Winners of IPC Hand Soldering and Rework Competition at NEPCON Thailand 2024 Announced

In conjunction with NEPCON Thailand 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Bangkok, on June 19-22, 2024. The seventh edition of the competition in Thailand welcomed 40 participants from 14 companies.

Skilled contestants competed against each other to rework a functional electronics assembly within a 50-minute time limit. Assemblies were judged on soldering in accordance with IPC-A-610H, IPC J-STD-001H, IPC-7711/21C - Class 3 criteria, the speed at which the assembly was produced, and overall electrical functionality of the assembly.                       

On the winner’s podium at NEPCON Thailand 2024 were:

  • First Place: Areeya Mukkrathok, Benchmark Electronics (Thailand) Public Co., Ltd. She received a certificate, a cash prize of $USD300 and a soldering station from premier sponsor QUICK. As the winner, Mukkrathok qualified for the IPC Hand Soldering World Championship in Munich, Germany in November.                                    
  • Second place: Sangrawee Baulert, Sanmina-sci systems (Thailand) ltd. She received a certificate and a cash prize of $USD200 and a soldering station from premier sponsor QUICK.
  • Third Place: Tidarat Phamorn,Benchmark Electronics (Thailand) Public Co., Ltd. She received a certificate and a cash prize of $USD100 and a soldering station from premier sponsor QUICK.

IPC would like to thank Hand Soldering and Rework Competition sponsors and partners for their generous support this year.

  • Premier Sponsor: QUICK
  • Gold Sponsors: NIHON SUPERIOR, SOLDERINDO
  • Co-Organizer RX TRADEX THAILAND

For more information on upcoming hand soldering and rework competitions, contact Tharinee Butmuang, customer service manager, IPC Thailand, at JibButmuang@ipc.org.

 

Selective Solder Nozzles: Insight Into Wear Mechanisms and Future Developments

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Selective soldering utilizes wettable metal nozzles for controlled application of solder to components. The wetting of solder to the nozzles is part of a complex mechanism that causes wear of the nozzle due to chemical interaction between the solder and the nozzle. This study explores the fundamental interactions between flowing solder and the nozzle.

Nozzles can last for hundreds of hours with the correct maintenance, however dewetting and eventual wear results in a loss of productivity and therefore revenue. Performance improvements to selective soldering nozzles allows for operation in more demanding process environments, producing higher quality and more reliable products, whilst also reducing process downtime and producing fewer defects. Thus far, limited work has been produced analyzing the efficacy of alternative alloys to improve the lifespan and wettability of selective solder nozzles.

A joint research project between industry and academia1 has been established to investigate the fundamental wear mechanisms of selective soldering nozzles and develop improved nozzles with increased wettability and lifetime. Alternative alloys are investigated for their operational viability.

Details of the methodologies employed will be given. Wear was quantified by proportional mass loss measured at regular time intervals measured throughout the nozzle's operational life. Wettability was quantified by measurement of the contact angle with solder in an inert atmosphere to mimic in-situ conditions.

Insights into field performance of these new nozzles will be presented with reports from key testing partners.

Author(s)
Samuel J. McMaster Ph.D, Andrew Cobley, Nigel Monk, John E. Graves
Resource Type
Technical Paper
Event
IPC APEX EXPO 2023

New Soldering Technology for High and Mixed-Volume Through-Hole Pin Devices

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Surface mount technology was developed in the 1960s and implemented on printed circuit boards in the 1980s. High-density electronic assemblies are dominated nowadays by surface mount devices. The number of through-hole components left on the assembly continuously declines. Although many through-hole devices are soldered with pin-in-paste solder technology in a reflow oven, for some, this is no option. The reason for this can be the higher process temperatures of a reflow process or the lack of space for more solder-paste deposits on the board. Liquid soldering of through-hole leads remains a robust method of making reliable component-to-board solder joints. A point-to-point soldering process takes too much time for a high-volume product and dip soldering comes with additional tooling that makes the production line less flexible. To meet short cycle times and still be flexible, a dip technology was introduced on an inline machine. This method of soldering is possible due to new advanced nozzle designs made possible with new 3D printing technology. Soldering methods are compared using Design of Experiments (DOE) to determine throughput, as well as energy and material consumption. Several experiments contain methods to eliminate bridges and optimize heat transfer by improving the design of nozzles and solder flow dynamics and reducing cycle times.

