Road to Reliability: Design for Reliability - a Technology Solutions Webinar Series for e-Mobility Electronics Hardware Reliability

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We are delighted to welcome Marius Tarnovetchi of Schaeffler, Olaf Schoenfeld of Zestron, and Andy Mackie of Indium to explore the critical role of Design for Reliability (DfR) in advancing e-Mobility. 

This panel discussion will cover PCB Design for high voltage, harsh environments, physics of failure, thermal management, and the impacts of technical cleanliness on the reliability of power electronic assemblies. It will also cover components, interconnects, and systems integration. 

Our "Road to Reliability" series aims to bring industry leaders together to discuss the hurdles in achieving reliability for new e-mobility technology. We will examine reliability drivers, technology applications, and target lifecycles.

 

Wiring the World Together: IPC and WHMA Unveil Global Wire Harness Competitions and Championship

IPC, in collaboration with the Wiring Harness Manufacturer's Association (WHMA), has organized the first-ever World Wire Harness Competitions and Championship. Regional country competitions will take place between March and December 2025 and final championship will be held at IPC’s Integrated Electronics Manufacturing & Interconnections (IEMI) event scheduled January 29–30, 2026, in Bangalore, India. The global initiative promotes industry’s best practices and strengthens the skilled workforce behind cable and wire harness assembly.           

 

Country wire harness competitions will take place in China (March 27-28), Sri Lanka (April 4), Australia (May 7), UAE (May 8), Vietnam (May 16 and September 10-12), Malaysia (July 23-25), Saudi Arabia (July), Thailand (August 20-22), Mexico (August), Philippines (October), and Egypt (November).                                                     

 

The global competition will bring together top talent from across the world to compete, collaborate, and showcase the highest standards of craftsmanship in wire harness assembly—an essential function in modern electronics manufacturing.

 

The competition will follow IPC/WHMA-A-620 Revision E, the industry benchmark for quality and reliability in the cable and wire harness industry. Participants will be evaluated on a wide range of competencies, including wire preparation, crimping, soldering, BOM verification, and final assembly workmanship. 

 

The World Wire Harness Competitions and Championship come at a time when the global wire harness market is poised for substantial growth. With a projected compound annual growth rate (CAGR) of 7.2 percent between 2024 and 2034, the sector is expanding across automotive, aerospace, defense, and industrial applications. 

 

“The wire harness competitions and subsequent championship are a global celebration of craftsmanship, collaboration, and excellence—bringing the best of each region together to inspire and celebrate the beauty inside of our craft and the people,” said Parker Garrett, EMSCO, chairman, WHMA.

 

Positioned as a centerpiece of IEMI 2026, the championship is expected to attract worldwide attention from leading manufacturers, industry stakeholders, and innovation-driven enterprises. For more information on regional rounds, sponsorship opportunities, or participation guidelines, visit: www.ipc.org/ipc-india-Wireharness-2025.

IPC Strengthens Electronics Industry Awareness with Appointment of Carrie Sessine as Global Communications Vice President

IPC announces the strategic appointment of Carrie Sessine as vice president of global communications. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to global innovation and economic growth. 

 

Sessine will spearhead IPC’s comprehensive communications strategy through high-impact industry partnerships, strategic media relations, social and digital engagement, and brand building initiatives. As the association’s chief reputation steward, she will collaborate with key stakeholders across IPC’s global ecosystem to develop powerful initiatives that positively impact the organization’s reputation and elevate the electronics industry’s profile and its most pressing issues.

 

With an impressive resume, Sessine has two decades of experience in corporate communications, reputation management, marketing, brand building and public relations. Prior to IPC, she served as the senior vice president of marketing & communications for In-Q-Tel, Inc., in Tysons, Va. While there, she led marketing and communications, directed a brand refresh, established crisis communications strategies, developed external content platforms and programming, and directed large-scale conferences.

 

Prior to her work at In-Q-Tel, Inc., Sessine led an independent strategic communications consultancy for clients in life sciences, pharma, biotech, corporate, and consumer packaged goods.

