Winners of IPC Masters Competition China 2023 Announced

IPC China Skills Competition has been upgraded to IPC Masters Competition China 2023. The competition was co-organized with Pudong New Area Association for Quality and Technology Shanghai and held July 11-13 in Shanghai.

In addition to hand soldering and rework, and cable and wire harness assembly competitions, a new BGA (ball grid array)/BTC (bottom terminated component) rework competition was launched. This is the first time that three competitions have been held concurrently. The competition welcomed 297 participants from 42 companies across 17 provinces and three municipalities.

Skilled contestants competed against each other to finish a functional electronics assembly within a required time limit. The three competitions were judged strictly in accordance with the corresponding standards: IPC-A-610H, IPC J-STD-001H, IPC-7711/21C, IPC/WHAM-A-620D, IPC-7093A, IPC-7095D-WAM1 - Class 3 criteria.

Top three BGA/BTC Rework Competition winners were:

  • First Place: Wujun Li, AVIC Computing Technique Research Institute.
  • Second Place: Si Chen, Beijing Railway Signal Co., Ltd.
  • Third Place: Guojun Yu, Wistron InfoComm (Kunshan) Co. Ltd.

Top three Cable and Wire Harness Assembly Competition winners were:

  • First Place: Jieyuan Cui, Shanghai Railway Communication Co., Ltd.
  • Second Place: Xiaoqin Shi, Wuhu State Machinery Factory
  • Third Place: Dongying Xu, Wuhu State Machinery Factory

Top three Hand Soldering and Rework Competition winners were:

  • First Place: Lingling Xu, Shanghai Railway Communication Co., Ltd.
  • Second Place: Jingjing Xu, Shanghai Railway Communication Co., Ltd.
  • Third Place: Yao Tang, Shenyang Railway Signal Co., Ltd.

All those placing in the top three positions received a certificate. The top three winners of the Hand Soldering and Rework Competition qualified for the IPC Hand Soldering World Championship in Munich, Germany in November.                                               

IPC would like to thank IPC Masters Competition China sponsors and partners for their generous support this year.

  • Premier Sponsor: QUICK
  • Supporting Sponsors: POUSTO, Lian Xi Technology
  • Co-Organizer: Pudong New Area Association for Quality and Technology Shanghai

For more information on IPC Masters Competition China next year, please contact Glenn Gong, marketing director, IPC Asia, at GlennGong@ipc.org. or contact Abby Zhang, marketing manager, at AbbyZhang@ipc.org.

 

Technical Paper Writing: Industry Best Practices for Conference Manuscripts

Date
- (12:00 - 1:00pm CDT)

Using the IPC APEX EXPO Technical Conference as a model, this webinar will provide an overview of best practices for preparing technical data to write a high-quality manuscript suitable for conference presentation and publication. This tutorial is designed for anyone who wants to build their technical writing skills and share their innovations and research with a technical audience, and will have a special focus on the electronics industry. The session will highlight important advanced preparations prior to submitting an abstract or paper that should be considered by the author and their management. Using the style guideline created for IPC APEX EXPO, attendees will receive an overview of the mechanics, format, and outlines used for an effective technical paper and presentation. Also covered will be how to avoid commercialism and common pitfalls that lead to inefficiencies and reduced quality. 

Stan Rak September 28

Speaker Bio

Dr. Stanton Rak is the President of SF Rak Company and specializes in materials science and electronics manufacturing consulting for automotive applications.  Stan is currently chairing the Technical Program Committee for IPC APEX EXPO 2025. He is also a member of the IPC Thought Leaders Program 2023-24. Previously, Stan worked 29 years combined at Continental Automotive and Motorola Automotive Group in global, manufacturing technology executive roles. Stan has a PhD degree in Organic Chemistry from the University of Minnesota. He is an active member of the IPC and has chaired / co-chaired the IPC APEX EXPO Technical Program Committee 2021-2024. Stan received the IPC President’s Award in 2023 and Rising Star Award in 2016.

DART Mission Leader Ed Reynolds to Keynote IPC High Reliability Forum

Ed Reynolds, space exploration sector program manager at Johns Hopkins Applied Physics Laboratory (APL), will present his keynote address, “The DART Mission: Earth Strikes Back,” at IPC’s High Reliability Forum on October 17 in Linthicum (Baltimore), Md.