Author(s)
Gerjan Diepstraten
Resource Type
Technical Paper
Event
IPC APEX EXPO 2023

Photonic Soldering of Wafer-level Chip-scale Packaged Components on Polyethylene Terephthalate Flex Board

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Advanced implementation of wearables and IOT applications require attachment of components on lightweight, mechanically flexible, and low-cost substrates. Candidate materials that meet these substrate requirements are typically made from temperature-sensitive polymers, such as polyethylene terephthalate (PET), and are thus challenging to use alongside standard high-temperature solder alloys. Reliable attachment of chip components to PET substrates with high-temperature solder has been demonstrated previously using a photonic soldering approach. This report expands the application of photonic soldering to components without line-of-sight, where direct exposure of solder junctions is not possible, using off-the-shelf lead-free solder alloys.

In this work, we show that wafer-level chip-scale packages (WLCSP) of various sizes can be photonically soldered to metallized PET substrates, using commercially available solder paste. The attached components feature ball grid array (BGA) footprints of three sizes to show the scaling of the process with I/O complexity. The quality of the solder junctions are characterized using continuity testing, optical, x-ray, and electron microscopy. The experimental results show that photonic soldering is an effective and capable processing technique for producing high quality and high reliability joints. Advances with this technique extend the range of design options, materials, and applications accessible for flexible electronic devices.

Author(s)
Harry Chou Ph.D, Ara Parsekian Ph.D, Nikhil Pillai, Ian Rawson, Rudy Ghosh Ph.D, Vahid Akhavan Ph.D
Resource Type
Technical Paper
Event
IPC APEX EXPO 2023

Electronics Industry Sentiment Falls in June, Driven by Weaker Demand and Stronger Cost Pressures

IPC releases June 2024 Global Sentiment of the Electronics Supply Chain Report

Sentiment among electronics manufacturers fell in June; despite the decline, sentiment remains above its long-term average according to IPC’s June Sentiment of the Global Electronics Manufacturing Supply Chain Report.

In a special question about the possibility of Chinese manufacturers oversupplying inputs and components including PCBs at artificially low prices over the next year to stimulate its economy, seven in 10 (68 percent) manufacturers expressed “somewhat” or “extreme” concern. A significantly lower level (29%) indicated a lesser level of concern among manufacturers operating in Asia Pacific.

Regarding outlook for the next six months, electronics manufacturers expect both labor and material costs to come down slightly, while material costs are expected to remain relatively stable. Although backlogs and ease of recruitment are likely to remain challenging, manufacturers expect profit margins and capacity utilization to rise. 

Additional survey data show:

  • Industry demand fell to its lowest level this year.
    • Demand fundamentals weakened for the third consecutive month, falling to the lowest level in 2024.
    • The Demand Index slipped 3.1percent this month, after falling three percent last month.
    • All four components of demand slipped this month. The Shipments Index fell one point, while both the New Orders Index and the Backlog Index dropped two points. The biggest drop came from the Capacity Utilization Index which fell eight points and dropped into contractionary territory.
  • Cost pressures rose for a second consecutive month, but after a record low in April.
    • The Labor Costs Index dropped two points this month, but the Material Costs Index increased six points.
    • The Material Costs Index is at its highest level since August 2023.
  • Industry outlook declined in June, dropping to the lowest level since October 2024.
    • The industry outlook remains strongly positive, though it has slightly softened over the two months from a record high in March.

These results are based upon the findings of IPC’s Current State of Electronics Manufacturing Survey, fielded between May 15 and May 31, 2024.

Read the full report.

Mitigating Hi-Rel Counterfeit Documentation Risks

Date
- (12:00 - 1:00pm CDT)

Join Anthony J. Bryant as he previews his August IPC Counterfeit Electronic Parts Mitigation course. The webinar reviews the key aspects of counterfeit documentation challenges focusing on the recent issues with aircraft engines and the broader High-Reliability supply chain concerns. Participants will gain a comprehensive understanding of the problem, as well as practical strategies and best practices for mitigating the risks. In this webinar, we’ll cover:

  • Understand the scope and impact of counterfeit documentation in the aerospace industry
  • Identify common tactics used by counterfeiters to create fake documentation
  • Learn strategies and best practices for mitigating the risk of counterfeit documentation
  • Discuss industry-wide initiatives and regulations aimed at addressing this challenge

Anthony Bryant July 31

Speaker Bio

Anthony J. Bryant is a trained expert in component counterfeiting detection techniques. He has collaborated with IPC on intermediate-level courses and webinars related to counterfeit electronics detection. With over 35 years of experience in the electronics manufacturing industry, Bryant witnessed the pervasive issue of substandard and counterfeit electronic components.

