Two important aspects concerning optimum performance of a (reverse) pulse plating line are (i) the uniform and correct pulse
shapes anywhere on the PCB and (ii) the uniformity of the plating current density (thickness distribution) over the whole
plating window of a vertical line or the entire width of a PCB in a horizontal line. To measure both precisely,comfortably,
and quickly the island method was enhanced to Optipulse 80. Special test boards with measurement islands and calibrated
shunts on both sides are used to check site-specifically the cathodic plating current density as close as possible to production
conditions. Sampling frequencies up to 20 kHz precisely resolve pulses as short as 0.5 ms. Up to 80 channels are sufficient to
obtain a well resolved overview over the plating window of most vertical lines within less than ten minutes. Statistical data
evaluation and visualization features make this a powerful tool for optimization of pulse plating lines (also applicable to DC
plating,of course). The system now has been successfully in use for more than three years. This paper presents a short review
of its history and the actual features as well as some examples from recent data.

The upcoming European Union RoHS and WEEE directives are driving new requirements for the management and exchange
of information,both across the extended electronics manufacturing value chain,and across the product lifecycle. The
Restriction of Certain Hazardous Substances in electrical and electronic equipment (RoHS) bans or severely restricts the use
of certain substances in the manufacture and assembly of electronics products to be marketed in the EU. The regulation of
Waste from Electrical and Electronic Equipment (WEEE) places strict requirements on the handling and disposition of
electronic products at their end of life. All electronics OEMs that sell products into the EU states will have to comply or they
will lose access to these markets. Information on the material composition of all components and bulk materials that go into
the manufacturing of products will have to be available and shared,across multiple tiers of the supply chain,to support RoHS
compliance. Information on substances of concern and the location of any hazardous substances,along with disassembly
instructions,will have to be available to recyclers to support WEEE. Additional information will likely be required to support
the upcoming directive on Design for Energy Using Products. Some estimates1 place the cost of enhancing and updating IT
systems to support environmental compliance for an average electronics producer at $2-$3 million over the next 3 years.

System in package (SiP) technology has grown significantly in the past several years. It was barely mentioned in the National
Electronics Manufacturing Initiative’s (NEMI’s) 2000 roadmap,but by the 2002 roadmap,SiP was one of the fastest growing
packaging technologies. Even though,at that time,SiP represented a relatively small percentage of the total unit volume,the
2002 NEMI roadmap noted that SIP was becoming a common technology in the high-growth Bluetooth,WLAN (wireless
local area network) and mobile phone applications. By 2004,SiP had grown so significantly that it was added to the roadmap
as a new product emulator group (one of seven),which are used to define future manufacturing needs across the entire
electronics supply chain.

For four decades,the semiconductor industry has distinguished itself by the rapid pace of improvement in its products. The
principal categories of improvement trends are shown in Table 1 with examples of each. Most of these trends have resulted
principally from the industry’s ability to exponentially decrease the minimum feature sizes used to fabricate integrated
circuits. Of course,the most frequently cited trend is in integration level,which is usually expressed as Moore’s Law. (i.e.,
the number of components per chip doubles every 24 months). The most significant trend for society is the decreasing costper-
function,which has led to significant improvements of productivity and quality of life through proliferation of computers,
electronic communication,and consumer electronics.

A new multi-layer PCB (printed circuit board) having low transmission loss and low thermal expansion that meets up-coming
further high speed and high volume data transmission demands was developed. New modified polyphenylene ether (PPE)
resin that posses excellent dielectric as well as thermal properties (Tg>200ºC) has been successfully designed and developed
in house. The selection of a PPE backbone structure let us realize low Dk and low Df of the PCB,resulting in lower
transmission loss. Low CTE of the PCB was achieved by incorporating inorganic fillers,while keeping low Df. By using
special VLP copper foil,high-speed data transmission performance was improved significantly. The Dk,and Df of the
developed PCB is 3.4-3.6,<0.002(1GHz) respectively and CTE in z direction is 45-50ppm. These are the basis of our
development. We demonstrated about 50 % reduction in transmission loss in comparison to FR-4. Because of its low CTE,
the PCB indicated excellent through-hole reliability. Over 2000 cycles of reliability were observed in its heat cycle (T/C;
-65ºC to 125ºC) test. It was 4 times better performance than that of FR-4. The PCB showed high CAF resistance as well. No
distinct failure was observed within 300 hours in its HAST (110ºC/85%/50V). Accordingly,newly developed our PCB has
reliable performance. The PCB is compatible with the conventional PCB manufacturing process. Thus,we believe our newly
developed PCB will offer one of the most promising solutions to achieve ultra high speed signal transmission technology that
will play a very important role in the emerging era.

The frequencies used to communicate and process information have been extended beyond the GHz band to the microwave
band to handle the growing volume of data. Moreover,increasing global interest in environment protection is calling for base
materials for printed wiring boards (PWBs) that can be based on restriction of the use of certain hazardous substances. We have developed new low- transmission-loss multilayer materials that have extremely low flammability without using any
halogenated compounds.
The original resin modification,resin formulation,and flame retardant system techniques have enabled us to produce these
new base materials having good dielectric characteristics (lower dielectric constants and dissipation factors),good flame retardancy,and high heat resistance. They will meet the requirement of high temperature soldering process using lead-free
solder.

Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels
there is an extreme need for improved PTH processing. There are several proven routes for high technology flex / flex-rigid
manufacturing as well as for high volume applications,but lately there have been some developments. From this
presentation,along with suitable examples,we aim to give an insight into the current status of flex / flex-rigid manufacturing,
from the point of view of PTH processing,as well as suitable solutions to common manufacturing issues.

We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed
circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnection Circuit) based on our original materials and
manufacturing technologies of FPCs.1)
The features of this multilayer FPC are attainment of high-density device mounting,high reliability,and super-thin thickness,
for example six layers: 0.3mm,eight layers: 0.4mm,etc.,with an all-layer IVH (stands for Interstitial Via-Hole) structure.
The interconnection consists of a solder bump,which has a copper bump as the core,and a capture pad. The flux activity of
Deoxidizable Bonding Film,our proprietary interlayer adhesive,supports the bump and the pad connected by solder.
We verified formation of the alloy of tin and copper by cross sectional observation. The reliability of the interconnection
passed a temperature cycle test (1,000 cycles at the range of -25°C to 125°C),a thermal shock test (100 cycles at the range of
room temperature to 260°C),etc. The conductive resistance of the interconnection kept an almost theoretical value during the
temperature cycle test.
We adopted the simultaneous interconnecting lamination of all-layer method,and attained shortening of the processes and a
high yield ratio. Moreover,halogen-free and lead-free materials were adopted for all the components in consideration of
environmental protection.

This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impact of different PCB surface finishes (OSP and
ENIG),was investigated from an assembly perspective. Different underfill materials including an acid anhydrate based
material and two non-acid anhydrate based materials were evaluated for compatibility with the flux and lead-free solder
bumps and process. A reflow encapsulate designed for lead-free soldering is also studied from an assembly point of view.

In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and finishes,and in different soldering
atmospheres (air and nitrogen). The impact of key process parameters on the process yield is discussed in comparison with
the Sn-Pb soldering process,and methodologies for optimizing the lead-free soldering processes are outlined. Component
compatibility issues are also discussed.