7:00 am – 7:45 am | Networking Breakfast
7:45 am – 8:00 am | Welcome Remarks
Matt Kelly, P.Eng., M.B.A.
8:00 am – 8:45 am | SRC Keynote – Packaging is the New King
Todd Younkin, Ph.D.
President and CEO
Semiconductor Research Corporation (SRC)
8:45 am – 10:15 am | Importance of IC-Substrates – Advanced Package Assembly Perspectives
Future Trends for Chiplet Heterogeneous Integrated Packaging (CHIP)
Charles Woychik, Ph.D.
Senior Director, Advanced Packaging Platforms
From Global to Local: The Journey to Supply Chain Localization
Corporate Vice President, Flipchip / Wafer Level Business Unit
Amkor Technology, Inc.
Trends in SIP and Highspeed Substrates
VP Business Development
10:15 am – 10:30 am | Break
10:30 am – 12:00 pm | Panel Discussion – North American Perspectives on the IC-Substrate Market
Moderator: Matt Kelly, P.Eng, MBA
General Principles for a North American Package Substrate Industry
Chief Executive Officer
Adopting New Process Technology to an Old Problem
Meredith LaBeau, Ph.D.
Chief Technology Officer
The Necessity of Process Synergies
Director of Product Development
GreenSource Fabrication LLC
The Foundational Requirements for High Impact Substrate Manufacturing
Vice President, Engineering and Technology Development
Barriers and Opportunities in Advanced Packaging Ecosystem
Director of Process Engineering, North America
12:00 pm – 1:00 pm | Lunch
1:00 pm – 2:30 pm | Global Perspectives on IC-Substrate Market
Yesterday, Today, and Tomorrow on Package Substrate Industry
Richard (KwangWook) Bae
Executive Vice President of NPI, CTO
Samsung Electro-Mechanics Pte.,Ltd. (SEMCO)
Advanced Substrates & Packages are Crucial – How Can the U.S. Achieve its Sovereignty?
Business Development Manager
Director Public Affairs Global
IC Substrates for Power Packaging - Technologies and Supply Chain Aspects
Vice President Technology
2:30 pm – 2:45 pm | Break
2:45 pm – 4:15 pm | IC-Substrate Material and Equipment Advancements
Idealism vs Realism – Bulletproof Stacked Microvias Built with Common Sense, Good Engineering, the Proper Material
Vice President of Innovation
Electroless Copper Plating Process "OPC FLET process" with Excellent Via Connection Reliability
Chief Administrative Officer
Equipment Challenges for Panel Level Packaging
Managing Director, SABRE 3D
4:15 pm – 5:15 pm | Final Session – So What’s Next?
More information coming soon
5:15 pm | Symposium Concludes