IPC TM-650 Test Methods Manual

 

IPC-TM-650-Testing Labs

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IPC-TM-650 Method Development Packet

The IPC-TM-650 MDP document has been developed to identify all the elements that should be included in the development of an IPC-TM-650 test method or test method revision. Click here to download a free copy of the IPC-TM-650 MDP.


 

SECTION 2.1 - 2.1 Visual Test Methods
TM 2.1.1.3 Microsection Preparation for Microvia Structures 06/15
SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.8A Flammability, Flexible Insulating Materials 12/82
SECTION 1.0 - 1.0 Reporting and Measurement Analysis Methods
TM 1.1C Introduction 01/03
TM 1.2A Calibration 01/03
TM 1.3A Ambient Conditions 01/03
TM 1.4A Reporting, General 01/03
TM 1.5A Reporting, Format 01/03
TM 1.6A Numerical Reporting 01/03
TM 1.7A Reporting, Invalid Test Results 01/03
TM 1.8A Measurement Precision Estimation for Binary Data 01/03
TM 1.9A Measurement Precision Estimation for Variables Data 01/03
SECTION 2.1 - 2.1 Visual Test Methods
TM 2.1.1F Microsectioning, Manual and Semi or Automatic 06/15
TM 2.1.2A Pinhole Evaluation, Dye Penetration Method 03/76
TM 2.1.3A Plated-Through Hole Structure Evaluation 08/76
TM 2.1.5A Surface Examination, Unclad and Metal-Clad Material 12/82
TM 2.1.6B Thickness of Glass Fabric 12/94
TM 2.1.6.1 Weight of Fabric Reinforcements 12/94
TM 2.1.7C Thread Count of Glass Fabric 12/94
TM 2.1.7.1 Thread Count, Organic Fibers 12/87
TM 2.1.8B Workmanship 12/94
TM 2.1.9 Surface Scratch Examination Metal-Clad Foil 05/86
TM 2.1.10A Visual Inspection for Undissolved Dicyandiamide 12/94
TM 2.1.13B Inspection for Voids in Flexible Printed Board Materials 05/12
SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.1A Mechanical Dimensional Verification 08/97
TM 2.2.2B Optical Dimensional Verification 08/97
TM 2.2.4C Dimensional Stability, Flexible Dielectric Materials 05/98
TM 2.2.5A Dimensional Inspections Using Microsections 08/97
TM 2.2.6A Hole Size Measurement, Drilled 08/97
TM 2.2.7A Hole Size Measurement, Plated 05/86
TM 2.2.12A Thickness of Copper by Weight 03/76
TM 2.2.12.1 Overall Thickness and Profile Factor of Copper Foils Treated and Untreated 09/87
TM 2.2.12.2 Weight and Thickness of Copper Foils with Releasable Carriers 07/89
TM 2.2.12.3 Weight and Thickness Determination of Copper Foils With Etchable Carriers 07/89
TM 2.2.13.1A Thickness, Plating in Holes, Microhm Method 01/83
TM 2.2.14 Solder Powder Particle Size Distribution - Screen Method for Types 1-4 01/95
TM 2.2.14.1 Solder Powder Particle Size Distribution - Measuring Microscope Method 01/95
TM 2.2.14.2 Solder Powder Particle Size Distribution - Optical Image Analyzer Method 01/95
TM 2.2.14.3 Determination of Maximum Solder Powder Particle Size 01/95
TM 2.2.17A Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique) 02/01
TM 2.2.18 Determination of Thickness of Laminates by Mechanical Measurement 12/94
TM 2.2.18.1 Determination of Thickness of Metallic Clad Laminates, Cross-sectional 12/94
TM 2.2.19.1 Length, Width and Perpendicularity of Laminate and Prepreg Panels 12/94
TM 2.2.20 Solder Paste Metal Content by Weight 01/95
TM 2.2.21 Planarity of Dielectrics for High Density Interconnection (HDI)/Microvia Technology 11/98
