Dr. Hans-Peter Tranitz Appointed Senior Director, Solutions at IPC Electronics Europe GmbH

IPC announces the first employee of its new legal entity in Germany, Hans-Peter Tranitz, Ph.D. Dr. Tranitz will serve as senior director, Solutions, at IPC Electronics Europe GmbH in Munich. In this role, Dr. Tranitz will focus on IPC global initiatives including automotive electronics, advanced packaging, and Factory of the Future as well as serving as a technical resource for regional activities in Europe.

“As we announced at productronica in November 2021, IPC has increased its commitment in 2022 to better serve our members and the electronics manufacturing industry in Europe,” said Sanjay Huprikar, president, Europe and South Asia operations. “Peter's subject matter expertise is well known across the region and we are looking to leverage his skills across several important verticals here including automotive, aerospace, medical, and factory automation.”

“As an industry leader, Peter brings a tremendous wealth of experience and expertise to the team,” added Matt Kelly, IPC chief technologist. “I look forward to his many contributions in helping advance IPC and the industry. IPC is committed to building stronger internal technical capabilities, and Peter is an integral part of this direction.”

Formerly with Continental Automotive in Germany, Dr. Tranitz served as a principal expert for mechanical joining of metals and plastics as the head of final assembly and test. An active volunteer with expertise in press-fit technology and tin whiskers, Dr. Tranitz chairs several IPC standards development committees including the Cold Joining Press-Fit Standard for Automotive Requirements and Other High-Reliability Applications (IPC-9797). Recipient of the IPC Dieter Bergman Fellowship Award in 2021 and the IPC Rising Star award in 2019, Dr. Tranitz holds a Ph.D. in physics from Chemnitz Technical University in Chemnitz, Germany.

Dr. Tranitz can be reached at Hans-PeterTranitz@ipc.org.

Challenging Conditions Ahead for Electronics Manufacturers per IPC’s Global Sentiment of the Electronics Supply Chain Report

Per IPC’s September Global Sentiment of the Electronics Supply Chain Report 81 percent of electronics manufacturers are currently experiencing rising material costs while 74 percent indicate labor costs are on the rise. At the same time, ease of recruitment, profit margins and inventory available from suppliers are presently declining.

Among other data, survey results show:

  • Demand, while still positive, is showing some signs of a slowdown
  • Lead-times are improving but much of the electronics supply chain expects lead-times to decline in the coming months and the recovery appears to be unevenly distributed
  • Inventory available from suppliers is expected to increase more among firms operating in APAC or globally than those in North America
  • Over the next six months, manufacturers expect to see continued increase in both material and labor costs, although to a lesser extent than what they are currently experiencing, especially as it relates to material costs.
  • On a positive note, manufacturers are anticipating a decline in backlogs over the next six months.

For the report, IPC surveyed hundreds of companies from around the world, including a wide range of company sizes representing the full electronics manufacturing value chain. View full report.

Industry Well Represented on New U.S. Government Advisory Committee on Microelectronics

Two of the electronics industry’s most far-sighted and innovative leaders have been named to the U.S. Department of Commerce’s new Industrial Advisory Committee (IAC), which will provide guidance to the Secretary of Commerce on a range of issues related to CHIPS for America Act programs.  

Meredith LaBeau, the Chief Technology Officer at Calumet Electronics in Calumet, Michigan, and Carol Handwerker, the Reinhardt Schuhmann, Jr. Professor of Materials Engineering and Professor of Environmental and Ecological Engineering at Purdue University, are among the first batch of nominees to be named. Both Handwerker and LaBeau have participated in IPC’s Thought Leaders Program, standards development and other IPC activities. They were chosen for their expertise in semiconductor fabrication and advanced packaging.

IPC and the U.S. Partnership for Assured Electronics (USPAE) jointly nominated the pair, and electronics manufacturing is well represented on the panel in other ways. Several other panel members are associated with IPC member companies Analog Devices, Microsoft, and Intel.  

The IAC, established by Congress under the National Defense Authorization Act of 2021, will provide federal officials with advice on the science and technology needs of the nation’s domestic microelectronics industry; the research and development programs funded through the CHIPS for America Act, including an advanced packaging program that IPC has advocated for; and opportunities for new public-private partnerships.

