Reflections from Circularity 25: Moving from Why to How

May 08, 2025

By Seth Jacobsen, IPC sustainability program manager

 

Last week, I had the opportunity to attend Circularity 25 in Denver—an inspiring gathering of professionals working to advance circular solutions across industries. With hundreds of voices at the intersection of design, policy, technology, and business, the message was clear: Circularity is not just an environmental imperative—it’s a smart business strategy. 

 

Key themes throughout the event emphasized a shift in mindset: 

  • Designing for next use, not just end-of-life
  • Circularity as a tool to unlock business value
  • Recognizing that our linear systems are not built for long-term resilience 

Some of the most impactful sessions I attended included: 

  • Designing Out Linearity in New Product Development -- How can product design extend a product’s lifespan? How can stakeholders across the supply chain collectively push suppliers to adopt circular design faster?
  • Carbon Emissions and Scope 3 -- How can businesses measure the carbon impact of circular practices like reuse, repair, and remanufacturing?
  • How to Build Your Circular Economy Roadmap -- How can companies turn circularity ambitions into actionable strategies? What are the essential elements of a roadmap that balances vision and practical implementation?
  • Beyond Compliance: Leveraging Digital Product Passports -- How can businesses use Digital Product Passports (DPPs) not just to adhere to forthcoming regulations but to drive brand value, customer trust, and supply chain resilience?

 

Each session offered a mix of inspiration and pragmatic insights. One recurring theme was that circularity flourishes when the customer becomes the supplier, transforming the take-make-waste model into regenerative systems. Another takeaway: Many of the technologies needed to enable circularity are yet to be invented, underscoring the need for ongoing innovation and cross-sector collaboration. 

For the electronics industry, the relevance is undeniable. We see real opportunities where resource efficiency leads to improved margins, reduced risk, and long-term growth. But perhaps the most important reminder from this conference is that articulating the business case is essential—to drive adoption, to secure investment, and to turn strategy into action. 

Why Circularity Makes Good Business Sense

One of the most consistent messages from Circularity 25 was that circularity is not just an environmental strategy—it’s a business imperative. Companies that embrace circular practices are seeing tangible benefits across several key areas:

1. Stronger Supply Chains and Material Security

Circularity strengthens supply chain resiliency by reducing reliance on fragile, globalized systems and mitigating risks tied to the availability of critical materials. For industries like electronics—where inputs such as rare earth elements, cobalt, and lithium are essential yet increasingly scarce or geopolitically sensitive—circular strategies like material recovery, reuse, and modular design can secure access to key resources. By diversifying material sources and closing loops, companies are better positioned to weather supply disruptions and reduce their exposure to volatile commodity markets.

2. Access to New Customers and Markets

Offering products that are designed for longevity, repairability, or take-back services can open doors to customers looking to meet their own sustainability goals. In addition, emerging policy frameworks—such as right-to-repair regulations or extended producer responsibility (EPR) laws—are creating markets that reward circular innovation.

3. Operational Cost Savings through Resource Efficiency

Resource-efficient design doesn’t just reduce environmental impact—it also lowers costs. Whether it's optimizing material use, reducing energy and water consumption, or minimizing waste generation, circular strategies can lead to real operational savings. For manufacturers operating on tight margins, especially in electronics, these efficiencies can be the difference between profit and loss.

As someone working to support sustainability across a global industry, a message from one of the keynotes resonated with me: We’ve made progress on the “why” and we’re seeing more examples of the “what.” Now it’s time to focus on the “how.” 

To learn how IPC supports the electronics industry on sustainability challenges and issues, visit www.ipc.org/evolve.

IPC Day Aero-Mil Toulouse

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Date
-

IPC Day Aero-Mil Toulouse – 4-5 June 2025

Wednesday 4 June 13:00-17:00 and Thursday 5 June 9:00-13:00

 

Day 1 (afternoon session) – Wednesday 4 June 

Welcome Address : 
•    Airbus DS - Pierre-Emmanuel Goutorbe, & IPC – Sanjay Huprikar

Keynote
·      Alison James – Update advocacy
·      Airbus DS-Defense & Space - Oscar Vazquez Chiclana

Session 1 – Connectors & High-speed Connectivity
A technical session where industry leaders and experts will dive into the latest innovations, challenges, and design strategies for connectors-to-board, including high-speed connectivity technology.

