SECTION 2.1 - 2.1 Visual Test Methods
TM 2.1.7.2 Determining a Weave as Spread Glass 12/69
SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.14.2A Solder Powder Particle Size Distribution—Optical Image Analyzer Method 12/69
TM 2.2.14.3A Determination of Maximum Solder Powder Particle Size 12/69
TM 2.2.20A Solder paste Metal Content by Weight 12/69
TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4 12/69
TM 2.2.14.1A Solder Powder Particle Size Distribution - Measuring Microscope Method 12/69
SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method) 12/69
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method 12/69
TM 2.3.35.1B Fluorides By Spot Test, Fluxes-Qualitative 12/69
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning 12/69
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel 12/69
TM 2.3.20.1 Stripping Gold from Nickel with ENIG Surface Finish 12/69
TM 2.3.13 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods 06/13
TM 2.3.33 Presence of Halides in Flux, Silver Chromate Method 06/13
TM 2.3.34 Solids Content, Flux 06/13
TM 2.3.35.1 Fluorides By Spot Test, Fluxes-Qualitative 06/13
SECTION 2.4 - 2.4 Mechanical Test Methods
TM 2.4.45A Solder Paste – Wetting Test 12/69
TM 2.4.34.1A Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise) 12/69
TM 2.4.34.2A Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise) 12/69
TM 2.4.34.3A Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise) 12/69
TM 2.4.35A Solder Paste – Slump Test 12/69
TM 2.4.43A Solder Paste - Solder Ball Test 12/69
TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose) 12/69
TM 2.4.14.2 Liquid Flux Activity, Wetting Balance Method 06/13
TM 2.4.46 Spread Test, Liquid, Paste or Solid Flux, or Flux Extracted from Solder Paste, Cored Wires or Preforms 06/13
SECTION 2.5 - 2.5 Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests 12/69
SECTION 2.6 - 2.6 Environmental Test Methods
TM 2.6.15D Corrosion, Flux 12/69
TM 2.6.14.1A Electrochemical Migration Resistance Test 12/69
TM 2.6.3.7A Surface Insulation Resistance 12/69
TM 2.6.3.6A Surface Insulation Resistance - Fluxes - Telecommunications 12/69
TM 2.6.1 Fungus Resistance of Printed Board Materials 06/13
TM 2.6.15 Corrosion, Flux 06/13
SECTION 1.0 - 1.0 Reporting and Measurement Analysis Methods
TM 1.1C Introduction 01/03
TM 1.2A Calibration 01/03
TM 1.3A Ambient Conditions 01/03
TM 1.4A Reporting, General 01/03
TM 1.5A Reporting, Format 01/03
TM 1.6A Numerical Reporting 01/03
TM 1.7A Reporting, Invalid Test Results 01/03
TM 1.8A Measurement Precision Estimation for Binary Data 01/03
TM 1.9A Measurement Precision Estimation for Variables Data 01/03
SECTION 2.1 - 2.1 Visual Test Methods
TM 2.1.1F Microsectioning, Manual and Semi or Automatic 06/15
TM 2.1.2A Pinhole Evaluation, Dye Penetration Method 03/76
TM 2.1.3A Plated-Through Hole Structure Evaluation 08/76
TM 2.1.5A Surface Examination, Unclad and Metal-Clad Material 12/82
TM 2.1.6B Thickness of Glass Fabric 12/94
TM 2.1.6.1 Weight of Fabric Reinforcements 12/94
TM 2.1.7C Thread Count of Glass Fabric 12/94
TM 2.1.7.1 Thread Count, Organic Fibers 12/87
TM 2.1.8B Workmanship 12/94
TM 2.1.9 Surface Scratch Examination Metal-Clad Foil 05/86
TM 2.1.10A Visual Inspection for Undissolved Dicyandiamide 12/94
TM 2.1.13B Inspection for Voids in Flexible Printed Board Materials 05/12
SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.1A Mechanical Dimensional Verification 08/97
TM 2.2.2B Optical Dimensional Verification 08/97
