IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem

Date
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Inviting you to the IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem to be held at the Kimpton Hotel Monaco in Washington D.C., October 11-12, 2022.

AGENDAREGISTRATION OPTIONS | SPONSORSHIPS | HOTEL

The electronics industry is in the early stages of a new era, with unprecedented change already in motion. In this era of ‘Heterogeneous Integration’ led by massive changes in semiconductor and advanced packaging sectors, the days of following Moore’s Law are over! Chiplet-based design architectures incorporating heterogeneous integration packaging methods will enable next-generation electronic systems and applications. These fundamental changes in the semiconductor sector have significant impact throughout the rest of the electronics supply chain. As lines blur between IC-Substrate and HDI printed circuit board technologies and capabilities, the lines between OSAT and EMS manufactures also blur. Please join us for this important symposium focused on IC-Substrates and OSAT manufacturing.

This symposium has been designed for executives, government, and industry leaders to meet in-person and share insights. The discussion will move past the hype to identify key business and technology issues with near- and longer-term solutions. Focused on opportunities and challenges for next-generation advanced packaging production, the top-down agenda will cover public policy updates, commercial and defense electronics technology drivers, current business environment for IC-Substrates and component assembly & test manufacturing.

This 2-day event is dedicated to in-depth discussions on strengthening the IC-Substrate and Package Assembly Ecosystem in North America and Europe. The intent of the symposium is to bring Commercial and Defense Electronic Industry leaders together to:

  • focus on highest priority needs for IC-Substrates and Advanced Packaging spanning the next 3-10 years,
  • identify key challenges to overcome that enable sustainable businesses over the long run,
  • move beyond general issue awareness and focus on ‘punching through’ into actionable research, development, design, materials, manufacturing, and business operations execution needs/projects, and
  • enable attendees to walk away with actionable next steps and an expanded network for continued development efforts. 

Speakers will span the advanced packaging ecosystem and semiconductor supply chain: component makers, HDI PCB fabricators, market leading IC-Substrate fabricators, assembly & test manufacturers, equipment, and material suppliers. Four featured keynote presentations will include senior leaders at Intel, US Department of Defense, SRC Semiconductor Research Corporation, and TechSearch International. With 28 speakers and 8 sessions, the agenda will also include the latest insights from speakers representing the US Department of Commerce, the European Commission, Intel, National Institute of Standards and Technology (NIST), Northrop Grumman, Raytheon, Schweizer Electronic, SEMCO, SkyWater, TTM, Western Digital, and others. 

EVENT SPONSORS

Advanced Packaging Sponsors
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“Everything follows silicon.” Matt Kelly, IPC chief technologist, participates in the Reliability Matters podcast with host Mike Konrad, covering issues from restoring North American competitiveness and what factors led to its lag in tech, to the opportunities expected from the passage of the CHIPS+ Act, and detailed information on IPC’s upcoming advanced packaging symposium.

Nolan Johnson from I-Connect speaks with IPC’s Chris Mitchell, vice president of global government relations, and Matt Kelly, chief technologist, about the inaugural IPC Advanced Packaging Symposium. In this conversation, Mitchell and Kelly detail the symposium's objectives, presenters, and the the attendance value to both fabricators and assemblers in attending. 

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IPC has undertaken a thorough, data-driven analysis of the global semiconductor and advanced packaging ecosystem and makes recommendations to address capability and capacity gaps within North America. This study is intended to help inform government policy and investment strategy to strengthen the North American advanced packaging ecosystem.

AGENDA

The agenda includes confirmed speakers from: 

  • AGC Taconic
  • AMD
  • Amkor Technology, Inc.
  • AT&S
  • Averatek Corporation
  • Calumet
  • U.S. Department of Commerce
  • U.S. Department of Defense
  • GreenSource Fabrication
  • IBM Research
  • Integra Technologies
  • Intel Corporation
  • Lam Research
  • NIST
  • Northrop Grumman
  • OKUNO
  • Samsung Electro-Mechanics Pte.,Ltd. (SEMCO)
  • Sanmina
  • Semiconductor Research Corporation (SRC)
  • Schweizer Electronic
  • SkyWater
  • TechSearch Intl.
  • TTM Technologies
  • Western Digital

7:00 am – 8:00 am | Networking Breakfast

8:00 am – 8:15 am | Welcome Remarks and Introductions
Matt Kelly, P.Eng., M.B.A.
Chief Technologist
IPC

Opening Remarks
John W. Mitchell
President and CEO
IPC

8:15 am – 9:00 am | Setting the Stage: Building the North American Advanced Packaging Ecosystem:  Economic Challenges and Opportunities
Jan Vardaman
Founder and President
TechSearch International Inc.