TM 2.2.22 Noncontact Metallic Foil Surface Topography/Texture 08/20
SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.44 Determination of Thickness and Phosphorus Content in Electroless Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry 11/17
TM 2.3.25D Detection and Measurement of Ionizable Surface Contaminations by Resistivity of Solvent Extract (ROSE) 11/12
TM 2.3.28B Ionic Analysis of Circuit Boards, Ion Chromatography Method 11/12
TM 2.3.1 Chemical Processing, Suitable Processing Material 04/73
TM 2.3.1.1B Chemical Cleaning of Metal-Clad Laminate 05/86
TM 2.3.2G Chemical Resistance of Flexible Printed Board Materials 12/07
TM 2.3.4B Chemical Resistance, Marking Paints and Inks 08/87
TM 2.3.4.2A Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure 12/94
TM 2.3.4.3 Chemical Resistance of Core Materials to Methylene Chloride 05/86
TM 2.3.6A Etching Ammonium Persulfate Method 07/75
TM 2.3.7A Etching, Ferric Chloride Method 07/75
TM 2.3.7.1A Cupric Chloride Etching Method 12/94
TM 2.3.7.2A Alkaline Etching Method 12/94
TM 2.3.9D Flammability of Prepreg and Thin Laminate 08/97
TM 2.3.10B Flammability of Laminate 12/94
TM 2.3.10.1 Flammability of Soldermask on Printed Wiring Laminate 08/98
TM 2.3.11 Glass Fabric Construction 04/73
TM 2.3.13A Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods 06/04
TM 2.3.14 Print, Etch, and Plate Test 04/73
TM 2.3.15D Purity, Copper Foil or Plating 05/04
TM 2.3.16B Resin Content of Prepreg, by Burn-off 12/94
TM 2.3.16.1C Resin Content of Prepreg, by Treated Weight 12/94
TM 2.3.16.2 Treated Weight of Prepreg 12/94
TM 2.3.17D Resin Flow Percent of Prepreg 08/97
TM 2.3.17.2B Resin Flow of "No Flow" Prepreg 08/97
TM 2.3.18A Gel Time, Prepreg Materials 04/86
TM 2.3.19C Volatile Content of Prepreg 12/94
TM 2.3.21A Plating Quality Hull Cell Method 08/97
TM 2.3.22 Copper Protective Coating Quality 02/78
TM 2.3.24 Porosity of Gold Plating 02/78
TM 2.3.24.1 Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method 10/85
TM 2.3.24.2A Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid Vapor Test) 08/97
TM 2.3.25.1 Ionic Cleanliness Testing of Bare PWBs 10/00
TM 2.3.28.1 Halide Content of Soldering Fluxes and Pastes 06/04
TM 2.3.28.2 Bare Printed Board Cleanliness by Ion Chromatography 12/09
TM 2.3.30A Solvent pH Determination in Anhydrous Fluorocarbon Solvents 11/81
TM 2.3.32D Flux Induced Corrosion (Copper Mirror Method) 06/04
TM 2.3.33D Presence of Halides in Flux, Silver Chromate Method 06/04
TM 2.3.34C Solids Content, Flux 06/04
TM 2.3.34.1B Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder 01/95
TM 2.3.35C Halide Content, Quantitative (Chloride and Bromide) 06/04
TM 2.3.35.1A Fluorides by Spot Test, Fluxes - Qualitative 06/04
TM 2.3.35.2A Fluoride Concentration, Fluxes - Quantitative 06/04
TM 2.3.36 Acid Acceptance of Chlorinated Solvents 10/85
TM 2.3.37B Volatile Content of Adhesive Coated Dielectric Films 05/98
TM 2.3.40 Thermal Stability 07/95
TM 2.3.41 Test Method for Total Halogen Content in Base Materials 04/06
TM 2.3.42 Solder Mask - Resistance to Solvents and Cleaning Agents 03/07
TM 2.3.17.1B Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films 05/98
SECTION 2.4 - 2.4 Mechanical Test Methods
