IPC Electronics Forum @ Global Industrie 2024

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*French version below* *Version Français ci-après*

IPC Electronics Forum @ Global Industrie 2024
 
IPC is back at Global Industrie this year with a brand-new program to uncover the future topics for our industry. IPC Forum will be held every day at IPC stand #5S78 (Hall 5). The objective is to enable meetings and exchanges of information within the community of electronics manufacturing experts through interactive technical presentations and face-to-face discussions. Topics covered will include:

Technology Solutions (every day from 11 a.m. to 12 p.m.)
IPC works with the electronics industry to develop a strong and efficient manufacturing ecosystem and promote a resilient supply chain. The production of advanced semiconductor packaging requires IC substrate manufacturing and has a direct impact on the future of PCB manufacturing technologies and assembly processes (PCBA). In order to promote a successful transition from the supply chain to a silicon-to-systems approach, IPC promotes our industrial ecosystem by organizing the representation at European and international level of all technologies. Join us and discover our initiatives on subjects as varied as: Ultra-HDI, plastronics for e-mobility, 3D-MID plastronics, and many more.

Speakers will include Dr. Maël Moguedet, S2P, Dr. Peter Tranitz, IPC and Francisco Fourcade, IPC.

Electronics Design (Mon., Tue., Wed. from 2 p.m. to 3 p.m.)
A new electronic product cannot be successful without a truly effective design process. Such a design process requires close collaboration across the entire supply chain. Our IPC Design Initiative aims to build a global forum for exchange and discussion in which all stakeholders, OEMs, PCB manufacturers, EMS assemblers, advanced packaging experts and designers, friends and EDA software suppliers will be able to share, exchange, collaborate and advance together the next generations of design/design approaches for electronic circuits. Join us and discover our initiatives on PCB Design, Eco-Design and come meet the experts from the IPC Designers Council France.

Speakers will include Nicolas Feyfant, FEDD, Dr. Peter Tranitz, IPC and Francisco Fourcade, IPC.

CFX-Connected Factory Exchange (Tues. & Thu. from 12 p.m. to 1 p.m.)
IPC-CFX is a new, open and international standard, developed by the industry, for the industry aimed at easily enabling machine-to-machine dialogue and constituting the foundation of the factory of the future and its applications. A plug-and-play solution, CFX standardizes and simplifies machine-to-machine communications and facilitates machine-to-business exchanges and business-to-machine applications. Join us and discover how to implement CFX within your manufacturing lines and start benefiting now from its many technical and economic advantages.

The presentation will be delivered by Sanjay Huprikar, IPC.

Sustainability (Mon. from 12 p.m. to 1 p.m. & Wed. from 3 p.m. to 4 p.m.)
Companies in the electronics industry are currently under pressure and must identify levers to identify and achieve their sustainable development objectives and meet increasing regulatory and reporting obligations. Our IPC's Sustainability for Electronics Initiative focuses efforts on the use of specific tools developed by the industry, including norms and standards, training programs, specific lobbying programs and other solutions under development.

This presentation will be delivered by Francisco Fourcade, IPC.

EU Government Advocacy for the Industry - Silicon-to-System (Tues. from 3 p.m. to 4 p.m. & Wed. from 12 p.m. to 1 p.m.)
The European Union (EU) is currently defining a legal framework for businesses and production activities on EU territory. IPC mobilizes businesses and industry stakeholders to define the parameters and influence the policies and regulations proposed by the EU in order to foster the entire 'Silicon-to-System' ecosystem for a European electronics manufacturing industry stronger and more resilient. Join us, discover how this European framework works and how IPC defends your interests on a daily basis.

The presentation will be delivered by Alison James, IPC.
 

Wire Harness - WHMA (Mon. 3 p.m. to 4 p.m.)
WHMA is the international organization that represents cable harness and connector players for the electronics industry. Founded in 1993, WHMA brings together the entire supply chain, including manufacturers, their suppliers, and customers. Now affiliated with IPC, WHMA provides its members and the entire industry with technical support, norms and standards and educational programs as well as training techniques and certifications. Join us to discover the latest technologies and meet live with the industrial leaders in cable and electronic connectors.