9:00 am – 9:45 am | Supporting Moore’s Law with Advanced Packaging
Tom Rucker, Ph.D.
Vice President Technology and Development
Intel Corporation

9:45 am – 10:10 am | Break

10:00 am – 10:45 am | Defense Perspectives Keynote: DoD Microelectronics Strategy
Devanand Shenoy, PhD
Principal Director for Microelectronics
Director, Defense Microelectronics Cross-Functional Team
Office of the Under Secretary of Defense for Research and Engineering
Office of the Deputy Chief Technology Officer for Critical Technology

10:45 am – 11:30 am | U.S. CHIPS Act Implementation   
Moderator, Chris Mitchell 
Vice President Government Relations, IPC

NIST, Semiconductors, and the CHIPS & Science Act
Frank Gayle, ScD 
Deputy Director
NIST Office of Advanced Manufacturing & Advanced Manufacturing National Program Office

11:30 am – 12:00 pm | Advancing a European Chips Act
Moderator, Chris Mitchell
Vice President Government Relations, IPC

Dr. Francisco J. Ibanez
Deputy Head of Unit
European Commission

12:00 pm – 1:00pm | Lunch

1:00 pm – 2:30 pm | Component OEM  - Commercial Perspectives, Needs, and Challenges
Thomas Boone, Ph.D.
Senior Technologist, Defense and Aerospace Research
Western Digital 

First level Packaging and Supply Chain Considerations for HPC: A System Perspective
Dale McHerron, Ph.D.
Senior Manager, Heterogeneous Integration Research
IBM Research, AI Hardware Center

Advanced Packaging – Future of Technology & Supply Chain
Deepak Kulkarni, Ph.D.
Fellow, Advanced Packaging Substrate Technology Development
AMD

2:30 pm – 2:45 pm | Break

2:45 pm – 4:15 pm | North American Defense Needs and Perspectives
Addressing DoD Advanced Packaging Needs
Darren Crum, PhD
Advanced Packaging Lead & SHIP Digital Technical Manager
Office of the Under Secretary of Defense for Research and Engineering

Establishing Domestic Advanced Packaging Capability for DoD Applications
Helen Phillips
Director, Advanced Operations Northrop Grumman Mission Systems
Northrop Grumman 

Kim Eilert
BAE Systems

4:15 pm – 4:30 pm | Day 1 Wrap-up 

5:00 pm – 6:30 pm | Networking Reception

7:00 am – 7:45 am | Networking Breakfast

7:45 am – 8:00 am | Welcome Remarks
Matt Kelly, P.Eng., M.B.A.
Chief Technologist
IPC

8:00 am – 8:45 am | SRC Keynote – Packaging is the New King
Todd Younkin, Ph.D.
President and CEO
Semiconductor Research Corporation (SRC)

8:45 am – 10:15 am | Importance of IC-Substrates – Advanced Package Assembly Perspectives

Future Trends for Chiplet Heterogeneous Integrated Packaging (CHIP)
Charles Woychik, Ph.D.
Senior Director, Advanced Packaging Platforms
SkyWater Technology 

From Global to Local: The Journey to Supply Chain Localization
Kevin Engel
Corporate Vice President, Flipchip / Wafer Level Business Unit
Amkor Technology, Inc. 

