IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem

Executive Vice President of NPI, CTO 

Mr. Richard (KwangWook) Bae is a Chief Technology Officer and a leader on the NPI (New Product Introduction) and the technical Sales at Strategic Marketing Center, Samsung Electro Mechanics. 

He had been a Chief Strategy Officer for 7 years and a Head of Samsung Electro Mechanics US Lab for 5 years. 

He led Samsung’s Fan Out PLP (Panel Level Package) business 5 years ago and now he is leading 2.nD package business of Samsung Electro Mechanics. 

Advanced Packaging Lead & SHIP Digital Technical Manager

Dr. Darren Crum is a technical leader with more than 20 years of experience in advancing microelectronics engineering in the defense industry. He is a Technical Area Lead and Program Technical Manager for microelectronics advanced packaging at the Naval Surface Warfare Center, Crane Division directly supporting the Office of Under Secretary of Defense for Research & Engineering’s Trusted & Assured Microelectronics Program and the SOTA Heterogeneous Integrated Packaging (SHIP) Program. He also serves as a government representative in various microelectronics industry working groups.

Senior Expert, Microelectronics and Photonics Industry
DG CONNECT

Francisco J. Ibáñez holds university degrees in Engineering and Solid-State Physics (Autonoma University, Madrid) and Masters in Communication Networks and Signal Processing (Polytechnic University, Madrid), Business Administration (Catholic University of Leuven) and Information Society and Knowledge (Open University of Catalonia).

Prior to joining the European Commission, he was active in semiconductors research (Bell Labs, US) and had a number of industrial assignments, including process and product engineering in microelectronics design and fabrication (AT&T Microelectronics, Lucent Technologies).

At the European Commission he had responsibilities in different R&D and policy areas, including Future and Emerging Technologies (FET) and Networks and Communications. He is currently involved in the EU Chips Act as part of the Microelectronics and Photonics Industry unit within DG CONNECT. 

Chief Technology Officer

Dr. Meredith Ballard LaBeau is the Chief Technology Officer and on the strategic leadership team at Calumet Electronics, a leader in manufacturing high-performance Printed Circuit Boards and IC Substrates for defense, aerospace, medical, power-grid, commercial, industrial controls, and space applications.

Meredith is the technical lead and manager of Calumet’s Process Engineering and R&D teams. She also is a member of two international standards committees: IPC and the National Aerospace and Defense Contractors Accreditation Program (NADCAP), an IPC Thought-Leader and plays a critical role in developing standards and PCB manufacturing quality and criteria for the electronics industry.

Director of Process Engineering, North America 

Matt Neely joined TTM Technologies as director of Engineering in 2019 when TTM acquired the assets and technology of i3 Electronics. He spent the bulk of his career working in Printed Circuit Board fabrication at i3 Electronics and Endicott Interconnect Technologies both of which were formerly part of IBM Corp. His roles have been in engineering management, customer program management and process engineering with responsibilities focused on technology growth and new product introduction.

Founder and President

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987.  She is the author of numerous publications on emerging trends in semiconductor packaging and assembly. 

She served on the NSF-sponsored World Technology Evaluation Center (WTEC) study team involved in investigating electronics manufacturing in Asia and on the U.S. mission to study manufacturing in China.  Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

Technology Development Manager

Kim Eilert is a Technology Development Manager in Advanced Electronics within BAE System's FAST Labs. She is the Integrated Chipset Solutions tech group lead, holds three patents and is an author of several papers describing implementations of passive filters in semiconductors, ceramics, and laminates. She has nearly 20 years of experience in RF and microwave design, focused on filters and packaging.  Previously, Kim held concurrent positions of Business Unit Manager and Senior Principal Engineer at On Semiconductor Corporation. Her responsibilities included ownership of the profit and margin for three technology lines in the foundry business division, cultivation of business relationships, management of marketing and engineering teams, direction of the R&D roadmap for her product lines, and technical design work.  Kim also volunteers with the IEEE Microwave Theory & Technology Society, and is a voting member of its board.  She holds a BSEE from Caltech, and welcomes you to connect with her through LinkedIn.

Chief Executive Officer

Haris Basit is the Chief Executive Officer of Averatek since 2017. Prior to joining Averatek, Haris was CEO at VIASPACE, an alternative energy company. He has also been founder or co-founder of several successful technology-based companies.

From 2004 to 2012 he was co-founder and CEO at Multigig, a fabless semiconductor company that was sold to Analog Devices. He has also held senior level positions at Lucent Technologies (Bell Labs division); Rockwell International; and at IBM Research Labs.

Corporate Vice President, Flipchip / Wafer Level Business Unit

Kevin Engel currently serves as Corporate VP, Flip Chip/Wafer Services Business Unit and President of General & Supervisory Board of Amkor Technology Portugal. Kevin joined Amkor in 2004 as part of the acquisition of Unitive Electronics. 