The presentation will be delivered by Sanjay Huprikar, IPC.

For more information, please contact Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org)

 

IPC Electronics Forum @ Global Industrie 2024

 IPC est de retour à Global Industrie cette année avec un tout nouveau programme pour découvrir les sujets d’avenir pour notre industrie.  IPC Forum se tiendra chaque jour sur le stand IPC #5S78 (hall 5). L’objectif est de permettre des rencontres et échanges d’information au sein de la communauté des experts de la fabrication électronique grâce à des présentations techniques interactives et des discussions en présentiel. Les sujets abordés incluront: 

Technology Solutions (chaque jour de 11h à 12h)
IPC travaille avec l’industrie électronique afin de développer un écosystème de fabrication solide et performant et favoriser une supply-chain résiliente. La production de Advanced Semiconductor Packaging nécessitent des fabrication de IC substrate et ont un impact direct sur le futur des technologies de fabrication des PCB et des process d’assemblage (PCBA). Afin de favoriser une transition réussie de la supply-chain vers une approche silicon-to-systems, IPC promeut nos écosystème industriels en organisation la représentation au niveau européen et international de l’ensemble ds technologies. Rejoignez nous et découvrez nos initiatives sur des sujets aussi variés que : Ultra-HDI, plastronics for e-mobility, 3D-MID Plastronics, et bien d’autres encore…

Les orateurs incluront Dr. Maël Moguedet, S2P, Dr Peter Tranitz, IPC et Francisco Fourcade, IPC

Electronics Design  (Lun., Mar., Mer. de 14h à 15h)
Un nouveau produit électronique  ne peut pas être réussi sans un processus de conception vraiment efficace. Un tel processus de conception nécessite une collaboration étroite au sein de l’ensemble de la supply-chain. Notre IPC Design Initiative vise à bâtir un forum global d’échange et de discussion au sein duquel l’ensemble des acteurs, OEM, fabricant de PCB, assembleurs EMS, experts advanced packaging et designers, amis aussi fournisseurs de software EDA pourront partager, échanger, collaborer et faire avancer ensemble les prochaines générations d’approches design/conception pour les circuits électroniques. Rejoignez nous et découvrez nos initiatives sur PCB Design, Eco-Design et venez à la rencontre des experts du IPC Designers Council France.

Les orateurs incluront Nicolas Feyfant, FEDD, Dr Peter Tranitz, IPC et Francisco Fourcade, IPC

CFX-Connected Factory Exchange  (Mar. & Jeu. de 12h à 13h)
IPC-CFX est un nouveau standards, ouvert et international, développé par l’industrie, pour l’industrie visant a permettre facilement le dialogue machine-to-machine et constituant la fondation de l’usine du futur et de ses applications. Solution plug-and-play, CFX standardise et simplifie les communications machine-to-machine et facilite les échanges machine-to-business et les applications business-to-machine. Rejoignez nous et découvrez comment mettre en oeuvre CFX au sein de vos lignes de fabrication et commencez dès maintenant à bénéficier de ses nombreux avantages techniques et économiques…

La présentation sera délivrée par Mr Sanjay Huprikar, IPC

Sustainability  (Lun. de 12h à 13h & Mer. de 15h à 16h)
Les entreprises de l’industrie électronique sont actuellement sous pression et doivent identifier les levier permettant d’identifier et d’atteindre leur objectifs en matière de développement durable et de remplir des obligations réglementaires et de reporting de plus en plus nombreuses. Notre IPC’s Sustainability for Electronics Initiative concentre les efforts sur l’utilisation d’outils spécifiques développés par l’industrie, y compris des normes et standards, des programmes de formation, des programmes de lobbying spécifiques et autres solutions en cours de développement. 