TM 2.4.53 Dye and Pull Test Method (Formerly Known as Dye and Pull) 08/17
TM 2.4.1E Adhesion, Tape Testing 05/04
TM 2.4.1.5A Determination of Treatment Transfer 05/95
TM 2.4.1.6 Adhesion, Polymer Coating 07/95
TM 2.4.2A Ductility of Copper Foil 03/76
TM 2.4.2.1D Flexural Fatigue and Ductility, Foil 03/91
TM 2.4.3E Flexural Endurance, Flexible Printed Wiring Materials 06/11
TM 2.4.3.1C Flexural Fatigue and Ductility, Flexible Printed Wiring 03/91
TM 2.4.3.2C Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics 03/91
TM 2.4.4B Flexural Strength of Laminates (at Ambient Temperature) 12/94
TM 2.4.4.1A Flexural Strength of Laminates (at Elevated Temperature) 12/94
TM 2.4.5.1 Flexibility - Conformal Coating 07/00
TM 2.4.6 Hot Oil 04/73
TM 2.4.7A Machinability, Printed Wiring Materials 07/75
TM 2.4.7.1 Solder Mask - Determination of Machineability 03/07
TM 2.4.8C Peel Strength of Metallic Clad Laminates 12/94
TM 2.4.8.1 Peel Strength, Metal Foil (Keyhole Method for Thin Laminates) 01/86
TM 2.4.8.2A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method) 12/94
TM 2.4.8.3A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method) 12/94
TM 2.4.8.4 Carrier Release, Thin Copper 01/90
TM 2.4.9.1 Peel Strength of Flexible Circuits 11/98
TM 2.4.9.2 Bonding Process 11/98
TM 2.4.12A Solderability, Edge Dip Method 06/91
TM 2.4.13F Solder Float Resistance Flexible Printed Wiring Materials 05/98
TM 2.4.13.1 Thermal Stress of Laminates 12/94
TM 2.4.14.2A Liquid Flux Activity, Wetting Balance Method 06/04
TM 2.4.15A Surface Finish, Metal Foil 03/76
TM 2.4.17 Tear Strength (Propagation) 04/73
TM 2.4.17.1B Propagation Tear Strength, Flexible Insulating Material 02/13
TM 2.4.18B Tensile Strength and Elongation, Copper Foil 08/80
TM 2.4.18.1A Tensile Strength and Elongation, In-House Plating 05/04
TM 2.4.18.2 Hot Rupture Strength, Foil 07/89
TM 2.4.18.3 Tensile Strength, Elongation, and Modulus 07/95
TM 2.4.19C Tensile Strength and Elongation, Flexible Printed Wiring Materials 05/98
TM 2.4.21F Land Bond Strength, Unsupported Component Hole 01/07
TM 2.4.22C Bow and Twist (Percentage) 06/99
TM 2.4.22.1C Bow and Twist-Laminate 05/93
TM 2.4.22.2 Substrate Curvature: Silicon Wafers with Deposited Dielectrics 07/95
TM 2.4.23 Soldering Resistance of Laminate Materials 03/79
TM 2.4.24C Glass Transition Temperature and Z-Axis Thermal Expansion by TMA 12/94
TM 2.4.24.1 Time to Delamination (TMA Method) 12/94
TM 2.4.24.2 Glass Transition Temperature of Organic Films - DMA Method 07/95
TM 2.4.24.3 Glass Transition Temperature of Organic Films - TMA Method 07/95
TM 2.4.24.4 Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias -DMA Method 11/98
TM 2.4.24.5 Glass Transition Temperature and Thermal Expansion of Materials Used In High Density Interconnection (HDI) and Microvias -TMA Method 11/98
TM 2.4.24.6 Decomposition Temperature (Td) of Laminate Material Using TGA 04/06
TM 2.4.25D Glass Transition Temperature and Cure Factor by DSC 11/17
TM 2.4.26 Tape Test for Additive Printed Boards 03/79
TM 2.4.27.1B Abrasion (Taber Method) Solder Mask and Conformal Coating 01/95
TM 2.4.28.1F Solder Mask Adhesion - Tape Test Method 03/07
TM 2.4.29C Adhesion, Solder Mask, Flexible Circuit 03/07
TM 2.4.30 Impact Resistance, Polymer Film 10/86
