D-33AT IPC-A-600 and IPC-6012 Training Committee
IPC-A-600 and IPC-6012- Certification Program training materials discussion, development, evaluation and revision.

Room 2C: 7-31H and 7-31K Wire Harness Design and Wire Harness Handbook Task Group Meeting
IPC-D-620 and IPC-HDBK-620 revision development for cables and harnesses.

3:15 pm-5:00 pm

Room 2C: 7-31N Manual Magnification Aides Task Group
Development of IPC-9904 for manual magnification guidelines.

ASSEMBLY AND JOINING

8:00 am-10:00 am

Room 8A: 5-22BT J-STD-001 Training Committee
J-STD-001 Certification Program training materials discussion, development, evaluation and revision.

Room 7A: 5-24B Solder Paste Task Group
J-STD-005 revision development for solder paste.

8:00 am-12:00 pm

Room 1D: 5-21M and 5-21N Cold Joining/Process-fit Standard and Handbook Joint Task Group
IPC-9797 and IPC-HDBK-9798 revision development for cold joining/press-fit processes and acceptance.

10:00 am-12:00 pm

Room 7A: 5-24A Flux Specifications Task Group
J-STD-004 revision development for flux materials.

1:30 pm-3:00 pm

Room 2C: 5-22AS J-STD-001 Space and Military Electronic Assemblies Task Group
J-STD-001 Space and Military Addendum revision development for soldered assemblies.

3:00 pm-5:00 pm

Room 7B: 5-24G Polymerics Standard Task Group
IPC-5262 revision development for polymeric applications.

BASE MATERIALS

8:00 am-12:00 pm

Room 6: 5-33A Conformal Coating Task Group
IPC-CC-830 revising development for qualification and performance of electrical insulating compound for printed board assemblies and the associated test methods.

10:15 am-12:00 pm

Room 3: 3-11J Metal Based Laminates for Printed Boards
Development of IPC-4105 for metal based laminates for printed boards.

ELECTRONIC PRODUCT DATA DESCRIPTION

8:00 am -12:00 pm

Room 4: 2-18B Materials Declaration Task Group
IPC-1752 revision activity for materials declaration.

10:15 am-12:00 pm

Room 8B: 2-12A Generic Requirements for Digital Twin Task Group
IPC-2551 revision activity for an international standard for digital twin architecture.

Room 5: 2-16 Digital Product Model Exchange (DPMX) Subcommittee
IPC-2581 revision activities requirements for printed board assembly products manufacturing description data and transfer methodology.

1:30 pm-5:00 pm

Room 4: 2-18J Lab Report Declaration Task Group
Development a standardized lab report format for gathering and communicating information on testing data for chemicals and products.

Room 5: 2-16D IPC-2581 Users Task Group
This IPC-2581 Consortium will continue working on facilitating the use of IPC-2581 in the industry.

PROCESS CONTROL

1:30 pm-3:00 pm

Room 3: 7-25A Automated Optical Inspection Process Control Standard Task Group
Developing IPC 9716 for requirements for automated optical inspection (AOI) process control for printed board assemblies.

3:15 pm-5:00 pm

Room 3: 7-25B AOI Process Control for IC Substrates Standard Task Group
Developing IPC-9712 for requirements for automated optical inspection (AOI) process control for integrated chip substrates.

DATA GENERATION & TRANSFER/DOCUMENTATION

1:30 pm-3:00 pm

Room 8A: 6-10J Design Guidelines for IoT-Based Products Task Group
Developing IPC-2232 for guidelines for printed board design and manufacturing of IOT products.

HIGH SPEED/HIGH FREQUENCY INTERCONNECTIONS

8:00 am-10:00 am

Room 3: D-22 High Speed High Frequency Board Performance Subcommittee
IPC-6018 revision activity for qualification and performance for high frequency (microwave) printed boards.

1:30 pm-3:00 pm

Room 7A: D-23 High Speed High Frequency Base Materials Subcommittee
IPC-4103 revision activity for high speed high frequency base materials.

FLEXIBLE AND RIGID PRINTED BOARDS

8:00 am -10:00 am

Room 8B: D-15 Flexible Circuits Test Methods Subcommittee

10:15 am-12:00 pm

Room 1C: D-12 Flexible Circuits Specifications Subcommittee
IPC-6013 revision activities for flexible and rigid flexible printed boards.

1:30 pm-3:00 pm

Room 8B: D-11 Flexible Circuits Design Subcommittee
IPC-2223 revision activities for design of flexible and rigid flexible printed boards.

3:15 pm-5:00 pm

Room 8B: D-13 Flexible Circuits Base Materials Subcommittee 
IPC-4202, IPC-4203, IPC-4204 and IPC-FC-234 revision activities.         

TESTING

1:30 pm-3:00 pm

Room 6: 7-12 Microsection Subcommittee
Test Method 2.1.1 discussion on maintenance and development of concepts, guidelines and tutorials for manual and automated microsection preparation used to evaluate printed board and assembly quality.

PRINTED BOARD DESIGN TECHNOLOGY

1:30 pm-3:00 pm

Room 5: 1-14 DFX Standards Subcommittee
Developing guidelines for the application of industry standards in DFM (design for manufacturing), DFR (design for reliability) DFA (design for assembly), etc.

ELECTRONIC PACKAGING DESIGN

3:15 pm-5:00 pm

Room 5: 1-13 Land Pattern Subcommittee
IPC-7352 revision activity for land pattern design concepts.

PACKAGED ELECTRONIC COMPONENTS

3:15 pm-5:00 pm

Room 6: B-10A Plastic Chip Carrier Cracking Task Group
J-STD-020 revision activities for handling moisture sensitive plastic IC packages.

PRODUCT ASSURANCE

8:00 am-12:00 pm

Room 4: 7-31J Electronic Box Assemblies Task Group
IPC-A-630 revision development for electronic enclosures (box build).

ELECTRONIC PRODUCT DATA DESCRIPTION

8:00 am-10:00 am

Room 5: 2-10 Electronic Product Data Description Committee 
Developing standards and guidelines in computer data format standardization.

10:00 am-12:00 pm

Room 5: 2-18J Lab Report Declaration Task Group
Development a standardized lab report format for gathering and communicating information on testing data for chemicals and products.

1:30 pm-5:00 pm

Room 5: 2-18H Conflict Minerals Data Exchange Task Group
Developing a standard supporting the electronic exchange of data.

PRODUCT RELIABILITY

8:00 am-10:00 am

Room 3: 3-11G Corrosion of Metal Finishes Task Group
Gathering data on corrosion of metals used in electronic assemblies with the intent to establish a long-term predictive test method and model.