IPC White Paper Maps the Regulatory Terrain for Electronics Suppliers in E-Mobility Sector

Electronics suppliers supporting the rapidly growing e-mobility sector are facing a dramatic escalation in environmental and social governance (ESG) compliance expectations. A new white paper from IPC’s e-Mobility Quality and Reliability Advisory Group provides a comprehensive overview of the evolving regulatory landscape and outlines the data infrastructure needed to stay ahead.

Titled Navigating E-Mobility Sustainability: Evolving Compliance and ESG Requirements for Electronics Suppliers – Part 1, the paper is authored by Brenda B. Baney of BCubed Consulting, Inc. and highlights “the increasing regulatory pressure for environmental compliance” across the automotive electronics supply chain.

The white paper traces key milestones from the European Union’s End-of-Life Vehicle (ELV) Directive through RoHS and REACH, showing how “automakers were compelled to not only adjust their manufacturing processes but also implement robust systems for tracking and reporting materials and substances used in their vehicles.”

The paper also documents how electronics suppliers have had to adapt. It notes that “suppliers, many of whom had not previously dealt with such detailed reporting requirements, faced challenges in transitioning to compliant processes,” especially in response to lead-free solder mandates and expanded SCIP database requirements.

In addition to regulatory context, the white paper dives into practical impacts, like the evolving use of the International Material Data System (IMDS) and IPC-1752 reporting systems, shifts in internal business functions, and the growing role of supply chain transparency and responsible sourcing frameworks like IPC-1755. These developments, the paper explains, are not just operational: they are “a natural part of the evolution of data systems.”

“The goal of this white paper is to help electronics suppliers not only stay ahead of regulatory trends but also leverage sustainability initiatives as a competitive advantage,” said Baney.

Part 2 of the series, which is coming soon, will provide actionable recommendations for electronics suppliers, including strategies for lifecycle carbon reporting, future-proofing compliance infrastructure, and deepening OEM collaboration to meet emerging sustainability mandates.

Download Part 1 of the white paper here: http://go.ipc.org/e-mobility-sustainabilitypart1.

IPC Hosts Industry Leaders and Signs Strategic MOUs in Taipei

May 19, 2025

On May 16, 2025, IPC hosted a high-level Industry Leaders Luncheon in Taipei, bringing together nearly 60 prominent representatives from government agencies, industry associations, and leading enterprises to explore trends and strategic opportunities shaping the future of electronics manufacturing.

During the luncheon, IPC signed two important strategic Memorandums of Understanding, the first with Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) and Institute for Information Industry (III) and the second, with Taiwan Printed Circuit Association (TPCA), taking concrete steps to deepen regional collaboration and promote the transformation of the electronics manufacturing industry.

IPC × TEEMA × III

The three organizations will collaborate to promote adoption of IPC-CFX (Connected Factory Exchange) across the EMS (electronics manufacturing services) sector in Taiwan. IPC will also support TEEMA and III in developing an artificial intelligence knowledge base for the EMS industry, empowering electronics manufacturers to accelerate their digital and intelligent transformation.

IPC × TPCA

IPC and TPCA will expand cooperation in standards development, talent development, global trade shows, and technical exchanges. In addition, the two organizations will also jointly advance sustainability initiatives such as net-zero carbon emissions and digital transformation, enhancing the global competitiveness and resilience of Taiwan’s printed circuit board (PCB) industry.

Industry Leaders Luncheon attendees included Tom Edman, TTM Technologies Inc. CEO and IPC Board chair; Dr. John W. Mitchell, IPC president and CEO; Grace Sung, Taiwan Electrical and Electronic Manufacturers’ Association (TEEMA) deputy secretary general; Calvin Tsai, director, Digital Transformation Research Institute, III; Lawrence Chang, TPCA chairman; and David Lai, TPCA secretary general.

Tom Edman stated in his speech to luncheon attendees, “As a key innovation hub in the global electronics industry, Taiwan has been working with IPC for over 50 years. Today, topics such as artificial intelligence, smart manufacturing, and sustainability are reshaping the global supply chain ecosystem, making it more important than ever for the industry to build closer and more efficient partnerships.”