“I’m grateful for the opportunity to serve on this committee and share my thoughts on the future R&D of semiconductor advanced packaging,” said LaBeau. “With passage of the CHIPS and Science Act, the U.S. has an opportunity to both fabricate and package the most cutting-edge silicon chips and electronic systems in the world, and I’m thrilled to be a part of that effort.”

“Congratulations to Carol, Meredith, and the others appointed to the committee,” said Chris Peters, executive director of USPAE. “They will provide the government with invaluable advice and industry insights on the nation's electronics manufacturing ecosystem.”

IPC President and CEO John Mitchell said, “IPC congratulates all our friends and colleagues on their appointment to the Industrial Advisory Committee. This is great news for the U.S. electronics manufacturing industry because they know, like we do, that America’s economic security and national security depend not just on silicon fabrication but on advanced packaging and the broader ecosystem that sustains innovative, resilient, and secure electronics manufacturing.”  

IPC, European Parliament Work to Bolster European Chips Act

Sep 30, 2022

Last week, Member of the European Parliament (MEP) Eva Maydell expressed to participants of IPC’s European Executive Forum her commitment to see a European Chips Act that would bolster the entire semiconductor ecosystem, including those segments critical to advanced packaging. 

That’s good news for the electronics industry given the important role that MEP Maydell plays in the European Parliament’s ongoing deliberations on the Chips Act. She is the EPP Group Rapporteur on the Chips Act and the Rapporteur on the Chips Joint Undertaking.

In her remarks to IPC members, she noted that Europe commands only 5% of packaging capability globally, a percentage that will need to increase given the criticality of advanced packaging for performance as well as lower energy consumption. Always a champion for innovation, she also offered to continue to work with IPC and the European electronics industry in the lead-up to her draft report on the Chips Joint Regulation.

IPC has been in touch with MEP Maydell and with many of her colleagues to bolster the Chips Act by providing: 

  • A definition for advanced packaging that includes assembly and test, IC substrate fabrication, and embedded components 
  • Greater affirmative support for investments in advanced packaging R&D and industrial capacity
  • Greater articulation that the Chips Act is the 1st step in a process of strengthening Europe’s electronics manufacturing ecosystem. 

IPC is working with our members and industry peers to secure greater support within the European Parliament. If you're interested in learning more about IPC’s efforts, please contact me at AlisonJames@ipc.org.   

 

Secure your Spot at IPC’s Advanced Packaging Symposium, October 11-12

Sep 29, 2022

IPC President and CEO John Mitchell invites you to join us in Washington, D.C. for a two-day meeting focused on the opportunities and challenges for next-generation advanced packaging production, public policy updates, commercial and defense electronics industry drivers, current business environment for IC substrates and component assembly and test manufacturing.

 

Gold-Aluminum Wire Bonding Process, Quality and Reliability

WEBINAR REGISTRATION
Date
- (12:00 - 1:00pm CST)

This webinar will preview the IPC APEX EXPO 2023 professional development course, “'Gold-Aluminum Wire Bonding Process, Quality and Reliability.” Join Dr. Syed Sajid Ahmad, Ph.D to review the historical timeline of the research in this area and summarize the relevant results including the means & actions proposed and tried to alleviate the adverse effects of the Kirkendall voiding caused by the phenomenon. What promotes purple plague? How to control its formation and growth. Observation and measurement methods. Interface analysis techniques. Methods of failure analysis.

Photo of Syed Sajid Ahmad

Speaker Bio

Syed Sajid Ahmad, Ph.D., contributed to quality and reliability enhancement of assembly processes at Intel (1979-89), especially wire bond. Ahmad contributed to semiconductor packaging development at National Semiconductor (1990) and managed quality at GigaBit/TriQuint (1990-91), a GaAs device company. His major work at Micron Technology (1991-2003) involved materials enhancement resulting in high reliability products and the development and implementation of advanced packaging of semiconductors. At the Center for Nanoscale Science and Engineering (2003-2015) at the North Dakota State University, his focus was on enhancing research and manufacturing capabilities at the center in the areas of thin film, thick film, advanced packaging (CSP) and surface mount technology (SMT). Ahmad has over 40 publications and presentations and holds 54 US patents. At Crossfire Technologies (2018-2019), Ahmad contributed to development and enhancement of assembly processes.