TM 2.2.4C Dimensional Stability, Flexible Dielectric Materials 05/98
TM 2.2.5A Dimensional Inspections Using Microsections 08/97
TM 2.2.6A Hole Size Measurement, Drilled 08/97
TM 2.2.7A Hole Size Measurement, Plated 05/86
TM 2.2.12A Thickness of Copper by Weight 03/76
TM 2.2.12.1 Overall Thickness and Profile Factor of Copper Foils Treated and Untreated 09/87
TM 2.2.12.2 Weight and Thickness of Copper Foils with Releasable Carriers 07/89
TM 2.2.12.3 Weight and Thickness Determination of Copper Foils With Etchable Carriers 07/89
TM 2.2.13.1A Thickness, Plating in Holes, Microhm Method 01/83
TM 2.2.14 Solder Powder Particle Size Distribution - Screen Method for Types 1-4 01/95
TM 2.2.14.1 Solder Powder Particle Size Distribution - Measuring Microscope Method 01/95
TM 2.2.14.2 Solder Powder Particle Size Distribution - Optical Image Analyzer Method 01/95
TM 2.2.14.3 Determination of Maximum Solder Powder Particle Size 01/95
TM 2.2.17A Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique) 02/01
TM 2.2.18 Determination of Thickness of Laminates by Mechanical Measurement 12/94
TM 2.2.18.1 Determination of Thickness of Metallic Clad Laminates, Cross-sectional 12/94
TM 2.2.19.1 Length, Width and Perpendicularity of Laminate and Prepreg Panels 12/94
TM 2.2.20 Solder Paste Metal Content by Weight 01/95
TM 2.2.21 Planarity of Dielectrics for High Density Interconnection (HDI)/Microvia Technology 11/98
TM 2.2.22 Noncontact Metallic Foil Surface Topography/Texture 08/20
SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.44 Determination of Thickness and Phosphorus Content in Electroless Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry 11/17
TM 2.3.25D Detection and Measurement of Ionizable Surface Contaminations by Resistivity of Solvent Extract (ROSE) 11/12
TM 2.3.28B Ionic Analysis of Circuit Boards, Ion Chromatography Method 11/12
TM 2.3.1 Chemical Processing, Suitable Processing Material 04/73
TM 2.3.1.1B Chemical Cleaning of Metal-Clad Laminate 05/86
TM 2.3.2G Chemical Resistance of Flexible Printed Board Materials 12/07
TM 2.3.4B Chemical Resistance, Marking Paints and Inks 08/87
TM 2.3.4.2A Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure 12/94
TM 2.3.4.3 Chemical Resistance of Core Materials to Methylene Chloride 05/86
TM 2.3.6A Etching Ammonium Persulfate Method 07/75
TM 2.3.7A Etching, Ferric Chloride Method 07/75
TM 2.3.7.1A Cupric Chloride Etching Method 12/94
TM 2.3.7.2A Alkaline Etching Method 12/94
TM 2.3.9D Flammability of Prepreg and Thin Laminate 08/97
TM 2.3.10B Flammability of Laminate 12/94
TM 2.3.10.1 Flammability of Soldermask on Printed Wiring Laminate 08/98
TM 2.3.11 Glass Fabric Construction 04/73
TM 2.3.13A Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods 06/04
TM 2.3.14 Print, Etch, and Plate Test 04/73
TM 2.3.15D Purity, Copper Foil or Plating 05/04
TM 2.3.16B Resin Content of Prepreg, by Burn-off 12/94
TM 2.3.16.1C Resin Content of Prepreg, by Treated Weight 12/94
TM 2.3.16.2 Treated Weight of Prepreg 12/94
TM 2.3.17D Resin Flow Percent of Prepreg 08/97
TM 2.3.17.2B Resin Flow of "No Flow" Prepreg 08/97
TM 2.3.18A Gel Time, Prepreg Materials 04/86
TM 2.3.19C Volatile Content of Prepreg 12/94
TM 2.3.21A Plating Quality Hull Cell Method 08/97
TM 2.3.22 Copper Protective Coating Quality 02/78
TM 2.3.24 Porosity of Gold Plating 02/78
TM 2.3.24.1 Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method 10/85
TM 2.3.24.2A Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid Vapor Test) 08/97
TM 2.3.25.1 Ionic Cleanliness Testing of Bare PWBs 10/00