At the signing ceremony, Lawrence Chang emphasized the importance of open collaboration amid global supply chain shifts, technological advancement, and net-zero transition. He stated that the partnership with IPC is a strategic response to these changes, aiming to enhance standardization, talent development, and global supply chain resilience.

“Today’s agreements reflect the long-standing trust and shared vision between IPC and Taiwan’s electronics industry,” said Dr. Mitchell. “As we look ahead, IPC remains committed to fostering forward-looking global partnerships that build a more resilient, innovative, and sustainable electronics manufacturing ecosystem.”

MoU signing in Taipei

 

MoU signing in Taipei

 

 

Understanding PCB Microsection Preparation and Analysis 101

WEBINAR REGISTRATION
Date
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Microsectional evaluation is a critical tool in determining the acceptability of printed circuit boards (PCBs). A properly prepared and evaluated sample provides reasonable assurance that the inspection performed is representative of the overall quality of the final product.

Speaker Bio

William Graver June 18

William Graver has over 36 years of experience in the PCB and PCBA manufacturing industry. Currently, Mr. Graver is a MIT (Master IPC Trainer) in IPC-A-600, IPC-6012, IPC-A-610, and IPC/WHMA-A-620 training programs, a PCBA and PCB Subject Matter Expert (SME) and Business Development Manager for Element Materials Technology (Formally NTS & Trace Labs) in Hunt Valley Maryland. His main areas of focus are IPC Training (Element is an IPC Certification Center), PCBA/PCB Failure Analysis and Business Development.

 

The Engineering Webinar Series will provides FREE, live, monthly educational experiences and videos discussing key design issues surrounding aspects of quality, defect detection & remediation, and design finalization & fabrication. All sessions are recorded and registered attendees will receive a link to the video to watch on-demand. 
 

WEBINAR REGISTRATION

New Courses Strengthen Industry Knowledge in Component Identification

May 19, 2025
| By Carlos Plaza

As electronics manufacturing continues to evolve, so too does the need for a well-trained, knowledgeable workforce. One essential skill—especially for those working on printed circuit board (PCB) assembly lines—is the ability to identify a wide range of electronic components accurately and efficiently.

To support this need, IPC has launched two new online training courses designed to build and strengthen Component Identification (ID) skills across multiple experience levels. Whether you're just starting out or already working in a technical role, these courses can help boost confidence, accuracy, and career-readiness.

Two Courses. One Foundation. Multiple Career Paths.

The new IPC Component ID course offerings are:

While both courses cover similar ground in terms of the component types presented—resistors, capacitors, transistors, diodes, and integrated circuits—their depth, instructional style, and target audience differ significantly.

Who Should Take the Introduction Course?

If you're new to electronics or onboarding entry-level assembly workers, the Introduction to Component Identification for Electronics Assembly course is the perfect place to begin. This self-paced training provides foundational knowledge in a highly accessible format. It’s particularly well suited for:

  • New hires in electronics manufacturing
  • High school and technical college students
  • Workforce development program participants
  • Anyone exploring a career in electronics assembly

The course walks learners through the visual characteristics of common components, how to read basic labels and markings, and how to match components to documentation. It's intentionally designed to be low-barrier, making it ideal for upskilling individuals without a technical background.

And because it’s free to IPC members, this course represents a valuable resource for employers looking to strengthen internal training without adding cost.

When to Advance to the PCB Assembly Course?

The Component Identification for PCB Assembly course provides a more rigorous, practical learning experience for more experienced professionals, such as line technicians, quality inspectors, or engineers working in surface mount or through-hole PCB assembly.

This advanced training dives deeper into:

  • Component function in circuit applications
  • Datasheet interpretation
  • Handling and storage concerns (such as ESD sensitivity)
  • The course also includes interactive activities and real-world visuals to help learners apply their knowledge in a manufacturing context. It’s ideal for individuals who:
  • Are transitioning into quality or inspection roles
  • Need to read and interpret bill of materials (BOMs)
  • Work with procurement or supplier quality assurance
  • Are preparing for IPC certification programs

By focusing on application rather than just recognition, this course ensures that learners are equipped to identify components and understand their role in performance and reliability.

