North American EMS Industry Up 1.7 Percent in February

IPC releases EMS industry results for February 2025

IPC announced today the February 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.33.

Total North American EMS shipments in February 2025 were up 1.7 percent compared to the same month last year. Compared to the preceding month, February shipments were up 0.2 percent. February's year-to-date (YTD) shipments decreased by 0.4% year-over-year (YOY).

EMS bookings in February decreased 3.6 percent year-over-year and increased 8.6 percent from the previous month. February’s YTD bookings decreased 2.6% compared to the same period last year.

“The EMS sector saw a pickup in bookings in the last month, bringing the strongest book-to-bill ratio since May 2024,” said Shawn DuBravac, IPC’s chief economist. “While year-to-date trends remain down for 2025, demand continues at a robust pace.”

February 2025 EMS book to bill ratio chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

 

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

 

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio

 

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

North American PCB Industry Sales Up 11.3 Percent in February

IPC Releases PCB Industry Results for February 2025

IPC announced today the February 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.33.

Total North American PCB shipments in February 2025were up 11.3 percent compared to the same month last year. Compared to the preceding month, February shipments were down 1.5 percent. February's year-to-date (YTD) shipments increased by 15.5 percent year-over-year (YOY).

PCB bookings in February were up 17.8 percent compared to the same month last year. February bookings were up 19.9 percent compared to the preceding month. February’s YTD bookings increased 28.8 percent compared to the same period last year.

“Another exceptionally strong month of bookings has pushed the PCB Book-to-Bill ratio to a new all-time high, underscoring the strong demand momentum currently in the industry,” said Shawn DuBravac, IPC’s chief economist. 

February 2025 PCB book to bill ratio chart 1

 

February 2025 PCB book to bill ratio chart 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

 

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

 

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

 

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

Why It Matters

The ROI of Training in Electronics Manufacturing
Mar 28, 2025
| By Carlos Plaza

Investing in employee training is essential in electronics manufacturing, but how do companies know if their training programs are actually paying off? Measuring Return on Investment (ROI) ensures that workforce development leads to tangible benefits like improved productivity, reduced errors, and increased efficiency. Here’s why tracking the ROI on training is crucial for success.

  1. Justifies Training Investments
    Training programs require significant financial and time commitments. Measuring ROI helps companies prove that training is not just a cost but a strategic investment that leads to measurable business gains.
     
  2. Supports Data-Driven Decision Making
    By tracking training ROI, companies can make informed decisions about which programs to expand, refine, or eliminate. This ensures resources are allocated to initiatives with the highest impact.
     
  3. Improves Training Effectiveness
    Evaluating ROI highlights which training methods work best. Companies can use these insights to refine content, improve delivery, and enhance employee engagement, leading to better learning outcomes.
     
  4. Align training with Business Goals
    For training to be effective, it must contribute to key business objectives like increasing production yield, reducing rework, or enhancing quality control. ROI measurement ensures training is directly linked to these goals.
     
  5. Reduces Waste & Inefficiencies
    Not all training programs deliver the expected results. Measuring ROI prevents companies from wasting money on ineffective training and helps redirect investments to initiatives with proven business benefits.
     
  6. Enhances Employee Productivity & Performance
    Well-trained employees work faster, make fewer errors, and contribute to a smoother production process. By measuring ROI, companies can assess how training influences workforce efficiency and performance.
     
  7. Strengthens Competitive Advantage
    In a rapidly evolving industry, companies that prioritize training ROI gain a competitive edge. Employees with up-to-date skills reduce errors, increase quality, and enhance customer satisfaction, all of which drive business growth.
     
  8. Increases Employee Retention & Engagement
    Employees who receive meaningful training feel valued and are more likely to stay with the company. Measuring ROI helps organizations understand how training impacts job satisfaction and long-term retention.
     
  9. Ensures Compliance & Risk Reduction
    Electronics manufacturing requires strict adherence to industry regulations. ROI analysis helps assess whether compliance training reduces violations, improves safety, and mitigates costly risks.

