Your Input Needed on Smart Manufacturing Survey

May 22, 2025
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The Interdisciplinary Center for Advanced Manufacturing Systems (ICAMS) at Auburn University is conducting its annual study on behalf of the Department of Defense to understand the issues and hurdles manufacturers face when adopting smart manufacturing technologies. That information then helps inform development of solutions to overcome those challenges and help manufacturers become more successful. (You can read last year’s results here: ENG---ICAMS-SMART Report_2023_020624.pdf. 

The survey should not take more than 10 minutes of your time. We will not be asking for any sensitive information, and your name and company’s name will not be associated with any information provided. Your insights will help us better understand several overarching industry issues. If you would like, we will provide you with this year’s resulting publication once it is completed. 

We hope that you are willing to help with this project. If so, please begin the survey by clicking on the following link: https://auburn.qualtrics.com/jfe/form/SV_77JLrDPwSfGDvBc?Source=I.

 

Thank you!

Electronics Industry Demand Holds Steady Amid Tariff Turbulence

Electronics manufacturers are bracing for higher costs as profit pressures deepen according to IPC’s May Sentiment of the Global Electronics Manufacturing Supply Chain Report. Despite tariff concerns and rising material and labor costs, electronics industry demand is holding steady. The New Order Index expanded this month, signaling ongoing demand strength.

 

Material cost pressures remain elevated and are expected to intensify, with most electronics manufacturers anticipating further increases. Meanwhile, labor cost pressures have moderated, reaching their lowest index level on record, though the majority of electronics manufacturers continue to report higher labor costs. The Profit Margin Outlook Index fell to a low level, reflecting growing expectations of near-term pressure among manufacturers.

 

In response to special questions regarding tariff pressures, the percentage of electronics manufacturers not pulling forward shipments due to potential tariff risks has dropped from 65 percent in February to 53 percent in May 2025. This shift is most pronounced in Europe, where the share not pulling forward shipments fell nearly 40 percent (from 76 percent to 38 percent, while 19 percent now report pulling forward 26 percent–50 percent of shipments, up from zero percent as reported in the March 2025 analysis.

 

Paying for Tariffs

Shawn DuBravac, Ph.D., IPC chief economist and report author noted, “Electronics manufacturers expect more than two-thirds (68 percent) of announced tariffs will be paid by consumers.” 

 

Fifty-two percent of electronics manufacturers report they are adding a separate line item for tariff costs on invoices, while 38 percent are rolling those costs into the overall price without identifying them specifically.                              

 

Additional survey data show:

  • Over the next six months shipments, capacity utilization, backlogs, and orders are expected to rise, while profit margins are expected to decline.
  • Electronics manufacturers report tariff uncertainty is delaying investment or sourcing decisions (53 percent), and half of firms report greater-than-expected disruption—yet views are split on whether tariffs will be reversed (48 percent) or become permanent (48 percent).
  • Nearly two-thirds (64 percent) of electronics manufacturers indicate they have not started or increased efforts to secure manufacturing capacity in the past 60 days.
  • Over the next six months, profit margins are expected to rise more so for firms in APAC than for those in North America.
  • Electronics manufacturers expressed greatest concern regarding U.S. trade policies as it relates to overall economic impact (47 percent) and Impact on Business Operations (32 percent).                     

These results are based upon the findings of IPC’s Current State of Electronics Manufacturing Survey, fielded between April 15 and April 30, 2025.

Read the full report.

Electronics Manufacturing & Packaging Symposium (EMPS) 2025

Learn More and Register
Date
-

Electronics Manufacturing & Packaging Symposium (EMPS) 2025

 

Location: 

ESA/ESTEC 

Noordwijk, the Netherlands

 

Date: 6–9 October 2025

 

Technical Presentations 

Professional Development Courses

Exhibition

 

The symposium, organised by the European Space Agency in partnership with IPC will focus on the latest developments in printed circuit boards, electronic assembly and packaging technologies. While space applications remain a core focus, the event also covers high-reliability market segments such as defense, automotive, medical and data infrastructure, which are central to Europe’s electronics manufacturing industry.

Space Research and Technology Centre of the European Space Agency (ESA/ESTEC)

Keplerlaan 1
2201 AZ Noordwijk-Binnen
Netherlands

Space Research and Technology Centre of the European Space Agency (ESA/ESTEC)

Space Research and Technology Centre of the European Space Agency (ESA/ESTEC)
Keplerlaan 1
Noordwijk-Binnen, 2201 AZ
Netherlands

Learn More and Register

IPC White Paper Maps the Regulatory Terrain for Electronics Suppliers in E-Mobility Sector

Electronics suppliers supporting the rapidly growing e-mobility sector are facing a dramatic escalation in environmental and social governance (ESG) compliance expectations. A new white paper from IPC’s e-Mobility Quality and Reliability Advisory Group provides a comprehensive overview of the evolving regulatory landscape and outlines the data infrastructure needed to stay ahead.

