After returning from IPC APEX EXPO we established a training program within our facility. We used advanced training for five instructors and additional training for 20 specialists. As a result, we successfully completed the IPC Qualified Manufacturing Listing audit. We improved our processes, the quality of the products we manufacture and the mastery of processes through knowledge of standards which motivated our staff towards excellence.
Eduardo Koroch, Industrial Director, Grupo Mirgor
Having earned the QML for several locations validates Mercury’s commitment to delivering high quality, reliable products to our customers.
We are part of a global network of trusted sources that the industry will look to first and foremost when evaluating potential business partners.
Amir Allahverdi, Senior Vice President, Mercury Systems, Inc.

Global Banking Crisis Signals Economic Volatility, Signs of Recession

IPC Issues March Economic Outlook Report

Economic data over the last month indicates that the global banking crisis will directly affect the ability of companies to buy new equipment, hire new employees, and expand.

“This is just the start of a wider banking crisis,” said Shawn DuBravac, IPC chief economist. “One that will get worse before it gets better. Banks will be cautious, raising lending standards, protecting capital, and creating greater liquidity buffers. Expect the coming months to remain volatile.”

The report also shows that the U.S. job market remained strong, and individuals appear to be reentering the labor market as the economy softens. In addition, the defense and space equipment segment rose 0.6% to another new all-time high. The sector is up 2.3% over the last year.

In Europe, economic growth was flat, while manufacturing production largely stabilized after eight months of contraction. Supply chains continue to improve which is easing strains on production schedules.

Additional data in the March report shows:

  • U.S. industrial production was unchanged in February but was down 0.4% including revisions to prior months and came in below consensus expectations of a 0.2% increase.
  • U.S. employment gains in the last year have been driven by firms with less than 250 employees. Tightening credit conditions are going to hit this part of the economy the hardest.
  • In the EU: Manufacturing output rose in January. Output increased 0.8% (month-on-month) and is up 1.7% over the last year. In addition, the electronics industry, which includes categories such as components, loaded boards, computers, communications equipment, and consumer electronics, rose 4.5% (month-on-month) in January. The sector is up 10.4% over the last year.
  • The U.S. job market remained strong in February, adding 311,000 new jobs even with a downward revision to payroll gains in December and January of 34,000 jobs. 

View full report.  For more information on IPC’s industry intelligence program including new reports, visit: www.ipc.org/advocacy/industry-intelligence.

 

 

Electronics Industry Comments on EPA’s Proposed Rule on PFAS

Mar 29, 2023

As part of IPC’s ongoing advocacy on behalf of the electronics industry, IPC, the Consumer Technology Association (CTA), and the Information Technology Industry Council (ITI) jointly submitted comments to the U.S. Environmental Protection Agency (EPA) on their proposed Significant New Use Rule (SNUR) for Per- and Polyfluoroalkyl Substances (PFAS) that are designated as inactive on the TSCA Inventory.

The Toxic Substances Control Act of 1976 (TSCA) – amended in 2016 by the Frank Lautenberg Chemical Safety for the 21st Century Act (LCSA) – is the primary U.S. federal law addressing the production, importation, use, and disposal of chemicals that pose risks to human health and the environment. The U.S. Environmental Protection Agency (EPA) has the authority to require and enforce compliance with it.

TSCA Section 5(a) SNURs can be used to require notice to the EPA before a chemical substance or mixture is used in new ways that might create concerns. Under the SNUR, EPA would have the authority to regulate articles, but historically it has provided exemptions based on the complexities associated with identifying and reporting substances in articles.

Today’s comment reiterated the complexities of the electronics manufacturing supply chain and the difficulties associated with extracting and compiling data on specific chemistries. Thus the three associations encouraged EPA to maintain the articles exemption; maintain the impurities exemption; and expand the byproducts exemption, and we asked EPA to specify the CAS RN and accession numbers of the 330 substances on the inactive list.

This comment ties into IPC’s larger effort to advocate for fair and reasonable reporting on behalf of the electronics industry. While reporting data and information is important and sometimes necessary for human health and the environment, it is important that it be feasible, effective, and not overly burdensome to industry.

More information on IPC’s advocacy on TSCA can be found on our website.

 

 

IPC Welcomes U.S. Presidential Determination Prioritizing Domestic Development of Printed Circuit Boards and IC Substrates

IPC, the global association representing the electronics manufacturing industry, welcomes the action of U.S. President Joe Biden today in issuing a “presidential determination” that prioritizes the domestic development of printed circuit boards (PCBs) and advanced packaging, including IC substrates, under Title III of the Defense Production Act (DPA).

IPC, along with partners including the U.S. Partnership for Assured Electronics (USPAE) and the PCB Association of America (PCBAA), has been calling on President Biden to address urgent industrial base vulnerabilities and deliver on the promise of the CHIPS Act through a “silicon-to-systems” innovation strategy, which today’s determination will help achieve.

IPC President and CEO John Mitchell said, “Increasing domestic chips production without bolstering the manufacture of cutting-edge PCBs and IC substrates risks lengthening the semiconductor supply chain, because many of the chips made in California or Ohio will still have to be sent outside of the United States for packaging and assembly into finished products.

“The erosion of U.S. PCB capabilities and capacity has compromised national and economic security, as the U.S. share of global PCB production has fallen from 30% to 4%, making the nation heavily reliant on a global supply chain that is itself in turmoil,” Mitchell added. “Today’s presidential determination is a key step toward moving beyond a silicon-only mindset and rebuilding the wider U.S. electronics manufacturing industry. We look forward to working with Congress and the Executive Branch to ensure this effort is fully funded and implemented.”