His journey began in the U.S. Navy, where he served as a fire control missiles technician (FCM). This firsthand experience highlighted the critical importance of reliable electronics in mission-critical applications, and he saw the consequences of equipment failures.

Transitioning to the civilian sector, Bryant pursued a career in aerospace and defense contract manufacturing. His commitment to quality led him to seek advanced training at leading electronics institutions, including ACI Technologies Inc. (formerly known as the American Competitiveness Institute) in Philadelphia.

During the COVID-19 pandemic, the problem of counterfeiting escalated significantly. Bryant personally encountered 19-20 instances where parts previously identified, rejected, and confiscated by the government resurfaced in the supply chain. This recurring cycle of non-conforming materials poses a persistent threat to the electronics supply chain.

His dedication to safety and national security stems from his service in the U.S. military, where he witnessed the catastrophic consequences of substandard equipment. Bryant’s expertise contributes to addressing the challenges posed by counterfeit electronic parts in high-reliability organizations. Join Bryant for his four-week (eight sessions) course, Counterfeit Electronic Parts Mitigation for High Reliability Organizations starting August 6th. 

IPC White Paper Emphasizes the Critical Importance of ‘Design for Excellence’ Throughout the Full Ecosystem of Electronics Design

A new white paper from IPC’s Chief Technologist (CTC) and Design Leadership (DLC) Councils, Better Electronics by Design: Next Generation Design Needs explores the elements of the “Design for Excellence” methodology, re-thinking how it needs to be further defined and applied in the full ecosystem of electronics design.

In addition, the whitepaper provides a high-level exploration of the full “silicon-to-systems” ecosystem, examines the justification and implications of an Authoritative Source of Truth (ASOT), discusses the need for synergy between building blocks of electronic systems, and takes a deep dive into the subject of design rules and “design for manufacturability.”

Key messages within the white paper include:

  • Electronic systems are increasingly complex and heterogeneous.
  • Facilitation of an Authoritative Source of Truth (ASOT) is mandatory to ensure consistency, efficiency, and traceability.
  • The industry needs a more robust and interoperable toolset to support greater silicon-to-systems collaboration.
  • Diverse electronic and mechanical CAD systems must gain interoperability by including proper model-based definitions (MBD) and collaborative software to cover both disciplines.
  • A shift towards true digital collaboration and automation and an early consideration of manufacturing capabilities across the development process is essential to master increasing time-to-market and complexity challenges.

“Creating better electronics by design is a common, collective goal of the electronics industry,” said Peter Tranitz, IPC senior director, technology solutions, and leader of IPC’s design initiative. “To achieve this, an ASOT should be established and protocols, standardized. To leverage the associated benefits, a culture of real digital collaboration, transparency, and accountability needs to be established. Tools need to support bi-directional, incremental exchange of information. And design rules need to be broken down to the relevant stages of the design workflow and checks need to be performed after every stage of the design process to drive the concept of ‘shift left.’ For effective Design for Manufacturability execution, manufacturers need to provide clear guidance on manufacturing capabilities and constraints to designers.”

Download the report:  https://go.ipc.org/next-gen-design.

North American PCB Industry Sales Down 6.8 Percent in May

IPC releases PCB industry results for May 2024

IPC announced today the May 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.95.

Total North American PCB shipments in May 2024 were down 6.8 percent compared to the same month last year. Compared to the preceding month, May shipments were down 16.5 percent.

PCB bookings in May were down 6.4 percent compared to the same month last year. May bookings were down 2.7 percent compared to the preceding month.

“The sluggish growth in the PCB industry reflects broader economic headwinds and likely signals a period of slower growth,” said Shawn DuBravac, IPC’s chief economist.

May 2024 PCB book to bill ratio chart one
May 2024 EMS book to bill ratio chart two

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

North American EMS Industry Up 5.0 Percent in May

IPC releases EMS industry results for May 2024

IPC announced today the May 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.36.

Total North American EMS shipments in May 2024 were up 5.0 percent compared to the same month last year. Compared to the preceding month, May shipments increased 3.7 percent.

EMS bookings in May increased 2.6 percent year-over-year and decreased 16.2 percent from the previous month.

“The North American EMS industry continues to show resiliency,” said Shawn DuBravac, IPC’s chief economist. “Shipments and orders moved higher in May, but lower order growth compared to a year ago speaks to the headwinds facing the sector today.”

May 2024 EMS book to bill ratio chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.