Preventing Manufacturing Defects & Product Failures

Date
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This webinar will preview the IPC APEX EXPO 2023 professional development course, “Preventing Product Failure and Manufacturing Defects.” Join Dr. Jennie S. Hwang to explore how to prevent prevailing production defects and product reliability issues that affect the first-pass yield/cost/performance by understanding potential causes and plausible solutions.

The webinar will cover product failure as related to tin whisker and five production defects including PCB pad cratering vs. pad lifting, BGA head-on-pillow, open or insufficient solder joints, copper dissolution and lead-free through-hole barrel filling.

The root causes/preventive measures for the five prevalent production defects; and specific defects associated with the reliability of BTC/PoP/BGA assembly will be highlighted. Tin whisker criteria for reliability implications and the relative effectiveness of mitigating measures will be ranked.  

Dr. Jennie S. Hwang

Speaker Bio

Dr. Hwang brings deep knowledge and comprehensive experience to this course through both hands-on and advisory capacities. She has provided solutions to reportedly the most challenging issues in production yield and high-reliability products, covering commercial and military applications. She is the author of seven internationally-used textbooks and 650+ publications; a speaker in innumerable international and national events; has received numerous honors/ awards; on the Board of NYSE Fortune 500 companies and on various civic, government and university boards and committees (e.g., DoD - Globalization Committee, DoD - Forecasting Future Disruptive Technologies Committee, National Materials & Manufacturing Board, Board of Army Science and Technology, and NIST Technical Assessment Board). She is the Chair of the National Laboratory Assessment Board, Assessment Board of Army Research Laboratory, and Army Engineering Centers. Her formal education includes Harvard Business School Executive Program; four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry, and liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and International Electronic Materials Corp. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.  

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North American PCB Industry Sales Up 15.1 Percent in August

IPC releases PCB industry results for August 2022

IPC announced today the August 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.

Total North American PCB shipments in August 2022 were up 15.1 percent compared to the same month last year. Compared to the preceding month, August shipments rose 7.5 percent.

PCB year-to-date bookings in August were down 7.7 percent compared to last year. Bookings in August increased 12.7 percent from the previous month.

“The PCB sector's book-to-bill ratio remains unchanged this month, but the underlying data suggests some marginal improvements,” said Shawn DuBravac, IPC’s chief economist. “Shipment strength improved notably this month, consistent with easing supply chain constraints. Order flow was less negative this month, suggesting a small uptick in demand compared to earlier this year.”

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

PCB book to bill chart 1 August 2022
PCB book to bill chart 2 August 2022

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

EMS North America Industry Report, August 2022

IPC releases EMS industry results for August 2022

IPC announced today the August 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.31.

Total North American EMS shipments in August 2022 were up 14.9 percent compared to the same month last year. Compared to the preceding month, August shipments increased 9.5 percent.

EMS bookings in August decreased 14.1 percent year-over-year and decreased 8.2 percent from the previous month.

“We continue to see order strength diminish, in line with a slowing economy and slowing demand for durable goods. At the same time, supply chain constraints, while still pronounced, appear to be easing somewhat and as a result shipment throughput has improved,” said Shawn DuBravac, IPC’s chief economist.

August 2022 EMS book to bill chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

Electronics Industry Calls for U.S. Presidential Determination On Key Components Under Defense Production Act

The electronics industry is calling on U.S. President Joe Biden to address urgent industrial base vulnerabilities and deliver on the promise of the CHIPS Act by prioritizing domestic development of printed circuit boards (PCBs) and integrated circuit (IC) substrates under Title III of the Defense Production Act.  

Three industry groups – IPC, the U.S. Partnership for Assured Electronics (USPAE), and the Printed Circuit Board Association of America (PCBAA) – delivered a letter to President Biden, calling on him to issue a presidential determination on the matter.

“For more than 20 years,” the letter states, “experts in and out of government have warned that the erosion of U.S. PCB capabilities and capacity would compromise national and economic security. These warnings have proven all too accurate, as today, the U.S. share of global PCB production has fallen from 30 percent to 4 percent, making the nation precariously reliant on a global supply chain that is itself in turmoil.”

The Biden administration’s year-long assessment of the information and communications technology (ICT) supply chain highlighted the critical importance of PCB fabrication and assembly in electronics manufacturing and recommended that government programs like Title III be used to bolster the strength of U.S. PCB manufacturers.   

Supporting the entire electronics ecosystem is also “critically important to the implementation of the CHIPS Act,” the letter continues. “Presently, there are no U.S. manufacturers that can produce the volume of IC substrates needed to support defense and commercial needs.”  

