Shaping the Future of Electronics: Why the “Component-to-System Level Packaging” Workshop is Critical to Automotive and Industrial Innovation
by Tracy Riggan, senior director, business development, IPC Technology Solutions
As the automotive and industrial sectors undergo rapid technological transformation, the electronics industry finds itself at a critical inflection point. From electric and autonomous vehicles to smart factories and connected infrastructure, modern applications demand increasingly complex electronic systems that are smaller, faster, more efficient—and more reliable than ever.
To address these challenges head-on, IPC, with the support of Research Fab Microelectronics Germany (FMD), is organizing the Workshop on Component-to-System Level Packaging – Addressing Integration Challenges for Automotive and Industrial Applications. This timely event, held in collaboration with the APECS Pilot Line initiative, offers an essential forum for the global electronics community to explore next-generation packaging and integration strategies.
Why This Workshop Matters
1. Meeting the Demands of Tomorrow’s Mobility and Industry
The shift to electrified and autonomous mobility has ushered in a new era for automotive electronics. Similarly, the rise of smart homes, Industry 4.0, and AI-driven automation has elevated the complexity and criticality of industrial electronics. These advancements necessitate unprecedented integration of processors, sensors, memory, and power modules into increasingly miniaturized and thermally efficient systems.
This workshop focuses directly on these trends, emphasizing real-world solutions to integration challenges from both Component-Level Packaging (CLP) and System-Level Packaging (SLP) perspectives.
2. From Components to Systems – A Paradigm Shift
Historically, electronic packaging stopped at the chip or device level (Level 0/1). However, today’s challenges demand a more holistic approach. System functionality is now deeply intertwined with packaging decisions—not just for individual components, but at the board (Level 2) and system (Level 3) levels. Concepts like System-in-Package (SiP) and chiplet integration blur the traditional boundaries, pushing the board "inside the package."
This shift requires close collaboration across the value chain—from OSATs (Outsourced Semiconductor Assembly and Test) to EMS (Electronics Manufacturing Services)—to enable innovation in design, materials, thermal management, and reliability.
3. Real Challenges, Real Solutions
The integration of mmWave radar, LIDAR, high-voltage EV components, wireless modules, and optical communication systems poses tough questions:
- How do we manage power and heat in ultra-compact designs?
- What standards and testing protocols ensure long-term reliability in harsh automotive or industrial environments?
- How can we accelerate the transition from research to mass production?
By focusing on these real-world issues, the workshop seeks to foster collaboration on standardization, guidelines, and best practices—all essential to bridging the gap between cutting-edge R&D and scalable manufacturing.
A Launchpad for Future Innovation
Beyond knowledge exchange, the planned outcome of this workshop is to initiate pre-competitive project proposals for Europe’s innovation ecosystem. These Research and Innovation Actions (RIA) or Innovation Actions (IA), ideally in connection with the APECS pilot line, will provide critical momentum to develop new packaging solutions that are both manufacturable and future-proof.
The emphasis on pre-competitive collaboration ensures that all players—large OEMs, mid-size manufacturers, startups, and academic partners—can contribute to and benefit from a shared innovation roadmap.
Be Part of the Solution
This workshop isn’t just another industry event. It’s a strategic touchpoint for everyone involved in the future of electronics—from IC designers and materials scientists to packaging engineers and production leaders. It is the first of several to be held globally with various focus points.
If your business is part of the automotive or industrial value chain, your presence in Berlin this July isn’t just recommended—it’s essential.
Register Today. Shape the Future of Electronics
Let’s turn challenges into solutions and innovations into industry standards—together.
For more information on the workshop, agenda, or how to participate in the APECS pilot line collaboration, visit IPC’s event calendar or contact DevanIyer@ipc.org.