Titled Navigating E-Mobility Sustainability: Evolving Compliance and ESG Requirements for Electronics Suppliers – Part 1, the paper is authored by Brenda B. Baney of BCubed Consulting, Inc. and highlights “the increasing regulatory pressure for environmental compliance” across the automotive electronics supply chain.

The white paper traces key milestones from the European Union’s End-of-Life Vehicle (ELV) Directive through RoHS and REACH, showing how “automakers were compelled to not only adjust their manufacturing processes but also implement robust systems for tracking and reporting materials and substances used in their vehicles.”

The paper also documents how electronics suppliers have had to adapt. It notes that “suppliers, many of whom had not previously dealt with such detailed reporting requirements, faced challenges in transitioning to compliant processes,” especially in response to lead-free solder mandates and expanded SCIP database requirements.

In addition to regulatory context, the white paper dives into practical impacts, like the evolving use of the International Material Data System (IMDS) and IPC-1752 reporting systems, shifts in internal business functions, and the growing role of supply chain transparency and responsible sourcing frameworks like IPC-1755. These developments, the paper explains, are not just operational: they are “a natural part of the evolution of data systems.”

“The goal of this white paper is to help electronics suppliers not only stay ahead of regulatory trends but also leverage sustainability initiatives as a competitive advantage,” said Baney.

Part 2 of the series, which is coming soon, will provide actionable recommendations for electronics suppliers, including strategies for lifecycle carbon reporting, future-proofing compliance infrastructure, and deepening OEM collaboration to meet emerging sustainability mandates.

Download Part 1 of the white paper here: http://go.ipc.org/e-mobility-sustainabilitypart1.

IPC Hosts Industry Leaders and Signs Strategic MOUs in Taipei

May 19, 2025

On May 16, 2025, IPC hosted a high-level Industry Leaders Luncheon in Taipei, bringing together nearly 60 prominent representatives from government agencies, industry associations, and leading enterprises to explore trends and strategic opportunities shaping the future of electronics manufacturing.

During the luncheon, IPC signed two important strategic Memorandums of Understanding, the first with Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) and Institute for Information Industry (III) and the second, with Taiwan Printed Circuit Association (TPCA), taking concrete steps to deepen regional collaboration and promote the transformation of the electronics manufacturing industry.

IPC × TEEMA × III

The three organizations will collaborate to promote adoption of IPC-CFX (Connected Factory Exchange) across the EMS (electronics manufacturing services) sector in Taiwan. IPC will also support TEEMA and III in developing an artificial intelligence knowledge base for the EMS industry, empowering electronics manufacturers to accelerate their digital and intelligent transformation.

IPC × TPCA

IPC and TPCA will expand cooperation in standards development, talent development, global trade shows, and technical exchanges. In addition, the two organizations will also jointly advance sustainability initiatives such as net-zero carbon emissions and digital transformation, enhancing the global competitiveness and resilience of Taiwan’s printed circuit board (PCB) industry.

Industry Leaders Luncheon attendees included Tom Edman, TTM Technologies Inc. CEO and IPC Board chair; Dr. John W. Mitchell, IPC president and CEO; Grace Sung, Taiwan Electrical and Electronic Manufacturers’ Association (TEEMA) deputy secretary general; Calvin Tsai, director, Digital Transformation Research Institute, III; Lawrence Chang, TPCA chairman; and David Lai, TPCA secretary general.

Tom Edman stated in his speech to luncheon attendees, “As a key innovation hub in the global electronics industry, Taiwan has been working with IPC for over 50 years. Today, topics such as artificial intelligence, smart manufacturing, and sustainability are reshaping the global supply chain ecosystem, making it more important than ever for the industry to build closer and more efficient partnerships.”

At the signing ceremony, Lawrence Chang emphasized the importance of open collaboration amid global supply chain shifts, technological advancement, and net-zero transition. He stated that the partnership with IPC is a strategic response to these changes, aiming to enhance standardization, talent development, and global supply chain resilience.

“Today’s agreements reflect the long-standing trust and shared vision between IPC and Taiwan’s electronics industry,” said Dr. Mitchell. “As we look ahead, IPC remains committed to fostering forward-looking global partnerships that build a more resilient, innovative, and sustainable electronics manufacturing ecosystem.”

MoU signing in Taipei

 

MoU signing in Taipei

 

 

Understanding PCB Microsection Preparation and Analysis 101

WEBINAR REGISTRATION
Date
-

Microsectional evaluation is a critical tool in determining the acceptability of printed circuit boards (PCBs). A properly prepared and evaluated sample provides reasonable assurance that the inspection performed is representative of the overall quality of the final product.