Amkor is a leading provider of outsourced semiconductor packaging and test services.  In his role, Kevin is responsible for multiple advanced packages including advanced flip chip, bumping, fan-out, high-density heterogenous integration solutions and test. These packages support a broad IDM, Fabless and Foundry customer base in the Automotive, Communications, Computing and Consumer markets. Manufacturing of these products occurs in South Korea, Japan, China, Taiwan and Portugal.

He has held various management positions in the semiconductor manufacturing and packaging industry for more than 25 years.

Director of Product Development

Michael Gleason is the Director of Product Development for GreenSource Fabrication in Charlestown, New Hampshire.  Since early 2006, Michael has held numerous management positions in the domestic PCB fabricator landscape. He joined GSF in 2021 after a five-year stint at Draper Laboratory as their PCB manufacturing SME where his primary focus was on bleeding edge PCB design and DFM supporting uHDI, organic substrates, SLPs and electronics packaging. 

Business Development Manager

Mario Ibrahim is a Strategic Business Development Manager at AT&S. He is engaged in AT&S’s advanced IC substrate and packaging development activities. He follows the semiconductor market trends, develops new businesses and helps in building the company’s future strategies.

Prior to AT&S, Mario was engaged in Advanced Packaging activities at Yole Développement (Yole) where he developed technology and market reports in addition to custom consultancy studies covering advanced packaging topics. Mario was engaged for 5 years in test activities development for LEDs at Aledia and oversaw several advanced packaging R&D programs. He spent three years at STMicroelectronics (Grenoble), where he contributed to test benches park automation within the Test & Validation team.

Vice President of Innovation 

Thomas McCarthy started his career in the chip packaging/circuit board industry at AlliedSignal in 1993. Tom later spent 20 years at Taconic having various positions including Director of Engineering and VP of Business Development.  AGC purchased Taconic’s Advanced Dielectric Division in 2019 after which Tom continued to manage the North American RF business for AGC. Tom has spent his entire career developing composite materials and continues to manage research into new thermoset composite material for low loss, low DK applications.   

Chief Administrative Officer

Growing up in a family-owned metal finishing chemical company that was a dominant force in Japan and Asia, Naoki traveled the globe meeting, working, and often collaborating with many of the strongest and most technologically advanced companies, with the goal of acquiring and developing next generation technology for global markets.

His resume includes positions in Sales & Marketing, Technical support and business management in Asia, Europe, the United State and South America. Naoki is currently on the board of directors of Okuno Chemical Industries and is responsible for creating and exploring future businesses in growing markets such as semiconductors and new technologies to achieve SDGs.

Vice President Technology and Development

Dr. Tom Rucker is vice president in Technology Development and director of Assembly and Test Technology Development Integration at Intel Corporation. He is responsible for the yield, development and initial production of Intel’s assembly and test process technologies.

His career at Intel has included responsibility for the development and initial production of Intel’s first-generation wafer bumping technology and first-generation flip-chip technology.

Tom has also managed Intel’s factory automation organization, where he oversaw the development of software, hardware and material-handling solutions for factories. He also previously served as director of the Digital Home Group, with responsibility for platform hardware and software solutions for networked media products and digital TVs based on Intel silicon.

Senior Director, Advanced Packaging Platforms

Dr. Charles G. Woychik is the Senior Director of Advanced Packaging Platforms at SkyWater Technology in Kissimmee, FL. 

Previously he was the Chief Scientist at i3 Microsystems in St. Petersburg, FL.  He was the Senior Director of 3D Technology at Invensas Corporation and was a Senior Scientist at GE’s Global Research Center.  He began his career at IBM Endicott, NY where he held both engineering and managerial positions. His area of expertise is materials and processes for electronics packaging.  He has 123 issued US issued patents to his credit. 

AT&S

Walter Moser has more than 30 years of experience in the innovative electronic business environment. He built up his knowledge of international management by founding legal entities and organizational units in Europe, Asia and the USA. In an expat assignment in Shanghai and Hong Kong, he not only built up the sales organization for AT&S in Asia, but also the organizational basis of AT&S Asia Pacific in Hong Kong.

Originally trained as a mechanical engineer, he holds a degree in international business. His responsibilities within AT&S AG over the past three decades include general management positions at AT&S Asia Pacific, AT&S Americas LLC and AT&S Germany. In the last ten years he was CSO of the Business Unit AIM (Automotive, Industrial, Medical) with plants in Austria, India and Korea.

In 2021, he took over the position of Director Public Affairs Global for AT&S AG.

