Best Technical Conference Papers at IPC APEX EXPO 2024 Selected

New this year, student scholarship awarded by IPC Education Foundation

The best technical conference papers of the ECWC16 Technical Conference at IPC APEX EXPO 2024 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Conference Program Committee (TPC), the paper authors will be recognized during show opening remarks on Tuesday, April 9.

“All of the papers making up the ECWC16 Technical Conference at IPC APEX EXPO 2024 represent the highest quality technical content from authors around the world,” said Stan Rak, co-chair of the TPC. “The global diversity of the presenting authors increased this year because of the large Asian cohort affiliated with the World Electronic Circuits Council (WECC). A Conference high 28 abstracts were received in total from next generation authors as well as seven student contributions, thus demonstrating the Conference’s ability to reach early career professionals. However, there is still a vast amount of experience taking stage with more than 25 percent of the presenting authors holding doctoral degrees. The commitment to quality is reflected in this year's selection of Best of Conference, NextGen, and Best Student papers. We extend our congratulations to all the award winners!"

         Taking top honors in the Best of Conference category, the winning papers are:

  • “Innerlayer Copper Balancing to Reduce PCB Surface Topography Under Large Form Factor BGAs” by Gary Brist, Intel and HDP User Group. His co-author is Neil Hubble, MBA, Akrometrix. This paper will be presented during Technical Conference Session S07: PCB Fab 2: Laminate Materials 1 on Tuesday, April 9.
  • “Humidity Robustness of Electronic Control Units – The Hidden Factor Solder Resist” by Lothar Henneken, Ph.D., Robert Bosch GmbH. This paper will be presented during Technical Conference Session S06: High Reliability for Extreme Requirements, on Tuesday, April 9.
  • “A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing” by Maarten Cauwe, Ph.D., imec. His co-authors are Geert Willems, Ph.D., imec, and Eddy Geerinckx, ACB. This paper will be presented during Technical Conference Session S08: Sustainability for Electronics 2: Life Cycle Assessment, on Tuesday, April 9.

The NextGen best paper is awarded to:

  • “Crack Formation in Glass Fiber Reinforced Polymer Printed Circuit Boards after Thermal Storage” by Mandy Krott, M.Sc., Robert Bosch GmbH. This paper will be presented during Technical Conference Session S07: PCB Fab 2: Laminate Materials 1, on Tuesday, April 9.

The Best Student paper is awarded to:

  • “High-frequency Signal Characteristics of Differential Striplines with Different Cu-Foil Roughness” by Ying-Chih Chiang, Master’s Student, Yuan Ze University, Taiwan, R.O.C. Her co-authors are Cheng-Yu Lee, Yu-Hsun Chang, Yu-Xuan Wen, Chun-Jou Yu, Wei-Ling Chou, and Cheng-En Ho, all of Yuan Ze University. This paper will be presented during Technical Conference Session S13: PCB Fab 4: RF Materials, Low Loss Materials, on Wednesday, April 10.

New in 2024, a scholarship from the IPC Education Foundation is awarded to:

  • Emily Lamport, Ph.D. Student, University of Massachusetts, for her paper “Implementation of 3D Printed Near Chip-Scale Interposers into X-Band Dual Channel MMIC Assembly.” This paper will be presented during Technical Conference Session S14: Factory of the Future 2: Additive Manufacturing, on Wednesday, April 10.

All technical conference papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.

To register for the ECWC16 Technical Conference at IPC APEX EXPO 2024 or for more information on all the activities taking place, including professional development courses, exhibition, keynote presentations, networking activities and more, visit www.IPCAPEXEXPO.org.

IPC Welcomes EU R&I Focus on Advanced Materials for the Future of Electronics

Mar 04, 2024

The European Commission published on 27 February its Communication on advanced materials. The Communication sets out the proposed approach to develop industrial leadership from Research and Innovation (R&I) through deployment. Electronics is one of the preliminary priority sectors in terms of potential use.

