IPC India to Host 2nd Annual Integrated Electronics Manufacturing & Interconnections (IEMI) Event

IPC India has announced the 2nd annual Integrated Electronics Manufacturing and Interconnections (IEMI) event scheduled on August 1, 2023 in Chennai, and on August 3, 2023, in Pune, India. Pre-event activities will start this November with skill competitions in hand soldering/wire harness/PCB design and member networking events at various locations in India and other countries. IEMI 2023 will be focused on automotive (EV), defence and industrial automation vertical market sectors.

IEMI is an annual platform for industry leaders and professionals in the electronics manufacturing industry to connect, communicate, collaborate and create. The two-day, two-city event will bring together designers, manufacturers, traders, suppliers, service providers and technical experts to explore new business partnerships, gain technical knowledge and source product/services. IPC India is partnering with several country and trade associations to arrange international delegate visits.

IEMI 2022 events in New Delhi (August 2, 2022) and Bengaluru (August 4, 2022) hosted approximately 1,000 international delegates, 200+ B2B meetings, presentations by experts, panel discussions, technical sessions, products and services displays, and final skill challenge competitions.       

"I am excited about the current manufacturing opportunities in India which is forecasted to bring the Indian electronics industry to US$300 billion by 2026. IEMI 2023 is an important platform for the Indian electronics manufacturing industry as it provides new business opportunities for manufacturers and suppliers,” said Dr. John W. Mitchell, IPC president and CEO.

“One of the major attractions of IEMI 2023 will be the Vendor Development Program or Sourcing Meet,” said Gaurab Majumdar, executive director, IPC India. “With the objective of promoting the growth and development of Indian SMEs by improving their market access, IPC India will be working with Indian and global OEMs,” added Majumdar.

For more information on Integrated Electronics Manufacturing & Interconnections (IEMI), visit  www.ipcindia.org.in/iemi/ or contact Gaurab Majumdar at gaurabmajumdar@ipc.org. To view the IEMI 2022 overview report, visit www.ipcindia.org.in/wp-content/uploads/2022/08/IEMI-7PSR.pdf.

IPC E-Textiles 2023 Offers an International Lineup of Speakers

Event co-located with IPC APEX EXPO 2023

IPC E-Textiles 2023 will be held Monday, January 23, 2023, in conjunction with IPC APEX EXPO, in San Diego, Calif., at the San Diego Convention Center.

IPC E-Textiles 2023 is an international forum for materials suppliers, product designers, manufacturers, technical experts, and company executives from around the world to collaborate on all areas of the supply chain for e-textiles technologies in fashion design, health and medical, sports and athletics, automotive, and military/aerospace.

This year’s event will feature informative and engaging presentations encompassing all areas of e-textiles, Q+A discussions with presenters, and a panel discussion on the economic and business aspects of e-textiles. Speakers have been invited to submit posters to accompany their presentations, and those will be displayed during poster and exhibits networking breaks at IPC APEX EXPO 2023.

In addition to the conference, IPC e-textiles standards development committee meetings will take place on January 24 and 25, and the professional development course, “Electronic Textile Evaluation Methods for Product Engineers and Designers,” taught by Madison Maxey, Loomia, will take place on January 22.

“After two years of virtual conferences, we are excited to welcome the e-textiles industry to come together in person to learn, network and collaborate,” said Vladan Koncar, Ph.D., professor, ENSAIT and IPC E-Textiles Program Committee chair, “Locating the event with IPC APEX EXPO 2023 also provides our attendees the unique opportunity to participate in standards development meetings and view the latest technologies happening in the electronics industry by visiting the exposition and other events and education offered during IPC APEX EXPO 2023.”

For more information or to register for IPC E-Textiles 2023, visit: www.ipc.org/events/ipc-e-textiles-2023.

One-Fourth of Electronics Manufacturers Believe We are Currently in a Recession

Manufacturers report passing on higher costs to customers

New data from IPC show that most electronics manufacturing industry executives see a recession as inevitable.

IPC’s October Monthly Economic Outlook and Global Sentiment Survey found that 27 percent of industry executives believe the economy is already in a recession, 45 percent believe the economy will enter a recession in 2023, and 13 percent believe the economy will enter a recession in the fourth quarter of 2023. Industry executives expecting a recession are bracing for a longer one.

“Tight financial conditions and an uncertain economic outlook are making both businesses and consumers more cautious,” stated Shawn DuBravac, IPC chief economist. “We have reached the end of the post-lockdown rebound.”