Trends in SIP and Highspeed Substrates
Matt Bergeron 
VP Business Development 
Integra Technologies 

10:15 am – 10:30 am | Break

10:30 am – 12:00 pm | Panel Discussion – North American Perspectives on the IC-Substrate Market 
Moderator: Matt Kelly, P.Eng, MBA 
Chief Technologist
IPC 

General Principles for a North American Package Substrate Industry
Haris Basit
Chief Executive Officer
Averatek Corporation

Adopting New Process Technology to an Old Problem
Meredith LaBeau, Ph.D.
Chief Technology Officer
Calumet  

The Necessity of Process Synergies
Michael Gleason
Director of Product Development
GreenSource Fabrication LLC

The Foundational Requirements for High Impact Substrate Manufacturing
Jim Fuller
Vice President, Engineering and Technology Development
Sanmina 

Barriers and Opportunities in Advanced Packaging Ecosystem
Matt Neely 
Director of Process Engineering, North America 
TTM Technologies

12:00 pm – 1:00 pm | Lunch

1:00 pm – 2:30 pm | Global Perspectives on IC-Substrate Market

Yesterday, Today, and Tomorrow on Package Substrate Industry
Richard (KwangWook) Bae 
Executive Vice President of NPI, CTO 
Samsung Electro-Mechanics Pte.,Ltd. (SEMCO)

Mario Ibrahim
Business Development Manager
and
Walter Moser
Director Public Affairs Global
AT&S

IC Substrates for Power Packaging - Technologies and Supply Chain Aspects
Thomas Gottwald
Vice President Technology
Schweizer Electronic 

2:30 pm – 2:45 pm | Break

2:45 pm – 4:15 pm | IC-Substrate Material and Equipment Advancements

Idealism vs Realism – Bulletproof Stacked Microvias Built with Common Sense, Good Engineering, the Proper Material
Tom McCarthy
Vice President of Innovation 
AGC Taconic 

Electroless Copper Plating Process "OPC FLET process" with Excellent Via Connection Reliability
Naoki Okuno
Chief Administrative Officer
OKUNO

Equipment Challenges for Panel Level Packaging 
John Ostrowski
Managing Director, SABRE 3D
Lam Research

4:15 pm – 5:15 pm | Final Session – So What’s Next?
More information coming soon

5:15 pm | Symposium Concludes 

MEET THE SPEAKERS

Richard (KwangWook) Bae

Richard (KwangWook) Bae
Samsung Electro-Mechanics Pte.,Ltd. (SEMCO) 

Bio

Executive Vice President of NPI, CTO 

Mr. Richard (KwangWook) Bae is a Chief Technology Officer and a leader on the NPI (New Product Introduction) and the technical Sales at Strategic Marketing Center, Samsung Electro Mechanics. 

He had been a Chief Strategy Officer for 7 years and a Head of Samsung Electro Mechanics US Lab for 5 years. 

He led Samsung’s Fan Out PLP (Panel Level Package) business 5 years ago and now he is leading 2.nD package business of Samsung Electro Mechanics. 

Darren Crum

Darren Crum, Ph.D.
Office of the Under Secretary of Defense for Research and Engineering

Bio

Advanced Packaging Lead & SHIP Digital Technical Manager

Dr. Darren Crum is a technical leader with more than 20 years of experience in advancing microelectronics engineering in the defense industry. He is a Technical Area Lead and Program Technical Manager for microelectronics advanced packaging at the Naval Surface Warfare Center, Crane Division directly supporting the Office of Under Secretary of Defense for Research & Engineering’s Trusted & Assured Microelectronics Program and the SOTA Heterogeneous Integrated Packaging (SHIP) Program. He also serves as a government representative in various microelectronics industry working groups.

Frank Gayle

Frank Gayle, ScD 
NIST Office of Advanced Manufacturing 

Bio

Deputy Director

Dr. Frank W. Gayle is Deputy Director of the Office of Advanced Manufacturing at the National Institute of Standards and Technology, and also Deputy Director of the Advanced Manufacturing National Program Office.

Dr. Gayle started his career with 11 years in industry, developing aerospace alloys and their manufacturing scale-up processes. He then joined the NIST Metallurgy Division where he spent much of his career, ultimately as Division Chief. As Chief, Frank developed major programs in energy, microelectronics, and mechanical properties.