  10. Provides a Competitive Edge in Workforce Planning
    By analyzing emerging gaps between employee competencies and industry advancements companies can anticipate skills gaps and plan for future workforce needs. This proactive approach ensures that employees are always equipped with the right knowledge and expertise.

    Final Thoughts

    Training is a critical component of success in electronics manufacturing, but its true value lies in the measurable impact it delivers. By calculating ROI, companies ensure their workforce development efforts lead to greater efficiency, cost savings, and long-term business growth.

    If you have questions about calculating training ROI at your organization you can contact me at CarlosPlaza@ipc.org.

 

Electronics Industry Leaders Available to Comment on Two-Year Anniversary of Defense Production Action

Today marks two years since President Biden issued Presidential Determination 2023-06, which invoked the Defense Production Act (DPA) to stimulate U.S. investment in the manufacturing of printed circuit boards (PCBs) and related technologies. This action identified a critical technology shortfall that, if left unaddressed, would ‘severely impair national defense’ and undermine the American warfighter.   

The Biden finding stemmed from President Trump’s Executive Order 13806 in 2017, which initiated a comprehensive assessment of the U.S. defense industrial base. The assessment characterized the domestic PCB industrial base as “aging, shrinking, and failing to maintain the state of the art,” noting that “some advanced high-density interconnect products [are] simply not producible in the U.S.” 

Little has changed in the two years since President Biden’s finding. The U.S. continues to marginalize investments in the PCB industry that are essential to U.S. military superiority and mission-critical functions carried out by warfighters.

IPC welcomes President Trump’s commitment to strengthen the U.S. electronics industrial base through new policy initiatives and sustained, strategic investment. IPC is committed to working with the administration and policymakers on Capitol Hill to ensure that America’s defense electronics capabilities are secure, resilient, and world-class.

For insights and perspectives on this second anniversary, interviews are available with Chris Mitchell, IPC’s vice president of global government relations, and Richard Cappetto, IPC’s senior director of government relations. Learn more in this blog or by visiting ipc.org. 

Two Years After Biden Action on Defense Electronics, Will Trump Follow Through on What He Started?

Mar 26, 2025

By Richard Cappetto, senior director, North American government relations

This Thursday marks two years since President Biden issued Presidential Determination 2023-06, which invoked the Defense Production Act (DPA) to catalyze U.S. investment in printed circuit board (PCB) and advanced packaging manufacturing. This action rightly identified a critical technology shortfall that, if left unaddressed, would "severely impair national defense" and undermine the warfighter.   

The Presidential Determination stemmed from President Trump’s 2017 Executive Order 13806, which launched a comprehensive assessment of the U.S. defense industrial base. A 2018 Trump administration report highlighted America’s overreliance on foreign-made PCBs, IC substrates (the materials in raw boards), and advanced packaging of semiconductor chips. The U.S. Department of Defense (DoD) continued to sound the alarm in its annual industrial capabilities reports, specifically identifying PCBs as a weak link in platforms like small, unmanned aircraft systems (drones). 

Signs of Progress   

In the two years since the Presidential Determination was issued, there have been signs of progress:  

  • Initial investments have been made: In recent years, the DoD has awarded more than $116 million in DPA funds to support PCB manufacturing. IPC member companies Calumet Electronics, GreenSource Fabrication, and TTM Technologies received funding to scale up production of cutting-edge PCBs, IC substrates, and advanced packaging.
  • Congress signaled initial support: Lawmakers approved DPA funding in FY24 for advanced packaging and PCBs, although not without a fight. IPC and its partners worked hard to preserve these investments in the face of a chips-only mentality and budgetary uncertainty.
  • More plans are in motion: Under the FY25 Continuing Resolution, the DoD is required to submit a detailed spending plan for DPA funds by May. IPC is working to ensure PCBs and related technologies are a key part of that plan, and we are advocating for robust funding in FY26 and beyond. 