The intent of the strategy is to enhance the EU's long-term competitiveness by ensuring the EU remains at the forefront of new material technologies, supporting development, testing and deployment capacities. The actions are also intended to strengthen the EU’s open strategic autonomy by reducing dependencies on critical materials. IPC recently provided key insights to the European Commission in expert consultations preceding the Communication. Our contributions stressed the essential "silicon-to-systems" framework, to ensure the electronics sector's needs are fully addressed. See Jan 25 blog.  

Advanced materials are intentionally designed and engineered materials to display superior performance or special functions. The demand for advanced materials is expected to increase significantly in the coming years, for instance for the production of renewable energy, batteries, zero-emission buildings, semiconductors, medicines and medical devices, satellites, space launchers, planes or for other dual-use applications as well as defence equipment.

IPC welcomes the reflection on the needs of performance in harsh environments, heightened reflection on new requirements for packaging technologies and substrates and the intent to up-date regularly the priority areas to take into account socio-economic, scientific or technological developments. IPC and our members look forward to continuing dialogue on industrial needs.

IPC invites you to let us know what your company needs to ensure availability of advanced materials in electronics manufacturing processes and products. We welcome additional input from our European members to ensure a research and innovation focus on advanced materials needed for industrial production in Europe.

For further information, contact IPC’s technical expert PeterTranitz@ipc.org or for policy, contact me at AlisonJames@ipc.org.

 

 

Top of the Class: IPC APEX EXPO Named One of Trade Show Executive’s Fastest 50, Class of 2023

IPC APEX EXPO 2023 was recognized as one of the top 50 fastest-growing trade shows in the United States for the number of exhibiting companies and attendance by Trade Show Executive, the foremost magazine for the trade show industry.

IPC APEX EXPO, the largest trade show for electronics manufacturing in North America, welcomed a 50 percent increase in event participants and a 33 percent increase in exhibitors in 2023.

“With more than 13,000 tradeshows held annually each year in the United States, this is such an honor for IPC APEX EXPO to be named as one of the Top 50 tradeshows, and we couldn’t be prouder,” said Alicia Balonek, IPC senior director, trade shows and events. “This year’s event, just weeks away is also seeing positive growth, proving IPC APEX EXPO is the industry’s premier event to make new connections and to build relationships. We can’t wait to welcome everyone to Anaheim next month.”

According to Trade Show Executive, the Fastest 50 are ranked in three categories: By Net Square Feet, By Exhibiting Companies, and By Total Attendance. The Class of 2023 represents more than 15 million net square feet of paid exhibit space, 48,517 exhibiting companies, and more than 1.4 million attendees.

This year, IPC APEX EXPO will feature more than 400 exhibitors from every step in the electronics manufacturing supply chain including the industry’s leading equipment manufacturers, suppliers and product innovators who provide services to help attendees gain greater efficiency while improving their bottom lines.

To view a complete list of companies exhibiting at IPC APEX EXPO, visit www.IPCAPEXEXPO.org/exhibitors. For more information about the show or to register, visit www.IPCAPEXEXPO.org. Event essentials registration is free to individuals who pre-register online ($50 on-site). To maximize event experience, individuals can take advantage of the All-Access Package which includes all technical conference sessions; five half-day professional development courses; the EMS Leadership Summit, IPC luncheons, and more.

 

 

No Cost Chemical Management Training Opportunity: Express Your Interest

Mar 02, 2024
| By Kelly Scanlon

IPC is pleased to share an exciting education opportunity for the industry. The Clean Electronics Production Network (CEPN) is seeking electronics brands and suppliers to participate in free in-person or virtual beta testing of chemical safety training for workers and management in electronics manufacturing facilities in Vietnam and Malaysia. CEPN is seeking letters of interest by 15 March 2024, to support the funding necessary to be able to provide this training starting in Autumn 2024. If you’re interested in piloting this no-cost training, please reach out to CEPN.

