IPC Hand Soldering Competition 2025 Regional Qualification - Budapest, Hungary

HSC Registration Form
Date
- (2:00 - 8:00am CDT)

Join the Regional Qualification Hungary for the IPC Hand Soldering Competition (HSC) at Innoelectro 2025, Budapest, Hungary on 8-10 April 2025.

Skilled soldering experts (F/M) will compete for 60 minutes on a complex circuit board assembly to win the 2025 National title, earn a cash prize, and compete for a coveted spot at the IPC Hand Soldering World Championship later this year.

Competition for Professionals

The professional competitors will be judged by IPC Master Instructors (MIT) on soldering a complex printed circuit board with a maximum time of 60 minutes under IPC-A-610 Class 3 criteria. Additional criteria will include the quality of the results achieved and of the assembly process, the overall electrical functionality, and the speed at which the assembly was produced.

Prizes for Professionals

The professionals will receive cash prizes: the winner and two runners-up.

  • 1st place – 300 €
  • 2nd place – 200 €
  • 3rd place – 100 €

IPC Hand Soldering World Championship: The winner will be invited by IPC (all expenses covered by IPC) to compete in the HSC World Final in November at productronica tradeshow in Munich, Germany.

Hand Soldering Best Company Team Award: This year, again, nominate a team to win the Hand Soldering Best Company Team Award. For any company enlisting 2 or 3 competitors, the highest combined scores of competitors from the same company will determine which company will receive the HSC Best Company Team Award.

Registration is free of charge.

You do not need to be an IPC member to take part.

You do not need to be IPC-certified to take part.

How to register?

Fill in the registration form and book your competition slot.

The registration deadline is Thursday 3 April 2025.

You will receive a confirmation email specifying your date and time to compete.

For more information, please contact Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org).

InnoElectro Budapest, Hungary

Budapest
Dozsa Gyorgy ut 1
1146
Hungary

Event Venue Website
https://innoelectro.com/hu/

InnoElectro Budapest, Hungary

InnoElectro Budapest, Hungary
Dozsa Gyorgy ut 1
Budapest, 1146
Hungary

HSC Registration Form

IPC Strengthens Its Global Executive Leadership Team

Matt Kelly and David Bergman transition into new roles

In an effort to strengthen service to its more than 3,200 corporate global members, IPC announces the transition of two of its executive leadership staff into new IPC roles. Matt Kelly, who most recently served as IPC’s vice president of technology solutions, has assumed the role of vice president of standards & technology and remains chief technology officer (CTO). David Bergman, IPC’s longest tenured employee who served as IPC’s standards & technology vice president, has taken on the role of vice president of international relations. 

As CTO and vice president of standards & technology, Kelly will now lead both technology solutions and standards groups. Within the standards group, he will develop and implement strategic objectives strengthening IPC standards offerings. He will provide direction and leadership toward achieving the organization’s mission to ensure IPC standards remain at the forefront of the global electronics industry. In addition, Kelly and the technology solutions group will continue to strengthen the industry in the areas of advanced electronic packaging, next generation design, and digital manufacturing. By collaborating with industry, Kelly and the solutions group will provide industry leading thought leadership, develop new guidelines and standards, and recommend new education/training solutions. 

As vice president of international relations, Bergman is responsible for expanding and strengthening the organization's global presence, fostering international partnerships, and advocating for the electronics manufacturing industry. His key responsibilities include global expansion of strategic initiatives, market development and member engagement, event and conference representation and leadership and team development of IPC’s regional teams. Bergman will continue his term as World Electronics Circuits Council (WECC) secretary general as well as executive director of the Wiring Harness Manufacturer’s Association (WHMA).

“Matt is widely recognized in the global electronics industry as a premier thought leader and innovator. As CTO, he and his group helped define and achieve a portfolio of “factory of the future” standards and technical research; he has become a trusted advisor to governments for advanced packaging; driving a silicon to systems approach for the industry; and created and launched an Industry Chief Technologist Council that has produced numerous thought-leadership reports,” said John W. Mitchell IPC president and CEO. 

