IPC/IMAPS On-Shoring Advanced Packaging and Assembly Workshop

Date
- (8:00am - 4:00pm CDT)

Bringing together government agencies, the Defense Industrial Base (DIB) and advanced packaging and assembly providers, the workshop will focus on efforts to onshore advanced packaging and identify newly created programs to address U.S. Government and Defense requirements critical to microelectronics assembly and packaging supply chain onshoring.

The workshop will feature two days of focused sessions by invited speakers, a panel discussion, and a variety of networking opportunities.

Keynotes include:

  • “CHIPS” presented by Eric Lin, U.S. Department of Commerce
  • “DPA/Title III and ICAM/IBAS Activity” presented by Anthony Di Stasio, Office of the Under Secretary of Defense (A&S)  
  • “Next Generation Microelectronics Manufacturing (NGMM)” presented by Carl McCants, Ph.D., DARPA
  • “DoD ME Commons” presented by Dev Shenoy, Ph.D., Office of the Undersecretary of Defense and Director of the Defense Microelectronics Cross Functional Team

The event will kick-off on Monday, July 10 with a pre-program day with two-hour professional development courses and working group sessions addressing a variety of topics relevant to the onshoring of advanced packaging. 

IPC/IMAPS On-Shoring Advanced Packaging and Assembly Workshop

Westin Tysons Corner
7801 Leesburg Pike
Falls Church, VA 22043
United States

IPC/IMAPS On-Shoring Advanced Packaging and Assembly Workshop

IPC/IMAPS On-Shoring Advanced Packaging and Assembly Workshop
Westin Tysons Corner
Falls Church, VA 22043
United States

IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop

IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington, D.C.

Bringing together government agencies, the Defense Industrial Base (DIB) and advanced packaging and assembly providers, the workshop will focus on efforts to onshore advanced packaging and identify newly created programs to address U.S. Government and Defense requirements critical to microelectronics assembly and packaging supply chain onshoring.

The workshop will feature two days of focused sessions by invited speakers, a panel discussion, and a variety of networking opportunities.

Keynotes include:

  • “CHIPS” presented by Eric Lin, U.S. Department of Commerce
  • “DPA/Title III and ICAM/IBAS Activity” presented by Anthony Di Stasio, Office of the Under Secretary of Defense (A&S)  
  • “Next Generation Microelectronics Manufacturing (NGMM)” presented by Carl McCants, Ph.D., DARPA
  • “DoD ME Commons” presented by Dev Shenoy, Ph.D., Office of the Undersecretary of Defense and Director of the Defense Microelectronics Cross Functional Team

The event will kick-off on Monday, July 10 with a pre-program day with two-hour professional development courses and working group sessions addressing a variety of topics relevant to the onshoring of advanced packaging. 

“Our message to policymakers is that building a more robust, domestic ecosystem for advanced electronics will require a few key policy decisions: investment in advanced packaging capacity and research and development, supply chain partnership promotion and strategic decisions on what we are building and for whom,” said Matt Kelly IPC chief technical officer and member of event organizing committee. “This workshop brings all the important players to the table – policy makers, the Defense Industrial Base, and commercial suppliers – all who have a goal to improve on advanced packaging and assembly onshoring strategies.”

For detailed information on the agenda, speakers or to register for the “On-Shoring Advanced Packaging and Assembly” workshop, visit http://www.imaps.org/onshoring.

 

Eskilstuna Elektronik Partner AB Requalifies for IPC J-STD-001/IPC-A-610 Qualified Manufacturers Listing

IPC's Validation Services Program has awarded an IPC J-STD-001/IPC-A-610 Qualified Manufacturers Listing (QML) Class 3 requalification to Eskilstuna Elektronik Partner AB (EEPAB), located in Esklistuna, Sweden. Eskilstuna Elektronik Partner AB continues to be a trusted source and supplier to original equipment manufacturers (OEMs), meeting the stringent requirements of two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.

Eskilstuna Elektronik Partner AB is a full-service provider -- from idea to finished solutions -- developing products to the specific needs and conditions for each client.

During the IPC Validation Services QML audit, Eskilstuna Elektronik Partner AB fulfilled or exceeded the requirements for the electronics industry’s most rigorous classification, Class 3, which is intended for high-performance electronics assemblies. The company continues to be recognized as an IPC trusted source capable of manufacturing in accordance with industry best practices.

IPC's Validation Services QPL/QML Programs were developed to promote supply chain verification and recognition. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize Eskilstuna Elektronik Partner AB for maintaining their participation in IPC's network of trusted suppliers.”

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org  or call +1 847-597-2892.

New to IPC Membership? Now What?

Date
-

Wondering how to make the most of your IPC membership? We can help.
This free 30-minute webinar presented by Logan Smith, Member and Customer Support Team Lead, will show you how to navigate the membership website pages to access all your benefits and how to participate in all the activities that IPC membership has to offer.