La présentation sera délivrée par Francisco Fourcade, IPC

EU Government Advocacy for the Industry - Silicon-to-System  (Mar. de 15h à 16h & Mer. de 12h à 13h)
L’Union européenne (UE) définit actuellement un cadre légal pour les entreprises et les activités de production sur le territoire de l'UE. IPC mobilise les entreprises et les acteurs de l’industrie pour définir les paramètre et influencer les politiques et réglementations proposées par l’UE afin de favoriser l’ensemble de l’écosystème 'Silicon-to-System' pour une industrie de fabrication électronique européenne plus forte et plus résiliente. Rejoignez nous, découvrez le fonctionnement de ce cadre européen et comment IPC défends vos intérêts au quotidien.

La présentation sera délivrée par Mme Alison James, IPC

Wire Harness - WHMA  (Lun. de 15h à 16h)
WHMA est l’organisation internationale qui représente les acteurs du faisceuu de câbles et des connecteurs pour l’industrie électronique. Fondée en en 1993, WHMA regroupe l’ensemble de la supply-chain, y compris les fabricants, leur fournisseurs, et les clients. Désormais affiliée à IPC, WHMA fournit à ses membres  et à l’industrie toute entière, du support technique, des normes et standards et des programme éducatifs ainsi que des formations techniques et certifications. Rejoingez nous pour découvrir les dernière technologies et rencontrer en direct les leaders industriels du câble et de la connectique électroniuque

La présentation sera délivrée par Mr Sanjay Huprikar, IPC

Pour plus d’information, merci de prendre contact avec  Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org)

 

2024 Global Industrie IPC Forum Presentation Schedule
IPC Booth #5S78

Monday, March 25

  • Technology Solutions (11:00 am - 12:00 PM)
  • Sustainability (12:00 pm - 1:00 pm)
  • Electronics Design (2:00 pm - 3:00 pm)
  • Wire Harness - WHMA (3:00 pm - 4:00 pm)

Tuesday, March 26

  • Technology Ultra-HDI (11:00 am - 12:00 PM)
  • CFX - Connected Factory Exchange  (12:00 pm - 1:00 pm)
  • Electronics Design (2:00 pm - 3:00 pm)
  • EU Government Advocacy for the Industry - Silicon-to-System (3:00 pm - 4:00 pm)

Wednesday, March 27

  • MID Plastronics (11:00 am - 12:00 PM) 
  • EU Government Advocacy for the Industry - Silicon-to-System (12:00 pm - 1:00 pm)
  • Electronics Design (2:00 pm - 3:00 pm)
  • Sustainability (3:00 pm - 4:00 pm)

Thursday, March 28

  • Technology Printed Electronics, E-Textiles and Plastronics (11:00 am - 12:00 PM)
  • CFX - Connected Factory Exchange  (12:00 pm - 1:00 pm)
  • IPC Awards Ceremony (2:00 pm - 3:00 pm)

 

 

 

Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC

Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry.

Dr. Iyer comes to IPC after serving as senior vice president, power products business and technology R&D at Amkor Technology Inc. Before that, he spent 13 years as a corporate vice president at Texas Instruments. He was also previously at Infineon Technologies and several microelectronics research institutes. He has earned 24 patents and has authored or co-authored more than 150 technical articles.

“We are so pleased that Devan Iyer has joined Team IPC,” said IPC Chief Technology Officer Matt Kelly. “The future of advanced packaging directly affects the future of all aspects of electronics manufacturing. With Devan’s help, IPC will continue to be the leading advocate of a ‘silicon-to-systems’ approach, recognizing the importance of silicon fabrication as well as related capabilities such as advanced packaging, printed circuit boards (PCBs), and IC substrates.”    

“We are thrilled to have Dr. Iyer join the IPC team,” said IPC President and CEO, Dr. John W. Mitchell. “Adding his capabilities to our organization further cements IPC’s role as the leading industry association for advanced packaging.”  

Governments in North America and Europe are actively ramping up their support of advanced packaging via several policies and programs. For example, the CHIPS for America R&D Office recently issued a Notice of Funding Opportunity (NOFO) for research and development activities that will help expand domestic capacity for advanced packaging substrates and substrate materials. IPC seeks to play an active role in this program.