On Friday, President Biden announced an additional $50 million in Defense Production Act funding for U.S. and Canadian companies to invest in advanced packaging for semiconductors and printed circuit boards. On Feb. 23, Commerce Secretary Gina Raimondo said the U.S. will develop multiple high-volume advanced packaging facilities and become a global leader in chip packaging technologies.

The Biden administration’s year-long assessment of the ICT supply chain, released in February 2022, highlighted the importance of PCB fabrication and assembly in electronics manufacturing and recommended that government programs like Title III be used to bolster the strength of U.S. PCB manufacturers. The issuance of this presidential determination is a crucial first step towards securing the domestic supply of these critical electronic components.

IPC looks forward to continuing to work with the Biden administration, the U.S. Congress, and industry partners to support long-term policy and funding to rebuild the entire ecosystem that sustains innovative, resilient, and secure electronics manufacturing.

For more information, visit www.IPC.org.

IPC Applauds New U.S.-Canada Partnership to Strengthen Advanced Packaging and Printed Circuit Board Manufacturing in North America

The following is statement by John W. Mitchell, president and CEO of IPC, the global electronics manufacturing association, on the joint statement today of U.S. President Joe Biden and Canadian Prime Minister Justin Trudeau:   

“On behalf of electronics manufacturers, IPC applauds the just-announced partnership between the United States and Canada ‘to strengthen advanced packaging for semiconductors and printed circuit boards in North America,’ including an additional USD $50 million in U.S. Defense Production Act funding for those purposes.

“In order to achieve their shared goals, the U.S. and Canada must invest in and support the growth of the electronics manufacturing ecosystem, including printed circuit boards (PCBs), IC substrates, and semiconductor assembly. Neglecting a “silicon-to-systems” approach would undercut the promise of the CHIPS Act and the region’s long-term leadership in innovation.

“Today’s announcement represents another meaningful step toward rebuilding a North American electronics manufacturing industry that was once the envy of the world.”

This is the third time in a month that the U.S. Government has called for a “more than just chips” approach to implementing the CHIPS Act. On Feb. 23, Commerce Secretary Gina Raimondo said the government is working to establish at least two new, large-scale clusters of leading-edge semiconductor fabs, each with a robust supplier ecosystem, cutting-edge R&D, and workforce training. Significantly, she said the U.S. will develop multiple high-volume “advanced packaging” facilities and become a global leader in chip packaging technologies.

The week before, on a Freakonomics podcast, Raimondo confirmed that some CHIPS Act funding will go to “smaller firms,” including “circuit-board companies.”

Here are additional IPC resources on this issue:

  • Website and video with industry leader soundbites: IPC has just published a new website with background information on advanced packaging. At the top of this page is a new video with straight-to-the-camera soundbites from nine electronics industry leaders on the need to strengthen the entire electronics manufacturing ecosystem.
  • Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT) recently called on the U.S. Department of Defense (DoD) to use the Defense Production Act (DPA) to increase domestic production of printed circuit boards (PCBs) and integrated circuit (IC) substrates. With over 50% of PCBs being imported from China, they said it is critical that the DoD increase domestic production and ensure the use of electronics from trusted sources. Read the full letter here.
  • IPC Report: Leadership Lost? Rebuilding the U.S. Electronics Supply Chain

Despite Growing Economic Uncertainties, the Electronics Manufacturing Industry Remains Upbeat

IPC issues March Global Sentiment of the Electronics Supply Chain report

Per IPC’s March 2023 Global Sentiment of the Electronics Supply Chain Report, the last month delivered another month of stable industry sentiment: industry demand appears to remain intact, production holds steady and some labor challenges may be receding. Though overall sentiment is upbeat, roughly 58 percent of sentiment survey respondents expect to raise prices in 2023 with an average of an 8 percent increase.

Among other data, survey results show:

  • Labor costs, orders, customer inventory, backlogs, and ease of recruitment is expected to remain relatively stable.
  • Backlogs are rising more so in North America when compared to both Europe and APAC.
    • Nearly two-fifths (38 percent) of firms in North America indicate backlogs are on the rise, while a significantly lower 8 percent of European firms and 14 percent of those in APAC are experiencing a current increase.
  • Material costs are declining at a faster pace among manufacturers in Europe vs. those in North America.  
    • While 11 percent of firms in Europe indicate material costs are currently declining, 0 percent of firms in North America are presently reporting a decrease.
  • The majority of manufacturers indicate less than 10 percent of 2022 revenue growth was attributable to pricing impacts, which holds true for manufactures in North America, Europe, and APAC.

For the report, IPC surveyed hundreds of companies from around the world, including a wide range of company sizes representing the full electronics manufacturing value chain.

View full report.

# # #

North American PCB Industry Sales Up 5.6 Percent in February

IPC Releases PCB Industry Results for February 2023

IPC announced today the February 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.99.

Total North American PCB shipments in February 2023 were up 5.6 percent compared to the same month last year. Compared to the preceding month, February shipments were up 16.4 percent.

PCB bookings in February were up 1.5 percent compared to the same month last year. February bookings were up 7.8 percent compared to the preceding month.

“Shipments were strong in February and are tracking above 2021 levels for the year,” said Shawn DuBravac, IPC’s chief economist. “However, despite a strong February, order volume remains down through the first two months.”

February 2023 PCB book to bill chart 1
February 2023 PCB book to bill chart 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

 

North American EMS Industry Up 5.1 Percent in February

IPC releases EMS industry results for February 2023

IPC announced today the February 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.30.