VP Business Development 

Matt Bergeron is VP of Business Development at Integra Technologies. He was previously CEO of CORWIL Technology, the largest North American outsourced semiconductor assembly and test (OSAT), until its acquisition by Integra. Matt’s 30+ year career includes President of WELLS-CTI, Inc, a semiconductor test and thermal management company; CEO of e2E Corporation, a global printed circuit board design and simulation company; and President of Praegitzer Industries, Inc, one of the Top 10 Circuit Board manufacturers with sales of over $220 million.

Vice President, Engineering and Technology Development

Jim is currently Vice President of Engineering and Technology Development for Sanmina’s PCB Division, responsible for product introduction, process implementation and manufacturing optimization. He previously worked for Endicott Interconnect where he held several positions including Vice President and General Manager of Fabrication, and Vice President of Engineering & Technology. He was Senior Engineering Manager for IBM, with Manufacturing Engineering responsibility for all products manufactured in Endicott. Jim holds or co-holds 16 US patents and has published several papers. 

Vice President Technology

Thomas Gottwald started his career at Schweizer Electronic AG in 1991. He began as a project manager in process technology, was Head of Product management, was appointed Director of the Innovation Center in 2011 and as a member of the Schweizer Leadership Team. In his current role as Vice President Technology, he is responsible for the departments Front End, Product Management, Embedded Power Solutions and Innovations. His focus is on embedding technologies, power electronics, electronic materials, and thermal management.

Fellow, Advanced Packaging Substrate Technology Development

Dr. Deepak Kulkarni is a Fellow at AMD. Deepak currently manages the advanced packaging, technology integration team. Over the last 17 years, he has held several leadership positions driving technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds eight patents and 19 publications on various aspects of packaging.

Senior Manager, Heterogeneous Integration Research

Dr. Dale McHerron is currently Senior Manager at IBM Research based in Albany, NY with responsibility for IBM’s Heterogeneous Integration Research Program and project leader in the IBM AI Hardware Research Center. 

Over his 30-year career at IBM, Dale has held various technical, managerial, and business development positions in both advanced packaging and CMOS logic R&D. 

In 2007, he transitioned to the IBM Albany Research lab where he has initiated and led research projects in logic scaling, heterogeneous integration, and has played a key role developing the IBM collaborative research ecosystem in Albany.

Managing Director, SABRE 3D

John Ostrowski has 32 years experience in the semiconductor industry and 26 years in electroplating. John is Product Line Head for SABRE 3D at Lam Research, where he sets the strategic path for continued market share increase and improved financial performance. Prior to becoming the product line head for SABRE 3D, John worked for over 20 years in different positions within the Electrofill Business Unit. Since 1996, John has been part of the SABRE development team, first as Electrical and Systems Engineer, and later as Program Manager tasked with ensuring successful penetration into a large device manufacturer. From this experience it was a natural transition into the management of the Global Product Support team for the Electrofill BU and then taking over the Director of Engineering position for SABRE 3D. John holds 8 US Patents.

Principal Director for Microelectronics
Director, Defense Microelectronics Cross-Functional Team

Dr. Devanand Shenoy joined the Office of the Under Secretary of Defense for Research and Engineering as the Principal Director for Microelectronics in July 2021. In this role, Dr. Shenoy is responsible for leading the Department of Defense’s research and engineering efforts in Microelectronics.

Dr. Shenoy previously served as the Director of Microelectronics Innovation and as Director of Advanced Technologies at the University of Southern California’s Information Sciences Institute. His career also includes serving as Chief Engineer in the Advanced Manufacturing Office at the U.S. Department of Energy; serving as Senior Advisor at the Manufacturing and Industrial Base Policy (MIBP) Office within the Office of the Secretary of Defense (OSD) as a detailee from the Army Night Vision and Sensors Directorate (NVESD) at Fort Belvoir where he helped develop a public-private partnership in Photonics that led to the creation of the AIM Photonics Institute. His career includes other roles in defense and commercial applications.

President and CEO

Dr. Todd Younkin is the President & CEO of SRC, where he leads a ~$90M/yr. global research agenda supported by ~3k academic and industrial researchers, 27 international companies, and 3 U.S. government agencies (DARPA, NSF, and NIST). Prior to becoming SRC’s CEO, Dr. Younkin worked at Intel from 2001-2020, with research and development experience that spanned Intel’s 0.18um to 5nm nodes and a variety of Intel business units.

With his leadership, SRC released its 2030 Decadal Plan for Semiconductors, and has called for greatly increased federal investments throughout the decade to establish a smarter pipeline for semiconductor R&D. This drove and resulted in the passage of the CHIPS and SCIENCE ACT of 2022 by Congress and President Biden on August 9th, 2022.

Todd is excited by the worldwide call for a renewed investment in semiconductor materials, hardware, and design, as well as the emphasis on education, workforce development, and environmental sustainability. Only by investing in a bright, collective future, will we rise to the meet the opportunities presented by the next industrial revolution.