As small surface-mount components such as 0201 and 01005 packages have entered volume assembly,manufacturers are observing increased instances of poor solder coalescence during reflow. The root cause is the change in oxidation behavior at very low volumes of deposited paste. A solution is required,both to restore a high-quality appearance to solder joints and to maintain customer confidence. Comprehensive analysis of factors including material selection,print process settings,reflow profile,and factory-floor practices highlights a number of measures that engineers may apply to solve this issue cost-effectively without impairing satisfactory reflow of other components on the board.

As the frontiers of feature size and interspace between devices become ever challenging,we as an industry have to start revaluating the performance of the toolsets that are used in the SMT arena. The days have gone where a tolerance of tens of microns was acceptable; this has now moved into the sub 10-micron domain. This issue is none more critical than within the print process,it is this pre placement tool-set that is most sensitive to the miniaturisation program running through the industry.
When we take a step back and reflect on what is required from a printing process at this new level of miniaturisation,we can quickly understand that the solder paste volumes required are crossing into semicon territory. Indeed it is clearly possible to count the solder particles that makes up a 0.3mm C.S.P deposit,the scale is so small. It is therefore paramount the composition of this pre placement tool-set is fully realised.
It is the intention of this paper to break down the elements of a print platform into its major mechanical and process subsections. Within the mechanical section,the elements investigated will be co planarity of rail systems and tooling nest; whereas with the process section the elements investigated will be the composition of the squeegee assembly. Each element will be fully explored using analytical methods to comprehend the cause and effects. The separate modules will then be combined to enable an aggregate picture of the process and thus allow a conclusion of which component parts are the most critical and to what level of accuracy is required for the SMT challenges ahead.

The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs (contract manufacturers) in Asia to outsource key operations such as board design,fabrication,SMT assembly and procurement to maintain profitability and competitive edge.
Outsourcing can offer OEMs significant advantages in maintaining a healthy bottom line,reduced capital risks,increased access to current technologies and reduced time to market. Outsourcing also allows CMs and EMS (Electronic Manufacturing Services) to subcontract the work that does not fit their core competencies,so they can make diversified product.
Outsourcing with strategic partners is more important for OEMs for the lead free migration as this is bringing many challenges for the PCB and SMT industry with new high Tg (Glass transition temperature) laminates,new lead free alloys,rework processes,moisture sensitivity etc. This requires careful evaluation of new laminate materials,balancing component layout and optimization of reflow profiles to minimize damage to PWBs. This is critical for thin PWBs (less than 0.1 mm) boards used in cell phones and other portable products that use build up microvia technologies.
The handheld wireless product market place demands products that are small,thin,low-cost and lightweight and improved user interfaces. In addition,the convergence of handheld wireless phones with palmtop computers and Internet appliances is accelerating the need for functional circuits designed with miniaturized,low-cost technology.
Outsourced PWBs from Asia are becoming more and more of a reality for OEMs involved in high volume manufacturing. Proper evaluation and qualification of these facilities is critical for assembly reliability.
This paper reviews qualification efforts from HDI (High Density Interconnect)[1} and ALIVH (Any layer Inner Via Hole) PWBs [2} procured from Asian fabs in China,Taiwan,Korea and Japan. Quality systems audit,PWB evaluation,acceptance criteria,DPPM (Defective Parts Per Million) Review and reliability testing will be presented. Additionally,ways and strategies for overcoming cultural differences,communication,conflict resolution,and building supplier/ customer relationship will be reviewed.

This paper will compare the current capabilities of raw material suppliers to the PWB industry to those same capabilities 10 and 20 years ago. Key raw materials such as resin,glass fabric,copper foil,laminates and prepregs will be discussed. Supplier profitability,consolidation and globalization have all had some influence on these changes. Globalization of the supply base and changes in telecommunications has also driven the trend.
Market segments especially affected by the migration of intellectual investment to Asia are computers,telecommunications and consumer electronics. More recently automotive electronics,internet infrastructure,test equipment and even some military electronics have found the need to search outside of the US for advanced raw materials. High Speed materials and RF products have traditionally been the most innovative and performance driven materials. Current trends have pushed even those materials into the realm of cost control and reduction.
The paper will also discuss how these changes affect the long-term viability of the PWB industry in North America. What markets can prosper under these conditions and what markets have suffered. Current and future business plans and investments of these key suppliers have shifted the US from a leader to follower in all but the most specialized raw materials. The shift from innovation driven business models to efficiency driven models in the supply base is also a major reason for the shift to lower cost manufacturing.
Is this trend going to continue unabated is it irreversible or is there a place for companies with manufacturing in North America to survive? This paper will also describe how some suppliers are restructuring to deal with these changes while continuing operations in North America.

As electronics manufacturing,design and after market services evolve into as a strategic option for today’s electronics original equipment manufacturers (OEM),opportunities for further growth exist. Where outsourcing has been used significantly over the past decade by OEMs in computer systems,mobile communications,and consumer electronics,many possibilities exist within other growing industry segments for Electronic Manufacturing Service (EMS) companies.
Such include medical,industrial,aerospace,defense,and homeland security (HLS) products. We have conducted significant research in market growth,outsourcing trends,OEM selection criteria,business opportunities,and challenges for these expanding segments. In addition to statistical analysis,this research has utilized extensive interviews with industry executive in both OEM and EMS companies. This is an overview of this research,the executive interviews,and the conclusions reached regarding today’s outsourcing of the medical,industrial and aerospace/defense/homeland security sectors.

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Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common solutions for routing Metric Pitch and Fine Pitch BGA components.

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