Increasing domestic chips production without bolstering regional development and manufacture of cutting-edge PCBs and IC substrates risks lengthening and slowing the semiconductor supply chain, because many of the chips made in Arizona or Ohio will need to be sent to other countries for component packaging and assembly into finished products.

“A presidential determination on PCBs and IC substrates would be a key step toward rebuilding the U.S. electronics manufacturing industry,” Mitchell added. “The Executive Branch and Congress must continue to support – through long-term policy and funding – the entire ecosystem that drives and sustains innovative, resilient, and secure electronics manufacturing.”  

For more information, visit www.IPC.org.

Taiwan Union Technology Corporation (TUC) First Company Globally to Re-Qualify Products to IPC-4101 Qualified Products Listing

IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Zhubei, Hsinchu County, Taiwan.

TUC provides mass lamination services, copper-clad laminates and prepregs to the global electronics industry. To earn the QPL, TUC successfully re-qualified their products to IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards. TUC first achieved QPL status five years ago for 18 products covering IPC specification sheets 102, 126, 130 and 134.

TUC met or exceeded the IPCs Validation Services QPL requirements for producing materials used by printed circuit board manufacturers in the electronics industry. Thus, the company is now listed as an IPC trusted source capable of manufacturing in accordance with industry best practices. TUC and other trusted suppliers can be found on IPC's QML/QPL (Qualified Product Listing) database at www.ipcvalidation.org.

“In the 1970s, 1980s, and 1990s, having a product posted on the Qualified Product List (QPL) for the USA Military Standard MIL-S-13949 meant that the company met the highest standards for production and quality,” said George Hsin, chief strategy officer, Taiwan Union Technology Corporation. “PWB suppliers made this QPL their first screen when selecting base materials. The facilities and the products on the QPL were trusted by the entire electronics supply chain. At TUC, we were happy to see the QPL concept brought back by IPC five years ago to their base materials standard IPC-4101. TUC is also excited to be the first copper-clad laminate and prepreg manufacturer in the world to pass the qualification testing program at an independent test laboratory for a second time.”  

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes that conform to IPC standards.

“TUC has differentiated itself from the competition by demonstrating its commitment to the highest level of quality,” said Randy Cherry, IPC director of Validation Services. “We are pleased to recognize TUC as a member of the trusted IPC-4101 QPL suppliers.”

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806. 

Winners of IPC Hand Soldering and Rework Competition at NEPCON Vietnam 2022 Announced

In conjunction with NEPCON Vietnam 2022, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam on September 14-16, 2022. Held for the first time in person since the COVID-19 pandemic, this ninth competition series welcomed 33 competitors from 17 Vietnamese electronics companies.                                                                              

Skilled contestants competed against each other to rework a functional electronics assembly within a 50-minute time limit. Assemblies were judged on soldering in accordance with IPC-A-610H, IPC J-STD-001H, IPC-7711/21C - Class 3 criteria, the speed at which the assembly was produced, and overall electrical functionality of the assembly.                                                

On the winner’s podium at NEPCON Vietnam 2022 were:                                                  

First Place: Nguyen Van Tuan, Spartronics Vietnam. He received a certificate, a cash prize of $USD300, and a soldering station from premier sponsor QUICK. As the winner, Nguyen qualified for the IPC Hand Soldering World Championship at electronica in Munich, Germany, November 15–18, 2022. 

Second place: Nong Van Minh, Spartronics Vietnam. He received a certificate, a cash prize of $USD200, and a soldering station from premier sponsor QUICK.

Third Place: Nguyen Thi Diep, SATO Vietnam. She received a certificate, a cash prize of $USD100, and a soldering station from premier sponsor QUICK.                                       

IPC would like to thank Hand Soldering and Rework Competition sponsors and partners for their generous support this year.

  • Premier Sponsor: QUICK
  • Gold Sponsors: NIHON SUPERIOR, SOLDERINDO
  • Supporting Sponsor: LORIOT
  • Co-Organizer RX TRADEX VIETNAM

For more information on upcoming hand soldering and rework competitions, contact Henry Ton, senior business development manager–Southeast Asia, at HenryTon@ipc.org.

 

Fralock Earns IPC-1791 Qualified Manufacturers Listing (QML) as Trusted Electronics Designer

IPC’s Validation Services program has awarded an IPC-1791, Trusted Electronics Designer Requirements Qualified Manufacturer Listing (QML) to Fralock, located in Valencia, Calif.                      

Following the initial IPC audit, Fralock passed stringent design requirements to optimize product quality, reliability, and consistency across the entire manufacturing operation, earning a place on IPC’s global network of rigorously vetted and trusted sources. 