Presentations will cover common use cases in aerospace/automotive areas addressing technical challenges and solutions, e.g., signal integrity and mechanical reliability. Industry experts are going to address best design practices, such as those applicable to printed board and wire harness design in relation to connector selection. 

Q&A sessions will be held after each technical session to enhance discussion on industry challenges and needs in standardization.

Confirmed speakers include : Airbus Patrick Rainjonneau, ODU Jonathan Milteau,  Considered speakers may include Thales, Amphenol, AXON, C&K, Radiall, FCI, Smith Interconnect, Positronic, Glenair France... 

Networking Dinner

Day 2 (morning session) – Thursday 5 June (9-13)

Session 2 – Press-fit Technologies Deep Dive
A team of industry experts with multi decade experience in designing, materials, manufacturing, process quality and acceptability, reliability of the interconnection, as well as the fundamental physical mechanisms will draw a holistic picture of press-fit technology.

The presentations include the Press-fit pin itself, PCB and PCBA, as well as the connector part. Quality and reliability will be discussed with an extensive automotive background. Following the presentation part, the speakers are happy to discuss questions around space requirements, surface finishes, and any other topics around the press-fit interconnection. Basis for the session will be the IPC-9797A standard and the IPC-HDBK-9798 handbook. The A version of the handbook will include a rework section.

Confirmed speakers include : Continental François Le Rest, Bosch Philippe Jaeckle, Uibel consulting Frank Uibel, EPT Hermann Eicher  

Hotel room in Toulouse for IPC Day participants

Toulouse is under quite high hotel room pressure during this period and IPC is holding a roomblock of 15 rooms available for IPC Day participants at Aparthotel Adagio Toulouse Centre Ramblas (located nearby the conference venue). 

These rooms are available for checkin 4 June and checkout 5 June at the price of 196 EUR per night (excluding. breakfast). They are to be paid onsite at checkin time and need to be attributed to participants by Thursday 29 May at the very latest. 

In case you would like to get one of these rooms for your own use, please send a written request including guest first name, last name and checkin/checkout date to philippeleonard@ipc.org. 

Upon receipt, a confirmation will be returned to you to confirm that the room is yours. Please note that any cancellation received after 29 May will bear 100% cost. 
 

Region
Europe
First Name Toulouse (formerly Pullman Toulouse Centre Ramblas)

84 All. Jean Jaurès
31000 Toulouse
France

First Name Toulouse (formerly Pullman Toulouse Centre Ramblas)

First Name Toulouse (formerly Pullman Toulouse Centre Ramblas)
84 All. Jean Jaurès
Toulouse, 31000
France

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IPC White Paper Maps the Regulatory Terrain for Electronics Suppliers in E-Mobility Sector

Electronics suppliers supporting the rapidly growing e-mobility sector are facing a dramatic escalation in environmental and social governance (ESG) compliance expectations. A new white paper from IPC’s e-Mobility Quality and Reliability Advisory Group provides a comprehensive overview of the evolving regulatory landscape and outlines the data infrastructure needed to stay ahead.

 

Titled Navigating E-Mobility Sustainability: Evolving Compliance and ESG Requirements for Electronics Suppliers – Part 1, the paper is authored by Brenda B. Baney of BCubed Consulting, Inc. and highlights “the increasing regulatory pressure for environmental compliance” across the automotive electronics supply chain.

 

The white paper traces key milestones from the European Union’s End-of-Life Vehicle (ELV) Directive through RoHS and REACH, showing how “automakers were compelled to not only adjust their manufacturing processes but also implement robust systems for tracking and reporting materials and substances used in their vehicles.”

 

The paper also documents how electronics suppliers have had to adapt. It notes that “suppliers, many of whom had not previously dealt with such detailed reporting requirements, faced challenges in transitioning to compliant processes,” especially in response to lead-free solder mandates and expanded SCIP database requirements.