More Upcoming Webinars

Webinar—Nov. 15
Preventing Manufacturing Defects & Product Failures
Join Dr. Jennie S. Hwang to explore how to prevent prevailing production defects
Webinar—Dec. 14
Electronic Textile Evaluation Methods for Product Engineers and Designers
Join Madison Maxey on how to engage with electronic textiles for new product development.
Webinar—Nov. 10
Troubleshooting SMT Yield Problems and Failure Analysis
Join Ray Prasad for this webinar and advance your understanding of the root causes of SMT and through hole defects
WEBINAR REGISTRATION

Troubleshooting SMT Yield Problems and Failure Analysis

WEBINAR REGISTRATION
Date
-

This webinar will preview the IPC APEX EXPO 2023 professional development course, “Troubleshooting SMT Yield Problems and Failure Analysis." Join Ray Prasad for this webinar and get an exclusive "sneak peek" on: 

  • Advancing your understanding of root causes of SMT and through hole defects
  • Implementing corrective actions in design, assembly and material purchases
  • Taking necessary actions to improve yield and reduce product cost.
  • You are also encouraged to bring your pesky defects for discussion and root cause analysis. 

Speaker Bio

Author of the textbook Surface Mount Technology: Principles and Practice and over 100 papers, Mr. Ray Prasad is an inductee to the IPC Hall of Fame, the highest honor in our industry for his contribution to the electronics industry. He is also the recipient of the IPC President's Award, SMTA Member of Distinction Award, Intel Achievement Award, and Dieter W. Bergman IPC Fellowship Medal.
As the lead engineer, Mr. Prasad introduced SMT into airplanes and defense systems at Boeing, and as SMT program manager, he managed the global implementation of SMT at Intel Corporation. In his consulting practice, Mr. Prasad has helped many clients over the years and has taught in-depth SMT classes at OEM and EMS client sites across the globe.
Mr. Prasad is the chairman of three IPC Committees: IPC-7095 (BGA), IPC-7093 (BTC), and IPC-7530 (Reflow). He also chaired many other IPC committees. He is Columnist for the SMT Magazine.
Mr. Prasad received his B.S. in Metallurgical Engineering from the National Institute of Technology, Jamshedpur in India, his M.S. in Materials Science and Engineering, and an MBA from the University of California at Berkeley. He is a registered Professional Engineer (P.E.) and a US Citizen.

More Upcoming Webinars

Webinar—Nov. 15
Preventing Manufacturing Defects & Product Failures
Join Dr. Jennie S. Hwang to explore how to prevent prevailing production defects
Webinar—Dec. 7
Gold-Aluminum Wire Bonding Process, Quality and Reliability
Join Dr. Syed Sajid Ahmad, Ph.D. to review the historical timeline of the research in this area and summarize the relevant results.
Webinar—Dec. 14
Electronic Textile Evaluation Methods for Product Engineers and Designers
Join Madison Maxey on how to engage with electronic textiles for new product development.
WEBINAR REGISTRATION

Likelihood of a Recession in 2023 in the United States and Europe Continues to Increase

IPC releases September 2022 economic outlook report

According to IPC’s September 2022 economic outlook report, the economic picture in the United States continues to dim and the likelihood of a recession next year continues to increase. The U.S. economy is expected to expand just 1.6 percent in 2022, less than half as fast as the 3.9 percent growth projected at the start of the year. Next year, the economy is slated to expand just 0.6 percent, down from an expected 2.6 percent growth. A recession in the United States next year is not a foregone conclusion, but the probability has increased.

The picture in Europe is decidedly dimmer. The Russian invasion of Ukraine continues to put tremendous pressure on the global economy, but the impact is especially pronounced in Europe. Europe reported annual inflation of 9.1 percent in August, another new high for the continent. Moreover, pressures continue to mount and Europe will see a few more months of new inflationary highs.

