IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem

Date
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Inviting you to the IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem to be held at the Kimpton Hotel Monaco in Washington D.C., October 11-12, 2022.

AGENDAREGISTRATION OPTIONS | SPONSORSHIPS | HOTEL

The electronics industry is in the early stages of a new era, with unprecedented change already in motion. In this era of ‘Heterogeneous Integration’ led by massive changes in semiconductor and advanced packaging sectors, the days of following Moore’s Law are over! Chiplet-based design architectures incorporating heterogeneous integration packaging methods will enable next-generation electronic systems and applications. These fundamental changes in the semiconductor sector have significant impact throughout the rest of the electronics supply chain. As lines blur between IC-Substrate and HDI printed circuit board technologies and capabilities, the lines between OSAT and EMS manufactures also blur. Please join us for this important symposium focused on IC-Substrates and OSAT manufacturing.

This symposium has been designed for executives, government, and industry leaders to meet in-person and share insights. The discussion will move past the hype to identify key business and technology issues with near- and longer-term solutions. Focused on opportunities and challenges for next-generation advanced packaging production, the top-down agenda will cover public policy updates, commercial and defense electronics technology drivers, current business environment for IC-Substrates and component assembly & test manufacturing.

This 2-day event is dedicated to in-depth discussions on strengthening the IC-Substrate and Package Assembly Ecosystem in North America and Europe. The intent of the symposium is to bring Commercial and Defense Electronic Industry leaders together to:

  • focus on highest priority needs for IC-Substrates and Advanced Packaging spanning the next 3-10 years,
  • identify key challenges to overcome that enable sustainable businesses over the long run,
  • move beyond general issue awareness and focus on ‘punching through’ into actionable research, development, design, materials, manufacturing, and business operations execution needs/projects, and
  • enable attendees to walk away with actionable next steps and an expanded network for continued development efforts. 

Speakers will span the advanced packaging ecosystem and semiconductor supply chain: component makers, HDI PCB fabricators, market leading IC-Substrate fabricators, assembly & test manufacturers, equipment, and material suppliers. Three featured keynote presentations will include senior leaders at Intel, US Department of Defense, and TechSearch International. With 28 speakers and 8 sessions, the agenda will also include the latest insights from speakers representing the US Department of Commerce, the European Commission, Intel, National Institute of Standards and Technology (NIST), Northrop Grumman, Raytheon, Schweizer Electronic, SEMCO, SkyWater, TTM, Western Digital, and others. 

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Remote video URL

“Everything follows silicon.” Matt Kelly, IPC chief technologist, participates in the Reliability Matters podcast with host Mike Konrad, covering issues from restoring North American competitiveness and what factors led to its lag in tech, to the opportunities expected from the passage of the CHIPS+ Act, and detailed information on IPC’s upcoming advanced packaging symposium.

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Download Report

IPC has undertaken a thorough, data-driven analysis of the global semiconductor and advanced packaging ecosystem and makes recommendations to address capability and capacity gaps within North America. This study is intended to help inform government policy and investment strategy to strengthen the North American advanced packaging ecosystem.

AGENDA

The agenda includes confirmed speakers from: 

  • AGC Taconic
  • AMKOR                                                   
  • AT&S
  • Averatek
  • Calumet
  • Department of Commerce
  • Department of Defense
  • Green Source
  • IBM Research
  • Integra Technologies
  • Intel
  • NIST
  • Northrop Grumman
  • OKUNO
  • Sanmina 
  • Schweizer Electronic
  • SEMCO
  • SkyWater
  • TechSearch Intl.
  • TTM
  • Western Digital

7:00 am – 8:00 am | Networking Breakfast

8:00 am – 8:15 am | Welcome and Introductions
Welcome remarks by: Matt Kelly, P.Eng, MBA, Chief Technologist | IPC

8:15 am – 9:00 am | Setting the Stage
Speaker: Jan Vardaman, Founder and President  | TechSearch International Inc.

9:00 am – 9:45 am | Commercial Perspectives Keynote
Presentation Title: Need for Increased Focus on IC-Substrate, Package Assembly & Test 
Speaker: Tom Rucker, PhD., Vice President Technology and Development | Intel 

9:45 am – 10:15 am | Break

10:15 am – 11:00 am | Defense Perspectives Keynote
More information coming soon.