 

“Our decision to hire Carrie, above all, is a testament to her robust credentials. She has a demonstrated history of successfully working in the tech industry, protecting, and enhancing brand and corporate reputations,” said Dr. John W. Mitchell, IPC president and CEO. “Carrie is an immersive storyteller and stresses the importance of engaging audiences through fostering connections. Collaborating with her team, Carrie will help position IPC and the electronics industry as a driving influence in the world.”

 

Sessine is based in the Washington, D.C. area and can be reached at CarrieSessine@ipc.org.         

A Deep Dive of Applying AI in Electronic Manufacturing

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The rapid growing availability and maturity of AI (Artificial Intelligence) technology is creating new paradigm in smart manufacturing and Industry 4.0 transformation for manufacturing industry, including electronic manufacturing sector. There is great potential to apply AI in electronic manufacturing processes to assure product quality with significant efficiency improvement and cost reduction. However, a successful AI adoption has critical dependency on the careful analysis of business processes and data availability of the use case. It requires deep expertise and knowledge in both AI and the use case domain to deliver the expected ROI (return of investment) for AI adaption.

This webinar will focuses on two types AI technologies: Computer Vision AI and LLM (Large Language Model) Generative AI. A deep dive on the following topics will be discussed, with reference of technical papers published by IBM and iNEMI. 

- Current state-of-art Computer Vision AI and Generative AI technology

- Analysis of business processes and use uses

- Reference architecture and methodology for AI adoption

- The associated challenges in security, privacy, cost and capability

Speaker Bio

Feng Xue May 14 2025

Feng Xue is a dynamic leader in semiconductor technology and supply chain operations, currently serving as a Senior Technical Staff Member at IBM Infrastructure's Supply Chain Engineering division. With over two decades of experience, Feng has honed his expertise in the field, making significant strides in his role as Chief Architect for Supply Chain Quality System Solutions.

Feng spearheads initiatives that revolutionize internal quality management systems, enhance supplier quality programs, and drive business analytics. His innovative approach to app modernization and cloud-native applications for quality processes has set new standards in the industry. Additionally, Feng is at the forefront of deploying AI solutions and leading the charge in Industrial 4.0 transformation. His commitment to engineering skill development and technical leadership is evident in his impactful work.

Since 2022, Feng has been an active member of IPC, where he currently chairs the 7-25A Automated Optical Inspection Process Control Standard Task Group and the 7-25B Automated Optical Inspection Process Control for IC Substrates Standard Task Group. He also contributes as a member of the A-team for 2-10-AT3 The Strategy Seekers, showcasing his strategic vision and dedication to advancing industry standards.

 

The Engineering Webinar Series will provides FREE, live, monthly educational experiences and videos discussing key design issues surrounding aspects of quality, defect detection & remediation, and design finalization & fabrication. All sessions are recorded and registered attendees will receive a link to the video to watch on-demand. 
 

Reliability of Electronics – Role of Solder Joint Voids

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Tuesday and Thursday 2:00 – 4:00 p.m.

 

Course Highlights:

  • Identify key causes and effects of solder joint voids
  • Explore best practices to minimize voids and improve product reliability
  • Learn from real-world case studies and industry standards (IPC-J-STD-001, IPC-A-610, IPC-7093, IPC-7095)
  • Engage with industry-leading knowledge and apply it to your own manufacturing challenges
 

Safer Chemical Alternatives in Electronics Manufacturing

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IPC partnered with the Clean Electronics Production Network (CEPN) to develop a guide for safer chemical alternatives in electronics manufacturing. Please download this free guide to get practical information for businesses in the electronics sector seeking to use safer alternatives in their products and manufacturing processes. 

To help provide more insights about this new guide, we are hosting a webinar on May 8 at 11:00 am EDT when we will host experts from CEPN to talk about substituting hazardous chemicals with safer alternatives. This is an opportunity for resource sharing for a wide range of individuals charged with making chemical selection decisions, including facility managers, environmental health and safety professionals, product designers and engineers, regulatory compliance teams, sustainability officers, and training coordinators.