The webinar will cover:

  • Getting started with IPC membership
  • Access to free documents and courses
  • Technical resources
  • Promoting your company to the industry

Register

Global Banking Crisis Continues; Inflation Rates Remain Stubbornly High in Both Europe and the United States

IPC Issues April Economic Outlook Report

Economic data over the last month indicates that while inflation remains stubbornly high, economic growth is slowing. The base case scenario for the United States right now suggests a recession in the middle two quarters of the year. The U.S. economy should grow about 1.2 percent this year, but growth in the back half of the year will be weak.

Germany recently raised its economic growth forecast for the year to 0.4 percent, up from the previous 0.2 percent, but the environment in both the United States and Europe remains persistently difficult. It remains uncertain how sharply higher interest rates will fully impact the economy.

“Supply constraints are easing everywhere which on the surface looks like a good thing. But it likely also means that backlogs will wane in the second half of the year. In the absence of new demand, output will likely be weak,” said Shawn DuBravac, IPC chief economist.

Additional data in the April 2023 IPC Economic Outlook show:

  • The U.S. economy grew 1.1 percent in the first quarter, coming in below an expected rise of 1.9 percent. However, the headline number masks underlying strength in the economy.
  • U.S. manufacturing sentiment contracted for the fifth consecutive month in April. The manufacturing PMI rose 0.8 percentage points in the last month, but not enough to move back into expansionary territory.
  • The European economy grew during the first quarter of the year, edging up 0.1 percent in the euro area and up 0.3 percent in the EU. The economy is up 1.3 percent in both areas compared to the first quarter of last year.
  • In the EU, manufacturing output in electronics end markets rose in February, increasing 1.3% from the prior month and 2.9% from the year-ago period.

View April 2023 IPC Economic Outlook. For more information on IPC’s industry intelligence program including current research and reports, visit www.ipc.org/advocacy/industry-intelligence.

 

 

 

 

IPC Events: Build Electronics Better with Standards and Solutions Conference - Powered by FLEX

Date
- (4:00 - 10:00am CDT)

IPC Day Romania: Build Electronics Better with Standards and Solutions, Conference Powered by Flex, will provide a unique opportunity to learn about the latest advancements in electronics manufacturing, participate in industry discussions, and network with a community of professionals dedicated to building electronics better, in the city of Timisoara - 2023 European Capital of Culture!

Presentation and panel discussions will feature industry experts in electronics reliability, e-mobility, medical meets 5G, education and training, and IPC leadership. The world-class lineup includes speakers and panelists from NASA, Stellantis, Bosch, Flex, Indium, TTM Technologies, Viscom, Nokia, IPC, The Polytechnic University, and Vitesco. Complete agenda coming soon!

Topics include:

  • Electronics Reliability
    • Introduction to solder joint reliability standards & simulations,
    • electronics reliability in space applications.
  • E-mobility Reliability Panel
  • Medical meets 5G
  • Education and Training – University studies and IPC certification and training programs
  • IPC opportunities to participate in standards development, educational opportunities, and events

Who should attend?

  • Manufacturing, quality, and design engineers
  • Members of Academia
  • Senior and junior engineering students
  • Specialist or Practitioner in Manufacturing 

Location: Auditorium of the Library of the Polytechnical University in Timisoara, Romania
Bulevardul Vasile Pârvan 2
300073 Timișoara, Romania

Download the event's agenda here.

Registration

Registration is free. Please complete the form to register.

Hotel Information

Check-in and check-out dates can be adjusted until 15 September 2023.

To take advantage of these room blocks, please send an email to andreaturcott@ipc.org before 15 September 2023 including your request for hotel and indicate which hotel you prefer along with check-in and checkout dates. We will send you your confirmation number. 

Important note: Cancellations/modifications are free of charge until 15 September.

Hotel Timisoara

Hotel Timisoara
Mărășești 1-3
Timișoara 300086, ROMÂNIA

Room blocks available: check-in 26/9- check-out 29/9, price between 95 EUR and 140 EUR per night.

NH Timisoara

NH Timisoara 
Strada Johann Heinrich Pestalozzi 1/a, Timișoara 300115, ROMÂNIA

Room blocks available: check-in 26/9- check-out 29/9, breakfast included price between 81 EUR and 126 EUR per night.

Del Corso Hotel

Del Corso Hotel 
Calea Bogdăneștilor 18
Timișoara, ROMÂNIA

Room blocks available: check-in 26/9- check-out 29/9, breakfast included price between 131 EUR and 140 EUR per night.

Auditorium of the Library of the Polytechnical University in Timisoara, Romania

Bulevardul Vasile Pârvan 2
300073 Timișoara
Romania

Auditorium of the Library of the Polytechnical University in Timisoara, Romania

Auditorium of the Library of the Polytechnical University in Timisoara, Romania
Bulevardul Vasile Pârvan 2
Timișoara, 300073
Romania

Cost Pressures Receding as Industry Expects Some Sector Growth in 2023

IPC Releases April Global Sentiment of the Electronics Supply Chain Report

Per IPC’s April 2023 Global Sentiment of the Electronics Supply Chain Report, last month delivered a mixed bag of industry sentiment: cost pressures are receding; industry demand appears to be slowing; and industry expects growth in some sectors.  