11:00 am – 12:30 pm | IC-Substrates – Policy, Legislation Updates
Speaker: Frank Gayle, ScD, Deputy Director | NIST Office of Advanced Manufacturing & Advanced Manufacturing National Program Office 

12:30 pm – 1:30pm | Lunch

1:30 pm – 3:00 pm | Commercial Perspectives, Needs, and Challenges
Speaker: Thomas Boone, Ph.D., Senior Technologist, Defense and Aerospace Research | Western Digital 

Speaker: Dale McHerron, Ph.D., Heterogeneous Integration and Process Strategy | IBM Research 

Speaker: Deepak Kulkarni, Ph.D., Fellow, Advanced Packaging Substrate Technology Development  | AMD 

3:00 pm – 3:30 pm | Break

3:30 pm – 5:00 pm | North American Defense Needs and Perspectives
Speaker: Darren Crumm, Ph.D., Advance Packaging/Heterogeneous Integrated Packaging Lead | Office of the Under Secretary of Defense for Research and Engineering | DoD SHIP Program 

Speaker: Helen Phillips, Director, Advanced Operations Northrop Grumman Mission Systems  | Northrup Grumman 

5:30 pm – 7:00 pm | Networking Reception

7:00 am – 7:45 am | Networking Breakfast

7:45 am – 8:00 am | Welcome Day 2
Welcome remarks by: Matt Kelly, P.Eng, MBA, Chief Technologist | IPC

8:00 am – 9:30 am | Importance of IC-Substrates – Advanced Package Assembly Perspectives
Speaker: Charles Woychick, Ph.D.,  Senior Director, Advanced Packaging Platforms | SkyWater Technology 

Speaker: Kevin Engel, Corporate Vice President, Flipchip / Wafer Level Business Unit | AMKOR 

Speaker from: Integra Technologies 

9:30 am – 10:00 am | Break

10:00 am – 12:00 pm | North American Perspectives on IC-Substrate Market 
Speaker: Haris Basit, Chief Executive Officer | Averatek 

Speaker: Meredith LaBeau, Ph.D., Chief Technology Officer | Calumet  

Speaker: Jim Brown | Green Source 

Speaker: Jim Fuller, Vice President, Engineering and Technology Development | Sanmina 

12:00 pm – 1:00 pm | Lunch

1:00 pm – 2:30 pm | Global Perspectives on IC-Substrate Market
Speaker: Mr. Bae | SEMCO 

Speaker from: AT&S 

Speaker: Thomas Gottwald, Ph.D., Vice President Technology | Schweizer Electronic 

2:30 pm – 3:00 pm | Break

3:00 pm – 4:30 pm | IC-Substrate Material Advancements
Speaker: Naoki Okuno, Chief Administrative Officer | OKUNO

Speakers from: Rogers  

4:30 pm – 5:30 pm | Final Session – So What’s Next?
More information coming soon.

REGISTRATION

Your registration includes a two day conference with 28 speakers and eight sessions, three keynotes, breakfast receptions, lunches and an evening networking reception!

Price per person: $895

Academic Faculty are eligible to receive 50% off the above price. Please contact Kim DiCianni at  KimDiCianni@ipc.org to receive your discounted rate. 

Register

SPONSORSHIP OPPORTUNITIES

Premier Sponsor

Cost: $15,000 

Benefits include:

  • Opportunity to present a 2-minute video to attendees during attendee welcome address
  • Opportunity to distribute company brochures to be placed on seats or tables during the welcome address
  • Social media spotlight on all IPC social media platforms which include posts on: 
    • Facebook
    • LinkedIn
    • Twitter
  • Company name and logo predominantly displayed on:
    • Event website
    • Pre-event promotions/emails
    • Signage at the event
  • Three complimentary registrations to attend the event
Supporting Sponsor Plus

Cost: $10,000

Benefits include:

  • Social media spotlight on all IPC social media platforms which include posts on
    • Facebook
    • LinkedIn
    • Twitter
  • Company name and logo predominantly displayed on:
    • Event website
    • Pre-event promotions/emails
    • Signage at the event
  • Two complimentary registrations to attend the event
Supporting Sponsor

Cost: $5,000

Benefits include:

  • Company name and logo predominantly displayed on:
    • Event website
    • Pre-event promotions/emails
    • Signage at the event
  • One complimentary registration to attend the event

Please reach out to our sponsorship sales representative, Mike Stone at MikeStone@ipc.org or call +1 847 597 2866 to reserve your sponsorship. Sponsorship opportunities will be available on a first come-first serve basis, so please reserve your opportunity today. 

HOTEL INFORMATION

IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem will be held at the Kimpton Hotel Monaco in Washington, D.C.

Please call the hotel directly for rates and availability. 
Reservations number: (800) 649-1202
Address: 700 F Street NW
Washington, D.C. 20004

Kimpton Hotel
Kimpton Hotel

ABOUT THE EVENT ORGANIZER 

About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its nearly 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training and education, industry intelligence and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry.

Cancellation Policy:
If you are unable to attend the conference, you may send a coworker in your place. Please notify us of name changes as soon as possible. Registrants who cancel by September 30, 2022, will be refunded in full, but those who cancel after that deadline will be responsible for the full registration fee. Sponsors who cancel by September 30, 2022 will incur a $100 cancellation fee and no refund will be issued for sponsors that cancel after the deadline. If you need to change your registration or cancel, please email Kim DiCianni at KimDiCianni@ipc.org