QFN Rework Challenges in a Lead Free World IPC Midwest - Sept. 2007

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It is clear that the future belongs to the ever shrinking component. Micro Lead Frame (MLF) components,and specifically the Quad Flat No-lead (QFN) packages have gained wide scale acceptance. They tend to appear in densely populated boards where real estate is at a premium.

The design,size and assembly process of QFN’s present some unique rework challenges not seen with other components. The challenge is only greater with the use of lead-free solders. This paper/presentation will focus on the complete rework process,including component removal,site preparation,component paste printing,and finally new component soldering.

Author(s)
Neil O’Brien
Resource Type
Slide Show
Event
IPC Midwest 2007

Designing a Data Storage System for Environmental Compliance (Focusing on RoHS-type Legislation)

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As more governments pass,implement,and enforce environmental compliance initiatives covering electronics,small to
medium sized businesses continue to struggle with what data should be tracked,how to track it,and keeping current on
legislative changes. This paper will focus on how to store and organize compliance data as well as what a company should
look for in a data tracking system.

Author(s)
Krista Botsford
Resource Type
Technical Paper
Event
IPC Midwest 2007

Material Declaration Reporting - Going Proactive

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Focus: Benefits of switching from a reactive to proactive ECR system Even with the RoHS deadline come and gone,most the ECR systems employed by suppliers follow the “reactive” model. Many suppliers still wait for a request from their customer for specific data or certifications before making the data available,and in some circumstances,even compiling it. This model naturally builds in unnecessary delays,drains resources,and often breeds tensions between supplier and customer. The discussion will outline one component manufacturer’s effort to switch to a “proactive” model,using the IPC 1752 forms as it’s default reporting method. This case study will include difficulties encountered with the reactive method,how the switch was made,and the benefits already recognized. Also,how this system may need to change going forward to support new compliance reporting requirements (China RoHS,REACH,EuP,etc.) will be explored. This presentation will be of interest to virtually anyone in the supply chain,component suppliers,contract manufacturers and OEMs; anyone that must produce or gather environmental compliance data. It will address the reporting systems that may be employed,as well as the suggested “backup” system that should be in place to satisfy due diligence requirements.

Author(s)
John Cuthbertson
Resource Type
Slide Show
Event
IPC Midwest 2007

North American Environmental Compliance Attitudes Towards Electronics

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More and more countries are beginning eco-compliance legislation for electronics products. Where does the USA stand? The
rest of North America? This paper will discuss the following areas and attitudes towards environmental compliance in the
USA: levels of legislation,who is (or should be) responsible,industry association involvement,and industry standards
development.

Author(s)
Krista Botsford,John Messina,Eric Simmon,
Resource Type
Technical Paper
Event
IPC Midwest 2007