Among other conclusions, the IPC survey results show:

  • After declining for two consecutive months, the Materials Cost Index rose three points.
  • Three-fourths (73 percent) of electronics manufacturers indicate labor costs are on the rise.
  • Ease of recruitment, profit margins, and inventory available from suppliers are presently declining.
  • Positively, manufacturers expect to see a decline in backlogs over the next six months.

Inflation continues to dominate the narrative, with the U.S. likely past peak inflation, while the situation worsens in Europe. Europe is expected soon to reach peak inflation, and prices continue to rise. Projections for economic growth in Europe in 2023 have been lowered, and now show a decline for the first time for the entire year.

China’s economy remains below the targeted 5.5 percent growth expected for the year, with growth likely to be closer to 3 percent in 2022. The yuan has fallen to its lowest level in 14 years.

IPC surveyed hundreds of companies from around the world, including a wide range of company sizes representing the full electronics manufacturing value chain.

View the full reports: 

Monthly Economic Outlook

Current Sentiment of the Global Electronics Manufacturing Supply Chain

Winners of IPC Hand Soldering & Rework Competition at NEPCON Nagoya 2022 Announced

IPC hosted its popular IPC Hand Soldering and Rework Competition in Nagoya, Japan on October 26-28, 2022. Held for the first time in person since the COVID-19 pandemic, the competition welcomed 24 finalists from 17 electronics companies from Japan. The total number of the competitors exceeded 130; 24 finalists passed the primary and the secondary qualifiers and competed at the final stage.

Skilled contestants competed against each other to rework a functional electronics assembly within a 45-minute time limit. Assemblies were judged on soldering in accordance with IPC-A-610H, IPC J-STD-001H, IPC-7711/21C - Class 3 criteria, the speed at which the assembly was produced, and overall electrical functionality of the assembly.

On the winner’s podium at NEPCON Nagoya 2022 were:

First place: Masaki Nakamichi, Panasonic Corporation. He received a certificate, a cash prize of USD$500 and a soldering station from premier sponsor -- JBC Soldering Japan.  As the winner, Nakamichi qualified for the IPC Hand Soldering World Championship at electronica in Munich, Germany, November 15–18, 2022.                                                                                     

Second place: Yuki Miyashita, FUJIFILM Healthcare Manufacturing Corporation. He received a certificate and a cash prize of USD$300.

Third place: Nao Morita, Advantest Corporation. She received a certificate and a cash prize of USD$100.

IPC would like to thank Hand Soldering and Rework Competition sponsors and partners for their generous support this year:

  • Premier Sponsors — JAPAN UNIX, JBC Japan
  • Supporting Sponsors — NIHON SUPERIOR, SMIC

For more information on upcoming hand soldering and rework competitions in Asia, contact Yusaku Kono, IPC Japan representative, at YusakuKono@ipc.org.

North American PCB Industry Sales Up 14.6 Percent in September

IPC releases PCB industry results for September 2022

IPC announced today the September 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.12.

Total North American PCB shipments in September 2022 were up 14.6 percent compared to the same month last year. Compared to the preceding month, September shipments rose 17.9 percent.

PCB year-to-date bookings in September were down 2.6 percent compared to last year. However, bookings in September increased 52.0 percent from the previous month.

“The North American PCB market experienced strong growth in booking and shipments in the last month -- with shipments recording the second highest levels in recent history -- a sign that supply chain dynamics continue to improve,” said Shawn DuBravac, IPC’s chief economist.

PCB book to bill chart 1 September 2022
PCB book to bill chart 2 September 2022

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

EMS North America Industry Report, September 2022

IPC releases EMS industry results for September 2022

IPC announced today the September 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.29.

Total North American EMS shipments in September 2022 were up 15.5 percent compared to the same month last year. Compared to the preceding month, September shipments decreased 0.1 percent.

EMS bookings in September increased 21.1 percent year-over-year and increased 18.1 percent from the previous month.

“North American EMS bookings improved in the last month, hitting a high for the year, a sign that demand for durable goods still has some life despite the slowing macroeconomic environment,” said Shawn DuBravac, IPC’s chief economist. “Shipments remain healthy for a second consecutive month, a hopeful sign that severe supply chain constraints are behind us.”

EMS book to bill chart for September 2022

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

USPAE Entering Rapid Growth Phase to Better Connect Industry, Government

The U.S. Partnership for Assured Electronics (USPAE) is entering a new phase of rapid growth to better connect the electronics industry with government needs and opportunities. Effective immediately, membership dues are reduced to $1,000 for all organizations, and the process to join is streamlined.

USPAE membership entitles qualified companies to participate in the Defense Electronics Consortium (DEC), which is a Department of Defense contract vehicle targeted at non-traditional defense suppliers. The first DEC project is a $42 million effort that involves academia and large defense prime contractors along with small- and medium-sized companies.