Momentum at Risk  

 Despite this encouraging start, significant risks threaten to derail progress: 

 No dedicated PCB funding in the FY25 Budget: Although the Senate Appropriations Committee included $45 million for PCBs and urged continued investment in the years ahead, a final defense spending bill never materialized. Congress defaulted to a Continuing Resolution, leaving the future of PCB investments uncertain. IPC has petitioned Congress to carry forward $86 million in PCB investments in FY26, and to add PCB and PCBA manufacturing to the list of Covered Technology Categories authorized for investment under the Office of Strategic Capital. 

Missed opportunities under the CHIPS Act: While the CHIPS and Science Act has helped fuel U.S. investments in semiconductors, it has yet to be meaningfully leveraged to strengthen the PCB and PCB Assembly sectors – technologies that are indispensable to the function and reliability of every chip-based system. 

 Proposed tariffs threaten supply chains: Meanwhile, a wave of new U.S. tariffs is looming on key manufacturing inputs such as copper, aluminum, steel, and components sourced from Canada, Mexico, Asia, and Europe. These tariffs would raise costs, cause supply disruptions, and undermine U.S. manufacturing competitiveness—at a time when the industry needs stability and growth. 

 A National Security Imperative 

 The modern military depends on reliable, advanced electronics—from night vision systems to precision-guided munitions, ISR drones, command-and-control centers, and navigation systems for aircraft and ships. Yet, the U.S. continues to rely heavily on offshore sources for the PCBs and substrates that form the backbone of these systems. 

 President Trump identified this vulnerability, and President Biden’s finding was a step toward addressing it. The Congress has taken a few more initial steps.  

 But now, America is at a crossroads. The work has been done to diagnose the risk and begin remediation. It would be a grave mistake now to stop short of completing the mission. 

 The U.S. warfighter needs sustained, strategic investment not just in semiconductors, but in the entire ecosystem of electronics technologies. IPC stands ready to work with policymakers to ensure these efforts don’t stall—and that America’s defense electronics capabilities are secure, resilient, and world-class. 

 

 

Dieter Bergman IPC Fellowship Award Presented to Hiroyuki Watanabe, NEC Corporation, at IPC APEX EXPO 2025

The Dieter Bergman IPC Fellowship Award was presented to Hiroyuki Watanabe, NEC Corporation, an IPC Board Member and long-time volunteer, at IPC APEX EXPO 2025 in Anaheim, Calif. The award is given to members who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts. 

 

A member of the IPC Board of Directors since 2020, Watanabe is an expert in security and international economics. He has presented papers at IPC APEX EXPO, published white papers for the IPC Thought Leaders Program, presented at the IPC Engineering Webinar Series, held individual webinars for members in Japan, and introduced IPC’s initiatives at the Counterfeit Symposium. He serves on the IPC-1792 Cyber Security Standards Committee, is an Asia Task Group member, is an active participant in IPC’s Thought Leadership Program, and is a member of the 2-10-AT3 A-Team, The Strategy Seekers. 

 

As part of the award, Watanabe bestowed the Dieter Bergman Memorial scholarship upon Niigata University in Niigata, Japan. 

 

“Watanabe-San epitomizes the spirit of fellowship of the Dieter Bergman Fellowship Award, in leading and working with committee volunteers from around the world and is a valued board member and industry thought leader,” said John W. Mitchell, IPC president and CEO. “We are fortunate that he has chosen to share his substantial talent and expertise with IPC and the global electronics industry.”

 

 

Four Industry Leaders Receive IPC President’s Award at IPC APEX EXPO 2025

In recognition of their leadership and significant contributions of time and talent to IPC and the electronics industry, four IPC volunteers were presented with the IPC President’s Award at IPC APEX EXPO in Anaheim, Calif., on March 18, 2025. Recipients were Xaver Feiner, Zollner Elektronik AG; Thomas Marktscheffel, ASMTPT GmbH; Barry Matties, IPC Publishing Group/I-Connect007; and Cathy Hanlin, Precision Manufacturing Company Inc.

