IPC Day Netherlands: Aerospace Electronics

Date
- (2:30 - 9:00am CDT)

IPC Day Netherlands: Aerospace Electronics is an aerospace-focused networking event featuring key industry experts from NASA and the European Space Agency. 

The event will provide participants with the opportunity to learn first-hand and exchange with leaders in the electronics industry. It is aimed at manufacturing, quality, or design engineers, specialists, and practitioners, to meet their peers in the region, enhance their knowledge, and learn about the latest industry trends.

Program:

  •  09:30 – Registration
  • 10:00 – Welcome: Philippe Léonard, IPC Europe director & Ramon Essers, ETECH Training CEO, Master IPC Trainer (MIT) in the Netherlands.
  • 10:30 – Keynote Speaker: "Role of Standards in Shaping the Future of Aerospace Technology” – Bhanu Sood, NASA Deputy Chief Technologist
  • 12:00 – Keynote Speaker: “ESA’S Approach to Supply Chain Stability, Capability Development and Qualification of Advanced PCB Technology for European Space Applications” – Stan Heltzel, ESA-European Space Agency (ESTEC) Materials and Processes Engineer
  • 13:00 – Networking lunch at ESA company restaurant (at each participant’s cost)
  • 14:30 – Ramon Essers, ETECH Training CEO and Master IPC Trainer (MIT)
  • 15:30 – Conclusions
  • 16:00 – Closing

Venue: European Space Agency, ESTEC (Building A - Room: Aj033 “Einstein”), Keplerlaan 1, 2201AZ, Noordwijk, Netherlands

ESA Access Security Process: Participants have to be pre-registered on the participants' list (no last-minute admission possible) and present a passport/ID at the security gate to collect a visitor badge.

Optional activities: Participants may choose to visit (in small groups only) the ESA laboratories and ESA Spacecraft Test Centre. You may also choose to visit the Space Expo, a nearby off-site exhibition/museum.

Participation is free of charge (all costs are covered by ESA, IPC, and ETECH).

The event has limited seat availability.

IPC Day Aerospace Netherlands Registration Form

 

European Space Agency, ESTEC

European Space Agency, ESTEC (Building A - Room: Aj033 “Einstein”)
Keplerlaan 1
2201AZ Noordwijk
Netherlands

Event Venue Website
https://www.esa.int/About_Us/ESTEC

European Space Agency, ESTEC

European Space Agency, ESTEC
European Space Agency, ESTEC (Building A - Room: Aj033 “Einstein”)
Noordwijk, 2201AZ
Netherlands

IPC Day France: Aerospace Electronics

Date
- (2:30 - 9:00am CDT)

IPC Day France: Aerospace Electronics is an aerospace-focused networking event featuring key industry experts from NASA and Airbus. 

The event will provide participants with the opportunity to learn first-hand and exchange with leaders in the electronics industry. It is aimed at manufacturing, quality, or design engineers, specialists, and practitioners, to meet their peers in the region, enhance their knowledge, and learn about the latest industry trends. 

Program:

  • 09:30 – Registration and Welcome coffee
  • 10:00 – Welcome: Philippe Léonard, IPC Europe director & Jonathan Albrieux, IFTEC, Master IPC Trainer (MIT) in France
  • 10:30 – Keynote Speaker: "Role of Standards in Shaping the Future of Aerospace Technology” - Bhanu Sood, NASA Deputy Chief Technologist 
  • 12:00 – Networking lunch
  • 13:30 – Keynote Speaker: “PCB procurement for IPC business”– Oscar Vázquez, Airbus Defence and Space (Airbus Crisa, Spain) PCB Specialist 
  • 15:30 – Conclusions
  • 16:00 – Closing

Venue: Pullman Toulouse Centre Ramblas, 84 & 86 Allees Jean Jaures, 31000 Toulouse, France

Participation is free of charge (all costs are covered by IPC and IFTEC).

The event has limited seat availability. 
 