TM 2.4.34 Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose) 01/95
TM 2.4.34.1 Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centipose) 01/95
TM 2.4.34.2 Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipose) 01/95
TM 2.4.34.3 Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipose) 01/95
TM 2.4.34.4 Paste Flux Viscosity - T-Bar Spindle Method 01/95
TM 2.4.35 Solder Paste - Slump Test 01/95
TM 2.4.36C Rework Simulation, Plated-Through Holes for Leaded Components 05/04
TM 2.4.38A Prepreg Scaled Flow Testing 06/91
TM 2.4.39A Dimensional Stability, Glass Reinforced Thin Laminates 02/86
TM 2.4.40 Inner Layer Bond Strength of Multilayer Printed Circuit Boards 10/87
TM 2.4.41 Coefficient of Linear Thermal Expansion of Electrical Insulating Boards 03/86
TM 2.4.41.1A Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method 08/97
TM 2.4.41.2A Coefficient of Thermal Expansion - Strain Gage Method 05/04
TM 2.4.41.3 In-Plane Coefficient of Thermal Expansion, Organic Films 07/95
TM 2.4.41.4 Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates 07/95
TM 2.4.42 Torsional Strength of Chip Adhesives 02/88
TM 2.4.42.1 High Temperature Mechanical Strength Retention of Adhesives 03/88
TM 2.4.43 Solder Paste - Solder Ball Test 01/95
TM 2.4.44 Solder Paste - Tack Test 03/98
TM 2.4.45 Solder Paste - Wetting Test 01/95
TM 2.4.46A Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms 06/04
TM 2.4.47 Flux Residue Dryness 01/95
TM 2.4.48 Spitting of Flux-Cored Wire Solder 01/95
TM 2.4.49 Solder Pool Test 01/95
TM 2.4.50 Thermal Conductivity, Polymer Films 07/95
TM 2.4.51 Self Shimming Thermally Conductive Adhesives 01/95
TM 2.4.9E Peel Strength, Flexible Dielectric Materials 06/14
TM 2.4.52 Fracture Toughness of Resin Systems for Base Materials 10/13
TM 2.4.16B Initiation Tear Strength, Flexible Insulating Materials 03/14
SECTION 2.5 - 2.5 Electrical Test Methods
TM 2.5.34 Power Density Rating for Embedded Resistors 07/12
TM 2.5.1B Arc Resistance of Printed Wiring Material 05/86
TM 2.5.2A Capacitance of Insulating Materials 07/75
TM 2.5.3B Current Breakdown, Plated Through-Holes 08/97
TM 2.5.4.1A Conductor Temperature Rise Due to Current Changes in Conductors 08/97
TM 2.5.5.2A Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method 12/87
TM 2.5.5.3C Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method) 12/87
TM 2.5.5.5C Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band 03/98
TM 2.5.5.5.1 Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ 03/98
TM 2.5.5.7A Characteristic Impedance Lines on Printed Boards by TDR 03/04
TM 2.5.5.9 Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz 11/98
TM 2.5.5.10 High Frequency Testing to Determine Permittivity and Loss Tangent of Embedded Passive Materials 07/05
TM 2.5.5.11 Propagation Delay of Lines on Printed Boards by TDR 04/09
TM 2.5.5.12A Test Methods to Determine the Amount of Signal Loss on Printed Boards 07/12
TM 2.5.5.13 Relative Permittivity and Loss Tangent Using a Split-Cylinder Resonator 01/07
TM 2.5.6B Dielectric Breakdown of Rigid Printed Wiring Material 05/86
TM 2.5.6.1B Solder Mask - Dielectric Strength 03/07
TM 2.5.6.2A Electric Strength of Printed Wiring Material 03/98
TM 2.5.6.3 Dielectric Breakdown Voltage and Dielectric Strength 10/86
TM 2.5.7D Dielectric Withstanding Voltage, PWB 05/04