Leading NASA’s Double Asteroid Redirection Test (DART) mission, the first-ever demonstration of asteroid deflection technology, Reynolds and his team from APL, industry, academia and government, made history on September 26, 2022. DART — envisioned, built and managed by APL — changed the orbit of a celestial body for the first time in human history, successfully validating the concept of kinetic impactors as a method to protect Earth and mankind from future asteroid impacts.

During his keynote, Reynolds will discuss the overall DART mission and its development, describing the purpose of the mission and its place in the overall planetary defense strategic plan. He will also cover mission and spacecraft design and new technologies being validated, with special emphasis on the factors affecting reliability, design and implementation decisions that were made during the spacecraft’s development and flight.

Reynolds’ experience with asteroid missions runs deep. He was a systems engineer during the concept stages for NASA’s Near Earth Asteroid Rendezvous (NEAR), the first mission to orbit and land on an asteroid. Reynolds began his APL career in 1985 as a space integration and test engineer working on missions such as the Polar BEAR spacecraft, the Special Purpose Inexpensive Satellite altimeter (SALT) program’s Miniature Radar Altimeter Payload, the Nuclear Electric Propulsion Space Test Program (NEPSTP) spacecraft and the Active Geophysical Rocket Experiment (AGRE).

Reynolds has a master’s degree in project management from the George Washington University and a bachelor’s degree in electrical engineering from Virginia Tech.

For more information on IPC High Reliability Forum including agenda, speaker profiles, exhibition and sponsorship information, or to register for event, visit www.ipc.org/event/high-reliability-forum.

 

EU Should Support Other Segments of the Electronics Industry That Complement Chips, New Report Says

DG GROW is taking a closer look at the “silicon-to-systems” approach to boost Europe’s autonomy and the twin transitions

Key segments of the European electronics manufacturing industry face significant challenges and require more support, considering their vital role in Europe’s strategic autonomy and the “twin transitions” to a greener, more digital economy.  

That is the major finding of a new report from IPC, the global electronics industry association, which says the recently enacted European Chips Act is a welcome step. But “the near singular focus” on the semiconductor industry “has obscured critically important segments of the electronics ecosystem,” specifically printed circuit boards (PCB) and electronic assembly (EMS), without which semiconductors cannot function, the report says.  

Over the last 20 years, the European PCB sector experienced a steep decline, the report says, shrinking from approximately 20-30% of global production to just 2% today. Over this time, the EU has become “highly dependent on China,” which now accounts for some 65% of total EU PCB requirements.

The EMS sector has experienced “solid” average annual growth in recent years, fueled by factory investment by large global companies and also by the growth of the downstream markets the sector serves, including automotive, industrial, aerospace, defense, and healthcare. However, the EU imports roughly 90% of required EMS products and services.

“Revitalizing and growing the PCB and EMS segments is essential to building a robust European electronics manufacturing ecosystem, which in turn is essential to ensuring supply chain resiliency, advancing the twin transitions, and promoting European innovation,” said Sanjay Huprikar, president of European Operations. “It takes all elements in the supply chain—from silicon to systems—to successfully produce the electronics we all depend on in so many ways.”

The European Commission is continuing to examine vulnerabilities in its industrial supply chains. On June 23, the European Commission’s Directorate General for Internal Market, Industry, Entrepreneurship and SMEs (DG GROW) hosted a meeting on electronics assembly and printed circuit board manufacturing with key industry stakeholders, including companies from the renewable energy, aerospace/defense, automotive, and industrial sectors. The structured dialogue was called on the heels of an IPC meeting in April that brought together leaders of government and industry to press for an EU strategy to strengthen silicon-to-systems innovation and manufacturing.

IPC’s data-rich report delves into many aspects of the EU’s PCB and EMS sectors, including:

  • Europe’s reliance on the PCB and EMS sectors of other nations, especially China, and its vulnerability to global supply chain disruptions related to trade wars, health crises, and natural disasters;
  • Europe’s leadership and opportunities in “embedded systems,” i.e., electronic systems embedded into automotive, industrial, aerospace/defense/security, telecommunications, and health care equipment;  
  • Changes over time in employment, growth rates, market share, and the number of companies in the European PCB and EMS sectors; and  
  • Government policy decisions that need to be considered, including investment in research, development, and innovation (R&D&I); incentives to invest in factories of the future; workforce development; and international trade policy. 

Additional reports, charts, images, and information are in the report and available at IPC.org; subject matter experts are available for interviews. 