Total North American EMS shipments in February 2023 were up 5.1 percent compared to the same month last year. Compared to the preceding month, February shipments decreased 4.9 percent.

EMS bookings in February decreased 5.4 percent year-over-year and decreased 16.4 percent from the previous month.

“The EMS sector has started the year on a slow note, with orders slipping in the first few months of the year as economic headwinds take hold,” said Shawn DuBravac, IPC’s chief economist.

February 2023 EMS book to bill chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

IPC WINTERCOM 2024

Registration Closed
Date
-
World Trade Center Barcelona

View the detailed event programme below for guidance on meeting rooms and times:

Monday - 22 January

Tuesday - 23 January

Wednesday - 24 January

Thursday - 25 January

Event venue map

WinterCom event venue map

 

Thanks to the IPC WinterCom 2024 Sponsors

 

 

 

Join colleagues from around the globe for a week of active participation in IPC standards development committee meetings during IPC WinterCom 2024, Barcelona, Spain, January 22 - 25, 2024.

IPC WinterCom 2024 is a new event to support IPC standards development committees in face-to-face sessions. During the weeklong series of meetings, the global electronics manufacturing industry will meet to develop and maintain the IPC standards they use to build electronics better.

Committee meeting topics will include materials, design, PCB fabrication, PCB assembly, Factory of the Future, e-textiles and all of the most widely used IPC standards will be discussed.

This event is open and free to both IPC members and nonmembers with an interest in IPC standards development committee meetings, from newcomers to IPC standards to longtime industry committee participants and leaders.

IPC appreciates your contribution to the industry standards and guidelines relied on by your company, customers, suppliers, and competitors.

We look forward to welcoming you to Barcelona in January!

Committee Meetings Schedule 

8:00 am-8:45 am | Welcome Remarks and Keynote Session, Port Vell Room Networking Area

9:00 am-5:30 pm
5-22A and 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting
The 5-22A task group is responsible for the joint industry soldering standard, J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies.

The 7-31B task group is responsible for maintaining IPC-A-610 Acceptability of Electronic Assemblies.

The group will be resolving comments for Revision K.

9:00 am-12:00 pm
5-33C: Conformal Coating Handbook Task Group
The 5-33C task group is responsible for the maintenance of the IPC-HDBK-830 Guidelines for Design, Selection, and Application of Conformal Coatings.

The group is in the inception of the review of IPC-HDBK-830 handbook, the committee is collecting new content that is not currently available to the industry. In addition, technical support and guidance is needed to complete the current actions that are open and will be discussed during these meetings.

5-21N: Cold Joining/Press-fit Task Group
The 5-21N task group is responsible for the handbook that explains accepted industry practices for users of IPC-9797. The handbook details the process techniques, equipment, materials, tests and acceptance requirements for the production of acceptable press-fit hardware.

During this meeting, the task group will provide an update on the development of content for IPC-HDBK-9798A, review action items assigned during previous meetings and review work that has been prepared by A-teams (A-teams topics: sustainability, cross-section, rework).

12:00 pm-1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:00 pm
2-17A: IPC-CFX Standard Task Group
The 2-17A task group is responsible for the management of IPC-2591, Connected Factory Exchange, which establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.

During this meeting, representatives from the task group A-Team will provide updates on progress made to date for IPC-2591, Version 2.0, which will be released in 2024. Some of these updates include the addition of capabilities for hand soldering stations and wave soldering, additional communications to support sustainability data exchange and a supporting IPC-CFX implementation guideline.

1:30 pm-5:30 pm
7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group
The 7-31FHV task group is looking at high voltage cable applications in the electric mobility industry.

The task group will be developing content for the High Voltage Addendum.

Smart Plastics Congress
The 9th Smart Plastics Congress will focus on plastronics, printed electronics and surface functionalization and the results of research projects and the latest technological innovations. To fully register for this congress please also register using the following link: https://9th-smart-plastics-congress.b2match.io/

D-25A: High Speed High Frequency Communication Devices Subcommittee
Task group developing requirements for mechanical properties, electrical test conditions, interconnections and plug-in technologies for high-speed connections in high reliability applications, such as automotive.

During this meeting, the task group will provide an overview of the work has been done so far in development of IPC-3711, review action items and define a common understanding of some electrical test conditions and parameters.

3:30 pm–5:30 pm
2-19A: Critical Components Traceability Task Group
The 2-19A task group is responsible for the management of IPC-1782, Standard for Manufacturing and Supply Chain Traceability of Electronic Products, which establishes minimum requirements for traceability of items throughout the entire supply chain.

This task group recently released IPC-1782B and is seeking industry input on schemas to collect IPC-1782 data and additional needs to expand the standard to other operations.

8:00 am-8:45 am | Morning Keynote Session, Port Vell Room Networking Area

9:00 am-10:15 am
5-21H: Bottom Termination Components (BTC) Task Group
The 5-21H task group is maintaining IPC-7093, a companion document to IPC-7094 and IPC-7095 that describes the design and assembly challenges for implementing Bottom Termination Components (BTCs) whose external connections consist of metalized terminations that are an integral part of the component body.

During this meeting, the task group will provide an update on the development of content for IPC-7093, review main changes have been made so far for the next revision and brainstorm additional needs for further development.

2-12A: Generic Requirements for Digital Twin Task Group
The 2-12A task group is responsible for maintaining IPC-2551, International Standard for Digital Twin Architecture, which stipulates and defines Digital Twin properties, types, complexities and readiness levels.

This meeting will provide a review of the content of this standard and how it applies to real-world use cases and an opportunity for industry to provide input on expansion of the standard for additional use cases.