“Fralock provides product design, development, engineering, prototyping, and manufacturing services to customers that require a high level of quality and precision,” said Shibu Gangadharan, vice president of specialty engineered materials at Fralock. “This validation assures our customers that processes pertaining to IPC-1791 are adhered to throughout the manufacturing cycle.”         

IPC's Validation Services QML program was developed to promote supply chain verification. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards.                                   

"Different from other audit programs, IPC's Validation Services programs uniquely provide technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize Fralock on becoming members of IPC's network of trusted QML suppliers.”                                                                                 

For more information about IPC's Validation Services QPL/QML program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.

Analyzing a Printed Circuit Board with Oxide Residue

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A number of similar Printed Wiring Assemblies (PWAs) had been subjected to final electrical tests on automated test equipment when a common test failure was recognized. All PWAs were failing for high leakage resistance; the occurrences were not on the same electrical nets, but all PWAs had similarities in that the failed signals in question had traces on layers 2 and n-1. Extensive analysis ensued and determined there was significant oxide treatment residue on layers 2 and n-1 of a sub compositefor this board design. This is a sequentially laminated Printed Circuit Board (PCB) where layers 2 thru n-1 are laminated initially, followed by a second and final lamination of layers 1 and n.

The first objective of this paper is to describe theoxide residue case history discovered with numerous PWAs. The second objective is to provide a summary of methods and techniques engaged in when 1) determining the oxide residue condition and 2) determining whether the functional performance of the printed wiring assemblies (PWAs) would be impacted by the condition.

Initially, conformance coupons from the affected lot of PCBs were reviewed. It was discovered that bright field inspection techniques did not effectively detect any anomalies, so dark field techniques were employed during the failure analysis investigation. During this review, small white areas were seen at the interface of layers 1 and 2, as well as n-1 and n. In an effort to better observe the anomaly, horizontal grinds were conducted down to the dielectric layer interface where the crystalline structure residue was prolific. During this investigation, other PCB lots (already built into PWAs that passed electrical tests) were found to have been affected, but to a less severe degree. A variety of techniques were utilized to evaluate the issue and determine the viability of using oxide-residue contaminated PWAs. These techniques included, but were not limited to: visual examinations, PCB cross-section analysis, horizontal grinds, scanning electron microscope (SEM) evaluation with Energy Dispersive Spectroscopy (EDS), electrical simulations, and Conductive Anodic Filament (CAF) testing.

This paper provides a structured, methodical approach to failure analysis for this type of failure, as well as to determining the impact to functional performance. It may be utilized as a guideline for others facing a similar predicament.

Author(s)
Wade Goldman , Andrew Dineen, Hailey Jordan, Curtis Leonard, Edward Arthur
Resource Type
Technical Paper
Event
IPC APEX EXPO 2019

Outgassing Behaviour of SMT Flux Residue During Reflow Soldering

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SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. This work shows how the amount of no clean flux residues can be reduced by adapting the reflow conditions and shows that even highly viscous flux residues are still humidity robust. Especially, no clean solder pastes are believed to cause numerous quality issues such as reduced humidity robustness, particles sticking in viscous flux residues, reduced adhesion of coatings and other issues during the following assembly and interconnect (AIT) processes. Those issues can be tracked down to both the physical and chemical properties of the flux residues namely the chemical composition, the viscosity, the mass, the covering and the distribution on the PCB and the components. To assess the risks and to control the flux residue properties a deep understanding of the mechanisms during and after reflow soldering is crucial. This understanding can only be reached with suitable measurement methods to analyze the different physical and chemical properties of the flux residues. This work presents a gravimetrical approach to measure the amount of flux residues remaining on the PCBA after reflow soldering. The results show that the outgassing and reaction behavior of the flux residues are caused by 3 main impact factors: the thermal load (reflow temperature and time), the local partial pressures of the outgassing organic gases (solder joint design, e.g., covered/open solder joints) and the global partial pressures (reflow atmosphere, e.g., gas circulation speed, oxygen partial pressure). No clean solder fluxes consist mainly of resin (encapsulates ionic contaminations), solvents (make paste well printable) and activating acids (remove metal oxide layers). Viscous flux residues where the resin matrix is not hard are often believed to be a source for ionic contaminations which could lead to electrochemical migration. Here, SIR (surface insulation resistance) measurements of PCBAs with highly viscous no clean flux residues prove a high humidity robustness of no clean solder pastes. The knowledge about the main impact factors on the physical and chemical properties of flux residues allow to optimize the no clean SMT reflow soldering and could be a solution for the issues, which are encountered with highly reactive clean solder pastes e.g., electrochemical migration.

Author(s)
Theresia Richter, Shiyu Huang, Thomas Blank, Pierre Eckold, Lothar Henneken
Resource Type
Technical Paper
Event
IPC APEX EXPO 2019