IPC Day Aerospace France Registration Form

 

Pullman Toulouse Centre Ramblas

84 & 86 Allees Jean Jaures
31000 Toulouse
France

Pullman Toulouse Centre Ramblas

Pullman Toulouse Centre Ramblas
84 & 86 Allees Jean Jaures
Toulouse, 31000
France

Electronics Industry Supply Chains Look Healthy; Inventories Expand

IPC Releases August Global Sentiment of the Electronics Supply Chain Report

Though cost pressures continue to impact the electronics industry, product demand and inventories remain positive, leading to a healthy supply chain per IPC’s August 2023 Global Sentiment of the Electronics Supply Chain Report.

“Over the next six months, electronics manufacturers expect to see continued increase in both labor and material costs, although to a lesser extent than current conditions,” said Shawn DuBravac IPC chief economist. “Conversely, while backlogs and profit margins are expected to improve, ease of recruitment is likely to remain challenging.”

Additional survey data show:

  • The Labor Costs Index rose four points in August. The index remains extremely elevated. The electronics industry has yet to see a break in the trend of raising labor costs.
  • The Material Costs Index rose five points in August. This is the first monthly increase since October 2022. Future months will help determine if this rise was driven by data volatility or a more meaningful trend.
  • The Shipment Index rose solidly in August and remains in expansionary territory. The Orders Index rose one point and also remains in expansionary territory.
  • The Backlog Index rose in August but remains in contraction territory, though just barely. New orders and shipments seem well balanced in the electronics industry right now which has likely weakened backlogs.      

For the report, IPC surveyed hundreds of companies from around the world, including a wide range of company sizes representing the full electronics manufacturing value chain. View full report.

North American PCB Industry Sales Up 23 Percent in July

IPC releases PCB industry results for July 2023

IPC announced today the July 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.01.

Total North American PCB shipments in July 2023 were up 23 percent compared to the same month last year. Compared to the preceding month, July shipments were up 10.2 percent.

PCB bookings in July were up 24.6 percent compared to the same month last year. July bookings were up 7.8 percent compared to the preceding month.

“July was a good month for the PCB sector. Orders were the strongest in 10 months and shipments were the strongest in four months,” said Shawn DuBravac, IPC’s chief economist. “The year-to-date trend for orders has steadily been improving, but the trend of lower orders in 2023 remains in place.”

July 2023 PCB book to bill ratio chart 1
July 2023 PCB book to bill ratio chart 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

North American EMS Industry Up 3.4 Percent in July

IPC releases EMS industry results for July 2023

IPC announced today the July 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.27.

Total North American EMS shipments in July 2023 were up 3.4 percent compared to the same month last year. Compared to the preceding month, June shipments decreased 0.7 percent.

EMS bookings in June decreased 3.5 percent year-over-year and increased 2.1 percent from the previous month.

“The North American EMS industry saw minimal change in July. The year-to-date trend of weaker orders and stronger shipments remains intact,” said Shawn DuBravac, IPC’s chief economist.

July 2023 EMS book to bill ratio

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

Green Circuits Inc. Earns IPC J-STD-001/IPC-A-610 and IPC J-STD-001 Space/Military Addendum Qualified Manufacturers Listings

IPC's Validation Services Program has awarded an IPC J-STD-001/IPC-A-610 Qualified Manufacturers Listing (QML) and IPC J-STD-001 Space/Military Addendum Qualified Manufacturing Listing (QML) to Green Circuits Inc., San Jose, Calif. Green Circuits Inc. is a full-service electronics manufacturing services (EMS) partner to leading original equipment manufacturers (OEMs), providing high-quality design, prototyping and full-scale production services for all types of printed circuit boards and complex systems.

Green Circuits Inc. met or exceeded the requirements for the electronics industry's Class 3, which is intended for dedicated service electronics products. They successfully completed an audit based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies. They also successfully completed the audit for IPC J-STD-001, Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H, Requirements for Soldered Electrical and Electronic Assemblies. Green Circuits Inc. joins only a few companies who have received both the QML for IPC J-STD-001/IPC-A-610 and IPC J-STD-001 Space/Military Addendum as a trusted source of electronics suppliers found on IPC's QML/QPL database.

Mark Evans, chief operating officer, Green Circuits Inc. stated, “Receiving not only the IPC J-STD-001 Space/Military Addendum QML but also the IPC J-STD-001/IPC-A-610 QML is a proud moment for our entire team at Green Circuits Inc.” Continued Evans, “The QMLs underscore our dedication to delivering top-notch quality and performance in electronic assemblies, even in the harshest and most demanding operating environments. We are excited to provide our customers in the aerospace and defense industries with the assurance that our products meet the most stringent requirements for space and military applications.”

