IPC High Reliability Forum
The IPC High Reliability Forum is back and better than ever! If you manufacture, design or test Class 3 electronics for applications with unique safety, reliability, and lifetime requirements, you don’t want to miss this event! The IPC High Reliability Forum will be held October 17-19, 2023, at the Hilton Baltimore BWI Airport, located in Linthicum (Baltimore), Maryland.
This event provides a unique opportunity to learn about the latest advancements in electronics, participate in industry discussions, and network with this respected community of professionals focused on electronics with high reliability requirements.
Presentation topics will include:
- Class 3 and safety critical electronics considerations
- Military, aerospace, medical, automotive, e-Mobility and other applications with specialized reliability requirements
- Well-rounded, industry-curated content covering many different topics related to high reliability issues in PCB design, PCB fabrication materials, PCB assembly, PCBA surface reliability, emerging electronic technologies, mitigation strategies and test methods
Abstract submission deadline is Monday, June 5.
Abstracts summarizing original and previously unpublished work must be submitted for consideration to present. Presentations should be non-commercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Presenting at the IPC High Reliability Forum provides visibility for you and your organization and helps build relationships with potential high reliability partners.
Abstracts will be peer-reviewed by the Technical Program Committee. Accepted abstracts will be invited to deliver a podium presentation in person at the High Reliability Forum in Linthicum (Baltimore), Maryland, October 17-19, 2023.
- PCB Fabrication Materials
- Interconnecting, Bonding
- Thermal/Power Management
- Conductivity/Resistivity
- Use Conditions/Environment (A&D vs. Automotive vs. Medical/Implantable vs. High Perf Computing, etc.)
- Environmental Restrictions/Impact
- Substrates for Advanced Packaging
- Materials Compatibility
- Flexible Printed Boards in RF/Microwave Applications
- Design for Reliability/Determining Reliability Requirements, System of Systems Architecture, Levels of Redundancy
- HDI/Microvia Reliability, Test Methods and Design Rules
- Micro HDI and Substrate Technologies, 1st Level Interconnect Methodologies
- Use of Simulation in the Design Process
- Automotive/High Voltage Applications
- Next Generation Solder Alloys
- Solder Paste and Coating Selection for High Reliability
- Reliability of Cleaning, Testing and Coating Strategies
- Assembly Materials: Coating, Cleaning, Underfilling, Encapsulation
- Effects of No-Clean Residues
- Voiding in Solder Joints
- 3D Package Level Reliability
- Assembly for Automotive/High Voltage Applications
- Fatigue Behavior and Reliability Testing for Solder Joints using Next Generation Solder Alloys
- Harsh Environment Reliability and Testing
- Thermal Stress Test Methods
- Connector Failure Modes and Reliability
- Vibration and Shock Test Methods for Predicting Reliability
- HDI/Microvia Reliability
- Automotive/High Voltage Applications
- Heterogeneous Integration/Advanced Packaging for High Reliability
- Supply Chain, Reshoring/Onshoring
- Failure Modes Effects Analysis (FMEA)
- Reliability Assurance and Prediction Workflows
- Selection of Appropriate Class of Electronics
- Requirements for Specific Class of Electronics
- Manufacturing Standards
- Emerging Electronic Technologies
REGISTRATION INFORMATION
Cancellation Policy:
If you are unable to attend, you may send a coworker in your place. Please notify us of name changes as soon as possible. If you need to cancel, please e-mail KimDiCianni@ipc.org.
Note, all cancellations must be a written notice. Please note the cancellation policy below:
Attendees who cancel in writing by September 22, 2023 will incur a $100 cancellation fee. Cancellations received after September 22, 2023 will be responsible for the full fee.
AGENDA
Coming soon
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Thank you for participating in the event!
TECHNICAL PROGRAM COMMITTEE