9:00 am-12:00 pm
5-22A and 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting
The 5-22A task group is responsible for the joint industry soldering standard, J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies.

The 7-31B task group is responsible for maintaining IPC-A-610 Acceptability of Electronic Assemblies.

During this meeting, the task group will be resolving comments for Revision K.

7-25A: Automated Optical Inspection Process Control Standard Task Group
This task group is developing IPC-9716, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies, which provides requirements for automated inspection systems to define, set up, establish and apply process control for manufacturing printed board assemblies, including general and specific process and equipment conditions.

During this meeting, representatives from the task group A-Team will provide an update on the development of content for IPC-9716, which is scheduled for release this year, and explain areas of the draft that would benefit from additional contributions from industry. The group leadership will also introduce a new standards project for AOI process control for IC substrates and how to participate in that initiative.

Smart Plastics Congress
The 9th Smart Plastics Congress will focus on plastronics, printed electronics and surface functionalization and the results of research projects and the latest technological innovations. A visit to EURECAT's plastronics pilot plant is planned as an afternoon activity. To fully register for this congress please also register using the following link: https://9th-smart-plastics-congress.b2match.io/

9:00 am-5:30 pm
E-31 Supplier Declaration Subcommittee
The E-31 subcommittee establishes the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration (sectional standards). The requirements for declaring information about a specific declaration topic are specified in the IPC-175x sectional standards.

During this meeting, the subcommittee will discuss ongoing work related to overhauling the framework of the IPC-175x standards family to be more modular and user-friendly, including the conversion of current XML-based schema to JSON. Individual task group actions will also be discussed as needed, including ongoing revision efforts related to IPC-1751, IPC-1753, and IPC-1755. This is a two-day meeting and participants are encouraged to attend both sessions (Tuesday, 23 January and Wednesday, 24 January).

10:30 am–12:00 pm
2-12B: Model Based Definition (MBD) for Digital Twins Task Group
The 2-12B task group is responsible for maintaining IPC/DAC -2552, General Electronic Components Model Based Definition (MBD) Standard, a set of specification elements for components and parts as part of a digital model-based standard for digital design of board-level assemblies and to support virtual manufacturing.

During this meeting, task group leadership will provide updates on its progress on the next version of this standard as well as an explanation on the benefits of this standard to industry.

IPC-V-TSL-MVIA-EU: Micro Via Task Group
The IPC-V-TSL-MVIA-EU has been raised in 2022 to address microvia reliability in the European HDI PCB supply chain. The objectives of the subcommittee are to gather experts from EU high-rel electronics manufacturing industry, to execute a specific first work proposal, as well as to identify future ones, and to strengthen EU industry presence in IPC standardization on microvias. The leadership of the subcommittee will provide the motivation for the ongoing work, and include a call to participate. Newcomers are welcome!

10:30 am–5:30 pm
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum Task Group
This Task Group is responsible for maintaining an addendum to J-STD-001 and IPC-A-610 to enable users to specify a standardized set of acceptance criteria unique to assemblies used in the automotive industry.

During this meeting, the task group will be preparing content for the Final Draft for Industry Review.

12:00 pm-1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:00 pm
5-22AS: Space and Military Electronic Assemblies Task Group
The 5-22AS Task Group is responsible for maintaining an addendum to J-STD-001 to enable users to specify a standardized set of acceptance criteria unique to electronic assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.

The J-STD-001 Space Addendum is ready for Final Draft for Industry Review, during this meeting the group will discuss the next steps.

1:30 pm–3:15 pm
D-31B: IPC-2221/2222 Task Group
This task group is reviewing the latest IPC-2221C revision release and establishing goals for an Amendment 1 to IPC-2221C and a revision to the IPC-2226A standard for HDI/Microvia Design.

2-12C: Cybersecurity Protection Standard Task Group
The 2-12C task group is responsible for maintaining IPC-1792, Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain, which establishes requirements to provide assurance that products have been manufactured in cybersecure environments, ensuring that there has been no risk of impact to the product due to cybersecurity incidents.

During this meeting, task group leadership provide updates on the status of a first amendment to IPC-1792 as well as a white paper on how to implement the standard, both of which are scheduled for release this year.

1:30 pm–5:30 pm
5-33A: Conformal Coating Task Group
The 5-33A task group is responsible for maintaining IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies and the associated test methods.

The committee will review tests methods, in particular Dielectric Withstanding Voltage, Thermal Shock and Moisture and Insulation Resistance.

Discussion on their suitability in their current form, and to canvass opinions about any needs for revisions. Previous discussion have been conducted on the MIR test, and will recap those conclusions.

3:15 pm–4:15 pm
7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
The 7-31FS Task Group is responsible for maintaining an addendum to IPC/WHMA-A-620 to enable users to specify a standardized set of acceptance criteria unique to cable and wire harness assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.

During this meeting, the group will be discussing the content and seeking input from industry.

3:30 pm-5:30 pm
D-33-AP: Ultra HDI Subcommittee
This subcommittee is developing a white paper outlining the need for future design and fabrication guidelines for printed boards utilizing conductors/spacings below 50 µm and dielectric spacings below 75 µm that are manufactured with semi-additive and modified semi-additive processing.

2-12D: Digital Sustainability Credentials Standard Task Group
The 2-12D task group is responsible for developing IPC-2553 Global Standard for Digital Sustainability Credentials, which establishes the framework, content definition and secure interoperability mechanism that provides the needed ability to exchange factors that influence environmental sustainability, without the risk of IP leakage, in a way that scales from the original source of materials, through to the final product.