Speaker Bio

William Graver June 18

William Graver has over 36 years of experience in the PCB and PCBA manufacturing industry. Currently, Mr. Graver is a MIT (Master IPC Trainer) in IPC-A-600, IPC-6012, IPC-A-610, and IPC/WHMA-A-620 training programs, a PCBA and PCB Subject Matter Expert (SME) and Business Development Manager for Element Materials Technology (Formally NTS & Trace Labs) in Hunt Valley Maryland. His main areas of focus are IPC Training (Element is an IPC Certification Center), PCBA/PCB Failure Analysis and Business Development.

 

The Engineering Webinar Series will provides FREE, live, monthly educational experiences and videos discussing key design issues surrounding aspects of quality, defect detection & remediation, and design finalization & fabrication. All sessions are recorded and registered attendees will receive a link to the video to watch on-demand. 
 

WEBINAR REGISTRATION

New Courses Strengthen Industry Knowledge in Component Identification

May 19, 2025
| By Carlos Plaza

As electronics manufacturing continues to evolve, so too does the need for a well-trained, knowledgeable workforce. One essential skill—especially for those working on printed circuit board (PCB) assembly lines—is the ability to identify a wide range of electronic components accurately and efficiently.

To support this need, IPC has launched two new online training courses designed to build and strengthen Component Identification (ID) skills across multiple experience levels. Whether you're just starting out or already working in a technical role, these courses can help boost confidence, accuracy, and career-readiness.

Two Courses. One Foundation. Multiple Career Paths.

The new IPC Component ID course offerings are:

While both courses cover similar ground in terms of the component types presented—resistors, capacitors, transistors, diodes, and integrated circuits—their depth, instructional style, and target audience differ significantly.

Who Should Take the Introduction Course?

If you're new to electronics or onboarding entry-level assembly workers, the Introduction to Component Identification for Electronics Assembly course is the perfect place to begin. This self-paced training provides foundational knowledge in a highly accessible format. It’s particularly well suited for:

  • New hires in electronics manufacturing
  • High school and technical college students
  • Workforce development program participants
  • Anyone exploring a career in electronics assembly

The course walks learners through the visual characteristics of common components, how to read basic labels and markings, and how to match components to documentation. It's intentionally designed to be low-barrier, making it ideal for upskilling individuals without a technical background.

And because it’s free to IPC members, this course represents a valuable resource for employers looking to strengthen internal training without adding cost.

When to Advance to the PCB Assembly Course?

The Component Identification for PCB Assembly course provides a more rigorous, practical learning experience for more experienced professionals, such as line technicians, quality inspectors, or engineers working in surface mount or through-hole PCB assembly.

This advanced training dives deeper into:

  • Component function in circuit applications
  • Datasheet interpretation
  • Handling and storage concerns (such as ESD sensitivity)
  • The course also includes interactive activities and real-world visuals to help learners apply their knowledge in a manufacturing context. It’s ideal for individuals who:
  • Are transitioning into quality or inspection roles
  • Need to read and interpret bill of materials (BOMs)
  • Work with procurement or supplier quality assurance
  • Are preparing for IPC certification programs

By focusing on application rather than just recognition, this course ensures that learners are equipped to identify components and understand their role in performance and reliability.

Building Career Pathways in Electronics Manufacturing

Both of these courses reflect IPC’s commitment to closing the skills gap in electronics manufacturing. As the industry faces increasing demands for precision, speed, and reliability, a well-trained workforce is essential for success.

"Component ID is a foundational skill for anyone working in electronics manufacturing," said Carlos Plaza, Senior Director of Education Development at IPC. "These two courses provide flexible, scalable training options that meet learners where they are—whether they’re just starting out or seeking to deepen their expertise."

Companies can also use the two-tiered approach as a progression model, starting new employees in the introductory course and advancing them to the more technical training as they grow in their roles.

Start Learning Today

Both Component ID courses are now available in IPC EDGE:

If your organization is already an IPC member, you can enroll your team in the introductory course today at no cost. Not a member? Learn more about IPC membership here.

Training managers looking to build a customized learning path or integrate these courses into a broader workforce development program can complete this form to contact our education team and learn more about group enrollment and subscription options.

The Right Skills, Right Now

Component Identification may seem like a small part of electronics manufacturing, but it has big implications for quality, efficiency, and reliability. These new courses from IPC ensure that employees at every level are equipped with the knowledge they need to succeed in today’s fast-paced production environments.

With flexible, engaging content aligned to industry needs, IPC is helping the electronics workforce stay sharp, capable, and ready for what’s next.