 

In addition to regulatory context, the white paper dives into practical impacts, like the evolving use of the International Material Data System (IMDS) and IPC-1752 reporting systems, shifts in internal business functions, and the growing role of supply chain transparency and responsible sourcing frameworks like IPC-1755. These developments, the paper explains, are not just operational: they are “a natural part of the evolution of data systems.”

 

“The goal of this white paper is to help electronics suppliers not only stay ahead of regulatory trends but also leverage sustainability initiatives as a competitive advantage,” said Baney.

 

Part 2 of the series, which is coming soon, will provide actionable recommendations for electronics suppliers, including strategies for lifecycle carbon reporting, future-proofing compliance infrastructure, and deepening OEM collaboration to meet emerging sustainability mandates.

 

Download Part 1 of the white paper here: http://go.ipc.org/e-mobility-sustainabilitypart1.

IPC EMS Advocacy Day and Public Policy Roundtable

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Date
- (7:30am - 5:00pm CDT)

Date: September 8-9, 2025
September 8 | 3:00 pm – 6:00 pm: Issues Roundtable (venue TBA)
6:00 pm – 8:00 pm Networking Dinner (venue TBA)

September 9 | 8:30 am – 3:00 pm Capitol Hill Meetings
Optional Happy Hour

Congress has agreed to a budget. The Tax committees are hard at work. The next installation of the EMS Public Policy Roundtable in our nation’s Capital will be September 8-9. Register today for a half-day policy roundtable, followed by a day of advocacy on Capitol Hill, making your voice heard on issues important to the EMS industry including taxes, tariffs, export controls, workforce and federal supply chain initiatives.

For more information, contact Richard Cappetto, RichardCappetto@ipc.org or Mark Wolfe, MarkWolfe@ipc.org.

Book your spot for an executive level solution roundtable! Space is limited.

Learn More and Register

New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability

IPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance. IPC-8981 introduces a common framework for evaluating wearables that integrate electronics directly into textile materials—applications that span healthcare, defense, fitness, and consumer technology.

 

The standard was developed by the IPC E-Textiles Wearables Standard Task Group, led by Vladan Koncar of ENSAIT GEMTEX Lab – University of Lille and Sigrid Rotzler of Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration. The task group included international experts from both the textile and electronics industries, bringing multidisciplinary insight to the testing needs of e-textile wearables.

 

“As the first standard of this kind, IPC-8981 provides a solid basis for e-textile developers to make their products more reliable, set quality targets, and choose relevant testing methods,” Rotzler explained.

 

Added Koncar, “Our IPC-8981 standard and the associated test methods are essential: They help companies from both the textile and electronics sectors collaborate more effectively to develop high-quality products that are ready for market adoption.”

 

IPC-8981 is supported by 14 newly published IPC-TM-650 Test Methods covering environmental and mechanical durability factors such as abrasion, perspiration, UV exposure, and washing. It also offers guidance on part classification, testing thresholds, and how to reduce unnecessary testing steps to streamline development.

 

The release of IPC-8981 marks a pivotal step forward for the e-textiles wearables industry—providing the tools needed to transform wearable electronics from promising prototypes into reliable, market-ready solutions.

 

To purchase IPC-8981, visit the IPC Store. To learn more to join the IPC E-Textiles Wearables Standard Task Group and guide future enhancements to the standard, visit IPC's committee page. 

 

Calculating the ROI of Training

A Step-by-Step Guide
Apr 28, 2025
| By Carlos Plaza

Measuring the effectiveness of training requires a systematic approach to data collection and analysis. Here’s a step-by-step guide to calculating the ROI of your training programs:

Step 1: Identify Key Performance Indicators (KPIs) & Responsibilities

Identify KPIs that your training program aims to improve. Your KPIs should relate directly to measurable outcomes for direct and indirect benefits.

  • Direct Benefits: Productivity, quality, cost, and operational efficiency metrics.
  • Indirect Benefits: Employee retention, customer satisfaction, and innovation metrics. 