During this meeting, attendees will learn about the concepts behind this new standard and how it will apply to real-world usage. Representatives from the task group A-Team will also provide an update on the development of content for the standard and plans it is developing for a proof-of-concept project for this standard using IPC-CFX.

4:30 pm–5:30 pm
7-34: Repairability Subcommittee
The 7-34 subcommittee is responsible for the maintenance of IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies.

During this meeting, the task group will be seeking input from industry on the recently released Revision D.

8:00 am-8:45 | Morning Keynote Session, Port Vell Room Networking Area

9:00 am–12:00 pm
D-33A and 7-31A: Rigid Printed Bd. and IPC-A-600 Task Group Joint Meeting
With the publication of IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards, this joint task group effort will be focusing on industry submissions of photographs for the upcoming Revision M to IPC-A-600, Acceptability of Printed Boards.

D-84A: Plastronics Accelerated Reliability Testing Task Group
The D-84A task group is responsible for the development of IPC-9206 Guidelines for Accelerated Reliability Testing of 3D Plastronics Parts, to enable users to specify a standardized set of testing guidelines to verify the reliability of 3D plastronics end products, such as in-mold electronics and laser surface activated molded integrated devices.

During this meeting, the task group will continue the development phase by reviewing the latest working draft content provided by the A-Teams on high temperature, thermal cycling, and vibration testing guidelines. Discussions on the classification system, applicable testing and definitions.

B-10A: Plastic Chip Carrier Cracking Task Group
The B-10A task group was formed based on concerns raised at the Surface Mount Council regarding cracking observed in plastic chip components.

This committee is at the inception of the review and revise of the J-STD-033 and would like to get additional active volunteer support from industry.

D-70: E-Textiles Committee
Task groups within this committee are responsible for maintaining and developing IPC standards for conductive yarn functionality; printed electronics e-textiles reliability; woven, knitted and braided e-textiles functionality; embroidered e-textiles design; reliability of e-textiles wearables and multiple new IPC Test Methods to support requirements in these standards.

During this meeting, leaders from each of the task groups will provide updates on their progress, including IPC-8921A (woven, knitted and braided e-textiles), IPC-8981 (e-textiles wearables reliability) and its 14 new IPC Test Methods, IPC-8961 (e-textiles guideline), IPC/JPCA-8911 (conductive yarn) and IPC-8953 (embroidered e-textiles design requirements). Attendees will learn how they can participate in any of these activities and learn about or propose new e-textiles standards activities.

9:00 am–4:30 pm
7-31F: IPC/WHMA-A-620 Task Group
This task group is responsible for maintaining IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies

During this meeting, the task group will be resolving comments for Revision F.

9:00 am–5:30 pm
E-31 Supplier Declaration Subcommittee
The E-31 subcommittee establishes the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration (sectional standards). The requirements for declaring information about a specific declaration topic are specified in the IPC-175x sectional standards.

During this meeting, the subcommittee will discuss ongoing work related to overhauling the framework of the IPC-175x standards family to be more modular and user-friendly, including the conversion of current XML-based schema to JSON. Individual task group actions will also be discussed as needed, including ongoing revision efforts related to IPC-1751, IPC-1753, and IPC-1755. This is a two-day meeting and participants are encouraged to attend both sessions (Tuesday, 23 January and Wednesday, 24 January).

12:00 pm–1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–5:30 pm
D-33AA: IPC-6012 Automotive Addendum
The D-33AA task group is chartered with maintaining an addendum to the IPC-6012, Qualification and Performance Specification for Rigid Printed Boards, that will provide specific requirements for printed boards in automotive applications.

During this meeting, the task group will provide an update on the development of content for IPC-6012FA, review current working draft and work that has been prepared by A-teams (A-teams topics: microvia, CAF, high-voltage test method, metal base printed boards, end of the life test method).

1-14: DFX Standards Subcommittee
The 1-14 subcommittee is developing guidelines for the application of industry standards in DFM (design for manufacturing), DFR (design for reliability) DFA (design for assembly), etc.

This session will focus on reviewing proposed changes to the IPC-2231A in preparation for FDIR.

D-83A: In-Mold Electronics Interconnection Task Group
The D-83A Task Group is responsible for the development of IPC-8411 Guidelines for In-Mold Electronics, to enable users to specify a standardized set of guidelines for the integration of printed electronics and electrical components into injection molded plastics to form 3D plastronic parts.

During this meeting, the task group will review the working draft and resolve a pending discussion on definitions. The group will focus on new and pending comments for resolution to go into Final Draft for Industry Review (FDIR) after this meeting as planned by the leadership.

4:30 pm–5:30 pm
7-31J: IPC-A-630 Task Group
The 7-31J task group is responsible for the maintenance of IPC-A-630 Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures and IPC-HDBK-630 Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures.

During this meeting, the group will be reviewing the Final Draft for Industry Review.

8:00 am–9:00 am | Morning Keynote Session, Port Vell Room Networking Area

9:00 am–3:00 pm
V-EUTG: European Training Group
This is the European Training Group/Committee for ALL IPC Training Programs. Meeting open to ALL training committee members, EU and International. V-EUTG is responsible for reviewing course content, including program translations, and providing recommendations for the training and certification programs.

During this meeting, the group leadership will provide updates on status of certification programs, translation activities and available resources, followed by discussions and comments disposition (if applicable) for each committee: 7-31BT – 610 Training, 5-22BT – 001 Training, 7-31FT- 620 Training, 7-34T – 7711/7721 Training, D-33AT &7-31AT – 6012 & 600 Training, V-TPTG – Training Programs Translation Group. Attendees will learn how they can join a training committee and participate in any of these activities.

