A Deep Dive of Applying AI in Electronic Manufacturing

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The rapid growing availability and maturity of AI (Artificial Intelligence) technology is creating new paradigm in smart manufacturing and Industry 4.0 transformation for manufacturing industry, including electronic manufacturing sector. There is great potential to apply AI in electronic manufacturing processes to assure product quality with significant efficiency improvement and cost reduction. However, a successful AI adoption has critical dependency on the careful analysis of business processes and data availability of the use case. It requires deep expertise and knowledge in both AI and the use case domain to deliver the expected ROI (return of investment) for AI adaption.

This webinar will focuses on two types AI technologies: Computer Vision AI and LLM (Large Language Model) Generative AI. A deep dive on the following topics will be discussed, with reference of technical papers published by IBM and iNEMI. 

- Current state-of-art Computer Vision AI and Generative AI technology

- Analysis of business processes and use uses

- Reference architecture and methodology for AI adoption

- The associated challenges in security, privacy, cost and capability

Speaker Bio

Feng Xue May 14 2025

Feng Xue is a dynamic leader in semiconductor technology and supply chain operations, currently serving as a Senior Technical Staff Member at IBM Infrastructure's Supply Chain Engineering division. With over two decades of experience, Feng has honed his expertise in the field, making significant strides in his role as Chief Architect for Supply Chain Quality System Solutions.

Feng spearheads initiatives that revolutionize internal quality management systems, enhance supplier quality programs, and drive business analytics. His innovative approach to app modernization and cloud-native applications for quality processes has set new standards in the industry. Additionally, Feng is at the forefront of deploying AI solutions and leading the charge in Industrial 4.0 transformation. His commitment to engineering skill development and technical leadership is evident in his impactful work.

Since 2022, Feng has been an active member of IPC, where he currently chairs the 7-25A Automated Optical Inspection Process Control Standard Task Group and the 7-25B Automated Optical Inspection Process Control for IC Substrates Standard Task Group. He also contributes as a member of the A-team for 2-10-AT3 The Strategy Seekers, showcasing his strategic vision and dedication to advancing industry standards.

 

The Engineering Webinar Series will provides FREE, live, monthly educational experiences and videos discussing key design issues surrounding aspects of quality, defect detection & remediation, and design finalization & fabrication. All sessions are recorded and registered attendees will receive a link to the video to watch on-demand. 
 

Reliability of Electronics – Role of Solder Joint Voids

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Tuesday and Thursday 2:00 – 4:00 p.m.

 

Course Highlights:

  • Identify key causes and effects of solder joint voids
  • Explore best practices to minimize voids and improve product reliability
  • Learn from real-world case studies and industry standards (IPC-J-STD-001, IPC-A-610, IPC-7093, IPC-7095)
  • Engage with industry-leading knowledge and apply it to your own manufacturing challenges
 

Introduction to PCB Design I (Southeast Asia)

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Tuesday and Thursday 10:00 am – 12:00 pm

 

Upon completion, participants will be able to:

  • Define and create schematic symbols and PCB footprints that comply with applicable IPC Standards
  • Create simple schematics for use in simulation and prototyping applications
  • Implement industry best practices for:
    • Schematic capture
    • Hierarchical design implementation
    • Documentation
    • Parts list generation
  • Recognize the trade-offs between the different schematic methodologies and when to use each type
  • Assess different component types and attachment methods
    • Differentiate when to use each type of component
  • Define standard schematic notes
    • Apply best practices in negotiating these terms with customers

Safer Chemical Alternatives in Electronics Manufacturing

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IPC partnered with the Clean Electronics Production Network (CEPN) to develop a guide for safer chemical alternatives in electronics manufacturing. Please download this free guide to get practical information for businesses in the electronics sector seeking to use safer alternatives in their products and manufacturing processes. 

To help provide more insights about this new guide, we are hosting a webinar on May 8 at 11:00 am EDT when we will host experts from CEPN to talk about substituting hazardous chemicals with safer alternatives. This is an opportunity for resource sharing for a wide range of individuals charged with making chemical selection decisions, including facility managers, environmental health and safety professionals, product designers and engineers, regulatory compliance teams, sustainability officers, and training coordinators.

Transform Your Constraint Engineering PCB Designs

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Monday and Wednesday 11:00 am – 1:00 pm

 

What You'll Gain:

  • Deep insights into ECAD/MCAD collaboration, enhancing your PCB model-based designs.
  • Advanced techniques for applying producibility, DFMA (Design for Manufacturing/Assembly), and local/global constraint management.
  • Practical experience with real-time sample projects, enabling immediate application of learned methodologies.

