Omnibus Package on Sustainability Reporting - What Should the Electronics Industry Expect

Date
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On 26 February 2025, the European Commission (EC) published the first ‘Omnibus’ package intended to simplify EU sustainability reporting rules related to the EU Green Deal. The package includes proposals related to the Corporate Sustainability Reporting Directive (CSRD), the Corporate Sustainability Due Diligence Directive (CSDDD), the Carbon Border Adjustment Mechanism (CBAM), and regulations related to InvestEU and other EU investment programmes. 

The EC also issued a draft Delegated Act to propose changes to the EU Taxonomy Regulation. The proposal brings several long-awaited changes as well as regulatory uncertainty for companies and investors, as it continues to advance from the EC to the Council of Europe and the European Parliament and, in the process, undergoes further modifications to the initially proposed legal text. 

To help mitigate associated risks and facilitate planning, for this webinar, IPC (as the global trade association for electronics) is partnering with the Anthesis group (as subject matter experts on the omnibus package) and the Incap Corporation (as industry representative) to discuss the impact of the proposal on the global electronics industry, with a focus on CSRD, CS3D, and Taxonomy and on the measures that the electronics industry needs to take to prepare for the next steps. IPC will also present its current position on the omnibus package on sustainability reporting requirements. The 30-min presentation will be followed by a 30-min Q&A session. 

Speakers: 

  • Pianpian Wang, Associate Director - ESG Regulatory Advisory, Anthesis Group
  • Helena Maripuu, Group Communication and Investor Relations Lead, Incap Corporation
  • Diana Radovan, Director of Sustainability Policy, IPC

Electronics Industry Welcomes House Committee Passage of Tax Reform Legislation

IPC applauds Chairman Jason Smith (R-MO) and the House Ways and Means Committee for advancing legislation that includes several top priorities for U.S. electronics manufacturers. 

 

The bill preserves the 21% corporate tax rate, restores 100% bonus depreciation, reinstates immediate expensing of domestic R&D costs, and expands and makes permanent the Section 199A deduction for pass-through businesses – all called for by IPC.

 

“Today’s vote marks meaningful progress toward restoring American electronics manufacturing strength,” said Dr. John W. Mitchell, IPC president and CEO. “These provisions are proven tools that help manufacturers reinvest, innovate, and grow. In IPC’s recent member survey, manufacturers reported that these provisions of the 2017 tax reform bill directly influenced their ability to upgrade equipment, expand production, and invest in workforce and innovation. Their restoration will provide immediate and lasting benefits.”

 

Electronics are essential to virtually every sector of the economy, from defense and aerospace to vehicles, healthcare, commerce, high performance computing, and AI. Yet the United States still faces serious gaps in its electronics manufacturing base. Many IPC members have shared that without predictable, pro-growth tax policies, long-term investments in critical manufacturing capabilities, including R&D and capital infrastructure, become far more difficult.

 

“The bill advanced by the Ways and Means Committee today is a great example of the type of pro-growth policy needed as part of a proactive strategy to build a stronger domestic electronics ecosystem in the United States.” said Mitchell.

 

“We’re encouraged by this strong step forward and urge Congress to continue building on this momentum,” said Mitchell.

Scope 3 Greenhouse Gas Disclosure in the Electronics Industry

Date
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Join IPC and Anthesis Group as we explore key insights from recent Carbon Disclosure Project (CDP) research on Scope 3 greenhouse gas emissions reporting in the electronics manufacturing industry. 

Discover practical next steps tailored for IPC members to enhance their reporting and drive impact across the value chain.

Artificial Intelligence - Opportunities, Challenges, Possibilities

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Tuesday and Thursday 11:00 – 1:00 p.m.

 

Description:

In this 4-hour course, you will learn and be updated on the following topics:

  • Backdrop & diverse perspectives on AI
  • Current state of AI – global race, AI chips
  • AI - six pillars
  • AI – trust, justified confidence
  • AI hierarchy – Machine Learning, Deep Learning, Neural Network, Digital Twin, Internet of Things – nuggets, use cases
  • Generative AI, OpenAI – ChatGPT-4 (+) – nuggets, tips
  • AI - prompt engineering – tips and recommendations
  • AI - impact on jobs
  • Enterprise opportunities – examples
  • Data – quality, management
  • Edge AI, private AI
  • Global leaders & competitiveness – examples, risk-mitigation
  • AGI - Artificial General Intelligence
  • Brain, mind → intelligence
  • Future of AI – near, far
  • Concluding remarks  
 

Intro to Wire Harness Design I

Date
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Monday and Wednesday 11:00 am - 1:00 pm

Upon completion, participants will be able to:

  • Understand wires, cables, and harnesses in the electronics industry.
  • Understand the trade-offs in materials used in these applications.
  • Understand and mitigate issues in wire harness in the electronics industry.
  • Describe steps of wire harness design.
  • Identify types of connectors used in wire harness technology.
  • Understand wire terminations and cable shielding in the electronics industry.
  • Understand how to read and create wiring diagrams according to cable types. 
     

PCB Design for Radio Frequency Boards

Date
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Monday and Wednesday 6:30 - 8:30 pm

This program is designed to provide circuit board designers with a balanced foundation of theoretical knowledge and practical skills in printed circuit board design. Upon completion, participants will be able to:

  • Design boards for high-speed analog and RF/microwave frequencies.
  • Understand the trade-offs in materials used in these applications.
  • Define a board stackup that implements structures that will meet the needs of these designs.
  • Understand and mitigate signal integrity issues for these designs.
  • Understand and define the effects of mechanical retention needs for these applications.
  • Define and implement the tighter manufacturing tolerances needed for these designs.
  • Understand the use of mixed material stackups in these designs.
  • Understand the documentation requirements for these designs.

PCB Design for Signal Integrity

Date
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Monday and Wednesday 11:00 am – 1:00 p.m.

 
Description:

Signal integrity is a critical aspect of modern PCB design, especially in high-speed digital applications where the design and layout of the Printed Circuit Board (PCB) and Printed Board Assembly (PBA) can significantly affect the product’s performance and reliability. The PCB Design for Signal Integrity course equips professionals with the knowledge and skills required to design and layout PCBs that meet advanced signal integrity requirements, ensuring optimal performance in high-speed digital circuits.

 

Component-to-System Level Packaging - Addressing Integration Challenges for Automotive & Industrial Applications

Date
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Sponsorship Packages are available for the workshop on Component-to-System Level Packaging - Addressing Integration Challenges for Automotive and Industrial Applications.

Registration is now open to attend the workshop. Be Part of the Solution - The workshop is intended to bring together industry experts presenting and discussing CLP and SLP trends, requirements, challenges, solutions, and the needs for guidelines/standards desired for design, assembly, test, reliability, and manufacturing solutions (EMS) perspective.

Region
Mercure Hotel MOA Berlin

Stephanstrabe 41
10559 Berlin
Germany

Mercure Hotel MOA Berlin

Mercure Hotel MOA Berlin
Stephanstrabe 41
Berlin, 10559
Germany