9:00 am–12:00 pm
D-83A: In-Mold Electronics Interconnection Task Group
The D-83A Task Group is responsible for the development of IPC-8411 Guidelines for In-Mold Electronics, to enable users to specify a standardized set of guidelines for the integration of printed electronics and electrical components into injection molded plastics to form 3D plastronic parts.

During this meeting, the task group will continue to review the working draft focusing on new and pending comments for resolution to go into Final Draft for Industry Review (FDIR) after this meeting as planned by the leadership.

9:00 am-12:00 pm
2-40: Documentation Committee

This meeting of the 2-40 Documentation Committee is to review proposed changes to the IPC-261x series of documentation documents, including a proposed new document that synthesizes the content of IPC-2611, IPC-2612, IPC-2612-1, IPC-2614, and IPC-2615, and IPC-D-325.

12:00 pm–1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:15 pm
5-21JND: Solder Paste Printing Task Group
This task group is responsible for the maintenance of IPC-7527 Requirements for Solder Paste Application.

During this meeting, the task group will review the updates on the working draft for Revision A in preparation for going into Final Draft for Industry Review (FDIR) after the meeting.

1:30 pm–5:30 pm
5-33C: Conformal Coating Handbook Task Group
The 5-33C task group is responsible for the maintenance of the IPC-HDBK-830 Guidelines for Design, Selection, and Application of Conformal Coatings.

The group is in the inception of the review of IPC-HDBK-830 handbook, the committee is collecting new content that is not currently available to the industry. In addition, technical support and guidance is needed to complete the current actions that are open and will be discussed during these meetings.

3:15 pm-5:30 pm
7-31N: Manual Magnification Aides Task Group

The 7-31N task group is responsible for IPC-9904 providing guidelines for manual magnification.

During this meeting, the group will be developing content for IPC-9904.

8:00 am-8:45 am | Welcome Remarks and Keynote Session, Port Vell Room Networking Area

9:00 am-5:30 pm
5-22A and 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting
The 5-22A task group is responsible for the joint industry soldering standard, J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies.

The 7-31B task group is responsible for maintaining IPC-A-610 Acceptability of Electronic Assemblies.

The group will be resolving comments for Revision K.

9:00 am-12:00 pm
5-33C: Conformal Coating Handbook Task Group
The 5-33C task group is responsible for the maintenance of the IPC-HDBK-830 Guidelines for Design, Selection, and Application of Conformal Coatings.

The group is in the inception of the review of IPC-HDBK-830 handbook, the committee is collecting new content that is not currently available to the industry. In addition, technical support and guidance is needed to complete the current actions that are open and will be discussed during these meetings.

5-21N: Cold Joining/Press-fit Task Group
The 5-21N task group is responsible for the handbook that explains accepted industry practices for users of IPC-9797. The handbook details the process techniques, equipment, materials, tests and acceptance requirements for the production of acceptable press-fit hardware.

During this meeting, the task group will provide an update on the development of content for IPC-HDBK-9798A, review action items assigned during previous meetings and review work that has been prepared by A-teams (A-teams topics: sustainability, cross-section, rework).

12:00 pm-1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:00 pm
2-17A: IPC-CFX Standard Task Group
The 2-17A task group is responsible for the management of IPC-2591, Connected Factory Exchange, which establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.

During this meeting, representatives from the task group A-Team will provide updates on progress made to date for IPC-2591, Version 2.0, which will be released in 2024. Some of these updates include the addition of capabilities for hand soldering stations and wave soldering, additional communications to support sustainability data exchange and a supporting IPC-CFX implementation guideline.

1:30 pm-5:30 pm
7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group
The 7-31FHV task group is looking at high voltage cable applications in the electric mobility industry.

The task group will be developing content for the High Voltage Addendum.

Smart Plastics Congress
The 9th Smart Plastics Congress will focus on plastronics, printed electronics and surface functionalization and the results of research projects and the latest technological innovations. To fully register for this congress please also register using the following link: https://9th-smart-plastics-congress.b2match.io/

D-25A: High Speed High Frequency Communication Devices Subcommittee
Task group developing requirements for mechanical properties, electrical test conditions, interconnections and plug-in technologies for high-speed connections in high reliability applications, such as automotive.

During this meeting, the task group will provide an overview of the work has been done so far in development of IPC-3711, review action items and define a common understanding of some electrical test conditions and parameters.

3:30 pm–5:30 pm
2-19A: Critical Components Traceability Task Group
The 2-19A task group is responsible for the management of IPC-1782, Standard for Manufacturing and Supply Chain Traceability of Electronic Products, which establishes minimum requirements for traceability of items throughout the entire supply chain.

This task group recently released IPC-1782B and is seeking industry input on schemas to collect IPC-1782 data and additional needs to expand the standard to other operations.

8:00 am-8:45 am | Morning Keynote Session, Port Vell Room Networking Area

9:00 am-10:15 am
5-21H: Bottom Termination Components (BTC) Task Group
The 5-21H task group is maintaining IPC-7093, a companion document to IPC-7094 and IPC-7095 that describes the design and assembly challenges for implementing Bottom Termination Components (BTCs) whose external connections consist of metalized terminations that are an integral part of the component body.

During this meeting, the task group will provide an update on the development of content for IPC-7093, review main changes have been made so far for the next revision and brainstorm additional needs for further development.

2-12A: Generic Requirements for Digital Twin Task Group
The 2-12A task group is responsible for maintaining IPC-2551, International Standard for Digital Twin Architecture, which stipulates and defines Digital Twin properties, types, complexities and readiness levels.