Printed Board Assembly By Design

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Monday and Wednesday 6:30 – 8:30 pm

 

Design the future today. Dive into the intricacies of contemporary DFM, from component-specific needs to the effects of printed board designs on assembly.

Key Takeaways:

  • Navigate evolving component technology.
  • Identify printed board fabrication challenges.
  • Understand assembly process implications.
  • Adopt the manufacturing-by-design approach.
  • Equip yourself with the expertise to tackle today's DFM challenges.

IPC Welcomes Exemptions to Reciprocal Tariffs

IPC shared the following statement today on tariff exclusions and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO: 

 

IPC, the global electronics association, welcomes the exclusion of key electronics components and technologies (laptops and smartphones) from recently imposed reciprocal tariff measures. These exclusions—covering components, computer parts, telecommunications equipment, and other critical inputs—reflect the importance of the interconnected nature of today’s global electronics supply chains.

 

The electronics industry depends on predictable trade policies to foster innovation, ensure supply chain resilience, and maintain the competitiveness of domestic manufacturing. These tariff exclusions will help avoid supply disruptions, control costs, and support continued investment in advanced technologies in the United States.

 

In addition to these tariff exclusions, IPC encourages the Administration to extend additional exclusions for materials, chemicals, and equipment essential to the manufacturing of electronics systems. 

 

The United States is a leader in technology design and, once again, can be a leader in electronics manufacturing, so long as economic and trade policies promote the investment that is sorely needed in the domestic industry. IPC remains committed to working with President Trump to build a stronger, more resilient electronics industry.

           

Wired for Change: Electronics Industry Sentiment on Sustainability

Member Download (pdf)

In January 2025, IPC International, Inc., the global electronics association, conducted an industry-wide sentiment survey to assess the state of sustainability efforts. Responses came from a range of sub-industries, geographies, and company sizes, reflecting a broad industry perspective.
Key Findings
• Growing Sustainability Momentum – 59% of respondents expect their companies to increase sustainability efforts in 2025. Printed circuit board (PCB) and contract manufacturers anticipate the most growth.
• Sustainability as a Competitive Advantage – Regulatory compliance is a key driver for 66% of respondents, but companies are also motivated by efficiency gains (58%), technological advancements (56%), and long-term competitive positioning (55%).
• Implementation Challenges – Budget constraints, regulatory complexity, and limited expertise are the top three barriers to sustainability.
• Industry Collaboration Key – Respondents emphasized the need for greater industry-wide interaction, sharing of best practices, and access to resources to navigate sustainability challenges.
IPC supports the industry to take advantage of opportunities and overcome challenges identified in the survey through its sustainability program Evolve. Through Evolve, IPC brings together experts, ideas, and solutions from across the industry to drive progress toward a more sustainable future. Further tools and resources will be added in 2025 that will empower the industry to address financial and non-financial impact assessments, greenhouse gas reporting, safer and more sustainable chemical alternatives, and circularity for electronics.

Author(s)
Dr. John W. Mitchell
Resource Type
Technical Paper
Event
Whitepaper

NAVIGATING E-MOBILITY SUSTAINABILITY: EVOLVING COMPLIANCE AND ESG REQUIREMENTS FOR ELECTRONICS SUPPLIERS

Member Download (pdf)

This two-part paper will explore how electronics suppliers within the e-mobility transportation sectors can address the exploding sustainability requirements. Part 1 contains background about regulatory drivers that led to the creation of an automotive specific database for the entire supply chain to report material content. This reporting system has evolved over time to encompass multiple Environmental, Social, and Governance (ESG) topics with a comprehensive, harmonized set of requirements. We’ll detail these current topics’ data structure needs and connectivity to existing electronics material compliance. In Part II of this paper, we cover current and expected future regulatory efforts and automotive industry approaches to managing overall supply chain compliance, such as their focus on CarbonNet0 metrics as a measure. The focus will shift toward providing actionable recommendations for electronics suppliers aiming to meet the evolving demands of the automotive industry’s environmental compliance requirements. These recommendations will cover best practices in regulatory compliance, supply chain management, and product redesign, as well as strategies for building stronger partnerships with automotive OEMs to ensure smoother transitions toward future regulatory frameworks. The goal is to help electronics suppliers not only stay ahead of regulatory trends but also leverage sustainability initiatives as a competitive advantage.

Author(s)
Brenda B. Baney, BCubed Consulting, Inc.
Resource Type
Technical Paper
Event
Whitepaper