Mitchell continued, “Earlier in David’s IPC career, he held responsibilities for international relations and helped establish IPC operations in China, India, Malaysia and Europe. Now based in Southeast Asia, his vast experience in international business development, coupled with his expertise in strengthening IPC’s global presence makes sense for him to serve as international relations lead. This executive leadership transition further cements IPC’s role as the leading global electronics association.”

Kelly can be reached at MattKelly@ipc.org and Bergman can be reached at DavidBergman@ipc.org.

Best Technical Papers at IPC APEX EXPO 2025 Selected

Student scholarship also awarded by IPC Education Foundation

The best technical conference papers of IPC APEX EXPO 2025 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Conference Program Committee (TPC), the international group of paper authors will be recognized during show opening remarks on Tuesday, March 18.

“The TPC is absolutely focused on providing the highest quality content to the technical conference,” said Stan Rak, co-chair of the TPC. “This commitment to quality is reflected in this year's selection of Best of Conference, NextGen, and Best Student Research papers. We extend our congratulations to all the award winners and a thank you to all paper contributors in this 25th anniversary year of IPC APEX EXPO.”  

Taking top honors in the Best of Conference category, the winning papers are:

  • “High Voltage Temperature-humidity-bias Testing of Electronic Materials on the Outer Layer of a PCB – A Round Robin Study and Beyond” by Dr. Lothar Henneken, Robert Bosch GmbH. This paper will be presented during Technical Conference Session 1 on March 18.
  • “A Method for Real-Time Rejection of Defective Components During the Pick and Place Process Using AI Technology” by Dr. Eyal Weiss, Cybord. This paper will be presented during Technical Conference Session 3 on March 18.
  • “Alternative Methods in Measuring BGAs for Thermal Warpage” by Neil Hubble, Akrometrix. Co-author: Chris Gastaldo, Akrometrix. This paper will be presented during Technical Conference Session 5 on March 18.

The NextGen best paper is awarded to:

  • “Improving THT-AOI Image Classification through Federated Learning: A Study on Model Performance and Training Stability under Various Data Distributions” by Ben Rachinger, Friedrich-Alexander-Universität Erlangen-Nürnberg. Co-authors: Nils Thielen, Sven Meier, Prof. Dr.-Ing. Jörg Franke, Prof. Dr.-Ing Florian Risch, Friedrich-Alexander-Universität Erlangen-Nürnberg, Institute for Factory Automation and Production Systems. This paper will be presented during Technical Conference Session 26 on March 19. 

The Best Student paper (and scholarship) is awarded to:

  • “Flexible Hybrid Electronics Created from a Multicomponent System of Electroless Copper on Laser-Induced Graphene”by Attila Rektor, Micron School of Materials Science and Engineering, Boise State University. Co-authors: Dr. Josh Eixenberger, Boise State University; Dr. Tony Vayalil Varghese, Boise State University; Brian Cummings, Boise State University; Michael Curtis, Boise State University, Science Applications International Corporation; Dr. Nicholas McKibben, Boise State University; Dr. John Timler, Science Applications International Corporation; and Prof. David Estrada, Boise State University, Idaho National Laboratory. This paper will be presented during Technical Conference Session 23 on March 19.

All technical conference papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry. 

To register for IPC APEX EXPO 2025 or for more information on all the activities taking place, including professional development courses, exhibition, keynote presentations, networking activities and more, visit www.IPCAPEXEXPO.org.

Technical Overview of the Semiconductor Chip Industry

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Date
-

Tuesday and Thursday 6:30 – 8:30 p.m.

 

Description:

From concept to creation, explore each stage of the semiconductor lifecycle — design, manufacturing, assembly, and testing.

Upon completing this immersive course, you will gain comprehensive insights into:

  • The fundamental components of microelectronics and how they power today's technology.
  • Key terms and cutting-edge technologies shaping the future of semiconductors.
  • The interconnected nature of the semiconductor supply chain and its impact on global markets.
  • The step-by-step journey of semiconductor chip development, from initial design to market delivery.
  • An overview of the critical manufacturing, assembly, and testing processes that ensure quality and performance.
  • Essential principles of failure analysis, enabling you to identify and resolve potential issues in chip functionality.
 