This meeting will provide a review of the content of this standard and how it applies to real-world use cases and an opportunity for industry to provide input on expansion of the standard for additional use cases.

9:00 am-12:00 pm
5-22A and 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting
The 5-22A task group is responsible for the joint industry soldering standard, J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies.

The 7-31B task group is responsible for maintaining IPC-A-610 Acceptability of Electronic Assemblies.

During this meeting, the task group will be resolving comments for Revision K.

7-25A: Automated Optical Inspection Process Control Standard Task Group
This task group is developing IPC-9716, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies, which provides requirements for automated inspection systems to define, set up, establish and apply process control for manufacturing printed board assemblies, including general and specific process and equipment conditions.

During this meeting, representatives from the task group A-Team will provide an update on the development of content for IPC-9716, which is scheduled for release this year, and explain areas of the draft that would benefit from additional contributions from industry. The group leadership will also introduce a new standards project for AOI process control for IC substrates and how to participate in that initiative.

Smart Plastics Congress
The 9th Smart Plastics Congress will focus on plastronics, printed electronics and surface functionalization and the results of research projects and the latest technological innovations. A visit to EURECAT's plastronics pilot plant is planned as an afternoon activity. To fully register for this congress please also register using the following link: https://9th-smart-plastics-congress.b2match.io/

9:00 am-5:30 pm
E-31 Supplier Declaration Subcommittee
The E-31 subcommittee establishes the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration (sectional standards). The requirements for declaring information about a specific declaration topic are specified in the IPC-175x sectional standards.

During this meeting, the subcommittee will discuss ongoing work related to overhauling the framework of the IPC-175x standards family to be more modular and user-friendly, including the conversion of current XML-based schema to JSON. Individual task group actions will also be discussed as needed, including ongoing revision efforts related to IPC-1751, IPC-1753, and IPC-1755. This is a two-day meeting and participants are encouraged to attend both sessions (Tuesday, 23 January and Wednesday, 24 January).

10:30 am–12:00 pm
2-12B: Model Based Definition (MBD) for Digital Twins Task Group
The 2-12B task group is responsible for maintaining IPC/DAC -2552, General Electronic Components Model Based Definition (MBD) Standard, a set of specification elements for components and parts as part of a digital model-based standard for digital design of board-level assemblies and to support virtual manufacturing.

During this meeting, task group leadership will provide updates on its progress on the next version of this standard as well as an explanation on the benefits of this standard to industry.

IPC-V-TSL-MVIA-EU: Micro Via Task Group
The IPC-V-TSL-MVIA-EU has been raised in 2022 to address microvia reliability in the European HDI PCB supply chain. The objectives of the subcommittee are to gather experts from EU high-rel electronics manufacturing industry, to execute a specific first work proposal, as well as to identify future ones, and to strengthen EU industry presence in IPC standardization on microvias. The leadership of the subcommittee will provide the motivation for the ongoing work, and include a call to participate. Newcomers are welcome!

10:30 am–5:30 pm
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum Task Group
This Task Group is responsible for maintaining an addendum to J-STD-001 and IPC-A-610 to enable users to specify a standardized set of acceptance criteria unique to assemblies used in the automotive industry.

During this meeting, the task group will be preparing content for the Final Draft for Industry Review.

12:00 pm-1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:00 pm
5-22AS: Space and Military Electronic Assemblies Task Group
The 5-22AS Task Group is responsible for maintaining an addendum to J-STD-001 to enable users to specify a standardized set of acceptance criteria unique to electronic assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.

The J-STD-001 Space Addendum is ready for Final Draft for Industry Review, during this meeting the group will discuss the next steps.

1:30 pm–3:15 pm
D-31B: IPC-2221/2222 Task Group
This task group is reviewing the latest IPC-2221C revision release and establishing goals for an Amendment 1 to IPC-2221C and a revision to the IPC-2226A standard for HDI/Microvia Design.

2-12C: Cybersecurity Protection Standard Task Group
The 2-12C task group is responsible for maintaining IPC-1792, Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain, which establishes requirements to provide assurance that products have been manufactured in cybersecure environments, ensuring that there has been no risk of impact to the product due to cybersecurity incidents.

During this meeting, task group leadership provide updates on the status of a first amendment to IPC-1792 as well as a white paper on how to implement the standard, both of which are scheduled for release this year.

1:30 pm–5:30 pm
5-33A: Conformal Coating Task Group
The 5-33A task group is responsible for maintaining IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies and the associated test methods.

The committee will review tests methods, in particular Dielectric Withstanding Voltage, Thermal Shock and Moisture and Insulation Resistance.

Discussion on their suitability in their current form, and to canvass opinions about any needs for revisions. Previous discussion have been conducted on the MIR test, and will recap those conclusions.

3:15 pm–4:15 pm
7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
The 7-31FS Task Group is responsible for maintaining an addendum to IPC/WHMA-A-620 to enable users to specify a standardized set of acceptance criteria unique to cable and wire harness assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.

During this meeting, the group will be discussing the content and seeking input from industry.

3:30 pm-5:30 pm
D-33-AP: Ultra HDI Subcommittee
This subcommittee is developing a white paper outlining the need for future design and fabrication guidelines for printed boards utilizing conductors/spacings below 50 µm and dielectric spacings below 75 µm that are manufactured with semi-additive and modified semi-additive processing.

