STI Electronics, Inc. Requalifies for Four IPC Qualified Manufacturers Listings

IPC's Validation Services Program announces that STI Electronics, Inc., a multifaceted technical organization supporting the electronics manufacturing industry, has been requalified, at the Class 3 level, to IPC J-STD-001, IPC-A-610, and IPC J-STD-001 Space & Military Addendum Qualified Manufacturers Listings (QML). During the same requalification process, STI was also requalified as an IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements Qualified Manufacturers Listing (QML) Type 3 Assembler.

Commenting on STI Electronics, Inc.’s QML requalification, David Raby, president and CEO, said, “STI Electronics, Inc. unlocks the future with IPC QMLs, where rigorous standards meet innovation. Quality, reliability, and efficiency coverage propel us towards excellence in electronic manufacturing.” He continued, “We extend our deepest appreciation to IPC and Randy Cherry for their unwavering dedication to advancing the electronics industry. Their commitment to fostering standards, innovation, and collaboration continues to shape a brighter future for all.”

STI Electronics, Inc. achieved its initial IPC Validation Services QML recognition status over six years ago. With its requalification, it maintains its QML status as an IPC trusted source capable of manufacturing by industry best practices and at the highest level of quality.

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and qualification of electronics companies' products and identifies processes that conform to IPC standards.

"Unlike other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes per IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize STI Electronics, Inc. for continuing to be a member of IPC's network of trusted QML suppliers for three of IPC’s foremost standards."

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.   

IPC President & CEO Dr. John W. Mitchell Engages in High-Level Dialogue at Keidanren’s Seminar on International Standards Strategy

Jun 14, 2024
| By Sydney Xiao
John W. Mitchell, IPC president and CEO presenting on international standards development in Tokyo.

Dr. John W. Mitchell, President & CEO of IPC, contributed his expertise as a panel speaker at the prestigious Keidanren Top Management Seminar on International Standards Strategy in Tokyo on June 1. The event convened a distinguished group of policymakers, industry leaders, and experts to explore the pivotal role of international standardization in driving global collaboration and securing competitive advantages.

The panel discussion was moderated by Shigeto Wada, Chair of the Policy Planning Subcommittee of the Keidanren Committee on IP and Corporate Senior Vice President of NEC. Other esteemed panelists included Miki Yamanaka from Daikin Industries, Nao Nishikawa from Ministry of Economy, Trade and Industry (METI), and Iwao Hojoki from National Institute of Information and Communications Technology (NICT).

 

Key Discussion Points:

  1. Collaborative Domain in the Global Market: Dr. Mitchell emphasized the strategic importance of proactive involvement in international standard-setting, allowing companies to mold the industry's future and gain a competitive edge. He showcased IPC’s collaborative efforts with its 3,200 member companies, including prominent Japanese corporations like Toyota, and their collective impact on global industry standardization.
  2. Strategic Partnership Building and Talent Development: Dr. Mitchell highlighted IPC as an exceptional platform for Japanese companies to forge strategic alliances with international businesses. He also highlighted IPC’s educational programs, which are highly regarded by engineers worldwide, as pivotal for talent development and industry advancement.
  3. Japan’s Winning Strategies for Society 5.0 and SDGs: Addressing the theme of Society 5.0 and the SDGs, Dr. Mitchell introduced IPC’s initiatives in advanced packaging technology, underscoring its significance for AI utilization and energy efficiency.

Dr. Mitchell expressed his appreciation to Keidanren for Keidanren policy paper issued in February 2024, which recognizes IPC as an important collaborative partner for Japan. He stressed the need to strengthen collaborative ties between IPC and the Japanese business community.

He also mentioned IPC's goal to foster industry innovation and competitiveness of our members on a global scale, adding, "We're excited to keep working with Keidanren and support Japan's leadership in the international standards arena," he concluded.

IPC APEX EXPO 2025

Event Website
Date
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Discover the newest innovations and hear from the best minds in the electronics manufacturing industry. IPC APEX EXPO 2025 will be our industry’s largest event in North America featuring a world-class trade show, professional development courses taught by industry experts, non-stop networking and more! Join us in Anaheim, California, March 15-20, 2025.