IPC Welcomes Exemptions to Reciprocal Tariffs

IPC shared the following statement today on tariff exclusions and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO: 

 

IPC, the global electronics association, welcomes the exclusion of key electronics components and technologies (laptops and smartphones) from recently imposed reciprocal tariff measures. These exclusions—covering components, computer parts, telecommunications equipment, and other critical inputs—reflect the importance of the interconnected nature of today’s global electronics supply chains.

 

The electronics industry depends on predictable trade policies to foster innovation, ensure supply chain resilience, and maintain the competitiveness of domestic manufacturing. These tariff exclusions will help avoid supply disruptions, control costs, and support continued investment in advanced technologies in the United States.

 

In addition to these tariff exclusions, IPC encourages the Administration to extend additional exclusions for materials, chemicals, and equipment essential to the manufacturing of electronics systems. 

 

The United States is a leader in technology design and, once again, can be a leader in electronics manufacturing, so long as economic and trade policies promote the investment that is sorely needed in the domestic industry. IPC remains committed to working with President Trump to build a stronger, more resilient electronics industry.

           

Wired for Change: Electronics Industry Sentiment on Sustainability

Member Download (pdf)

In January 2025, IPC International, Inc., the global electronics association, conducted an industry-wide sentiment survey to assess the state of sustainability efforts. Responses came from a range of sub-industries, geographies, and company sizes, reflecting a broad industry perspective.
Key Findings
• Growing Sustainability Momentum – 59% of respondents expect their companies to increase sustainability efforts in 2025. Printed circuit board (PCB) and contract manufacturers anticipate the most growth.
• Sustainability as a Competitive Advantage – Regulatory compliance is a key driver for 66% of respondents, but companies are also motivated by efficiency gains (58%), technological advancements (56%), and long-term competitive positioning (55%).
• Implementation Challenges – Budget constraints, regulatory complexity, and limited expertise are the top three barriers to sustainability.
• Industry Collaboration Key – Respondents emphasized the need for greater industry-wide interaction, sharing of best practices, and access to resources to navigate sustainability challenges.
IPC supports the industry to take advantage of opportunities and overcome challenges identified in the survey through its sustainability program Evolve. Through Evolve, IPC brings together experts, ideas, and solutions from across the industry to drive progress toward a more sustainable future. Further tools and resources will be added in 2025 that will empower the industry to address financial and non-financial impact assessments, greenhouse gas reporting, safer and more sustainable chemical alternatives, and circularity for electronics.

Author(s)
Dr. John W. Mitchell
Resource Type
Technical Paper
Event
Whitepaper

NAVIGATING E-MOBILITY SUSTAINABILITY: EVOLVING COMPLIANCE AND ESG REQUIREMENTS FOR ELECTRONICS SUPPLIERS

Member Download (pdf)

This two-part paper will explore how electronics suppliers within the e-mobility transportation sectors can address the exploding sustainability requirements. Part 1 contains background about regulatory drivers that led to the creation of an automotive specific database for the entire supply chain to report material content. This reporting system has evolved over time to encompass multiple Environmental, Social, and Governance (ESG) topics with a comprehensive, harmonized set of requirements. We’ll detail these current topics’ data structure needs and connectivity to existing electronics material compliance. In Part II of this paper, we cover current and expected future regulatory efforts and automotive industry approaches to managing overall supply chain compliance, such as their focus on CarbonNet0 metrics as a measure. The focus will shift toward providing actionable recommendations for electronics suppliers aiming to meet the evolving demands of the automotive industry’s environmental compliance requirements. These recommendations will cover best practices in regulatory compliance, supply chain management, and product redesign, as well as strategies for building stronger partnerships with automotive OEMs to ensure smoother transitions toward future regulatory frameworks. The goal is to help electronics suppliers not only stay ahead of regulatory trends but also leverage sustainability initiatives as a competitive advantage.

Author(s)
Brenda B. Baney, BCubed Consulting, Inc.
Resource Type
Technical Paper
Event
Whitepaper