Building Career Pathways in Electronics Manufacturing

Both of these courses reflect IPC’s commitment to closing the skills gap in electronics manufacturing. As the industry faces increasing demands for precision, speed, and reliability, a well-trained workforce is essential for success.

"Component ID is a foundational skill for anyone working in electronics manufacturing," said Carlos Plaza, Senior Director of Education Development at IPC. "These two courses provide flexible, scalable training options that meet learners where they are—whether they’re just starting out or seeking to deepen their expertise."

Companies can also use the two-tiered approach as a progression model, starting new employees in the introductory course and advancing them to the more technical training as they grow in their roles.

Start Learning Today

Both Component ID courses are now available in IPC EDGE:

If your organization is already an IPC member, you can enroll your team in the introductory course today at no cost. Not a member? Learn more about IPC membership here.

Training managers looking to build a customized learning path or integrate these courses into a broader workforce development program can complete this form to contact our education team and learn more about group enrollment and subscription options.

The Right Skills, Right Now

Component Identification may seem like a small part of electronics manufacturing, but it has big implications for quality, efficiency, and reliability. These new courses from IPC ensure that employees at every level are equipped with the knowledge they need to succeed in today’s fast-paced production environments.

With flexible, engaging content aligned to industry needs, IPC is helping the electronics workforce stay sharp, capable, and ready for what’s next.

 

Harnessing Connections: EWPTE 2025 Draws Nearly 3,000 Attendees

The 2025 Electrical Wire Processing Technology Expo (EWPTE), held May 6-8 at Baird Center in Milwaukee, Wis., provided 2,994 attendees the opportunity to meet, network and learn from the industry leading innovators and suppliers. Two hundred and eighteen (218) exhibitors -- marking the largest number of exhibiting companies in the event’s history -- showcased their products and services spanning an expanded 51,500 net square feet of show floor space.

“EWPTE has been recognized as a top 100 fastest growing show in the United States and is in a spectacular venue and a great city. My own colleagues who attended said this year’s show was an incredible place to learn and in such a specific way that directly applies to what we do,” said Parker Garrett, president, EMSCO and WHMA Board chair. “From my interactions this year, so many attendees highlighted that EWPTE provided them the unique opportunity to come together to find solutions to challenging wire processing problems, though training and education as well as to network and do business with industry leaders and subject matter experts all under one roof.”

Highlights this year included seven professional development courses and 30 technical conference sessions that offered new technical data, practical skills and techniques, and insights from research and case studies; and a keynote from Brian Schneider, Harley Davidson Motor Company, on the company’s wire harness integration into their motorcycles.

Attendees were pleased with the hands-on product experiences the show provided. “I was able to find a new supplier for tough-to-find materials, helping out just-in-time production needs. I was also able to source equipment and compare vendor options that met my company’s specific needs, live in-person and demo vendor prototype products not yet available to the public,” said Bill Givney, director of engineering, Elite Vehicle Solutions.

The exhibitor experience at EWPTE 2025 was equally beneficial. “As an exhibiting company, we enjoyed the opportunity to collaborate closely with the IPC/WHMA team at this year’s show,” said Tom Leach, business development director, Stratasys. “On the show floor, we showcased our wire harness additive manufacturing solutions and presented various customer use cases. These efforts helped us establish valuable new contacts in the electrical applications sector. Overall, the show was a major success, and we are committed to returning next year. We look forward to working with the new customers we met at the event and solving their challenges with a new advanced manufacturing approach.”                                                              

In 2026, EWPTE will return to Baird Center for its 24th year, May 5-7. For more information, visit www.electricalwireshow.com.

Advanced Packaging to System Integration – Trends and Challenges

More Information & Registration:
Date
- (9:30 - 10:15am CDT)

Advanced Packaging to System Integration – Trends and Challenges
 

Speaker:
Dr. Devan Iyer, Chief Strategist, Advanced Packaging, IPC
 

Date & Time:
Tuesday, July 9, 2025
8:30 AM – 9:15 AM (Mountain Time)
 

Location:
3D-PEIM 2025
Golden, Colorado

The future of electronics isn’t just about smaller chips—it’s about smarter integration. In this keynote plenary, Dr. Devan Iyer will explore how advanced packaging technologies such as 2.5D/3D, fan-out, and heterogeneous integration are enabling next-generation applications in data centers, 5G/6G, autonomous systems, IoT, and AR/VR.
The session will also address critical challenges in chip-package-PCB co-design and highlight the materials, processes, and integration strategies shaping the systems of tomorrow.