From 2002 through 2007, Frank headed the team of experts investigating the structural steel involved in the collapse of the World Trade Center towers on September 11, 2001. The NIST investigation led to major changes in building codes across the globe, dramatically enhancing building safety.

 

 

 

 

 

Dr. Francisco Ibanez
European Commission

Bio

Deputy Head

More information coming soon.

Meredith

Meredith LaBeau, Ph.D.
Calumet  

Bio

Chief Technology Officer

Dr. Meredith Ballard LaBeau is the Chief Technology Officer and on the strategic leadership team at Calumet Electronics, a leader in manufacturing high-performance Printed Circuit Boards and IC Substrates for defense, aerospace, medical, power-grid, commercial, industrial controls, and space applications.

Meredith is the technical lead and manager of Calumet’s Process Engineering and R&D teams. She also is a member of two international standards committees: IPC and the National Aerospace and Defense Contractors Accreditation Program (NADCAP), an IPC Thought-Leader and plays a critical role in developing standards and PCB manufacturing quality and criteria for the electronics industry.

Matt Neely

Matt Neely 
TTM Technologies

Bio

Director of Process Engineering, North America 

Matt Neely joined TTM Technologies as director of Engineering in 2019 when TTM acquired the assets and technology of i3 Electronics. He spent the bulk of his career working in Printed Circuit Board fabrication at i3 Electronics and Endicott Interconnect Technologies both of which were formerly part of IBM Corp. His roles have been in engineering management, customer program management and process engineering with responsibilities focused on technology growth and new product introduction.

Helen Phillips

Helen Phillips
Northrop Grumman

Bio

Director, Advanced Operations Northrop Grumman Mission Systems

Helen Phillips is the Director of Advanced Operations for Northrop Grumman Mission Systems leading the development of discriminating manufacturing capabilities addressing next generation sensor technology needs. Helen is responsible for a highly motivated team of operations systems engineers who use systems thinking early in the design process to identify opportunities to develop maturation plans ensuring our factory and suppliers are ready for future demands. Helen also manages the planning and execution of Operations NCTA in support of discriminating technologies such as additive manufacturing, advanced packaging, automation and digital thread to improve operational efficiency. 

Jan Vardaman

Jan Vardaman
TechSearch International Inc.

Bio

Founder and President

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987.  She is the author of numerous publications on emerging trends in semiconductor packaging and assembly. 

She served on the NSF-sponsored World Technology Evaluation Center (WTEC) study team involved in investigating electronics manufacturing in Asia and on the U.S. mission to study manufacturing in China.  Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

Haris Basit

Haris Basit
Averatek Corporation

Bio

Chief Executive Officer

Haris Basit is the Chief Executive Officer of Averatek since 2017. Prior to joining Averatek, Haris was CEO at VIASPACE, an alternative energy company. He has also been founder or co-founder of several successful technology-based companies.

From 2004 to 2012 he was co-founder and CEO at Multigig, a fabless semiconductor company that was sold to Analog Devices. He has also held senior level positions at Lucent Technologies (Bell Labs division); Rockwell International; and at IBM Research Labs.

Kevin Engel

Kevin Engel
Amkor Technology, Inc

Bio

Corporate Vice President, Flipchip / Wafer Level Business Unit

Kevin Engel currently serves as Corporate VP, Flip Chip/Wafer Services Business Unit and President of General & Supervisory Board of Amkor Technology Portugal. Kevin joined Amkor in 2004 as part of the acquisition of Unitive Electronics. 

Amkor is a leading provider of outsourced semiconductor packaging and test services.  In his role, Kevin is responsible for multiple advanced packages including advanced flip chip, bumping, fan-out, high-density heterogenous integration solutions and test. These packages support a broad IDM, Fabless and Foundry customer base in the Automotive, Communications, Computing and Consumer markets. Manufacturing of these products occurs in South Korea, Japan, China, Taiwan and Portugal.

He has held various management positions in the semiconductor manufacturing and packaging industry for more than 25 years.