Meanwhile, the European Commission has also identified microelectronics and advanced packaging as areas requiring further government focus and support.

IPC’s influential 2021 report, North American Advanced Packaging Ecosystem Gap Assessment, found the U.S. has only just begun to invest in advanced packaging, while nations in Asia have sprinted ahead to develop the lion's share of capabilities and capacity. That report was referenced in the CHIPS Office’s guiding strategy document for the National Advanced Packaging Manufacturing Program. An IPC Symposium on Advanced Packaging in 2022 also helped propel government action. 

For more information, visit Advanced Packaging Semiconductors | IPC Industry Initiatives.

Bold Breakthroughs: Women Reshaping the Engineering Landscape

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IPC is shining a spotlight on the incredible women in the electronics industry who are breaking barriers, making bold breakthroughs, and paving the way for future generations. They're not just engineers – they're innovators, problem-solvers, and trailblazers who are transforming the field in ways never seen before.

Join IPC on June 24 at 10:00 am EDT for a special virtual event, "Bold Breakthroughs: Women Reshaping the Engineering Landscape," as we celebrate International Women in Engineering Day (INWED). Our lineup of panelists features nine extraordinary women from nine different countries, each a leader in her own right within the electronics industry:

🔸Sylvie Bugnand, Founder and Director, Polygone CAO (France)
🔸Susann Chen, Senior Engineer, Zhuzhou CRRC Times Electric Co. (China)
🔸Savita Ganjigatti, Vice President, Engineering, Sienna ECAD Technologies (India)
🔸Milea Kammer, Senior Engineering Manager – Materials Engineering, Honeywell Aerospace (United States)
🔸Susan Kayesar, PCBflow Product Manager, Siemens Digital Industries Software (Israel)
🔸Carol Marsh, Head of Digital Systems, Celestia Technologies (United Kingdom)
🔸Raquel Rodriguez, CEO, INSYTE SA (Spain)
🔸Outi Rusanen, Principal Interconnection Specialist, TactoTek (Finland)
🔸Corina Stocker, Senior Expert Press-fit Technology, Continental Automotive Technologies (Germany)

Emcee: IPC’s Teresa Rowe, Senior Director, Assembly & Standards Technology

Get ready to hear firsthand about:

🚀 Their inspiring engineering journey

🏆 Their proudest accomplishment

💡 One invaluable piece of advice (or a lesson learned)

Meet the faces behind the feats -- this is your chance to connect with these trailblazing women, learn from their experiences, and chart your own path to success.

Don't miss out on this empowering event and get ready to be inspired like never before! Together, let's celebrate the unstoppable force of female engineers and ignite a new era of innovation.

REGISTER FOR FREE VIRTUAL PANEL

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

Foreign Object Debris for Electronics Manufacturing Course Available in Spanish, French and German

IPC has announced the expansion of its complimentary training offerings for IPC members with the introduction of a “Foreign Object Debris (FOD) for Electronics Manufacturing” course, now available in French, Spanish and German. This initiative reinforces IPC's commitment to providing valuable resources to its members worldwide. FOD training across electronics manufacturing and assembly can mitigate risks, ensuring quality production and reliable electronics products.

The FOD course joins the training courses "ESD Control for Electronics Manufacturing" and “Safety for Electronics Manufacturing” which are also offered in English, French, and German and serves to familiarize participants with the intricacies of electrostatic discharge (ESD) and the precautions necessary for mitigating its impacts during the handling, storage, or transportation of ESD-sensitive components and common safety practices within an electronics manufacturing environment.

Available to all IPC member companies, these training resources facilitate cost reduction by offering free access to essential knowledge and enabling the seamless implementation of standardized training across multiple manufacturing sites. Since their launch in 2023, IPC member companies have trained more than 10,000 employees using IPC member courses.