The training is being developed by CEPN and it will include a suite of chemical management and safety capacity building training modules. The training will help companies to address the complex challenges of modern workplace chemical health and safety and will include five modules for workers, two modules for managers as well as a manager toolkit for creating facility specific chemical management training – and will be available in three modalities:

✅In person training

✅Webinar-based training (either live or recorded)

✅Interactive animated digital

Based on the building blocks of CEPN’s Toward Zero Exposure program, this fundamental capacity building training series on chemical management and safety is relevant for both workers and production managers in all electronics manufacturing facilities. Workers will learn general concepts about chemical handling and safety, as well as how their awareness and engagement can make the workplace safer for everyone. Production managers will learn about the benefits of involving workers in chemical handling safety and will be guided to develop chemical management and safety training specific to their own workplace.

Development of this training has been funded through a grant from Initiative for Global Solidarity, a program of the Deutsche Gesellschaft für internationale Zusammenarbeit (GIZ) GmbH. GIZ is reviewing funding for the next phase and robust interest from the industry will help to secure the funding so that CEPN will be able to provide this training at no cost. Your non-binding letters of interest help to show the importance of this topic and the need for this training.

If you are interested in learning more and providing a letter of interest (non-binding), please reach out to CEPN by 15 March 2024.

 

 

IPC WorksAsia China- Automotive Electronics Workshop

Register Here
Date
- (12:30 - 4:00am CDT)

With the rapid development of electronic information technology and the continuous drive towards electrification, intelligence, and connectivity in the automotive industry, the landscape of automobile manufacturing is undergoing constant changes. The proportion of automotive electronics within the entire vehicle is rapidly increasing. The demand for traceability of production data, high-quality and highly reliable products, and the continuous elevation of requirements for intelligent manufacturing are propelling advancements and growth in the automotive industry. The development of automotive electronics is accelerating the transition of the electronic manufacturing industry towards intelligent manufacturing.

How can the entire vehicle manufacturing ensure that the upstream and downstream of the supply chain meet the constantly increasing requirements for high quality and reliability? How should the electronic manufacturing industry respond to the opportunities and challenges presented by the development of automotive electronics?

IPC WorksAsia China will focus on topics such as automotive electronic materials and printed circuit board applications, process technology, intelligent manufacturing solutions, specific requirements and development trends of entire vehicle manufacturers, as well as the application of IPC automotive supplementary standards. We invite representatives from leading companies in the industry to engage in face-to-face discussions and share insights. Industry colleagues are welcome to register and participate.

Agenda：

13:30-13:40 Opening Session, Introduction of Speaker
By IPC

13:40-14:10 Analysis of Printed Circuit Board Standards in the Automotive Sector
By Jiong Dai, Quality Department Standards Manager at Shennan Circuits Co., Ltd., Member of IPC Asia Standards Steering Committee

14:10-14:40 Application of Flexible Printed Circuits (FPC/FPCA) in the Automotive Field
By Huiqin Zheng, Chief Engineer at Xiamen Long-Shine Flex Co., Ltd

14:40-15:10 Reliability Analysis of PCBA for New Energy Vehicle Electric Drive Controllers
By Zupei Tan, Supervisor of Electronics and Electrical Control Processes at Zhuzhou CRRC Times Electric Co., Ltd.

15:10-15:30 Tea Break

15:30-16:00 Innovative Soldering Techniques for Automotive Electronics
By Xuan Ma, Application Technology Expert in Automatic Soldering at TSUTSUMI China Agency

16:00-16:30 Identification and Control of Latent Defects in Electronic Components
By Zhitang Chen, Senior Expert in Supplier Quality Electronic Information at SGMW & Member of IPC China Automotive Electronics Committee

16:30-17:00 Embracing the Challenges of Automotive Electronics: Steering Towards Success with IPC Standards
By Chuck Li, Standards Director, IPC Asia Pacific

17:00-17:10 Q&A Session

Premier Sponsors

ONG SHINETSUTSUMI

Supporting Sponsor

 

 

 

 

For more information or event sponsorship, please contact marketingchina@ipc.org

 

 

Shenzhen Dengxilu International Hotel - 2nd Floor, Shenzhen Hall

12 Baotian 1st Road
Bao'an Qu
Shenzhen Shi
Guangdong Sheng, 518102
China

Shenzhen Dengxilu International Hotel - 2nd Floor, Shenzhen Hall

Shenzhen Dengxilu International Hotel - 2nd Floor, Shenzhen Hall
12 Baotian 1st Road
Shenzhen Shi, GD 518102
China

Register Here

Electronics Industry Praises U.S. Government Notice of Funding Opportunity for “Advanced Packaging” Technologies

IPC praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.