Learn More

AI Applications of Machine Data in the EMS Industry

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Date
-

Tuesday and Thursday 11:00 – 1:00 p.m.

 

Description:

In this course, we will review the data produced by factory machines such as SMT and test equipment and how AI tools can be leveraged to assist with the analysis and interpretation of the data. The course is designed around practical, interactive learning experiences with an anonymized real-world dataset and freely available analysis and visualization tools.  AI agents and copilots will be directly created live in the course using UI tools to visually illustrate the concepts and show what is possible with current technologies.

Topics include:

  • What is machine data
  • How to collect and analyze machine data
  • Visualizing and analyzing machine data using Grafana
  • What are AI copilots and agents?
  • Applications of AI technologies to analyzing machine data
  • IPC-CFX standard
 
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SMT Manufacturing Productivity & Yield - Mitigating Production Defects II

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Date
-

Tuesday and Thursday 11:00 – 1:00 p.m.

 

Description:

Module 2 will focus on production defects associated with bare PCB, PCB fabrication, and components – causes, remedies, and preventive measures. In this 4-hour course, you will learn and be updated on the following topics:

  1. Premise
  2. BGA solder ball drop
  3. PBGA crack
  4. BGA/CSP interposer heat damage
  5. BGA/CSP co-planarity issue
  6. Large BGA rework challenge
  7. Ceramic capacitor damage
  8. SOT issue
  9. Tome stoning
  10. 01001 component issue
  11. PCB board sagging
  12. PCB-related issues
  13. PCB pad-cratering
  14. PCB pad lifting
  15. PCB bare board issues
  16. Thermal damages
  17. Concluding summary
 
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NEPCON NAGOYA / IPC HSC 2025 Japan Final

Learn More and Register
Date
- (Oct 28, 2025 | 8:00pm - Oct 31, 2025 | 3:00am CDT)

NEPCON NAGOYA is the exhibition held in the center of the manufacturing industry of Japan. Nagoya is a capital city of Aichi prefecture which has Japan's largest automotive-related manufacturing industry cluster. IPC Japan will have its booth and have Japan regional final of IPC hand soldering competition 2024.

Port Messe Nagoya, Japan

2-2, Kinjofuto
Nagoya Minato-ku, Aichi
455-0848
Japan

Port Messe Nagoya, Japan

Port Messe Nagoya, Japan
2-2, Kinjofuto
Nagoya Minato-ku, 23 455-0848
Japan

Learn More and Register

IPC Standards Task Group Meeting - Japan regional F2F meeting

Date
- (Sep 29, 2025 | 11:30pm - Sep 30, 2025 | 3:00am CDT)

This face-to-face opportunity intends for regional task group members in Japan such as 7-31BV-JP and D-33AA-JP. With the guests from IPC Global, we discuss and make proposals to the original task group.

IPC Works ASIA 2025 IPC Seminar in Japan

Date
- (Sep 29, 2025 | 8:00 - 10:00pm CDT)

This annual seminar is held mainly for IPC members, regional TG participants and its standards users in Japan with the collaboration of IPC Asia. In the morning of the day, we have guest speakers from IPC global such as TG chair and liaison to update on IPC standards and activities for them. Following this, in the afternoon, Japan regional task group meeting(s) will be held.

IPC Hand Soldering Competition (HSC) 2025 in Japan

Learn More and Register
Date
-

This competition is for choosing the Japanese champion to dispatch the world final 2025 with the cooperation of Japan Unix Co., Ltd. Preliminary details (mid-July & August) will be announced around June in their website. And then, only who pass the preliminary is invited to the final at NEPCON NAGOYA (Oct. 29 - 31).

Port Messe Nagoya, Japan

2-2, Kinjofuto
Nagoya Minato-ku, Aichi
455-0848
Japan

Port Messe Nagoya, Japan

Port Messe Nagoya, Japan
2-2, Kinjofuto
Nagoya Minato-ku, 23 455-0848
Japan

Learn More and Register
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