TM 2.3.28.1 Halide Content of Soldering Fluxes and Pastes 06/04
TM 2.3.28.2 Bare Printed Board Cleanliness by Ion Chromatography 12/09
TM 2.3.30A Solvent pH Determination in Anhydrous Fluorocarbon Solvents 11/81
TM 2.3.32D Flux Induced Corrosion (Copper Mirror Method) 06/04
TM 2.3.33D Presence of Halides in Flux, Silver Chromate Method 06/04
TM 2.3.34C Solids Content, Flux 06/04
TM 2.3.34.1B Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder 01/95
TM 2.3.35C Halide Content, Quantitative (Chloride and Bromide) 06/04
TM 2.3.35.1A Fluorides by Spot Test, Fluxes - Qualitative 06/04
TM 2.3.35.2A Fluoride Concentration, Fluxes - Quantitative 06/04
TM 2.3.36 Acid Acceptance of Chlorinated Solvents 10/85
TM 2.3.37B Volatile Content of Adhesive Coated Dielectric Films 05/98
TM 2.3.40 Thermal Stability 07/95
TM 2.3.41 Test Method for Total Halogen Content in Base Materials 04/06
TM 2.3.42 Solder Mask - Resistance to Solvents and Cleaning Agents 03/07
TM 2.3.17.1B Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films 05/98
SECTION 2.4 - 2.4 Mechanical Test Methods
TM 2.4.53 Dye and Pull Test Method (Formerly Known as Dye and Pull) 08/17
TM 2.4.1E Adhesion, Tape Testing 05/04
TM 2.4.1.5A Determination of Treatment Transfer 05/95
TM 2.4.1.6 Adhesion, Polymer Coating 07/95
TM 2.4.2A Ductility of Copper Foil 03/76
TM 2.4.2.1D Flexural Fatigue and Ductility, Foil 03/91
TM 2.4.3E Flexural Endurance, Flexible Printed Wiring Materials 06/11
TM 2.4.3.1C Flexural Fatigue and Ductility, Flexible Printed Wiring 03/91
TM 2.4.3.2C Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics 03/91
TM 2.4.4B Flexural Strength of Laminates (at Ambient Temperature) 12/94
TM 2.4.4.1A Flexural Strength of Laminates (at Elevated Temperature) 12/94
TM 2.4.5.1 Flexibility - Conformal Coating 07/00
TM 2.4.6 Hot Oil 04/73
TM 2.4.7A Machinability, Printed Wiring Materials 07/75
TM 2.4.7.1 Solder Mask - Determination of Machineability 03/07
TM 2.4.8C Peel Strength of Metallic Clad Laminates 12/94
TM 2.4.8.1 Peel Strength, Metal Foil (Keyhole Method for Thin Laminates) 01/86
TM 2.4.8.2A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method) 12/94
TM 2.4.8.3A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method) 12/94
TM 2.4.8.4 Carrier Release, Thin Copper 01/90
TM 2.4.9.1 Peel Strength of Flexible Circuits 11/98
TM 2.4.9.2 Bonding Process 11/98
TM 2.4.12A Solderability, Edge Dip Method 06/91
TM 2.4.13F Solder Float Resistance Flexible Printed Wiring Materials 05/98
TM 2.4.13.1 Thermal Stress of Laminates 12/94
TM 2.4.14.2A Liquid Flux Activity, Wetting Balance Method 06/04
TM 2.4.15A Surface Finish, Metal Foil 03/76
TM 2.4.17 Tear Strength (Propagation) 04/73
TM 2.4.17.1B Propagation Tear Strength, Flexible Insulating Material 02/13
TM 2.4.18B Tensile Strength and Elongation, Copper Foil 08/80
TM 2.4.18.1A Tensile Strength and Elongation, In-House Plating 05/04
TM 2.4.18.2 Hot Rupture Strength, Foil 07/89
TM 2.4.18.3 Tensile Strength, Elongation, and Modulus 07/95
TM 2.4.19C Tensile Strength and Elongation, Flexible Printed Wiring Materials 05/98
TM 2.4.21F Land Bond Strength, Unsupported Component Hole 01/07
TM 2.4.22C Bow and Twist (Percentage) 06/99
TM 2.4.22.1C Bow and Twist-Laminate 05/93
TM 2.4.22.2 Substrate Curvature: Silicon Wafers with Deposited Dielectrics 07/95
TM 2.4.23 Soldering Resistance of Laminate Materials 03/79
TM 2.4.24C Glass Transition Temperature and Z-Axis Thermal Expansion by TMA 12/94
TM 2.4.24.1 Time to Delamination (TMA Method) 12/94