With a focus on efficiency and effectiveness, IPC's training modules are designed to deliver fundamental skills in just 45 minutes, ensuring that trainees can quickly transition to the production line with confidence and proficiency. By offering consistent training in different languages, IPC empowers its members worldwide to streamline operations and enhance overall productivity.

IPC members are encouraged to take advantage of this valuable benefit to optimize their training processes, improve operational performance, and elevate their competitive edge in the industry.

For more information about IPC's complimentary training courses and membership benefits, visit https://edu.ipc.org/membercourses.

FTG Circuits Earns IPC-1791 Trusted Electronic Designer, Fabricator and Assembler QML Requalification

IPC’s Validation Services program has awarded an IPC-1791, Trusted Electronics Fabricator Qualified Manufacturer Listing (QML) requalification to FTG Circuits’ Haverhill, Mass. location.

FTG Circuits manufactures printed circuit boards for leaders in the aviation, defense, and high-technology industries.              

“IPC-1791 Qualified Manufacturer Listing incorporates the NIST-SP-800 and verifies that FTG Circuits Haverhill has successfully achieved robust and stringent cyber, physical, and chain-of-custody protocols to assure the security of our customers’ products and critical IP,” commented Peter Bigelow, president of FTG East. He added, “We are proud to have achieved the distinction as an IPC Validation Services Qualified Trusted Fabricator Supplier since 2020.”

IPC's Validation Services QML program was developed to promote supply chain verification. It also provides auditing and qualification of electronics companies' products and identifies processes that conform to IPC standards.                                   

“Unlike other audit programs, IPC's Validation Services programs uniquely provide technical and in-depth assessments of products and processes following IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize FTG Circuits, Haverhill on becoming members of IPC's network of trusted QML suppliers and their requalification.”                   

For more information about IPC's Validation Services QPL/QML program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.

European EMS Market Grew to a Record Level in 2023 But May Experience Challenges in 2024

As revealed this week by an annual survey conducted by in4ma and sponsored by IPC Electronics Europe GmbH, the European electronics manufacturing services (EMS) industry experienced a robust 11 percent growth last year. Printed circuit board assembly (PCBA) production by EMS companies achieved record revenues of 57.3 billion Euros in 2023, underscoring electronics manufacturing’s vital role in the European economy and industrial base.

Dieter Weiss, founder and president of in4ma, and lead architect of the survey, stated that 306 legal entities contributed data to this year’s survey, which represented a 50 percent expansion in participants in just three years.

Key year-over-year industry takeaways from the survey data included:

  • Eighty-one percent of EMS companies had higher revenues than the previous year.
  • Employment in the EMS industry increased by approximately 14,000 to just over 254,000 total, which represented employment growth of 5.9 percent.
  • EMS production of PCBAs represented only 43 percent of the total market of European PCBA production in Europe, so long-term growth potential still exists.
  • The market remained very top heavy: Less than four percent of the total EMS companies in Europe represented over 70 percent of revenue.
  • Excessive raw materials in inventory were calculated to be 5.2 billion Euros.
  • Market consolidation will continue in 2024 as witnessed by 12 merger and acquisition (M&A) deals completed just in the first two months of the new year.
  • Overall prognosis for 2024 is that the European EMS market could contract by up to one percent.

Weiss will share his findings at several live presentations over the next six months:

  • IPC APEX EXPO – Anaheim, California, USA – April 8
  • in4ma EMS & PCB Forum – Ulm, Germany – June 6
  • IPC UK EMS Executives Meeting – London, UK – June 13
  • IPC European EMS Executives Meeting – Gdansk, Poland – September 25

The full report, “Annual Survey of the European EMS Industry 2024,” authored by Dieter Weiss and Mareike Haass can be purchased directly from in4ma for 690 Euros. Contact Weiss at weiss@in4ma.de for additional information.

IPC fully champions the Pan-European EMS industry by focusing on standards, education, advocacy, solutions, industry intelligence, and networking events. You can learn more about how to participate in these initiatives by contacting Philippe Leonard, senior director, IPC Electronics Europe GmbH, at PhilippeLeonard@ipc.org.