TM 2.5.7.1 Dielectric Withstanding Voltage - Polymeric Conformal Coating 07/00
TM 2.5.7.2A Dielectric Withstanding Voltage (HiPot Method) - Thin Dielectric Layers for Printed Boards 11/09
TM 2.5.10.1 Insulation Resistivity for Adhesive Interconnection Bonds 11/98
TM 2.5.12 Interconnection Resistance, Multilayer Printed Wiring 04/73
TM 2.5.13A Resistance of Copper Foil 03/76
TM 2.5.14A Resistivity of Copper Foil 08/76
TM 2.5.15A Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable 10/86
TM 2.5.17E Volume Resistivity and Surface Resistance of Printed Wiring Materials 05/98
TM 2.5.17.1A Volume and Surface Resistivity of Dielectric Materials 12/94
TM 2.5.17.2 Volume Resistivity of Conductive Materials Used in High Density Interconnection (HDI) and Microvias, Two-Wire Method 11/98
TM 2.5.18B Characteristic Impedance Flat Cables (Unbalanced) 07/84
TM 2.5.19A Propagation Delay of Flat Cables Using Time Domain Reflectometer 07/84
TM 2.5.19.1A Propagation Delay of Flat Cables Using Dual Trace Oscilloscope 07/84
TM 2.5.21A Digital Unbalanced Crosstalk, Flat Cable 03/84
TM 2.5.27 Surface Insulation Resistance of Raw Printed Wiring Board Material 03/79
TM 2.5.30 Balanced and Unbalanced Cable Attenuation Measurements 12/87
TM 2.5.33 Measurement of Electrical Overstress from Soldering Hand Tools 11/98
TM 2.5.33.1 Measurement of Electrical Overstress from Soldering Hand Tools - Ground Measurements 11/98
TM 2.5.33.2 Measurement of Electrical Overstress from Soldering Hand Tools - Transient Measurements 11/98
TM 2.5.33.3 Measurement of Electrical Overstress from Soldering Hand Tools - Current Leakage Measurements 11/98
TM 2.5.33.4 Measurement of Electrical Overstress from Soldering Hand Tools - Shielded Enclosure 11/98
SECTION 2.6 - 2.6 Environmental Test Methods
TM 2.6.7.2C Thermal Shock, Continuity and Microsection, Printed Board 03/20
2.6.7.2C Thermal Shock, Continuity and Microsection, Printed Board 03/20
2.6.27A Thermal Stress, Convection Reflow Assembly Simulation 06/17
TM 2.6.26A DC Current Induced Thermal Cycling Test 06/14
TM 2.6.1G Fungus Resistance Printed Wiring Materials 03/07
TM 2.6.1.1 Fungus Resistance – Conformal Coating 07/00
TM 2.6.2D Moisture Absorption, Flexible Printed Wiring 02/12
TM 2.6.2.1A Water Absorption, Metal Clad Plastic Laminates 05/86
TM 2.6.3F Moisture and Insulation Resistance, Printed Boards 05/04
TM 2.6.3.1E Solder Mask - Moisture and Insulation Resistance 03/07
TM 2.6.3.3B Surface Insulation Resistance, Fluxes 06/04
TM 2.6.3.4A Moisture and Insulation Resistance – Conformal Coating 07/03
TM 2.6.3.5 Bare Board Cleanliness by Surface Insulation Resistance 01/04
TM 2.6.3.6 Surface Insulation Resistance - Fluxes - Telecommunications 01/04
TM 2.6.3.7 Surface Insulation Resistance 03/07
TM 2.6.4B Outgassing, Printed Boards 05/04
TM 2.6.5D Physical Shock, Multilayer Printed Wiring 05/04
TM 2.6.7.1A Thermal Shock - Conformal Coating 07/00
TM 2.6.7.3 Thermal Shock - Solder Mask 07/00
TM 2.6.8E Thermal Stress, Plated-Through Holes 05/04
TM 2.6.8.1 Thermal Stress, Laminate 09/91
TM 2.6.9B Vibration, Rigid Printed Wiring 05/04
TM 2.6.9.1 Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy 01/95
TM 2.6.9.2 Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy 01/95