TM 2.4.24.2 Glass Transition Temperature of Organic Films - DMA Method 07/95
TM 2.4.24.3 Glass Transition Temperature of Organic Films - TMA Method 07/95
TM 2.4.24.4 Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias -DMA Method 11/98
TM 2.4.24.5 Glass Transition Temperature and Thermal Expansion of Materials Used In High Density Interconnection (HDI) and Microvias -TMA Method 11/98
TM 2.4.24.6 Decomposition Temperature (Td) of Laminate Material Using TGA 04/06
TM 2.4.25D Glass Transition Temperature and Cure Factor by DSC 11/17
TM 2.4.26 Tape Test for Additive Printed Boards 03/79
TM 2.4.27.1B Abrasion (Taber Method) Solder Mask and Conformal Coating 01/95
TM 2.4.28.1F Solder Mask Adhesion - Tape Test Method 03/07
TM 2.4.29C Adhesion, Solder Mask, Flexible Circuit 03/07
TM 2.4.30 Impact Resistance, Polymer Film 10/86
TM 2.4.34 Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose) 01/95
TM 2.4.34.1 Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centipose) 01/95
TM 2.4.34.2 Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipose) 01/95
TM 2.4.34.3 Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipose) 01/95
TM 2.4.34.4 Paste Flux Viscosity - T-Bar Spindle Method 01/95
TM 2.4.35 Solder Paste - Slump Test 01/95
TM 2.4.36C Rework Simulation, Plated-Through Holes for Leaded Components 05/04
TM 2.4.38A Prepreg Scaled Flow Testing 06/91
TM 2.4.39A Dimensional Stability, Glass Reinforced Thin Laminates 02/86
TM 2.4.40 Inner Layer Bond Strength of Multilayer Printed Circuit Boards 10/87
TM 2.4.41 Coefficient of Linear Thermal Expansion of Electrical Insulating Boards 03/86
TM 2.4.41.1A Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method 08/97
TM 2.4.41.2A Coefficient of Thermal Expansion - Strain Gage Method 05/04
TM 2.4.41.3 In-Plane Coefficient of Thermal Expansion, Organic Films 07/95
TM 2.4.41.4 Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates 07/95
TM 2.4.42 Torsional Strength of Chip Adhesives 02/88
TM 2.4.42.1 High Temperature Mechanical Strength Retention of Adhesives 03/88
TM 2.4.43 Solder Paste - Solder Ball Test 01/95
TM 2.4.44 Solder Paste - Tack Test 03/98
TM 2.4.45 Solder Paste - Wetting Test 01/95
TM 2.4.46A Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms 06/04
TM 2.4.47 Flux Residue Dryness 01/95
TM 2.4.48 Spitting of Flux-Cored Wire Solder 01/95
TM 2.4.49 Solder Pool Test 01/95
TM 2.4.50 Thermal Conductivity, Polymer Films 07/95
TM 2.4.51 Self Shimming Thermally Conductive Adhesives 01/95
TM 2.4.9E Peel Strength, Flexible Dielectric Materials 06/14
TM 2.4.52 Fracture Toughness of Resin Systems for Base Materials 10/13
TM 2.4.16B Initiation Tear Strength, Flexible Insulating Materials 03/14
SECTION 2.5 - 2.5 Electrical Test Methods
TM 2.5.5.14 Measuring High Frequency Signal Loss and Propagation on Printed Boards with Frequency Domain Methods 03/21
TM 2.5.34 Power Density Rating for Embedded Resistors 07/12
TM 2.5.1B Arc Resistance of Printed Wiring Material 05/86
TM 2.5.2A Capacitance of Insulating Materials 07/75
TM 2.5.3B Current Breakdown, Plated Through-Holes 08/97
TM 2.5.4.1A Conductor Temperature Rise Due to Current Changes in Conductors 08/97
TM 2.5.5.2A Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method 12/87
TM 2.5.5.3C Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method) 12/87
TM 2.5.5.5C Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band 03/98
TM 2.5.5.5.1 Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ 03/98
TM 2.5.5.7A Characteristic Impedance Lines on Printed Boards by TDR 03/04