“It is rare for one company to earn two QMLs at the same time, and we are pleased to recognize Green Circuits Inc. as a member of IPC's network of trusted suppliers,” said Randy Cherry, director, IPC Validation Services. “It’s a significant achievement showing a commitment to delivering the highest level of quality in electronics manufacturing.”

For more information about IPC's Validation Services QPL/QML Program, visit www.ipc.org/standards/ipc-validation-services or call +1 847-597-2892.

It’s Been an Interesting Year for IPC in Government Policy

Aug 21, 2023

By Chris Mitchell, IPC Vice President, Global Government Relations

It has been said that August is “the bridge between how the year has been and how the year will end.”

In the spirit of taking a brief pause to rest and refresh, we thought we would share some thoughts on the year to date in IPC’s advocacy efforts on your behalf.

In short, 2023 has been a very interesting year for the electronics industry in the halls of government. So far this year, we have witnessed many policy developments that IPC and its members and allies have been advocating for years:

  • CHIPS for America: The U.S. Government launched the “CHIPS for America” program, including IPC-proposed commitments to devote some CHIPS Act funding to other parts of electronics ecosystem, including printed circuit boards (PCBs), IC substrates, and advanced packaging. A bipartisan team in Congress reintroduced a PCB Act to reinforce the effort. We’re continuing to keep up our advocacy for a “silicon-to-systems” approach.  
  • PCBs: U.S. President Biden issued a “presidential determination” that greater domestic production of PCBs is critical to national security. IPC has been a champion of more resilient, trusted, and secure defense electronics supply chains in all nations.
  • Electronics in Europe: The European Institutions reached agreement on the European Chips Act and launched an “Important Project of Common European Interest (IPCEI),” designed to support research, innovation, and “first industrial deployment” of microelectronics and communication technologies across the value chain. IPC is maintaining a fruitful, ongoing dialogue with the European Commission, and together with partners and stakeholders we have submitted a report with recommendations to bolster Europe’s PCB and EMS sectors.
  • Green Electronics: Acknowledging all of the efforts underway in all parts of the world to encourage a greener, more sustainable economy, IPC this year launched a Sustainability for Electronics Leadership Council and several Action Groups; published a white paper on the key sustainability issues facing our industry; and rallied the industry to face the prospect of partial or full bans on PFAS chemicals in the European Union and United States.  
  • Thought Leadership: In our role as the voice of electronics manufacturing, IPC released major reports on IC substrates; the European PCB and EMS sectors; and sustainability in electronics design and manufacturing, not to mention our regular economic outlook reports and industry sentiment surveys.

Over the next several months, the IPC GR Team will continue to advocate for you, your company, and the entire industry on all these issues and more. Our efforts may include meetings, calls, and letters with government officials; official comments in regulatory proceedings; and educational events, reports, social media posts, and media coverage.

We also need and welcome your active support and participation in our efforts. Here’s how you can stay informed and involved:

We thank you for your support and look forward to making more progress in the months ahead.

IPC Welcomes U.S. House Veteran Rich Cappetto as Senior Director of North American Government Relations

Washington, D.C. office boosted by four new hires this year

IPC welcomes Richard Cappetto, a 14-year veteran of the U.S. House of Representatives, as its new senior director for North American government relations.

In this role, Cappetto will be responsible for the development and implementation of IPC’s public policy advocacy efforts in the United States, Canada, and Mexico. He will work closely with key government officials and their staffs; with IPC’s Government Relations Steering Committee and its Advocacy Team, composed of senior executives and staff of IPC member companies; and with IPC’s professional staff worldwide to advocate on behalf of the electronics industry in the halls of government. IPC’s policy priorities include securing funding and incentives for investment and innovation in electronics manufacturing; ensuring practical, risk-based regulations; and expanding efforts to educate and train more high-skilled workers.

Cappetto’s prior role was Chief Customer Officer in the U.S. House, where he worked to improve internal services to all Members of Congress and their staffs, so that they could better serve their constituents. Previously he was staff director of the Commission on Congressional Mailing Standards and a professional staff member at the Committee on House Administration. He holds a bachelor’s degree from Central Michigan University; a master’s degree in defense and strategic studies from the U.S. Naval War College; and a certificate in public sector leadership from Cornell University. He is a certified project management professional (PMP) and contracting officer’s representative.