“Right now, all eyes are on inflation,” said Shawn DuBravac IPC chief economist and report author. “Whereas inflation has likely peaked in the U.S., that is not the case in Europe, and likelihood of a recession in Europe next year is high. When the prospect for growth is limited, it does not take much to push an economy into recession.”

In addition to DuBravac's observations, the report also provides U.S. and European data on economic growth, employment, consumer sentiment, manufacturers’ sentiment (PMI), manufacturing capacity utilization and end markets for electronics.

View full September 2022 report. To view other industry intelligence information, visit https://www.ipc.org/advocacy/industry-intelligence.

Electronic Textile Evaluation Methods for Product Engineers and Designers

Register
Date
-

Join Madison Maxey, founder and technical lead of Loomia, as she shares highlights of her IPC APEX EXPO 2023 professional development course. The course provides a primer to electrical and mechanical engineers -as well as product designers - on how to engage with electronic textiles for new product development. Attendees should walk away with a clear picture of when electronic textiles may be relevant to their engineering, which type of technology is ideal for their application, and how to thoroughly evaluate a technology when selected. 

Speaker Bio

Madison Maxey is passionate about working at the intersection of design and engineering to create useful products. She studied materials science and engineering at Stanford University and previously worked in design at companies like Tommy Hilfiger.  

Currently, she is focused on bringing soft, flexible circuits (e-textiles) to scale through her company, Loomia. Her mission is to create tools for engineers and designers who are creating next-generation products. Throughout the course of her work at Loomia, she has developed e-textile prototypes and workshops for companies like North Face, Google, Flextronics and Adidas.  

Her work has built the foundation for 6 granted patents and has led to invited lectures at Universities such as Columbia University, Parsons School of Design, NYU and the University of Illinois Urbana-Champaign. 

More Upcoming Webinars

Webinar—Nov. 15
Preventing Manufacturing Defects & Product Failures
Join Dr. Jennie S. Hwang to explore how to prevent prevailing production defects
Webinar—Nov. 10
Troubleshooting SMT Yield Problems and Failure Analysis
Join Ray Prasad for this webinar and advance your understanding of the root causes of SMT and through hole defects
Webinar—Dec. 7
Gold-Aluminum Wire Bonding Process, Quality and Reliability
Join Dr. Syed Sajid Ahmad, Ph.D. to review the historical timeline of the research in this area and summarize the relevant results.
Register

Engineer Turned Accomplished Author and Emmy-nominated Science TV Host Emily Calandrelli to Keynote IPC APEX EXPO 2023

Each year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2023 will feature Emily Calandrelli, host and co-executive producer of the hit Netflix series “Emily’s Wonder Lab,” host and executive producer of FOX channel’s “Exploration Outer Space” and author of the children’s chapter book series, “The Ada Lace Adventures.” During her keynote on January 24, Calandrelli will present, “The Sustainability, Economics and Advocacy of Space Exploration.”                               

Why are space exploration and space-based technologies worth the effort and the investment? Space exploration has led to the development of various technologies that feed back into the economy and improve our lives on Earth. Without space programs, we wouldn’t have GPS, accurate weather prediction, solar cells, or the ultraviolet filters in sunglasses and cameras. In her keynote presentation, Calandrelli will address how space exploration is helping life here on Earth and provide an overview of the innovation occurring today, where we’re headed and the economics and advocacy behind it all.             

Calandrelli frequently presents on the importance of science literacy, the benefits of space exploration, and the challenges for women in STEM careers. In addition to her morning keynote on January 24, she will also be the featured speaker at the Women in Electronics Reception in the evening, addressing why women are in the minority in STEM professions and what is being done to break barriers into STEM for the next generation.                                            

Calandrelli's educational background is in engineering and policy. At West Virginia University she received a bachelor’s degree in mechanical and aerospace engineering. While at WVU she was awarded the Goldwater scholarship for research and Truman scholarship for policy work. She received her master’s degrees from MIT in aeronautics and astronautics as well as technology and policy.                                         

Calandrelli’s keynotes are free to all IPC APEX EXPO participants with advance registration ($40 online and onsite after January 21, 2023). Meetings and courses will run January 21-26; the technical conference and exhibition will run January 24-26, 2023. For more information on schedule and registration options, visit www.IPCAPEXEXPO.org.

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