TM 2.5.5.9 Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz 11/98
TM 2.5.5.10 High Frequency Testing to Determine Permittivity and Loss Tangent of Embedded Passive Materials 07/05
TM 2.5.5.11 Propagation Delay of Lines on Printed Boards by TDR 04/09
TM 2.5.5.12A Test Methods to Determine the Amount of Signal Loss on Printed Boards 07/12
TM 2.5.5.13 Relative Permittivity and Loss Tangent Using a Split-Cylinder Resonator 01/07
TM 2.5.6B Dielectric Breakdown of Rigid Printed Wiring Material 05/86
TM 2.5.6.1B Solder Mask - Dielectric Strength 03/07
TM 2.5.6.2A Electric Strength of Printed Wiring Material 03/98
TM 2.5.6.3 Dielectric Breakdown Voltage and Dielectric Strength 10/86
TM 2.5.7D Dielectric Withstanding Voltage, PWB 05/04
TM 2.5.7.1 Dielectric Withstanding Voltage - Polymeric Conformal Coating 07/00
TM 2.5.7.2A Dielectric Withstanding Voltage (HiPot Method) - Thin Dielectric Layers for Printed Boards 11/09
TM 2.5.10.1 Insulation Resistivity for Adhesive Interconnection Bonds 11/98
TM 2.5.12 Interconnection Resistance, Multilayer Printed Wiring 04/73
TM 2.5.13A Resistance of Copper Foil 03/76
TM 2.5.14A Resistivity of Copper Foil 08/76
TM 2.5.15A Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable 10/86
TM 2.5.17E Volume Resistivity and Surface Resistance of Printed Wiring Materials 05/98
TM 2.5.17.1A Volume and Surface Resistivity of Dielectric Materials 12/94
TM 2.5.17.2 Volume Resistivity of Conductive Materials Used in High Density Interconnection (HDI) and Microvias, Two-Wire Method 11/98
TM 2.5.18B Characteristic Impedance Flat Cables (Unbalanced) 07/84
TM 2.5.19A Propagation Delay of Flat Cables Using Time Domain Reflectometer 07/84
TM 2.5.19.1A Propagation Delay of Flat Cables Using Dual Trace Oscilloscope 07/84
TM 2.5.21A Digital Unbalanced Crosstalk, Flat Cable 03/84
TM 2.5.27 Surface Insulation Resistance of Raw Printed Wiring Board Material 03/79
TM 2.5.30 Balanced and Unbalanced Cable Attenuation Measurements 12/87
TM 2.5.33 Measurement of Electrical Overstress from Soldering Hand Tools 11/98
TM 2.5.33.1 Measurement of Electrical Overstress from Soldering Hand Tools - Ground Measurements 11/98
TM 2.5.33.2 Measurement of Electrical Overstress from Soldering Hand Tools - Transient Measurements 11/98
TM 2.5.33.3 Measurement of Electrical Overstress from Soldering Hand Tools - Current Leakage Measurements 11/98
TM 2.5.33.4 Measurement of Electrical Overstress from Soldering Hand Tools - Shielded Enclosure 11/98
SECTION 2.6 - 2.6 Environmental Test Methods
TM 2.6.7.2C Thermal Shock, Continuity and Microsection, Printed Board 03/20
TM 2.6.26A DC Current Induced Thermal Cycling Test 06/14
TM 2.6.1G Fungus Resistance Printed Wiring Materials 03/07
TM 2.6.1.1 Fungus Resistance – Conformal Coating 07/00
TM 2.6.2D Moisture Absorption, Flexible Printed Wiring 02/12
TM 2.6.2.1A Water Absorption, Metal Clad Plastic Laminates 05/86
TM 2.6.3F Moisture and Insulation Resistance, Printed Boards 05/04
TM 2.6.3.1E Solder Mask - Moisture and Insulation Resistance 03/07
TM 2.6.3.3B Surface Insulation Resistance, Fluxes 06/04
TM 2.6.3.4A Moisture and Insulation Resistance – Conformal Coating 07/03
TM 2.6.3.5 Bare Board Cleanliness by Surface Insulation Resistance 01/04
TM 2.6.3.6 Surface Insulation Resistance - Fluxes - Telecommunications 01/04
TM 2.6.3.7 Surface Insulation Resistance 03/07
TM 2.6.4B Outgassing, Printed Boards 05/04
TM 2.6.5D Physical Shock, Multilayer Printed Wiring 05/04
TM 2.6.7.1A Thermal Shock - Conformal Coating 07/00
TM 2.6.7.3 Thermal Shock - Solder Mask 07/00