Anaheim Convention Center

800 W Katella Ave
Anaheim, CA 92802
United States

Event Venue Website
https://www.anaheim.net/1117/Anaheim-Convention-Center

Anaheim Convention Center

Anaheim Convention Center
800 W Katella Ave
Anaheim, CA 92802
United States

Event Website

Circularity Challenges in Electronics Manufacturing

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IPC and iNEMI convened electronics industry experts in person on June 17 to discuss circularity challenges at the workshop, "There’s no end to a circle. A workshop on how to address circularity challenges in electronics manufacturing" at the Electronics Goes Green conference in Berlin. The fundamental goal of the workshop was to scope industry solutions to address pressing circularity challenges.

Please join us on July 17 at 10:00 AM EDT to learn more about the results of the workshop and next steps that will lead to work by iNEMI and IPC to assist industry with:

✅ Scope of Work statements for new industry standards, tools, and education

✅ Ideas for solutions to address the identified problems

✅ Next steps and additional workshop opportunities

Solutions driven by industry will help enable efficient and effective adoption of circularity through the electronics manufacturing value chain.

Presenters: Kelly Scanlon, IPC lead sustainability strategist and Mark Schaffer, project manager, iNEMI

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

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IPC Hosts Advanced Packaging Symposium in Tokyo

The IPC Advanced Packaging Symposium held in Tokyo on June 7, 2024, brought together leading experts, policy makers and other stakeholders from the semiconductor industry to discuss cutting-edge advancements and collaborative strategies shaping the future of advanced packaging technologies.

Under the guidance of Matt Kelly, IPC chief technology officer and vice president of technology solutions, the symposium commenced with an opening address from John W. Mitchell, IPC president and CEO and Hiroyuki Watanabe, IPC Board member and executive director of global security strategic planning at NEC Corporation.

Highlights of the event included presentations from esteemed speakers including Hidemichi Shimizu, director of device industry and semiconductor strategy at Ministry of Economy, Trade and Industry (METI), who delved into Japan’s strategic initiatives for advanced packaging, emphasizing the country's pivotal role in driving innovation in the semiconductor landscape.

Raja Swaminathan, corporate vice president of advanced packaging at AMD, educated participants with insights into the future of AI hardware enabled by advanced packaging, sparking engaging discussions on how the Japanese ecosystem can spearhead this transformative drive.

Matt Kelly's presentation on IPC’s advanced packaging initiative shed light on the organization's efforts to facilitate collaboration and standardization within the industry, fostering a conducive environment for technological advancements and market growth.

"The industry stands on the brink of a new era in advanced packaging, driven by innovation and collaboration. IPC extends its heartfelt thanks to all the guests who participated in the symposium. IPC remains dedicated to supporting advanced packaging through its standards, education, advocacy efforts, providing platforms for experts to exchange ideas, share knowledge, and shape the future of advanced packaging technology,” remarked Kelly.

To learn more about IPC’s advanced packaging initiative, visit www.ipc.org/solutions/ipc-advanced-packaging-technology.

Sharp Decline in European Electronics Manufacturing Jeopardizes Strategic EU Priorities

Key segments of EU electronics manufacturing industry set to decline undermining Europe’s security, industrial resiliency, and global competitiveness

A new report by IPC, reveals Europe’s growing dependency on other regions for electronics manufacturing in critical and strategic sectors including aerospace and defence. Despite the adoption of the European Chips Act, the Securing EU’s Electronics Ecosystem report finds the EU’s market share in critical electronics components beyond chips, including printed circuit boards (PCBs), electronic manufacturing services (EMS) and advanced packaging, will decline to 15 percent by 2035.

The PCB industry segment has faced significant erosion over the last two decades. Revitalizing and growing electronics manufacturing – beyond chips – is essential to building a secure and robust European electronics ecosystem. A “silicon to systems” approach is necessary to support ongoing EU technological leadership and meet strategic goals. 