 

Xaver Feiner is an active member of the IPC Europe Advocacy Group, where he dedicates his time to advancing the position of the electronics industry and the EMS sector across Europe. He has testified before the European Commission to support Europe’s EMS industry. He is also active in IPC’s EMS Leadership Summit, working closely with other EMS leaders to bring improvements and innovation to the manufacturing process.

 

Thomas Marktscheffel shares his expertise with IPC as a member and leader of several committees and is a driving force for global industry standards such as IPC-2591 CFX and IPC-HERMES-9852. Marktscheffel has been involved with IPC standards development since 2015 when he joined the IPC-1782 A-team. He is active on A-teams for IPC-2591, IPC-HERMES-9852, IPC-2551, IPC-2552, and IPC-2553, with the overarching goal of providing standards for Factory of the Future. Currently, Marktscheffel is chair of the IPC 2-10 committee, co-chair of the IPC-2591 CFX Task Group, and chair of several A-teams.

 

Barry Matties is a leading force in publishing content about the electronics industry. I-Connect007 is the leading online media source for original electronics manufacturing supply chain content. I-Connect007 publishes multiple magazines, newsletters, books, webinars, podcasts, and real-time event coverage. For the past several years, Matties and I-Connect007 have been a valuable media partner for IPC APEX EXPO, dedicating entire issues of its trade magazines to covering the show. During APEX EXPO, I-Connect007 conducts interviews with dozens of industry leaders and multiple IPC staff and publishes the IPC APEX EXPO Show and Tell magazine, a 200-page retrospective of the show.

 

A posthumous President’s Award was presented to valued industry member, Cathy Hanlin, with Precision Manufacturing Company, Inc. Hanlin was a valued IPC/WHMA committee member whose extensive contributions to standards development are well known. She held leadership roles on 7-31F: IPC WHMA-A-620 Task Group, 7-31FT: IPC WHMA-A-620 Training Committee, 7-31FT-AT: Training Wheelz, and 5-22A- Blue Hedgehog A-Teams. 

 

“The leadership and expertise of Xaver, Thomas, Barry and Cathy have been indispensable to our industry,” said John W. Mitchell, IPC president and CEO. “We were proud to show our appreciation for their significant contributions to IPC and the global electronics industry by presenting them with the IPC President’s Award.”

IPC Honors Shennan Circuits Company and Foxconn with Corporate Recognition Awards

IPC presented its highest corporate honors to two IPC member companies, Shennan Circuits Company (SCC) and Foxconn, during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2025. The Peter Sarmanian Corporate Recognition Award was presented to SCC, and the Stan Plzak Corporate Recognition Award was presented to Foxconn.

 

The Peter Samarian Corporate Recognition Award recognizes an IPC-member company in the printed circuit board (PCB) industry that has supported IPC through participation in technical and management programs while providing leadership for the industry.

 

SCC, headquartered in Shenzhen, Guangdong, China, is a leader in China’s packaging substrate field and electronic assembly manufacturing. Since 2008, SCC has actively engaged in IPC standards development and certification training. SCC embeds IPC standards into its employee training programs, strengthening professional expertise and optimizing quality management processes. They also actively participate in IPC CEMAC, a yearly event promoting international exchange and cooperation in electronics manufacturing. 

 

The IPC Stan Plzak Corporate Recognition Award honors an IPC-member company in the electronics assembly industry (EMS) that actively contributes to the industry while supporting IPC technical and management programs. 

 

Foxconn, established in Taiwan in 1974, is the largest EMS company in the world. An IPC member since 2009, Foxconn actively participates in the development of IPC standards, standards promotion, and talent development. Strong supporters of IPC’s sustainability initiative, Evolve, Foxconn developed IPC-1401 and IPC-1402, two leading sustainability standards, and the global implementation of the IPC-CFX standard. They have invested substantially in workforce development, training, and certifying professionals to IPC standards. 