 

Harnessing Connections: EWPTE 2025 Draws Nearly 3,000 Attendees

The 2025 Electrical Wire Processing Technology Expo (EWPTE), held May 6-8 at Baird Center in Milwaukee, Wis., provided 2,994 attendees the opportunity to meet, network and learn from the industry leading innovators and suppliers. Two hundred and eighteen (218) exhibitors -- marking the largest number of exhibiting companies in the event’s history -- showcased their products and services spanning an expanded 51,500 net square feet of show floor space.

“EWPTE has been recognized as a top 100 fastest growing show in the United States and is in a spectacular venue and a great city. My own colleagues who attended said this year’s show was an incredible place to learn and in such a specific way that directly applies to what we do,” said Parker Garrett, president, EMSCO and WHMA Board chair. “From my interactions this year, so many attendees highlighted that EWPTE provided them the unique opportunity to come together to find solutions to challenging wire processing problems, though training and education as well as to network and do business with industry leaders and subject matter experts all under one roof.”

Highlights this year included seven professional development courses and 30 technical conference sessions that offered new technical data, practical skills and techniques, and insights from research and case studies; and a keynote from Brian Schneider, Harley Davidson Motor Company, on the company’s wire harness integration into their motorcycles.

Attendees were pleased with the hands-on product experiences the show provided. “I was able to find a new supplier for tough-to-find materials, helping out just-in-time production needs. I was also able to source equipment and compare vendor options that met my company’s specific needs, live in-person and demo vendor prototype products not yet available to the public,” said Bill Givney, director of engineering, Elite Vehicle Solutions.

The exhibitor experience at EWPTE 2025 was equally beneficial. “As an exhibiting company, we enjoyed the opportunity to collaborate closely with the IPC/WHMA team at this year’s show,” said Tom Leach, business development director, Stratasys. “On the show floor, we showcased our wire harness additive manufacturing solutions and presented various customer use cases. These efforts helped us establish valuable new contacts in the electrical applications sector. Overall, the show was a major success, and we are committed to returning next year. We look forward to working with the new customers we met at the event and solving their challenges with a new advanced manufacturing approach.”                                                              

In 2026, EWPTE will return to Baird Center for its 24th year, May 5-7. For more information, visit www.electricalwireshow.com.

Advanced Packaging to System Integration – Trends and Challenges

More Information & Registration:
Date
- (9:30 - 10:15am CDT)

Advanced Packaging to System Integration – Trends and Challenges
 

Speaker:
Dr. Devan Iyer, Chief Strategist, Advanced Packaging, IPC
 

Date & Time:
Tuesday, July 9, 2025
8:30 AM – 9:15 AM (Mountain Time)
 

Location:
3D-PEIM 2025
Golden, Colorado

The future of electronics isn’t just about smaller chips—it’s about smarter integration. In this keynote plenary, Dr. Devan Iyer will explore how advanced packaging technologies such as 2.5D/3D, fan-out, and heterogeneous integration are enabling next-generation applications in data centers, 5G/6G, autonomous systems, IoT, and AR/VR.
The session will also address critical challenges in chip-package-PCB co-design and highlight the materials, processes, and integration strategies shaping the systems of tomorrow.


More Information & Registration:
https://www.3d-peim.org/
 

Sheraton Denver West Hotel

360 Union Blvd
Lakewood, CO 80228
United States

Sheraton Denver West Hotel

Sheraton Denver West Hotel
360 Union Blvd
Lakewood, CO 80228
United States

More Information & Registration:

Components to Systems: Integration Needs, Gaps, Challenges, and Solutions

More Information & Registration:
Date
-

HIR Session with Joint Participation by IPC at 75th Electronic Components and Technology Conference (ECTC) 
May 27, 2025 - 3:30pm – 5:00pm
Room: Texas D
Gaylord Texan Resort & Convention Center
Dallas, Texas

Moderated by industry leaders:

  • Dr. William Chen (ASE)
  • Dr. Ravi Mahajan (Intel)
  • Dr. Devan Iyer (IPC)

Featuring expert speakers and panelists from:
Google • AMD • ASE • Siemens EDA • IME • KNS
 

Topics Include: 

  • Co-design strategies
  • Thermal management
  • Materials and assembly
  • Reliability considerations
  • R&D prototyping capabilities  

This session will explore the critical technologies and collaborations driving successful Component-to-System Integration in today’s advanced electronics landscape.

See you at #ECTC2025! ECTC | IEEE Electronic Components and Technology Conference

Gaylord Texan Resort & Convention Center

1501 Gaylord Trail
Grapevine, TX 76051
United States

Gaylord Texan Resort & Convention Center

Gaylord Texan Resort & Convention Center
1501 Gaylord Trail
Grapevine, TX 76051
United States

More Information & Registration:
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