“Rich’s expertise in congressional affairs and his extensive relationships on Capitol Hill will enable him to be a trusted, effective advocate for IPC members in Washington, Ottawa, Mexico City, and across the globe,” said Chris Mitchell, IPC vice president of global government relations.

Cappetto is the latest in a string of new hires and promotions in IPC’s Washington office. Michelle Mermelstein recently joined IPC as senior director of media engagement; Nyron Rouse as director of government grants and strategic funding initiatives; and Kate Koger as public affairs coordinator. The entire team and the IPC advocacy agenda can be found on IPC’s Advocacy pages.

Cappetto can be reached at 202-661-8096 or RichardCappetto@ipc.org.

Michelle Leff Mermelstein Joins IPC as New Senior Director of Media Engagement

IPC announces the addition of Michelle Leff Mermelstein, APR, as senior director of media engagement to its staff at IPC’s offices in Washington, D.C. In this role, Mermelstein will lead IPC’s public relations efforts and communications with media outlets to raise the stature of the electronics industry and its public policy priorities. In addition, Mermelstein will leverage her expertise to design and execute proactive PR strategies that cultivate relationships with national and international media outlets, engage target audiences, and increase awareness of the electronics manufacturing industry and IPC’s role in supporting its growth.        

“Michelle comes to IPC with an impressive track record of developing and executing media campaigns to further the strategic goals of some of the world’s largest companies including Nokia, Adobe, LG Electronics, and T-Mobile,” said Chris Mitchell, IPC vice president of global government relations. “With more than two decades of experience positioning products, services and issues to drive audience engagement, Michelle is an impressive addition to IPC, and we’re excited to have her as part of IPC’s public affairs team.”         

Mermelstein earned a master’s degree in political management from George Washington University and a bachelor’s degree in political science and journalism from American University. In addition, she serves as a capstone advisor and adjunct lecturer on corporate communications and public relations at Georgetown University, School of Continuing Studies.

Mermelstein can be reached at MichelleMermelstein@ipc.org or +1 202 661-8092.                                 

Latest Advancements in Safety and Reliability Requirements in Medical, Auto and Aerospace Applications Take Center Stage at IPC’s High Reliability Forum

The critical reliability of electronic prosthetics in the brain to help restore movement to a paralyzed hand, enhancing the durability of EV automotive infrastructure, testing criteria and challenges of working with lead-free materials, and evaluation of reliability and maintainability for safe airborne structures are just a few of the agenda items offered at IPC’s High Reliability Forum October 17-19 in Linthicum (Baltimore), Md.

Presentation topics include: safety critical electronics considerations; military, aerospace, medical, automotive, e-Mobility and other applications with specialized reliability requirements; and others related to high reliability issues in PCB design, PCB fabrication materials, PCB assembly, PCBA surface reliability, emerging electronic technologies, mitigation strategies and test methods.

Speakers from the following companies include: Ed Reynolds, John Hopkins University Applied Physics Laboratory (opening keynote); Cynthia A. Chestek, Ph.D., University of Michigan; Raymond Zhao, Ph.D., Northrop Grumman Systems Corporation; Leslie Kim, MacDermid Alpha Electronics Solutions; Brian O’Leary, Indium Corporation; Theresa Campobasso, Exiger; William Capen, Honeywell; and Denis Barbini, Ph.D., Zestron. View complete speaker lineup.

“The event provides a unique opportunity for those in industry who design, manufacture, or test electronics for critical applications with unique safety, reliability, and lifetime requirements to learn about the latest advancements, participate in industry discussions, and network with a respected community of professionals who are all focused on high reliability electronics,” said Bhanu Sood Ph.D., NASA Goddard Space Flight Center, and High Reliability Forum Technical Program co-chair. “And this year, the technical panel is stronger than ever, with well-rounded, industry-curated content focused on electronics with high reliability requirements.”

For more information on the IPC High Reliability Forum including agenda, speaker profiles, exhibition and sponsorship information, or to register for event, visit www.ipc.org/event/high-reliability-forum.

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