Michael Gleason

Michael Gleason
GreenSource Fabrication LLC

Bio

Director of Product Development

Michael Gleason is the Director of Product Development for GreenSource Fabrication in Charlestown, New Hampshire.  Since early 2006, Michael has held numerous management positions in the domestic PCB fabricator landscape. He joined GSF in 2021 after a five-year stint at Draper Laboratory as their PCB manufacturing SME where his primary focus was on bleeding edge PCB design and DFM supporting uHDI, organic substrates, SLPs and electronics packaging. 

Mario

Mario Ibrahim
AT&S

Bio

Business Development Manager

Mario Ibrahim is a Strategic Business Development Manager at AT&S. He is engaged in AT&S’s advanced IC substrate and packaging development activities. He follows the semiconductor market trends, develops new businesses and helps in building the company’s future strategies.

Prior to AT&S, Mario was engaged in Advanced Packaging activities at Yole Développement (Yole) where he developed technology and market reports in addition to custom consultancy studies covering advanced packaging topics. Mario was engaged for 5 years in test activities development for LEDs at Aledia and oversaw several advanced packaging R&D programs. He spent three years at STMicroelectronics (Grenoble), where he contributed to test benches park automation within the Test & Validation team.

Tom McCarthy

Tom McCarthy
AGC Taconic 

Bio

Vice President of Innovation 

Thomas McCarthy started his career in the chip packaging/circuit board industry at AlliedSignal in 1993. Tom later spent 20 years at Taconic having various positions including Director of Engineering and VP of Business Development.  AGC purchased Taconic’s Advanced Dielectric Division in 2019 after which Tom continued to manage the North American RF business for AGC. Tom has spent his entire career developing composite materials and continues to manage research into new thermoset composite material for low loss, low DK applications.   

Naoki Okuno

Naoki Okuno
OKUNO

Bio

Chief Administrative Officer

 

Growing up in a family-owned metal finishing chemical company that was a dominant force in Japan and Asia, Naoki traveled the globe meeting, working, and often collaborating with many of the strongest and most technologically advanced companies, with the goal of acquiring and developing next generation technology for global markets.

His resume includes positions in Sales & Marketing, Technical support and business management in Asia, Europe, the United State and South America. Naoki is currently on the board of directors of Okuno Chemical Industries and is responsible for creating and exploring future businesses in growing markets such as semiconductors and new technologies to achieve SDGs.

Tom Rucker

Tom Rucker, Ph.D.
Intel Corporation

Bio

Vice President Technology and Development

Dr. Tom Rucker is vice president in Technology Development and director of Assembly and Test Technology Development Integration at Intel Corporation. He is responsible for the yield, development and initial production of Intel’s assembly and test process technologies.

His career at Intel has included responsibility for the development and initial production of Intel’s first-generation wafer bumping technology and first-generation flip-chip technology.

 

Tom has also managed Intel’s factory automation organization, where he oversaw the development of software, hardware and material-handling solutions for factories. He also previously served as director of the Digital Home Group, with responsibility for platform hardware and software solutions for networked media products and digital TVs based on Intel silicon.

Charles Woychik

Charles Woychik, Ph.D.
SkyWater Technology 

Bio

Senior Director, Advanced Packaging Platforms

Dr. Charles G. Woychik is the Senior Director of Advanced Packaging Platforms at SkyWater Technology in Kissimmee, FL. 

Previously he was the Chief Scientist at i3 Microsystems in St. Petersburg, FL.  He was the Senior Director of 3D Technology at Invensas Corporation and was a Senior Scientist at GE’s Global Research Center.  He began his career at IBM Endicott, NY where he held both engineering and managerial positions. His area of expertise is materials and processes for electronics packaging.  He has 123 issued US issued patents to his credit. 

Matt Bergeron

Matt Bergeron 
Integra Technologies 

Bio

VP Business Development 

Matt Bergeron is VP of Business Development at Integra Technologies. He was previously CEO of CORWIL Technology, the largest North American outsourced semiconductor assembly and test (OSAT), until its acquisition by Integra. Matt’s 30+ year career includes President of WELLS-CTI, Inc, a semiconductor test and thermal management company; CEO of e2E Corporation, a global printed circuit board design and simulation company; and President of Praegitzer Industries, Inc, one of the Top 10 Circuit Board manufacturers with sales of over $220 million.