Then, determine who will be responsible for each of the remaining steps in the ROI Evaluation process. For example, your MES and ERP specialist will document the pre training metrics and collect the post training data exactly 3 months after the trained individuals are placed on the line. Having settled on an analytical method (e.g., control groups, A/B testing, trendline analysis, benchmarking, etc.) your first shift QA engineer will use an ROI calculation model, such as cost-benefit analysis, to determine the value of your gains or loses.

Step 2: Establish Baseline Data 

Use production reports, quality control audits, financial accounting systems, and HR systems to gather baseline data for each of the KPIs you identified in step one. Your pre-training performance metrics might include productivity levels, defect rates, operational costs, employee retention rates, customer satisfaction levels, and employee engagement scores. 

Step 3: Post-Training Data Collection 

After training, continue to collect data on the same KPIs to determine improvements across both direct and indirect benefits. Ongoing tracking helps determine the extent of improvements across both direct and indirect benefits. 

Step 4: Compare Pre- and Post-Training Data 

Compare post-training data against baseline data to quantify improvements. For example, measure productivity increases, defect rate reductions, and cost savings. 

Step 5: Calculate the Cost of Training 

Account for all associated expenses, including both direct and indirect costs. Direct costs include tangible, trackable expenses such as trainer fees, course materials, software licenses, and participant wages paid during training. They may also cover ongoing coaching, refresher courses, post-training support, and program evaluation activities.

Indirect costs refer to less visible but necessary resources, such as administrative time, facility usage, utilities, and general overhead.
While opportunity cost—the lost productivity of participants while attending training—is a valid business consideration, it’s not always included in ROI calculations unless the time away from core tasks significantly impacts operations.

Step 6: Apply ROI Calculation Models

Use ROI calculation models to quantify the financial return on the training investment. 

Cost-Benefit Analysis: Compares direct and indirect financial benefits to the total cost of the training program. 

Balanced Scorecard: Considers financial metrics along with customer satisfaction, internal process improvements, and employee growth. 

Benchmarking: Compares pre-training performance, post-training results, and industry standards. 

Measure for Success

Calculating the ROI of training isn't just about showing value—it's about maximizing your investment in your people and processes. By following a structured approach, you can clearly demonstrate how training impacts critical areas like productivity, quality, employee retention, and customer satisfaction.

The key is systematically defining measurable objectives, collecting meaningful pre- and post-training data, and applying appropriate analytical methods. Remember to consider both direct benefits, such as increased productivity and cost savings, as well as indirect benefits like improved engagement and retention. Accurately calculating your training costs ensures that your ROI results reflect the true impact of your investment.

Ultimately, measuring training ROI isn't just a retrospective exercise. It's a strategic practice that helps your company optimize resources, justify training budgets, and continuously improve workforce development.

Carlos Plaza

Need help organizing, implementing, or evaluating your training initiatives? I'm here to guide you every step of the way. Feel free to reach out to discuss your training goals and ROI measurement strategies. Let’s ensure your training delivers measurable value and aligns with your company's long-term success.
Carlos Plaza, IPC Senior Director of Education  
 

North American PCB Industry Shipments Down 3.1 Percent in March

IPC Releases PCB Industry Results for March 2025

IPC announced today the March 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.24.

Total North American PCB shipments in March 2025were down 3.1 percent compared to the same month last year. Compared to the preceding month, March shipments were down 2.3 percent. March's year-to-date (YTD) shipments increased by 8.7% year-over-year (YOY).

PCB bookings in March were down 0.3 percent compared to the same month last year. March bookings were down 31.8 percent compared to the preceding month. March’s YTD bookings increased 19.3% compared to the same period last year.

“March marked the closest alignment between bookings and shipments that we’ve seen since October 2024—a signal that supply chains may be stabilizing, even as demand remains firm,” said Shawn DuBravac, IPC’s chief economist. 

March 2025 PCB book to bill ration chart 1

 

March 2025 PCB book to bill ratio chart 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

 

 

North American EMS Industry Up 0.2 Percent in March

IPC releases EMS industry results for March 2025

IPC announced today the March 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.37.