“IPC applauds this very important milestone in the work to build a more resilient semiconductor manufacturing supply chain in North America,” said Richard Cappetto, Senior Director of North American Relations at IPC. “Today’s action is a welcome milestone following years of education and advocacy work by IPC and our partners. It will help ensure that the United States can bridge current gaps in its semiconductor supply chain and position itself to be a leader in the global marketplace with the ability to manufacture cutting-edge technologies.”

Advanced packaging is driving semiconductor innovation by introducing greater electronic interconnection within semiconductor packages. Electronic interconnection is key to U.S. semiconductor leadership, and industry leaders call advanced packaging the “new king” of innovation in the chips sector. 

The NOFO makes $300 million available for multiple awards of up to $100 million each for up to five years. Investments will be focused on projects that achieve ambitious targets for one or more of the program’s chief objectives:

  • Accelerate domestic R&D and innovation in advanced packaging materials and substrates;
  • Translate domestic materials and substrate innovation into U.S. manufacturing;
  • Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and
  • Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry.

IPC is the leading advocate for a “silicon-to-systems” approach to the CHIPS and Science Act, recognizing the importance of silicon fabrication but also the need for related electronics manufacturing capabilities—including advanced packaging, printed circuit boards (PCBs), and IC substrates.   

IPC’s influential 2021 report, North American Advanced Packaging Ecosystem Gap Assessment, found the U.S. has only just begun to invest in advanced packaging, while nations in Asia have sprinted ahead to develop the lion's share of capabilities and capacity. That report was referenced both in today's NOFO and in the CHIPS Office’s guiding document for the National Advanced Packaging Manufacturing Program. An IPC Symposium on Advanced Packaging in 2022 also helped propel government action.   

For more information: Advanced Packaging Semiconductors | IPC Industry Initiatives

Electrical Wire Processing Technology Expo (EWPTE) Named in Trade Show Executive’s Top 100 List of Fastest Growing Shows

IPC/WHMA and Baird Center announce that Electrical Wire Processing Technology Expo (EWPTE) 2023 has been recognized as a top 100 fastest growing show in the United States for net square footage and number of exhibiting companies by Trade Show Executive.

EWPTE, the cable and wire harness industry’s exclusive trade show, drew in a total of 3,049 attendees in 2023, an 18 percent increase over 2022. The EWPTE 2023 experience was equally positive for the 185 exhibitors (up 19 percent from 2022) who showcased their products and services spanning 43,400 net square feet of show floor space (up 17 percent from 2022) and generated a total of 12,063 leads according to the lead data count, a 35 percent increase over leads in 2022.

According to the Center for Exhibition Industry Research (CEIR), there are approximately 13,000 tradeshows held annually in the United States each year. “It’s an honor for EWPTE to be recognized as a top U.S. tradeshow,” said Alicia Balonek, IPC senior director of trade shows and events. “In the past two years that IPC/WHMA have managed the show, EWPTE has seen both exhibitor growth and overall net-square footage growth. Being ranked in the top 100 is a tremendous accomplishment not only for the show, but for IPC, WHMA and Baird Center and we couldn’t be more proud.”

With an even larger show floor than 2023, EWPTE 2024 will feature the industry’s leading suppliers and product innovators, giving attendees exclusive access to new technologies and new suppliers to help find solutions to challenging wire problems. “Baird Center is about to debut a $456 million expansion, doubling the square footage of the convention center in May 2024. The show has even more room for growth when it moves to this space in 2025,” said Megan Seppmann, vice president of sales for the Wisconsin Center District, owners and operators of Baird Center. “My colleagues and I cannot wait to welcome attendees, exhibitors and guests into the beautifully renovated and expanded facility.”