IPCMasters Competition China 2023

Date
- (9:00am - 6:00pm CDT)

IPC skills competition will be upgraded to IPC Electronic Assembly Masters, namely IPCMasters Competition China 2023. The competition will be co-organized with Pudong New Area Association For Quality And Technology Shanghai. Except for the hand soldering and rework competition and the cable harness assembly competition, IPC Standard knowledge competition(online), BGA/BTC rework competition will be launched. The competition system will be optimized and upgraded to meet the needs of the industry.

Marriot Renaissance Shanghai Pudong Hotel

No.719 Yingchun Road, Pudong New Area
Lianyang District
Pudong Xinqu
Shanghai Shi, 200135
China

Marriot Renaissance Shanghai Pudong Hotel

Marriot Renaissance Shanghai Pudong Hotel
No.719 Yingchun Road, Pudong New Area
Pudong Xinqu, SH 200135
China

Industry Networking Event & Technical Workshop

Date
- (2:30 - 4:30pm CDT)

An exclusive event for professionals and enthusiasts in electronics manufacturing and assembly. Whether you are an engineer, technician, manager, or industry expert, you will be able to connect with like-minded individuals, share knowledge, and gain valuable insight into the latest trends and innovations in electronics assembly and build your electronics better with IPC Standards at this networking event.

Setia Spice Convention Centre, Penang

NO. 108C, JALAN TUN DR. AWANG
11900 Penang
Pulau Pinang
Malaysia

Setia Spice Convention Centre, Penang

Setia Spice Convention Centre, Penang
NO. 108C, JALAN TUN DR. AWANG
Penang, 07 11900
Malaysia

IPC Chief Technologist Council Publishes Sustainability White Paper on Electronic Design and Manufacturing

Environmental sustainability requirements for electronics manufacturers are proliferating worldwide

In light of the growing need to understand and address environmental sustainability challenges in the electronics manufacturing industry, the IPC Chief Technologist Council this week published a white paper that serves as an educational primer and a guide to further action for electronics manufacturing companies. 

“Electronic Design and Manufacturing Sustainability” provides an overview of eight sustainability topics that affect the electronics industry: product life-cycle assessment; recycling and recyclability; bio-based polymers; modularity, repairability, and reuse; eco-design; data needs and management; energy use; and carbon footprints. 

The report also covers several changes needed to help industry move in a more sustainable direction; barriers and pitfalls on the road to sustainability; recommendations for company actions, both near-term and long-term; and more than 30 useful online references.  

“We’re hearing from our members and from industry influencers that sustainability is a matter of growing importance in our industry,” said IPC Lead Sustainability Strategist Dr. Kelly Scanlon. “Sustainability reporting requirements are already in place in many countries, and many more are being considered.

“Thus, the purpose of this white paper is to help our members begin to understand and cope with some of the pressing environmental sustainability issues affecting our industry,” Scanlon added.

The white paper is a joint product of nearly 20 industry experts from the IPC Chief Technologist Council, composed of technology leaders from OEM, EMS, component packaging, materials, and PCB companies.

Download the paper and visit the IPC Sustainability for Electronics or the IPC Chief Technologist Council landing pages, for more information.

Will U.S. Economy Slip into Recession Second Half of 2023?

IPC Issues June Economic Outlook Report

Per IPC’s June 2023 Economic Outlook report, the U.S. economy has remained resilient through the first half of the year, despite significant headwinds from stubbornly high inflation, aggressive interest rates hikes and a number of high-profile bank failures.

According to Shawn DuBravac, IPC’s chief economist, “This resiliency probably will not last. The second half will prove more difficult, and we expect the economy to slip into recession. The New York Fed’s recession probability model is currently showing a 70 percent chance that the economy experiences a recession within the next 12 months. The current consensus calls for a minor, short-lived recession in the second half of 2023. While a U.S. recession appears imminent, it is hard to know with certainty that it will be short-lived.”

Downward revisions in Europe pushed the economy down 0.1 percent in Q1. This follows a decline in Q4 of last year suggesting Europe did in fact slip into recession in the first half of the year. Many countries in Europe are still experiencing record levels of inflation. Hungary’s inflation rate is running at 21.9 percent while Estonia has seen prices rise 11.2 percent over the last year and prices in Lithuania are up 10.7 percent over the same time period. While these are down from earlier peaks, they remain high.