Total North American EMS shipments in March 2025 were up 0.2 percent compared to the same month last year. Compared to the preceding month, March shipments were up 4.2 percent. March’s year-to-date (YTD) shipments decreased by 0.3% year-over-year (YOY).

EMS bookings in March increased 12.7 percent year-over-year and increased 10.5 percent from the previous month. March’s YTD bookings increased 4.0% compared to the same period last year.

“March bookings jumped as buyers raced to get ahead of mounting uncertainty. Concerns over geopolitical tensions and potential tariff hikes have prompted preemptive orders as firms look to secure inventory before conditions worsen,” said Shawn DuBravac, IPC’s chief economist. “But while bookings surged, shipment growth remained relatively flat, reminding us that order volumes have a natural ceiling dictated by production capacity limitations.”

March 2025 EMS book to bill ratio chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

 

IPC Strengthens Global Leadership Team with Addition of Joe Schneider as Vice President of U.S/Canada

IPC announces the strategic appointment of Joe Schneider as vice president of U.S./Canada. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to this region’s innovation and economic growth. 

 

In this role, Schneider is responsible for ensuring that the needs of this vital region’s electronics industry are clearly understood and served by IPC and accomplished by developing strong relationships with regional membership, customers, and partners along with providing exceptional service delivery and identifying new business opportunities throughout the electronics eco-system.

 

With an impressive resume, Schneider brings more than two decades of executive experience with very successful roles and increasing responsibility in the EMS industry (Flex, Sparton) and the medical devices industry (Abbott, Siemens Healthcare). Immediately prior to joining IPC, he served as the vice president of commercial operations, health solutions for Flex in Buffalo Grove, Ill. While there, he led multi-site operations responsible for medical device, equipment and drug delivery for the healthcare industry.

 

“As our members, partners and other industry stakeholders meet Joe and see him in action, it will become very apparent that developing strong relationships with our targeted community and finding creative ways to address their challenges are part of his natural DNA. We look forward to him implementing the right strategies to better know the industry and in parallel fulfill our mission to serve the membership,” said Sanjay Huprikar, IPC’s chief global officer. 

 

Schneider is based from IPC’s corporate headquarters in Bannockburn, Ill., and can be reached at JoeSchneider@ipc.org.

IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data

IPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing. 

 

Version 2.0 provides substantial updates or expansions to support a broader range of shop floor operations. This includes capabilities added for hand soldering and wave soldering operations – expanding the total number of supported device types to 14 – and providing a pathway for gateway solutions providers to demonstrate their CFX capabilities via the CFX Validation and Qualification System. 

 

Additionally, CFX version 2.0 includes new capabilities, message additions, and structural changes to support smarter factory operations, including, for example:

  • New messaging to support Automated Guided Vehicle (AGV) and Autonomous Mobile Robot (AMR) technologies deployed in a CFX environment

  • Message field added to enable traceability of specific PCB differences (e.g., board vendor identification), which can be used to influence inspection outcomes and process optimization

  • SMT placement capabilities extended to include pick-and-place cycle information for each component to provide a detailed view of component placement and any failed pickup attempts on the machine and capture how many consecutive pickup attempts occurred before a placement error 

  • Improved handling of dynamic recipe changes during production by logging any on-the-fly modifications an operator makes to an active recipe at the equipment level

 

As with all previous IPC-2591 CFX releases, the CFX version 2.0 software development kit (SDK) is backward compatible with previous versions of the CFX SDK.

 

“Each of these enhancements in IPC-CFX 2.0 was driven by real-world manufacturing needs and vetted by the IPC task group to maintain compatibility with earlier versions,” said Thomas Marktscheffel, director of product management software solutions at ASMPT. “The result is a more expansive and detailed standard that covers a broader array of production processes and delivers richer data from machines, enabling smarter analytics and more efficient operations across the connected factory.”

 

To purchase IPC-2591, Version 2.0, visit the IPC Store.

 

For more information on CFX, including access to the latest SDK and software development resources, visit www.ipc-cfx.org.

 

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