At EWPTE 2024, there will also be a range of professional development courses with content designed to deliver new information, skills, and techniques related to the cable and wire harness industry. Technical conference sessions presented by engineers, researchers, academics, technical experts, and industry leaders will provide new technical data, significant results from experiments and case studies, and share new techniques and trends of interest.

EWPTE 2024 will be held at Baird Center May 14-16, 2024, in Milwaukee, Wis. For more information, visit www.electricalwireshow.com.

Electric Vehicle and Smart Car Technology Workshop

Learn More
Date
- (12:00 - 4:00am CDT)

Electric vehicles and smart cars have become one of the fastest-growing markets in the electronics industry. With demands for automation, electrification, connectivity, and safety, vehicles are not only integrating more electronic products from various industries, but their quality and reliability must also be enhanced.

This workshop encourages attendees to interact, discuss, and share research and experiences related to the following topics:

• Material and technology trends in electric vehicles

• Reliability issues of electronic equipment in electric vehicles, including PCBs, solder joints, components, and assemblies

• Electronic component characteristics, failure analysis, reliability modeling, standards, and specifications

• Knowledge gaps and collaborative opportunities to address common issues faced by the supply chain of materials and parts for electric vehicles

This workshop will be organized during TPCA SHOW from October 23-25, 2024.

For more information or event sponsorship, please contact Ms. Winny Lin at WinnyLin@ipc.org

Nangang Exhibition Center

No. 1, Jingmao 2nd Road
Nangang District, Taipei City 11568
Taiwan

Nangang Exhibition Center

Nangang Exhibition Center
No. 1, Jingmao 2nd Road
Nangang District, TPE 11568
Taiwan

Learn More

IPC-2951-CFX Future Factory Applications & Real Scene Demonstrations

Date
- (12:00 - 4:00am CDT)

This event will be organized during 2024 Taiwan Robot and Intelligent Automation Exhibition \ 2024 Taipei International Industrial Automation Exhibition from August 21-24, showcasing the research and experience on industry pain points:

-Introduction of IPC-HERMES-9852 & Basic Architecture & Transmission Mechanism & Interchangeable Messages

-Introduction of IPC-2951-CFX & Basic Architecture & Transmission Mechanism & Basic Specifications (Table 6-1, 6-2) & Interchangeable Messages & Application Scene Introduction & Factory of the Future Applications & Real Scene Demonstrations

- AMR Automated Loading and Unloading (CFX)

- First Station Data & Batch Completion Data & Rework Station PCB Placement & Command Stop Board

- Integration System Manufacturer – Enlight Technology for CFX Equipment Integration

For more information or event sponsorship, please contact Ms. Winny Lin at WinnyLin@ipc.org

Nangang Exhibition Center

No. 1, Jingmao 2nd Road
Nangang District, Taipei City 11568
Taiwan

Nangang Exhibition Center

Nangang Exhibition Center
No. 1, Jingmao 2nd Road
Nangang District, TPE 11568
Taiwan

CIT Club Networking Event

Date
- (Mar 7, 2024 | 11:00pm - Mar 8, 2024 | 3:00am CST)

IPC cordially invites you to attend the 2024 CIT Networking Event and the main meeting on EMS Digital Smart Factory, which will be held in Taipei on March 8, 2024. This event will showcase the new policies and standard updates for the 2024 IPC certification training, and together we will discuss how to deal with the standardization and dynamic uploading of data from rapidly growing manufacturing stations, standardizing data formats, centralized analysis, closed-loop feedback control, as well as quality and reliability requirements and challenges of the plan.

For more information or event sponsorship, please contact Ms. Winny Lin at WinnyLin@ipc.org

Sunjsong Technology

6th Floor, No. 649, Zhongzheng Road
Xinzhuang District, New Taipei City 242051
Taiwan

Sunjsong Technology

Sunjsong Technology
6th Floor, No. 649, Zhongzheng Road
Xinzhuang District, NWT 242051
Taiwan

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