TM 2.6.10A X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods 08/97
TM 2.6.11D Solder Mask - Hydrolytic Stability 03/07
TM 2.6.11.1 Hydrolytic Stability - Conformal Coating 07/00
TM 2.6.13 Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring 10/85
TM 2.6.14D Solder Mask - Resistance to Electrochemical Migration 03/07
TM 2.6.14.1 Electrochemical Migration Resistance Test 09/00
TM 2.6.15C Corrosion, Flux 06/04
TM 2.6.16 Pressure Vessel Method for Glass Epoxy Laminate Integrity 07/85
TM 2.6.16.1 Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel) 08/98
TM 2.6.18A Low Temperature Flexibility, Flexible Printed Wiring Materials 07/85
TM 2.6.21B Service Temperature of Metal-Clad Flexible Laminate, Cover Material and Adhesive Bonding Films 06/11
TM 2.6.23 Test Procedure for Steam Ager Temperature Repeatability 07/93
TM 2.6.24 Junction Stability Under Environmental Conditions 11/98
TM 2.6.28 Moisture Content and/or Moisture Absorption Rate, (Bulk) Printed Board 08/10
TM 2.6.3.2C Surface Insulation and Moisture Resistance, Copper Clad Flexible Dielectric Material 08/15
TM 2.6.25B Conductive Anodic Filament (CAF) Resistance Test: X-Y Axis 04/16
TM 2.6.27B Thermal Stress, Convection Reflow Assembly Simulation 02/20
SECTION 3.0 - 3.0 Connector Test Methods
TM 3.1A Contact Resistance, Connectors 07/75
TM 3.2A Contact Retention, Connectors 07/75
TM 3.3A Crimp Tensil Strength, Connectors 07/75
TM 3.4B Durability, Connectors 01/83
TM 3.5A Humidity, Connectors 07/75
TM 3.6A Insulation Resistance, Connectors 07/75
TM 3.7A Low Level Circuit Connectors 07/75
TM 3.8A Mechanical Shock, Connectors 07/75
TM 3.9A Salt Spray, Connectors 07/75
TM 3.10A Solderability, Connectors 07/75
TM 3.11A Thermal Shock, Connectors 07/75
TM 3.12A Vibration, Connectors 07/75
TM 3.13A Withstanding Voltage, Connectors 07/75
TM 3.14 High Temperature Life, Connectors 07/75
TM 3.15 Fungus Resistance, Connectors 07/79
TM 3.16 Fretting Corrosion, Connectors 02/78
TM 3.17 Industrial Gas Test (Battelle Method), Connectors 02/78
TM 3.18 Mating and Unmating Force, Connectors 01/83
SECTION 2.1 - 2.1 Visual Test Methods
TM 2.1.1.1 Microsectioning, Ceramic Substrate 12/87
TM 2.1.1.2A Microsectioning—Semi or Automatic Technique Microsection Equipment (Alternate) 05/04
SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.8 Location of Holes 04/73
TM 2.2.10A Hole Location and Conductor Location 12/83
TM 2.2.15 Cable Dimensions (Flat Cable) 06/79
TM 2.2.16 Artwork Master Evaluation by Use of a Drilled Panel 12/87
TM 2.2.16.1 Artwork Master Evaluation by Overlay 12/87
TM 2.2.19 Measuring Hole Pattern Location 12/87
SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.3A Chemical Resistance of Insulating Materials 02/78
TM 2.3.5B Density, Insulating Material 08/97
TM 2.3.8.1 Flammability of Flexible Printed Wiring 12/88
TM 2.3.23B Cure (Permanency) Thermally Cured Solder Mask 02/88
TM 2.3.23.1A Cure (Permanency) UV Initiated Dry Film Solder Mask 02/88
TM 2.3.26A Superseded by Test Method 2.3.25 02/88
TM 2.3.26.1 Superseded by Test Method 2.3.25 02/88
TM 2.3.27 Cleanliness Test - Residual Rosin 01/95
TM 2.3.27.1 Rosin Flux Residue Analysis-HPLC Method 01/95
TM 2.3.29 Flammability, Flexible Flat Cable 11/88
TM 2.3.31 Relative Degree of Cure of U.V. Curable Material 02/88