TM 2.6.8E Thermal Stress, Plated-Through Holes 05/04
TM 2.6.8.1 Thermal Stress, Laminate 09/91
TM 2.6.9B Vibration, Rigid Printed Wiring 05/04
TM 2.6.9.1 Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy 01/95
TM 2.6.9.2 Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy 01/95
TM 2.6.10A X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods 08/97
TM 2.6.11D Solder Mask - Hydrolytic Stability 03/07
TM 2.6.11.1 Hydrolytic Stability - Conformal Coating 07/00
TM 2.6.13 Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring 10/85
TM 2.6.14D Solder Mask - Resistance to Electrochemical Migration 03/07
TM 2.6.14.1 Electrochemical Migration Resistance Test 09/00
TM 2.6.15C Corrosion, Flux 06/04
TM 2.6.16 Pressure Vessel Method for Glass Epoxy Laminate Integrity 07/85
TM 2.6.16.1 Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel) 08/98
TM 2.6.18A Low Temperature Flexibility, Flexible Printed Wiring Materials 07/85
TM 2.6.21B Service Temperature of Metal-Clad Flexible Laminate, Cover Material and Adhesive Bonding Films 06/11
TM 2.6.23 Test Procedure for Steam Ager Temperature Repeatability 07/93
TM 2.6.24 Junction Stability Under Environmental Conditions 11/98
TM 2.6.28 Moisture Content and/or Moisture Absorption Rate, (Bulk) Printed Board 08/10
TM 2.6.3.2C Surface Insulation and Moisture Resistance, Copper Clad Flexible Dielectric Material 08/15
TM 2.6.27B Thermal Stress, Convection Reflow Assembly Simulation 02/20
TM 2.6.25C Conductive Anodic Filament (CAF) Resistance Test: X-Y Axis 06/21
SECTION 3.0 - 3.0 Connector Test Methods
TM 3.1A Contact Resistance, Connectors 07/75
TM 3.2A Contact Retention, Connectors 07/75
TM 3.3A Crimp Tensil Strength, Connectors 07/75
TM 3.4B Durability, Connectors 01/83
TM 3.5A Humidity, Connectors 07/75
TM 3.6A Insulation Resistance, Connectors 07/75
TM 3.7A Low Level Circuit Connectors 07/75
TM 3.8A Mechanical Shock, Connectors 07/75
TM 3.9A Salt Spray, Connectors 07/75
TM 3.10A Solderability, Connectors 07/75
TM 3.11A Thermal Shock, Connectors 07/75
TM 3.12A Vibration, Connectors 07/75
TM 3.13A Withstanding Voltage, Connectors 07/75
TM 3.14 High Temperature Life, Connectors 07/75
TM 3.15 Fungus Resistance, Connectors 07/79
TM 3.16 Fretting Corrosion, Connectors 02/78
TM 3.17 Industrial Gas Test (Battelle Method), Connectors 02/78
TM 3.18 Mating and Unmating Force, Connectors 01/83
SECTION 2.1 - 2.1 Visual Test Methods
TM 2.1.1.3 Microsection Preparation for Microvia Structures 06/15
SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.8A Flammability, Flexible Insulating Materials 12/82
SECTION 2.1 - 2.1 Visual Test Methods
TM 2.1.1.1 Microsectioning, Ceramic Substrate 12/87
TM 2.1.1.2A Microsectioning—Semi or Automatic Technique Microsection Equipment (Alternate) 05/04
SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.8 Location of Holes 04/73
TM 2.2.10A Hole Location and Conductor Location 12/83
TM 2.2.15 Cable Dimensions (Flat Cable) 06/79
TM 2.2.16 Artwork Master Evaluation by Use of a Drilled Panel 12/87
TM 2.2.16.1 Artwork Master Evaluation by Overlay 12/87
TM 2.2.19 Measuring Hole Pattern Location 12/87
SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.3A Chemical Resistance of Insulating Materials 02/78
TM 2.3.5B Density, Insulating Material 08/97
TM 2.3.8.1 Flammability of Flexible Printed Wiring 12/88
TM 2.3.23B Cure (Permanency) Thermally Cured Solder Mask 02/88
TM 2.3.23.1A Cure (Permanency) UV Initiated Dry Film Solder Mask 02/88
TM 2.3.26A Superseded by Test Method 2.3.25 02/88