More Information & Registration:
https://www.3d-peim.org/
 

Sheraton Denver West Hotel

360 Union Blvd
Lakewood, CO 80228
United States

Sheraton Denver West Hotel

Sheraton Denver West Hotel
360 Union Blvd
Lakewood, CO 80228
United States

More Information & Registration:

Components to Systems: Integration Needs, Gaps, Challenges, and Solutions

More Information & Registration:
Date
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HIR Session with Joint Participation by IPC at 75th Electronic Components and Technology Conference (ECTC) 
May 27, 2025 - 3:30pm – 5:00pm
Room: Texas D
Gaylord Texan Resort & Convention Center
Dallas, Texas

Moderated by industry leaders:

  • Dr. William Chen (ASE)
  • Dr. Ravi Mahajan (Intel)
  • Dr. Devan Iyer (IPC)

Featuring expert speakers and panelists from:
Google • AMD • ASE • Siemens EDA • IME • KNS
 

Topics Include: 

  • Co-design strategies
  • Thermal management
  • Materials and assembly
  • Reliability considerations
  • R&D prototyping capabilities  

This session will explore the critical technologies and collaborations driving successful Component-to-System Integration in today’s advanced electronics landscape.

See you at #ECTC2025! ECTC | IEEE Electronic Components and Technology Conference

Gaylord Texan Resort & Convention Center

1501 Gaylord Trail
Grapevine, TX 76051
United States

Gaylord Texan Resort & Convention Center

Gaylord Texan Resort & Convention Center
1501 Gaylord Trail
Grapevine, TX 76051
United States

More Information & Registration:

Omnibus Package on Sustainability Reporting - What Should the Electronics Industry Expect

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Date
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On 26 February 2025, the European Commission (EC) published the first ‘Omnibus’ package intended to simplify EU sustainability reporting rules related to the EU Green Deal. The package includes proposals related to the Corporate Sustainability Reporting Directive (CSRD), the Corporate Sustainability Due Diligence Directive (CSDDD), the Carbon Border Adjustment Mechanism (CBAM), and regulations related to InvestEU and other EU investment programmes. 

The EC also issued a draft Delegated Act to propose changes to the EU Taxonomy Regulation. The proposal brings several long-awaited changes as well as regulatory uncertainty for companies and investors, as it continues to advance from the EC to the Council of Europe and the European Parliament and, in the process, undergoes further modifications to the initially proposed legal text. 

To help mitigate associated risks and facilitate planning, for this webinar, IPC (as the global trade association for electronics) is partnering with the Anthesis group (as subject matter experts on the omnibus package) and the Incap Corporation (as industry representative) to discuss the impact of the proposal on the global electronics industry, with a focus on CSRD, CS3D, and Taxonomy and on the measures that the electronics industry needs to take to prepare for the next steps. IPC will also present its current position on the omnibus package on sustainability reporting requirements. The 30-min presentation will be followed by a 30-min Q&A session. 

Speakers: 

  • Pianpian Wang, Associate Director - ESG Regulatory Advisory, Anthesis Group
  • Helena Maripuu, Group Communication and Investor Relations Lead, Incap Corporation
  • Diana Radovan, Director of Sustainability Policy, IPC
REGISTER

Electronics Industry Welcomes House Committee Passage of Tax Reform Legislation

IPC applauds Chairman Jason Smith (R-MO) and the House Ways and Means Committee for advancing legislation that includes several top priorities for U.S. electronics manufacturers. 

 

The bill preserves the 21% corporate tax rate, restores 100% bonus depreciation, reinstates immediate expensing of domestic R&D costs, and expands and makes permanent the Section 199A deduction for pass-through businesses – all called for by IPC.