TM 2.3.38C Surface Organic Contaminant Detection Test 05/04
TM 2.3.39C Surface Organic Contaminant Identification Test (Infrared Analytical Method) 05/04
TM 2.3.25B Detection and Measurement of Ionizable Surface Contaminants 08/97
TM 2.3.26.2 Mobile Ion Content of Polymer Films 07/95
SECTION 2.4 - 2.4 Mechanical Test Methods
TM 2.4.1.1B Adhesion, Marking Paints and Inks 11/88
TM 2.4.1.2 Adhesion of Conductors on Hybrid Substrates 12/87
TM 2.4.1.3 Adhesion, Resistors (Hybrid Circuits) 12/87
TM 2.4.1.4 Adhesion, Overglaze (Hybrid Circuits) 12/87
TM 2.4.5 Folding Endurance, Flexible Printed Wiring Materials 04/73
TM 2.4.9D Peel Strength, Flexible Dielectric Materials 10/88
TM 2.4.11 Shear Strength Flexible Dielectric Materials 04/73
TM 2.4.14 Solderability of Metallic Surfaces 04/73
TM 2.4.14.1 Solderability, Wave Solder Method 03/79
TM 2.4.20 Terminal Bond Strength, Flexible Printed Wiring 04/73
TM 2.4.27.2A Solder Mask Abrasion (Pencil Method) 02/88
TM 2.4.28B Adhesion, Solder Mask (Non-Melting Metals) 08/97
TM 2.4.31A Folding, Flexible Flat Cable 04/86
TM 2.4.32A Fold Temperature Testing, Flexible Flat Cable 04/86
TM 2.4.33C Flexural Fatigue and Ductility, Flat Cable 03/91
TM 2.4.37A Evaluation of Hand Soldering Tools for Terminal Connections 07/91
TM 2.4.37.1A Evaluation of Hand Soldering Tools for Printed Wiring Board Applications 07/91
TM 2.4.37.2 Evaluation of Hand Soldering Tools on Heavy Thermal Loads 07/93
TM 2.4.42.2 Die Shear Strength 03/18
TM 2.4.42.3 Wire Bond Pull Strength 03/18
TM 2.4.10 Plating Adhesion 04/73
SECTION 2.5 - 2.5 Electrical Test Methods
TM 2.5.7.2 Dielectric Withstanding Voltage (HiPot Method) - Thin Dielectric Layers for Printed Circuit Boards (PCBs) 12/07
TM 2.5.11 Insulation Resistance, Multilayer Printed Wiring (Within a Layer) 04/73
TM 2.5.4 Current Carrying Capacity, Multilayer Printed Wring 04/73
TM 2.5.5A Dielectric Constant of Printed Wiring Materials 07/75
TM 2.5.5.1B Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 1MHz (Contacting Electrode Systems) 05/86
TM 2.5.5.4 Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Micrometer Method 10/85
TM 2.5.5.6 Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates 05/89
TM 2.5.5.8 Low Frequency Dielectric Constant and Loss Tangent, Polymer Films 07/95
TM 2.5.8A Dissipation Factor of Flexible Printed Wiring Material 07/75
TM 2.5.16A Shorts, Internal on Multilayer Printed Wiring 11/88
TM 2.5.24 Conductor Resistance, Flexible Flat Cable 06/79
TM 2.5.25A Dielectric Withstand Voltage Flexible Fat Cable 11/85
TM 2.5.26A Insulation Resistance Flexible Flat Cable 11/85
TM 2.5.28A Q Resonance, Flexible Printed Wiring Materials 04/88
TM 2.5.31 Current Leakage (Through Overglaze Films) 12/87
TM 2.5.32 Resistance Test, Plated Through-Holes 12/87
SECTION 2.6 - 2.6 Environmental Test Methods
TM 2.6.7.1 Thermal Shock - Conformal Coating 07/00
TM 2.6.6B Temperature Cycling, Printed Wiring Board 12/87
TM 2.6.7A Thermal Shock and Continuity, Printed Board 08/97
TM 2.6.12 Temperature Testing, Flexible Flat Cable 06/79
TM 2.6.17 Hydrolitic Stability, Flexible Printed Wiring Material 12/82
TM 2.6.19 Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate Boards 12/87
TM 2.6.20A 2.6.20A 01/95
TM 2.6.22 2.6.22 01/95