Due to the ever-aggressive
miniaturization program that is rolling
through the electronics industry,the
next component that is fast approaching
this horizon is the 0.3mm CSP
• This paper will research the key elements
that influence the 0.3mm CSP deposition
process.
• Process design factors such as solder paste
stencil design and substrate will be fully
investigated.
• The impact of typical fabrication defects
associated to the fabrication of stencils will be
observed to ensure that an authentic picture
is created and not one that belongs in a
laboratory.

With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when
soldering RoHS compliant through-hole devices. Many contract electronic manufacturers and original equipment
manufacturers who have implemented lead-free soldering in production volumes have experienced the phenomenon of
copper dissolution. The ability to control this issue is paramount to assuring long-term product quality.
Many circuit board designs are predominately SMT while also containing interconnection hardware,displays and other
through-hole components. This variation in thermal component mass often requires elongated solder dwell times which
exacerbates the effects of copper erosion immediately adjacent to through-hole solder pads and plated thru-hole barrels.
Lead-free wave soldering of through-hole devices often results in a greater occurrence of first-pass solder defects due to the
differences in wetting and flow characteristics of lead-free versus conventional tin-lead solder alloys. This generally results
in a greater propensity of post-wave soldering rework and repair often performed with a static solder pot or fountain-based
soldering system with limited control over critical process parameters other than solder pot temperature,contact time and
solder flow rate.
Mini-wave selective soldering systems employing advanced solder delivery technology,solder nozzles designed for
optimized solder flow,and variable tilt angle extraction,provide an alternative for optimal solder joint formation while
minimizing copper erosion and solder bridging for a range of printed circuit board interconnection applications.
This paper addresses mini-wave application considerations such as component layout and the resulting effects on solder
nozzle design as well as other design for manufacturability considerations. The proper selection of solder nozzles and
process parameters,together with several case studies,will be reviewed to assure optimum solderability critical for lead-free
soldering applications. Proper understanding of system aspects including flux deposition,preheating techniques,solder
application and nozzle design are addressed to insure complete knowledge of the selective soldering process and successful
mini-wave applications.

C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and
commercialized by Suss MicroTec. C4NP is a solder transfer technology where molten solder is injected into pre-fabricated
and reusable glass templates (molds). Mold and wafer are brought into close proximity and solder bumps are transferred onto
the entire wafer in a single processing step. The technology is capable of fine pitch bumping while offering the same alloy
selection flexibility as solder paste printing. The simplicity of the C4NP process makes it a low cost solution for both,finepitch
FC in package as well as large pitch / large ball WLCSP (wafer level chip scale package) bumping applications.
Solder Transfer is the key process step in C4NP technology. Wafer with capture pad and mold with filled solder is heated and
brought together at a specific temperature. This paper provides a summary of impact evaluation of wafer and mold peak
temperatures during solder transfer process. We discuss intermetallic structure of UBM and solder as well as chip pull
strength and fracture mode. We will also show the reliability results of C4NP Lead Free bumps transferred at several
different transfer temperatures and compare it with the Electroplated High Lead solder bumped high-end logic devices. The
data in this paper is provided by IBM’s packaging operation at the Hudson Valley Research Park in East Fishkill,NY

insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering
and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of
electronics with new solder alloys and often new fluxes.
The selection of soldering materials and fluxes are important as to insure high quality solder joints with lead-free solders
which tend to wet slower than leaded solders but also the process equipment must be lead-free process compatible.
Components must be lead-free and able to meet the thermal requirements of the process but also the MSL (moisture
sensitivity limits) must be observed. Board finish must be lead-free and the PCB must be able to sustain higher process
temperature cycles with no physical damage but also good solderability to enable subsequent soldering at the wave or hand
assembly.
Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. The IPC Solder Value Product
Council as the preferred option endorsed Sn96.5Ag3.0Cu0.5 (SAC305) for SMT assembly and most assemblers have
transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive
when compared to traditional leaded process for this reason many contract manufacturers and PCBA assemblers are opting
for less costly options such as tin-copper based solders for wave,selective,hand-soldering,dip tinning operations.
In recent years tin-copper based solders with a variety of elemental additives have emerged which improve the overall
properties and performance of tin-copper solders. Tin-copper solder without the incremental additions of certain elements is
rarely used but the addition of nickel or nickel and bismuth as found for example in K100 and K100LD respectively do offer
improvements in wetting,joint cosmetics and in some cases solder joint reliability.
In this conversion SAC305 was used for the reflow process,tin-copper-nickel based solder K100 was used in the wave
soldering operation and it was also used in solder wire form for hand assembly. This paper is a summary of the experience at
a medium sized assembler in achieving the customer driven mandate to go lead-free and the maintenance of production yields
and quality using both tin-silver-copper and tin-copper in the assembly of high end printer boards. Over 120,000 builds were
achieved with a 99.6% first pass yield for the overall soldering process.

Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common solutions for routing Metric Pitch and Fine Pitch BGA components.

(not available)

(not available)

(not available)

(not available)

As the entire electronic manufacturing industry braced for the July 1,2006 deadline,it has been reevaluating the entire production process. Likewise,the precision cleaning industry must also prepare for the impending deadline as lead-free solder paste formulations will increase cleaning demands. When implementing lead-free solder pastes,users’ assemblies have to be reflowed at higher temperatures,thus intensively baking-in flux residues. To improve the flow of solder at higher reflow temperatures,lead-free pastes contain increased activator content in return impacting the potential risk of corrosion. Furthermore,lead-free pastes also have increased rosin content to achieve low void rates increasing the amount of residues to be removed. Finally,several studies by the authors have determined that silver,a commonly used alloy in lead-free solder pastes,has a tendency to form dendrites. To prepare for the new cleaning demands,the precision cleaning industry must ask itself what changes to existing processes are necessary to meet the new cleaning demands. In fact,more than 15 years ago,non-ozone depleting legislation forced radical changes—changes that mirror the one presented by WEEE / RoHS now. A large number of users have previously used DI water-based cleaning processes,in which water-soluble eutectic products were cleaned. With the onset of lead-free alloys,the authors have experienced an increased demand for cleaning water-soluble lead-free products,as some residues have become water insoluble (due to lead-free soldering process specification). As a result,modifications to the current DI-water processes are necessary,and will involve chemically assisted cleaning. These new users as well as current users are now confronted with more questions,especially whether additional hardware is necessary,or whether processes need to be separated. Current legislation restricts the level of lead in lead-free assemblies to exceed 0.1% by weight. This limitation was adopted in December 2004,and also included other heavy metals such as Cadmium (0.01%),Mercury (0.1%),hexa-valent chromium (0.1%). Such stringent limitation requires tight process controls,including verification of RoHS and WEEE conformance for the cleaning process. This DOE study was therefore initiated,and begins to shine light on the potential risks associated with cleaning lead-free and eutectic assemblies in a single process also known as mixed cleaning process. An initial customer bath sample analysis was conducted to determine the levels of lead and other heavy metals commonly found in eutectic processes using MPC®-based products. It was found that lead and tin were present in various amounts. Tin and lead is a commonly known redox-pair with sufficient redox potential to facilitate the reduction of lead on lead-free assemblies. The authors decided to study this phenomenon in more detail and include the ionic contamination pathway as well. As a result this study was able to address the two most probable pathways to the incorporation of lead into lead-free assemblies