TM 2.3.26.1 Superseded by Test Method 2.3.25 02/88
TM 2.3.27 Cleanliness Test - Residual Rosin 01/95
TM 2.3.27.1 Rosin Flux Residue Analysis-HPLC Method 01/95
TM 2.3.29 Flammability, Flexible Flat Cable 11/88
TM 2.3.31 Relative Degree of Cure of U.V. Curable Material 02/88
TM 2.3.38C Surface Organic Contaminant Detection Test 05/04
TM 2.3.39C Surface Organic Contaminant Identification Test (Infrared Analytical Method) 05/04
TM 2.3.25B Detection and Measurement of Ionizable Surface Contaminants 08/97
TM 2.3.26.2 Mobile Ion Content of Polymer Films 07/95
SECTION 2.4 - 2.4 Mechanical Test Methods
TM 2.4.1.1B Adhesion, Marking Paints and Inks 11/88
TM 2.4.1.2 Adhesion of Conductors on Hybrid Substrates 12/87
TM 2.4.1.3 Adhesion, Resistors (Hybrid Circuits) 12/87
TM 2.4.1.4 Adhesion, Overglaze (Hybrid Circuits) 12/87
TM 2.4.5 Folding Endurance, Flexible Printed Wiring Materials 04/73
TM 2.4.9D Peel Strength, Flexible Dielectric Materials 10/88
TM 2.4.11 Shear Strength Flexible Dielectric Materials 04/73
TM 2.4.14 Solderability of Metallic Surfaces 04/73
TM 2.4.14.1 Solderability, Wave Solder Method 03/79
TM 2.4.20 Terminal Bond Strength, Flexible Printed Wiring 04/73
TM 2.4.27.2A Solder Mask Abrasion (Pencil Method) 02/88
TM 2.4.28B Adhesion, Solder Mask (Non-Melting Metals) 08/97
TM 2.4.31A Folding, Flexible Flat Cable 04/86
TM 2.4.32A Fold Temperature Testing, Flexible Flat Cable 04/86
TM 2.4.33C Flexural Fatigue and Ductility, Flat Cable 03/91
TM 2.4.37A Evaluation of Hand Soldering Tools for Terminal Connections 07/91
TM 2.4.37.1A Evaluation of Hand Soldering Tools for Printed Wiring Board Applications 07/91
TM 2.4.37.2 Evaluation of Hand Soldering Tools on Heavy Thermal Loads 07/93
TM 2.4.42.2 Die Shear Strength 03/18
TM 2.4.42.3 Wire Bond Pull Strength 03/18
TM 2.4.10 Plating Adhesion 04/73
SECTION 2.5 - 2.5 Electrical Test Methods
TM 2.5.7.2 Dielectric Withstanding Voltage (HiPot Method) - Thin Dielectric Layers for Printed Circuit Boards (PCBs) 12/07
TM 2.5.11 Insulation Resistance, Multilayer Printed Wiring (Within a Layer) 04/73
TM 2.5.4 Current Carrying Capacity, Multilayer Printed Wring 04/73
TM 2.5.5A Dielectric Constant of Printed Wiring Materials 07/75
TM 2.5.5.1B Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 1MHz (Contacting Electrode Systems) 05/86
TM 2.5.5.4 Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Micrometer Method 10/85
TM 2.5.5.6 Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates 05/89
TM 2.5.5.8 Low Frequency Dielectric Constant and Loss Tangent, Polymer Films 07/95
TM 2.5.8A Dissipation Factor of Flexible Printed Wiring Material 07/75
TM 2.5.16A Shorts, Internal on Multilayer Printed Wiring 11/88
TM 2.5.24 Conductor Resistance, Flexible Flat Cable 06/79
TM 2.5.25A Dielectric Withstand Voltage Flexible Fat Cable 11/85
TM 2.5.26A Insulation Resistance Flexible Flat Cable 11/85
TM 2.5.28A Q Resonance, Flexible Printed Wiring Materials 04/88
TM 2.5.31 Current Leakage (Through Overglaze Films) 12/87
TM 2.5.32 Resistance Test, Plated Through-Holes 12/87
SECTION 2.6 - 2.6 Environmental Test Methods
TM 2.6.7.1 Thermal Shock - Conformal Coating 07/00
TM 2.6.6B Temperature Cycling, Printed Wiring Board 12/87
TM 2.6.7A Thermal Shock and Continuity, Printed Board 08/97
TM 2.6.12 Temperature Testing, Flexible Flat Cable 06/79
TM 2.6.17 Hydrolitic Stability, Flexible Printed Wiring Material 12/82
TM 2.6.19 Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate Boards 12/87
TM 2.6.20A 2.6.20A 01/95
TM 2.6.22 2.6.22 01/95