“An innovative and resilient European electronics manufacturing industry is vital to ensuring the region’s access to defence and aerospace systems, medical technologies, and communications infrastructure. The growing strategic dependencies highlighted in the report are alarming as they undermine Europe’s ability to achieve key strategic priorities from a strengthening of the defense industrial base to the green and digital transitions,” says Sanjay Huprikar, president of Europe and South Asia Operations, IPC.

The report assesses how reliant Europe is on non-EU manufacturing across eight strategic sectors including aerospace/defence, automation, mobility, healthcare, and renewable energy. Highlights of the report include:

  • Across the key sectors, EU electronics production is expected to lag behind global trends and decline from 16.5% global market share today to 15% by 2035.
  • Those numbers become starker when looking at subsectors of the European electronics manufacturing industry, such as PCB production (1.7% global market share by 2035), advanced packaging (1.4%) and IC substrate production (0.7%) respectively.
  • Europe’s share of electronics manufacturing has fallen significantly in the last two decades despite demand for electronics soaring.
  • Global PCB production has more than doubled since 2000 with European demand today at an estimated EUR 7.87 billion.
  • Despite soaring demand for PCBs, European PCB production is projected to satisfy only 11 percent of European demand for PCBs (down from 17.5% today).

The study findings echo growing calls for strategic investments and comprehensive policies to enhance the EU’s competitiveness including the 17 and 18 April European Council conclusions stating that Europe “needs to reduce its strategic dependencies in sensitive sectors– energy, critical raw materials, semi-conductors, health, digital, food and critical technologies – and in other sectors such as chemicals, biotechnology and space.”

In response to the study, the European electronics manufacturing industry calls for an “Electronics Manufacturing Strategy” under the 2024-2029 European Commission mandate to help the EU better withstand global disruptions and maintain a competitive edge. An industry “Call-to-Action” shared today includes support from leading European electronics manufacturers and Trade Associations raising awareness for this situation.

“Any new industrial policy supporting competitiveness needs to embrace electronics manufacturing as a key enabler for innovation and resiliency in strategically important sectors, like aerospace and defence. A dedicated strategy, including EU targets for electronics manufacturing, will help Europe compete with global competitors” said Alison James, IPC senior director, European government relations.

IPC is hosting a meeting today with representatives of the European Commission and industry experts to review the study and call-to-action. This event will provide a forum for discussion of the situation and the need for a more ambitious and focused strategy to revitalize European manufacturing.

View full Securing Europe’s Electronics Ecosystem report.   

View Call-to-Action for a European Silicon to Systems Electronics Manufacturing Strategy on behalf of industry members and associations.

 

IPC Issues Call for Participation for IPC APEX EXPO 2025

IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2025. The technical conference will be held March 18-20 and professional development courses will take place March 16-17 and 20, 2025 at the Anaheim Convention Center in Anaheim, Calif.

The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers, and executives from all segments of the industry worldwide. Topics for technical conference papers, technical posters and professional development courses include: advanced packaging/components, assembly and test processes, design, electronic assembly materials, emerging technologies, Factory of the Future, HDI, µHDI and substrates, PCB fabrication and materials, power electronics, quality and reliability, and sustainability for electronics.

To recognize exceptional achievement, the IPC Technical Program Committee (TPC) will select the top qualifying papers and one top poster for awards. Awards include “Best of Conference,” “NextGen Best Paper,” “Best Student Research Paper,” and “Best Technical Poster.” 

For technical conference paper presentations and posters, IPC seeks abstracts that describe significant results from research experiments, highlight new techniques or materials, and/or discuss cutting-edge trends and challenges facing the electronics manufacturing industry. All submissions must be non-commercial, summarizing original and previously unpublished work covering case histories, research, and discoveries. Conference speakers and presenters are entitled to a free one-day conference pass for the day of their presentations and are eligible for discounted rates if they wish to register themselves for the full conference. Papers will be published in a proceedings document, and both paper and poster presentations will be delivered in person at IPC APEX EXPO 2025 in Anaheim. Deadline for technical paper abstract submissions is October 4, 2024.                                           

All posters will be displayed on the exhibit floor, with dedicated poster networking sessions for increased visibility. Authors of posters selected for the conference will receive further guidance on formatting, printing, and displaying posters. The deadline for technical poster abstracts is December 2, 2024.