Jim Fuller

James W. Fuller, Jr.
Sanmina

Bio

Vice President, Engineering and Technology Development

Jim is currently Vice President of Engineering and Technology Development for Sanmina’s PCB Division, responsible for product introduction, process implementation and manufacturing optimization. He previously worked for Endicott Interconnect where he held several positions including Vice President and General Manager of Fabrication, and Vice President of Engineering & Technology. He was Senior Engineering Manager for IBM, with Manufacturing Engineering responsibility for all products manufactured in Endicott. Jim holds or co-holds 16 US patents and has published several papers. 

Thomas Gottwald

Thomas Gottwald
Schweizer Electronic 

Bio

Vice President Technology

Thomas Gottwald started his career at Schweizer Electronic AG in 1991. He began as a project manager in process technology, was Head of Product management, was appointed Director of the Innovation Center in 2011 and as a member of the Schweizer Leadership Team. In his current role as Vice President Technology, he is responsible for the departments Front End, Product Management, Embedded Power Solutions and Innovations. His focus is on embedding technologies, power electronics, electronic materials, and thermal management.

Deepal Kulkarni

Deepak Kulkarni, Ph.D.
AMD

Bio

Fellow, Advanced Packaging Substrate Technology Development

Dr. Deepak Kulkarni is a Fellow at AMD. Deepak currently manages the advanced packaging, technology integration team. Over the last 17 years, he has held several leadership positions driving technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds eight patents and 19 publications on various aspects of packaging.

Dale McHerron

Dale McHerron, Ph.D.
IBM Research, AI Hardware Center

Bio

Senior Manager, Heterogeneous Integration Research

Dr. Dale McHerron is currently Senior Manager at IBM Research based in Albany, NY with responsibility for IBM’s Heterogeneous Integration Research Program and project leader in the IBM AI Hardware Research Center. 

Over his 30-year career at IBM, Dale has held various technical, managerial, and business development positions in both advanced packaging and CMOS logic R&D. 

In 2007, he transitioned to the IBM Albany Research lab where he has initiated and led research projects in logic scaling, heterogeneous integration, and has played a key role developing the IBM collaborative research ecosystem in Albany.

John Ostrowski

John Ostrowski
Lam Research

Bio

Managing Director, SABRE 3D

John Ostrowski has 32 years experience in the semiconductor industry and 26 years in electroplating. John is Product Line Head for SABRE 3D at Lam Research, where he sets the strategic path for continued market share increase and improved financial performance. Prior to becoming the product line head for SABRE 3D, John worked for over 20 years in different positions within the Electrofill Business Unit. Since 1996, John has been part of the SABRE development team, first as Electrical and Systems Engineer, and later as Program Manager tasked with ensuring successful penetration into a large device manufacturer. From this experience it was a natural transition into the management of the Global Product Support team for the Electrofill BU and then taking over the Director of Engineering position for SABRE 3D. John holds 8 US Patents.

Devanand Shenoy

Devanand Shenoy, Ph.D.
Office of the Under Secretary of Defense for Research and Engineering & Office of the Deputy Chief Technology Officer for Critical Technology

Bio

Principal Director for Microelectronics
Director, Defense Microelectronics Cross-Functional Team

Dr. Devanand Shenoy joined the Office of the Under Secretary of Defense for Research and Engineering as the Principal Director for Microelectronics in July 2021. In this role, Dr. Shenoy is responsible for leading the Department of Defense’s research and engineering efforts in Microelectronics.

Dr. Shenoy previously served as the Director of Microelectronics Innovation and as Director of Advanced Technologies at the University of Southern California’s Information Sciences Institute. His career also includes serving as Chief Engineer in the Advanced Manufacturing Office at the U.S. Department of Energy; serving as Senior Advisor at the Manufacturing and Industrial Base Policy (MIBP) Office within the Office of the Secretary of Defense (OSD) as a detailee from the Army Night Vision and Sensors Directorate (NVESD) at Fort Belvoir where he helped develop a public-private partnership in Photonics that led to the creation of the AIM Photonics Institute. His career includes other roles in defense and commercial applications.