“We anticipate a multi-project solicitation will be available to DEC members in the next few months,” said Chris Peters, USPAE Executive Director. “The business changes we’re making will help us be better positioned for that and other opportunities.”

Launched in 2020, USPAE is a DC-based nonprofit industry association dedicated to ensuring the U.S. government has access to resilient and trusted electronics supply chains. Membership is open to companies, academic institutions and nonprofit organizations based in the United States or its allies. Members from across the electronics supply chain participate in a variety of programs, such as conferences, networking events, and funded projects.

For further information, visit www.USPAE.org or send inquiries to info@uspae.org.

Gold Brush Plating Rework of Power Logic Circuit Card Assembly in an Aerospace Electronic Application

Member Download (pdf)

Selective electrodeposition (brush plating) was successfully used to rework a solder-contaminated, hard gold-plated copper flag connector for a circuit card assembly (CCA). The localized repair methodology of brush plating eliminated the need to scrap a number of CCAs that otherwise could not be reworked with conventional bath plating processes. The flag contacts on the CCA were chemically stripped to remove the contaminated gold to expose the nickel-plated copper substrate. Hard gold (Au) was applied to meet the drawing requirements. To characterize and understand the quality of the rework process, plating repair and rework were prepared on separate flag connectors, which were applied via a pencil application process and a brush plating process. Surface morphology and environmental resistance were evaluated to understand the differences among the brush plating, pencil process, and bath plated control specimens. The reworked flag connectors were also evaluated for wear resistance in comparison to conventional bath plated connectors. Results implied that the hard gold brush plating rework was dense, smooth, and uniform, with comparable wear characteristics to the bath plated control sample. The conventional hard gold bath plating flag connectors contained process artifacts that were exposed with environmental testing that were consistent with the features of the brush plating flag connectors. The lack of uniformity and presence of process artifacts in the manual pencil repair contributed to poor environmental resistance. Overall, environmental resistance and wear behavior of the brush plating flag connectors were similar to the control specimens prepared with conventional bath plating. Edge effects did not contribute to adhesion defects or blisters in the brush plated connectors.

Author(s)
Kevin R. Chasse, Daniel N. Urban, John P. Dahill, and Kurt V. Delorenzo
Resource Type
Technical Paper
Event
IPC APEX EXPO 2019

iNEMI General Purpose Flowers of Sulfur Corrosion Chamber

Member Download (pdf)

The iNEMI flowers of sulfur (FoS) corrosion chamber was developed to study creep corrosion on printed circuit board assemblies(PCBAs). The chamber, typically run at 50 or 60oC, has corrosive sulfur and chlorine gases along with relative humidity controlled in the 11 to 90% range. The sulfur gas is emitted from a bed of sulfur and the chlorine gas from household bleach containing 8.25% sodium hypochlorite. The chamber has been used to study creep corrosion. It has reproduced creep corrosion on PCBAs from manufacturing lots that suffered creep corrosion in the field; shown that creep corrosion is a function of relative humidity; shown that creep corrosion originates where the solder mask overlaps the copper metallization on printed circuit boards (PCBs); and shown that PCB storage time reduces creep corrosion propensity in service. In addition, preliminary investigations have shown the chamber to be useful in determining corrosion rates of copper and silver as a function of relative humidity and temperature and for conformal coating characterization. The paper will review the above examples of the successful use of the iNEMI FoS chamber in addition to the research currently underway to develop a qualification test for surface mount resistors at a more realistic temperature of 70oC. The current qualification test for these resistors is run at an unrealistically high temperature of 105oC which most probably causes the resistors to fail with a mechanism different from that in the field.

Author(s)
Prabjit Singh, Larry Palmer, Haley Fu, Dem Lee, Jeffrey Lee, Karlos Guo, Jane Li, Chen Xu, Simon Lee and Geoffrey Tong
Resource Type
Technical Paper
Event
IPC APEX EXPO 2019

Reducing Dust Deposition on Electronic Equipment by Optimizing Cooling Air Flow Patterns

Member Download (pdf)

Environmental dust accumulation on electronic equipment can impact the performance and reliability of the equipment in various ways. This includes mechanical effects (such as obstructions of cooling air, moving parts and optical interference), chemical effects (such as corrosion and metallic dendrite growth) and electrical effects (such as impedance reduction, short and open circuits). Minimization of dust deposition on electronic equipment is necessary and beneficial to product performance and long-term reliability. This work focuses on one aspect of reducing dust accumulation on electronic equipment, specifically by optimizing the cooling air flow.

Author(s)
Chen Xu, Jason Stafford*
Resource Type
Technical Paper
Event
IPC APEX EXPO 2019