For professional development courses, IPC seeks abstracts for three-hour sessions of live instruction covering all aspects of electronics manufacturing. Courses can be offered as one 3-hour session or two 3-hour sessions (offered as Part 1 & Part 2 for a total of 6 hours). Honoraria and travel expense stipends are offered to professional development instructors. Professional development abstracts are due September 6, 2024.

To submit an abstract, visit www.ipcapexexpo.org/event-info/call-participation. For more information on IPC APEX EXPO 2025, visit www.ipcapexexpo.org.

IPC Adds Nimonik as New Global Standards Subscription Distributor

Effective June 1, 2024, IPC entered into a distribution agreement with Nimonik, a regulatory and standards compliance software company. Nimonik is now able to offer IPC standards products in hard-copy and electronic media format through their online retail store or via an annual subscription.

IPC standards are accepted worldwide as the key manufacturing standards for the printed board and electronics manufacturing industries and they are associated with nearly every stage of the electronic product development cycle. Today, IPC's collection of industry standards and guidelines exceeds 300 active multilingual standards and is used by more than 3,600 companies worldwide.

“Nimonik is honoured to announce our partnership with IPC, a global industry association dedicated to enabling reliable, high-quality electronics by developing the trusted standards that drive the global electronics industry's success,” said Jonathan Brun, Nimonik CEO. “Now, Nimonik customers will have the opportunity to access IPC subscriptions, complementing our existing offerings and providing a complete package for our users."

“IPC is thrilled to add Nimonik to our list of global standards subscription distributors,” said John W. Mitchell, IPC president and CEO. “Companies now have expanded access to IPC standards documents with the addition of this organization; IPC members can purchase a subscription to IPC standards via a well-established online platform.”

To learn more about Nimonik’s , visit www.nimonik.com or their online retail store at www.document-center.com/.

IPC Midwest EMS Leadership Roundtable: Leveling Up Your Business

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Date
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July 9, 2024 | 4:00 pm – 8:00 pm
Location: Arc-Tronics, Inc.
1150 Pagni Dr
Elk Grove Village, IL 60007
www.arc-tronics.com

Hosted by: Arc-Tronics, Inc.

Join fellow EMS leaders in the region to share industry pain points and solutions. Our focus for this meeting is how companies profitably reach the next level of revenue. Following a presentation on the current EMS market and revenue tiers in the industry, participants will discuss how to reach the next level and grow their business. The discussion will pull from direct experience, questions, and ideas. From there, the conversation goes where you, the leaders, take it. Every roundtable ends with unique takeaways. 

Complimentary registration includes:

  • Peer-led roundtable discussions
  • Updates on relevant EMS industry studies/reports
  • Recap of business resources available
  • Reception and dinner
  • Peer networking, partnership building
  • Facility tour (no photography allowed)

Hosted with the support and cooperation of Arc-Tronics, Inc.
Street parking is available, limited parking is available behind the building.

Have questions? Email Mark Wolfe at MarkWolfe@ipc.org.

Arc-Tronics, Inc.

1150 Pagni Dr.
Elk Grove Village, IL 60007
United States

Arc-Tronics, Inc.

Arc-Tronics, Inc.
1150 Pagni Dr.
Elk Grove Village, IL 60007
United States

Learn More & Register

Chemicals Management for Electronics - USA 2024

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IPC will be in Boston, MA on June 24th and 25th to keep on top of chemical management and its implication for achieving sustainability initiatives. IPC is proud to be a sponsor for this event and IPC members receive a 15% discount on registration. This event is hybrid – so we hope to see you there in person or on screen.

Hyatt Regency Boston Harbor

101 Harborside Drive
Boston, MA 02128
United States

Hyatt Regency Boston Harbor

Hyatt Regency Boston Harbor
101 Harborside Drive
Boston, MA 02128
United States

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