 

“Today’s vote marks meaningful progress toward restoring American electronics manufacturing strength,” said Dr. John W. Mitchell, IPC president and CEO. “These provisions are proven tools that help manufacturers reinvest, innovate, and grow. In IPC’s recent member survey, manufacturers reported that these provisions of the 2017 tax reform bill directly influenced their ability to upgrade equipment, expand production, and invest in workforce and innovation. Their restoration will provide immediate and lasting benefits.”

 

Electronics are essential to virtually every sector of the economy, from defense and aerospace to vehicles, healthcare, commerce, high performance computing, and AI. Yet the United States still faces serious gaps in its electronics manufacturing base. Many IPC members have shared that without predictable, pro-growth tax policies, long-term investments in critical manufacturing capabilities, including R&D and capital infrastructure, become far more difficult.

 

“The bill advanced by the Ways and Means Committee today is a great example of the type of pro-growth policy needed as part of a proactive strategy to build a stronger domestic electronics ecosystem in the United States.” said Mitchell.

 

“We’re encouraged by this strong step forward and urge Congress to continue building on this momentum,” said Mitchell.

Tax Policy Update: What’s in the House Tax Bill — and What It Means for Electronics Manufacturers

May 14, 2025

This morning, the House Ways and Means Committee advanced a major tax package that includes several provisions supported by IPC. These provisions — including restoring bonus depreciation, immediate R&D expensing, and strengthening the pass-through deduction — were identified by IPC members as key tools that would help them invest, grow, and compete more effectively. While the legislation still has a long way to go before becoming law, its passage out of committee marks a critical step forward.

Here’s what’s in the bill — and what it could mean for electronics manufacturers.

✅ Key Provisions Included in the Bill:

🏗️ Restores 100% Bonus Depreciation

  • Allows businesses to immediately write off the full cost of qualifying equipment and machinery investments.
  • Helps manufacturers reinvest in advanced tools, automation, and production lines — a top priority identified by IPC members.

🔬 Restores Immediate Expensing for Domestic R&D

  • Reverses the current amortization of R&D expenses and allows companies to fully deduct domestic research costs in the year incurred.
  • Encourages continued investment in innovation — especially for small and mid-sized firms.

🧾 Expands and Makes Permanent Section 199A Pass-Through Deduction

  • Increases the deduction for qualified business income to 23% and simplifies the rules for small and medium-sized businesses.
  • Supports the many IPC members organized as S corporations or partnerships.

❌ What’s Not in This Version of the Bill

While the bill includes several of IPC’s top priorities, it does not include new or expanded tax credits targeted specifically at electronics manufacturing. Proposals such as:

  • A 25% tax credit for sourcing U.S.-made printed circuit boards (PCBs)
  • Expansion of the Section 48D and 45X credits to include PCB and electronics assembly production

…were not incorporated into this version of the bill.

Given the current focus on limiting the bill’s impact on the national debt, lawmakers prioritized restoring and extending existing tax provisions rather than creating new ones. IPC understands the constraints facing Congress and appreciates the inclusion of meaningful pro-manufacturing policies in this package.

We will continue working with policymakers to make the case for targeted incentives that address the specific gaps in the U.S. electronics manufacturing ecosystem — especially as future legislative opportunities arise.

💬 IPC CEO John Mitchell: "A Strong Step Forward"

“These provisions are proven tools that help manufacturers reinvest, innovate, and grow,” said IPC President and CEO Dr. John W. Mitchell.
“We’re encouraged by this strong step forward and urge Congress to keep up the momentum. With continued leadership in the House and action by the Senate, a tax package that supports American innovation, investment, and industrial capacity can be enacted this year.”

🛠️ What Happens Next?

  • The bill now moves to the full House of Representatives for consideration.
  • The Senate must also act; discussions are ongoing.
  • Congressional Republicans have targeted a July 4 date for final passage.
  • IPC will continue pressing lawmakers to support provisions that benefit the entire electronics manufacturing supply chain.

Want to learn more or share your perspective? Contact us at friends@ipc.org or visit Advocating for the Global Electronics Industry | IPC International, Inc.

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