Co-Chair: Bhanu Sood PhD
NASA Goddard Space Flight Center

Co-Chair: Martin Goetz
Northrop Grumman Corporation

Brian Chislea
The Dow Chemical Company

Kimera Cho
Collins Aerospace

Kevin Kusiak
Lockheed Martin Corporation

Steven Murray
Northrop Grumman Corporation
EXHIBIT & SPONSORSHIPS
Order Exhibit and Sponsorships Now
Cancellations will be accepted up to 15 days prior to the event. $100 cancellation fee will apply. No refunds will be given for notice less than 15 days prior to the event.
EXHIBITOR INFORMATION
IPC Member: $1,500 | Nonmember: $1,875
Benefits include:
- One 6' draped table
- Two side chairs
- One standard electrical outlet
- Contact list of consented registered attendees
- One complimentary Conference registration for your exhibit staff
- Logo on promotional materials, electronic and printed
IPC Member: $2,500 | Nonmember: $3,125
Benefits include:
- Exclusive opportunity to deliver welcome address to attendees (3 minutes maximum)
- One 6’ draped tabletop exhibit with two side chairs and one standard electrical outlet
- Acknowledgment with sponsor logo on all printed conference materials
- Acknowledgment with sponsor logo on all pre-conference electronics promotions
- Signage at the event with all sponsor name and logo
- Opportunity to display sponsor promotional literature at the reception
- Contact list of consented registered attendees
- Two complimentary Conference registrations
$2,500 Member | $3,125 Nonmember
Benefits include:
- One 6’ draped tabletop exhibit with two side chairs and one standard electrical outlet
- Tent cards with sponsor logo placed at each table
- Acknowledgment with sponsor logo on printed conference materials
- Acknowledgment with sponsor logo on pre-conference electronic promotions
- Signage at the event with sponsor name and logo
- Opportunity to display sponsor promotional literature
- Contact list of consented registered attendees
- Two complimentary Conference registrations
$3,000 Member | $3,750 Nonmember
Benefits include:
- One 6’ draped tabletop exhibit with two side chairs and one standard electrical outlet
- Acknowledgment with sponsor logo on printed conference materials
- Acknowledgment with sponsor logo on pre-conference electronic promotions
- Signage at the event with sponsor name and logo
- Opportunity to display sponsor promotional literature
- Contact list of consented registered attendees
- Two complimentary Conference registrations
$1,200 Member | $1,500 Nonmember
Benefits include:
- Company logo on stickers included on the box lunch.
- Acknowledgment of sponsorship with company logo on event website, pre-show promotions, event on-site guide and on signage at the event.
$1,000 Member | $1,250 Nonmember
Benefits include:
- Opportunity to distribute company-branded badge lanyards to event attendees.
- Acknowledgment of sponsorship with company logo on event website, pre-show promotions, event on-site guide and on signage at the event.
$1,000 Member | $1,250 Nonmember
Benefits include:
- Opportunity to distribute company-branded gift to event attendees.
- Acknowledgment of sponsorship with company logo on event website, pre-show promotions, event on-site guide and on signage at the event.
HOTEL AND LOCATION
Hilton Baltimore BWI Airport
1739 West Nursery Road
Linthicum Heights, MD 21090
Conference Location: Concourse A & B
Hotel Website
The IPC room rate is $149 per night and available until Monday, September 25, 2023 or until all rooms are booked.
Reservations can be made by calling 410-694-0808 and mentioning IPC or by clicking the reserve your room button below.
Reserve Your Room
EXHIBITORS & SPONSORS
CONTACT US
Julia Gumminger, MSEd, CMP |
Julia Flynn |
Kim DiCianni, CEM |
Alicia Balonek, CEM |
Kim DiCianni, CEM
Director, Trade Shows and Events
KimDiCianni@ipc.org
Kristin Schueler, CMP
Director of Meetings and Events
KristinSchueler@ipc.org
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,000+ member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
1739 W Nursery Rd
Linthicum Heights, MD 21090
United States
Hilton Baltimore BWI Airport
Hilton Baltimore BWI Airport
1739 W Nursery Rd
Linthicum Heights, MD 21090
United States