 

“SCC and Foxconn have consistently provided staff resources for standards development and other IPC programs and initiatives,” said John W. Mitchell, IPC president and CEO. “Their involvement has directly contributed to IPC’s global growth in the electronics industry, and we are pleased to recognize these two strong member companies with these prestigious awards.”

 

Long-time Industry Icon Peter Bigelow Inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2025

In recognition of his extraordinary contributions to IPC and the electronics manufacturing industry, Peter Bigelow, president of FTG Circuits Haverhill, was inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2025. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service to and advancement of IPC and the electronics industry.

 

Active in the printed circuit board industry (PCB) for more than 30 years, Bigelow was honored for his enthusiastic support of IPC’s mission to serve the electronics industry as an advocate for standards development and committee programs. He served on the IPC Board of Directors for 11 years, helping to shape IPC’s strategic objectives and enhance IPC’s position as the voice for the electronics industry supply chain.

 

He has been actively involved with the PCB Management Council and numerous professional development programs and task groups, especially those related to industry compliance challenges and the development of standards that assure trusted suppliers and secure supply chains. He is also a member of the IPC Thought Leaders Program. He is a member of eight IPC committees, serving as Chair of the PCB/IMS Presidents Management Council Steering Committee. He is a member of the Government Relations Grassroots Participants, the Trusted Supplier Task Group, the Cybersecurity Protection Standard Task Group, and two IPC A-Teams.

 

Bigelow has extensive experience in general management, marketing, operations, and sales with large publicly traded and privately held manufacturing companies in the printed circuit, electronics, and instrumentation industries. He is President of FTG Circuits in Haverhill, Mass., focusing on the military, RF/ microwave, and aerospace markets. For 22 years before its acquisition by FTG, Peter was CEO of IMl, Inc., a leading AS9100, MIL, and IPC-1791 certified and ITAR-registered fabricator of PCBs and substrates. Before that, he was president of Beaver Brook Circuits.

 

“Peter has been a true leader and innovator in the global electronics industry and has made immense and long-lasting contributions to IPC and to electronics manufacturing,” said John W. Mitchell, IPC president and CEO. “We are thrilled to welcome him as the newest inductee into the IPC Hall of Fame.”

IPC Announces New Board Members at IPC APEX EXPO 2025

At the 68th IPC Annual Meeting on March 19, held in conjunction with IPC APEX EXPO 2025, the IPC Board of Directors announced new officers and first-term members. Board officers serve a two-year term, board members serve a four-year term, and the student board member serves a one-year term.

The newly elected Board officers are:

  • IPC Board Vice Chair: Peter Cleveland, Senior Vice President, TSMC

  • IPC Board Secretary/Treasurer: Paul Baldassari, President, Manufacturing and Services, Flex

First time Board members are:

  • Markus Aschenbrenner, Member of Executive Board, Zollner Elektronik AG
  • Frank McKay, Senior Vice President, Chief Supply Chain & Procurement Officer, Jabil
  • Günter Lauber, Executive Vice President and Executive Director of the Group and Chairman of Group SMT Solutions Segment, ASMPT 

Student Board member is:

  • Emily Daley, Michigan Tech University

“IPC is privileged to have these outstanding professionals on our current slate of Board members,” said John W. Mitchell, IPC president and CEO. “We look forward to working with them as we advance the global electronics industry and build electronics better.” 

In addition to Board election announcements, IPC honored three outgoing Board Members and one Student Member:

  • Cao Xi, Technical Director, Huawei Technologies Co., Ltd., for eight years for service
  • Elke Eckstein, Board Professional, Advisor, Senior Executive in Industrials, for four years for service
  • Jay Hill, Chief Operating Officer, Imaging, GE Healthcare, for seven years of service
  • Waad Tarman, Second-year Ph.D., Student, Auburn University 

Added Mitchell, “IPC expresses its sincere gratitude to Cao Xi, Elke, Jay and Waad for their dedicated service to the IPC Board. All have shared their expertise with IPC and industry – we thank them for imparting their knowledge and helping guide IPC to best serve our members and the global electronics community.”

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