          Additional data in the June 2023 IPC Economic Outlook show:

  • The U.S. labor market remains strong but might be showing some cracks. While workers are receiving higher wages, up 4.3 percent over the last year, consumer prices are up 4.9 percent over the same time. Wage gains are being lost to inflation.
  •  U.S. industrial production fell 0.2 percent in April, though revisions to prior months offset the decline. The manufacturing sector rose 0.1 percent during the month.
  • The European economy fell during the first quarter of the year, edging down 0.1 percent in the euro area, but rising 0.1 percent in the EU. The economy is up 1.0 percent in both the Euro area and the EU compared to the first quarter of last year.
  • In EU end markets for electronics, manufacturing output appears to have risen in April, up 3.7 percent from the prior month and 1.3 percent from the year-ago period.

View June 2023 IPC Economic Outlook. For more information on IPC’s industry intelligence program including current research and reports, visit www.ipc.org/advocacy/industry-intelligence.

Winners of IPC Hand Soldering and Rework Competition at NEPCON Thailand 2023 Announced

In conjunction with NEPCON Thailand 2023, IPC hosted its popular IPC Hand Soldering and Rework Competition in Bangkok, on June 21-23, 2023. The seventh edition of the competition in Thailand welcomed 39 participants from 15 companies.

Skilled contestants competed against each other to rework a functional electronics assembly within a 50-minute time limit. Assemblies were judged on soldering in accordance with IPC-A-610H, IPC J-STD-001H, IPC-7711/21C - Class 3 criteria, the speed at which the assembly was produced, and overall electrical functionality of the assembly.                       

On the winner’s podium at NEPCON Thailand 2023 were:

  • First Place: Atiwan Tongbai, Benchmark Electronics (Thailand) Public Co., Ltd. He received a certificate, a cash prize of $USD300, and a soldering station from premier sponsor QUICK. As the winner, Atiwan Tongbai qualified for the IPC Hand Soldering World Championship in Munich, Germany in November.                                    
  • Second place: Montree Rojsutthiwan, Clarion Asia Thailand Co. Ltd. He received a certificate and a cash prize of $USD200.
  • Third Place: Anongnat Inthaput from Sanmina-SCI Systems (Thailand) Ltd. She received a certificate and a cash prize of $USD100.

IPC would like to thank Hand Soldering and Rework Competition sponsors and partners for their generous support this year.

  • Premier Sponsor: QUICK
  • Gold Sponsors: NIHON SUPERIOR, SOLDERINDO, INVENTEC Performance Chemicals
  • Co-Organizer RX TRADEX THAILAND

For more information on upcoming hand soldering and rework competitions, contact Tharinee Butmuang, customer service manager, IPC Thailand, at JibButmuang@ipc.org.

Cost Pressures Continue to Recede for Electronics Manufacturers

IPC Releases June Global Sentiment of the Electronics Supply Chain Report

Cost pressures continue to recede and demand remains positive, with Orders Index rising to 107, the highest level in three months, per IPC’s June 2023 Global Sentiment of the Electronics Supply Chain Report.

“Cost pressures are continuing to recede,” said Shawn DuBravac, IPC chief economist. “The majority of survey respondents are still reporting that labor costs and material costs are rising, but the number of companies experiencing rising costs declined again this month. Less than half of respondents believe material costs will rise in the coming months.”

Additional survey results indicate:

  • The Backlog Index slipped further into contraction territory this month, hitting the lowest level on record.
  • Over the next six months, electronics manufacturers expect to see continued increases in both labor and material costs, although to somewhat of a lesser extent with respect to materials.
  • While two-thirds (68 percent) of firms operating globally report rising customer inventory, only 26 percent of firms in Asia Pacific and 28 percent of those in Europe are experiencing a current increase, with European firms instead more likely to indicate customer inventory is holding steady.
  • Per special questions asked about worker recruitment and retention, most manufacturers indicate employee retention this year is comparable to 2022. Roughly 18 percent indicate retention is more difficult this year, 18 percent indicate is it easier than in 2022 and 55 percent report it is about the same.
  • In an effort to hire new employees, two-thirds (66 percent) of electronics manufacturers have raised salaries/rates beyond what was anticipated, with more than half (54 percent) looking for potential employees in non-traditional places. About 39 percent report they have improved benefits packages to attract new workers.

For the report, IPC surveyed hundreds of companies from around the world, including a wide range of company sizes representing the full electronics manufacturing value chain.

View full report.