Todd Younkin

Todd Younkin, Ph.D.
Semiconductor Research Corporation (SRC)

Bio

President and CEO

Dr. Todd Younkin is the President & CEO of SRC, where he leads a ~$90M/yr. global research agenda supported by ~3k academic and industrial researchers, 27 international companies, and 3 U.S. government agencies (DARPA, NSF, and NIST). Prior to becoming SRC’s CEO, Dr. Younkin worked at Intel from 2001-2020, with research and development experience that spanned Intel’s 0.18um to 5nm nodes and a variety of Intel business units.

With his leadership, SRC released its 2030 Decadal Plan for Semiconductors, and has called for greatly increased federal investments throughout the decade to establish a smarter pipeline for semiconductor R&D. This drove and resulted in the passage of the CHIPS and SCIENCE ACT of 2022 by Congress and President Biden on August 9th, 2022.

Todd is excited by the worldwide call for a renewed investment in semiconductor materials, hardware, and design, as well as the emphasis on education, workforce development, and environmental sustainability. Only by investing in a bright, collective future, will we rise to the meet the opportunities presented by the next industrial revolution.

REGISTRATION

Your registration includes a two-day conference with 28 speakers and eight sessions, three keynotes, breakfast receptions, lunches and an evening networking reception!

Price per person: $895

Academic Faculty are eligible to receive 50% off the above price. Please contact Kim DiCianni at  KimDiCianni@ipc.org to receive your discounted rate. 

Register

SPONSORSHIP OPPORTUNITIES

Premier Sponsor

Cost: $15,000 

Benefits include:

  • Opportunity to present a 2-minute video to attendees during attendee welcome address
  • Opportunity to distribute company brochures to be placed on seats or tables during the welcome address
  • Social media spotlight on all IPC social media platforms which include posts on: 
    • Facebook
    • LinkedIn
    • Twitter
  • Company name and logo predominantly displayed on:
    • Event website
    • Pre-event promotions/emails
    • Signage at the event
  • Three complimentary registrations to attend the event
Supporting Sponsor Plus

Cost: $10,000

Benefits include:

  • Social media spotlight on all IPC social media platforms which include posts on
    • Facebook
    • LinkedIn
    • Twitter
  • Company name and logo predominantly displayed on:
    • Event website
    • Pre-event promotions/emails
    • Signage at the event
  • Two complimentary registrations to attend the event
Supporting Sponsor

Cost: $5,000

Benefits include:

  • Company name and logo predominantly displayed on:
    • Event website
    • Pre-event promotions/emails
    • Signage at the event
  • One complimentary registration to attend the event

Please reach out to our sponsorship sales representative, Mike Stone at MikeStone@ipc.org or call +1 847 597 2866 to reserve your sponsorship. Sponsorship opportunities will be available on a first come-first serve basis, so please reserve your opportunity today. 

TRAVEL AND HOTEL INFORMATION

Travel Options

Nearest Airports

Nearest Amtrak/ MARC/ VRE Train Station

Hotel Accommodations Options

IPC offers this list of hotel accommodation options for your consideration. You are welcome to book your accommodations at any hotel that you prefer. Please call the hotel of your choice directly for rates and availability. 

Kimpton Hotel Monaco (Symposium Location)
700 F Street NW
Washington, D.C. 20004
Hotel Website
Reservations number: (800) 649-1202

Cambria Hotel Washington DC Capitol Riverfront
69 Q Street, SW
Washington, DC 20024
0.9 miles from the Kimpton Hotel Monaco (conference location)
Hotel Website

ABOUT THE EVENT ORGANIZER 

About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its nearly 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training and education, industry intelligence and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry.

Cancellation Policy:
If you are unable to attend the conference, you may send a coworker in your place. Please notify us of name changes as soon as possible. Registrants who cancel by September 30, 2022, will be refunded in full, but those who cancel after that deadline will be responsible for the full registration fee. Sponsors who cancel by September 30, 2022 will incur a $100 cancellation fee and no refund will be issued for sponsors that cancel after the deadline. If you need to change your registration or cancel, please email Kim DiCianni at KimDiCianni@ipc.org