Test Methods Subcommittee - provides definitions associated with test methods

Cancelled Methods:  A method that is no longer referenced in a current IPC specification, guidance document or whose scope is outdated for the evaluating modern electronic materials, processes or products. Additionally, a cancelled method may no longer have an Originating Task Group (OTG)

Archived Method: A method that is no longer referenced in a current IPC specification or guidance document but may still be used to meet legacy product requirements. Additionally, a archived method may no longer have an Originating Task Group (OTG)

Withdrawn Method: A method that was taken out of service by the Originating Task Group because it either did not meet validation requirements or the method was found to no longer be necessary.

CAF Test Vehicle Artworks within TM-650

The decision of which test vehicle artwork to use for CAF testing is made by the user after examining and understanding the test method 2.6.25.


 

IPC-TM-650-Testing Labs

The following laboratories are members of IPC and was developed to provide companies with various testing capabilities


 

IPC-TM-650 Equipment Vendor Listings

Does your company need to complete a test method defined in the IPC-TM-650? Click here to view a listing of equipment and materials vendors with products that can help you test your products.


 

IPC-TM-650 Method Development Packet

The IPC-TM-650 MDP document has been developed to identify all the elements that should be included in the development of an IPC-TM-650 test method or test method revision. Click here to download a free copy of the IPC-TM-650 MDP.