Survey results show:

  • 54 percent of respondents reported that labor and material costs are rising, but the number of companies experiencing rising costs continues to decline.
  •  The Orders Index slipped to 105. While this is still in expansionary territory, it is the lowest it has been since the start of the survey. 
  • Industry believes the military sector will grow 16 percent on average this year, followed by the aerospace sector and the communications sector which are both expected to grow by roughly 11 percent. The medical sector is expected to rise 10 percent.  
  • The automotive sector and industrial electronics sector are both expected to rise 5.6 percent. The consumer electronics sector is expected to decline 3 percent and the computer sector is expected to decline 7 percent in 2023.

“Over the next six months, electronics manufacturers expect to see continued increase in both labor and material costs,” said Shawn DuBravac, IPC chief economist. “Meanwhile, backlogs, ease of recruitment, and profit margins are expected to contract."                       

For the report, IPC surveyed hundreds of companies from around the world, including a wide range of company sizes representing the full electronics manufacturing value chain.

View full report.

Teledyne Cable Solutions Awarded IPC/WHMA-A-620 Qualified Manufacturers Listing

IPC's Validation Services Program has awarded an IPC/WHMA-A-620 Qualified Manufacturers Listing (QML) Class 3, to Teledyne Cable Solutions (Division of Teledyne Marine Interconnect Solutions), in Dallas, Texas. Teledyne Cable Solutions, with over 50 years of experience in providing cable solutions, has been added to the trusted quality supplier list meeting the stringent requirements of IPC’s foremost Standard: IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.

Teledyne Cable Solutions has fulfilled or exceeded the requirements for the electronics industry’s most rigorous classification, Class 3, which is intended for high performance electronic cable assemblies and continues is recognized as an IPC trusted source capable of manufacturing in accordance with industry best practices.

IPC's Validation Services QPL/QML Programs were developed to promote supply chain verification and recognition. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provide technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize Teledyne Cable Solutions for becoming part of IPC's network of trusted suppliers.”

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or call +1 847-597-2892.

Nathan Edwards to Lead USPAE as New Executive Director

Effective May 1, 2023, Nathan Edwards will transition into the role of executive director of the U.S. Partnership for Assured Electronics (USPAE). Currently serving as director of government development, Edwards will replace Chris Peters who will continue with the organization as a senior advisor, providing continuity and focus on special projects.

As executive director of USPAE, Edwards will be responsible for establishing and growing the organization to help ensure the U.S. Government has access to trusted, secure, and resilient electronics supply chains. One of the organization’s signature programs is the $42 million Defense Electronics Consortium, which provides a contract vehicle for the Department of Defense (DoD) to work on electronics-related challenges with trusted partners in industry and academia, including small and medium-sized innovators that typically do not do business with DoD.

 Edwards joined USPAE in August 2022 after being highly recommended by several members of the electronics manufacturing community. He has significant electronics expertise stemming from an impressive academic record and valuable experience in commercial and government environments. Much of that experience involves security of microelectronics and hardware systems, including five patents for the protection of embedded technologies. Edwards’s previous employers have ranged from Medtronic and Boeing to Sandia National Laboratories. He also has supported the Trusted and Assured Microelectronics program under the Office of the Secretary of Defense.

“Nathan’s electronics expertise and experience in both commercial and government segments make him ideally suited to continue the growth of USPAE,” said board member and retired Navy Rear Admiral Kevin Sweeney. “Chris has done a superb job as founding director and we’re grateful that he will help transition Nathan into this leadership role.”

Adds John W. Mitchell, IPC president and CEO and USPAE board member, “We’re fortunate to have both Nathan and Chris as part of the USPAE leadership team. “Nathan knows the U.S. Government customer well, including the Department of Defense, and has substantial technical expertise. His work at USPAE will help us bridge the gap between industry capabilities and the governments’ needs for electronics that support our national and economic security. Chris’s extensive experience in driving the innovation and adoption of solutions throughout manufacturing supply chains has helped connect the electronics industry and government.”

For more information on USPAE, visit www.USPAE.org or send inquiries to info@uspae.org.

North American PCB Industry Sales Up 11.6 Percent in March

IPC releases PCB industry results for March 2023

IPC announced today the March 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.91.

Total North American PCB shipments in March 2023 were up 11.6 percent compared to the same month last year. Compared to the preceding month, March shipments were up 30.1 percent.

PCB bookings in March were down 10.5 percent compared to the same month last year. March bookings were up 2.3 percent compared to the preceding month.

“The book-to-bill slipped this month, but this was driven in part by strong shipments,” said Shawn DuBravac, IPC chief economist. “Order flow is holding steady, but at lower levels than a year ago.”  

March 2023 PCB book to bill ratio chart 1
March 2023 PCB book to bill ratio chart 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.