2-12D: Digital Sustainability Credentials Standard Task Group
The 2-12D task group is responsible for developing IPC-2553 Global Standard for Digital Sustainability Credentials, which establishes the framework, content definition and secure interoperability mechanism that provides the needed ability to exchange factors that influence environmental sustainability, without the risk of IP leakage, in a way that scales from the original source of materials, through to the final product.

During this meeting, attendees will learn about the concepts behind this new standard and how it will apply to real-world usage. Representatives from the task group A-Team will also provide an update on the development of content for the standard and plans it is developing for a proof-of-concept project for this standard using IPC-CFX.

4:30 pm–5:30 pm
7-34: Repairability Subcommittee
The 7-34 subcommittee is responsible for the maintenance of IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies.

During this meeting, the task group will be seeking input from industry on the recently released Revision D.

8:00 am-8:45 | Morning Keynote Session, Port Vell Room Networking Area

9:00 am–12:00 pm
D-33A and 7-31A: Rigid Printed Bd. and IPC-A-600 Task Group Joint Meeting
With the publication of IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards, this joint task group effort will be focusing on industry submissions of photographs for the upcoming Revision M to IPC-A-600, Acceptability of Printed Boards.

D-84A: Plastronics Accelerated Reliability Testing Task Group
The D-84A task group is responsible for the development of IPC-9206 Guidelines for Accelerated Reliability Testing of 3D Plastronics Parts, to enable users to specify a standardized set of testing guidelines to verify the reliability of 3D plastronics end products, such as in-mold electronics and laser surface activated molded integrated devices.

During this meeting, the task group will continue the development phase by reviewing the latest working draft content provided by the A-Teams on high temperature, thermal cycling, and vibration testing guidelines. Discussions on the classification system, applicable testing and definitions.

B-10A: Plastic Chip Carrier Cracking Task Group
The B-10A task group was formed based on concerns raised at the Surface Mount Council regarding cracking observed in plastic chip components.

This committee is at the inception of the review and revise of the J-STD-033 and would like to get additional active volunteer support from industry.

D-70: E-Textiles Committee
Task groups within this committee are responsible for maintaining and developing IPC standards for conductive yarn functionality; printed electronics e-textiles reliability; woven, knitted and braided e-textiles functionality; embroidered e-textiles design; reliability of e-textiles wearables and multiple new IPC Test Methods to support requirements in these standards.

During this meeting, leaders from each of the task groups will provide updates on their progress, including IPC-8921A (woven, knitted and braided e-textiles), IPC-8981 (e-textiles wearables reliability) and its 14 new IPC Test Methods, IPC-8961 (e-textiles guideline), IPC/JPCA-8911 (conductive yarn) and IPC-8953 (embroidered e-textiles design requirements). Attendees will learn how they can participate in any of these activities and learn about or propose new e-textiles standards activities.

9:00 am–4:30 pm
7-31F: IPC/WHMA-A-620 Task Group
This task group is responsible for maintaining IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies

During this meeting, the task group will be resolving comments for Revision F.

9:00 am–5:30 pm
E-31 Supplier Declaration Subcommittee
The E-31 subcommittee establishes the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration (sectional standards). The requirements for declaring information about a specific declaration topic are specified in the IPC-175x sectional standards.

During this meeting, the subcommittee will discuss ongoing work related to overhauling the framework of the IPC-175x standards family to be more modular and user-friendly, including the conversion of current XML-based schema to JSON. Individual task group actions will also be discussed as needed, including ongoing revision efforts related to IPC-1751, IPC-1753, and IPC-1755. This is a two-day meeting and participants are encouraged to attend both sessions (Tuesday, 23 January and Wednesday, 24 January).

12:00 pm–1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–5:30 pm
D-33AA: IPC-6012 Automotive Addendum
The D-33AA task group is chartered with maintaining an addendum to the IPC-6012, Qualification and Performance Specification for Rigid Printed Boards, that will provide specific requirements for printed boards in automotive applications.

During this meeting, the task group will provide an update on the development of content for IPC-6012FA, review current working draft and work that has been prepared by A-teams (A-teams topics: microvia, CAF, high-voltage test method, metal base printed boards, end of the life test method).

1-14: DFX Standards Subcommittee
The 1-14 subcommittee is developing guidelines for the application of industry standards in DFM (design for manufacturing), DFR (design for reliability) DFA (design for assembly), etc.

This session will focus on reviewing proposed changes to the IPC-2231A in preparation for FDIR.

D-83A: In-Mold Electronics Interconnection Task Group
The D-83A Task Group is responsible for the development of IPC-8411 Guidelines for In-Mold Electronics, to enable users to specify a standardized set of guidelines for the integration of printed electronics and electrical components into injection molded plastics to form 3D plastronic parts.

During this meeting, the task group will review the working draft and resolve a pending discussion on definitions. The group will focus on new and pending comments for resolution to go into Final Draft for Industry Review (FDIR) after this meeting as planned by the leadership.

4:30 pm–5:30 pm
7-31J: IPC-A-630 Task Group
The 7-31J task group is responsible for the maintenance of IPC-A-630 Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures and IPC-HDBK-630 Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures.

During this meeting, the group will be reviewing the Final Draft for Industry Review.

8:00 am–9:00 am | Morning Keynote Session, Port Vell Room Networking Area

9:00 am–3:00 pm
V-EUTG: European Training Group
This is the European Training Group/Committee for ALL IPC Training Programs. Meeting open to ALL training committee members, EU and International. V-EUTG is responsible for reviewing course content, including program translations, and providing recommendations for the training and certification programs.

During this meeting, the group leadership will provide updates on status of certification programs, translation activities and available resources, followed by discussions and comments disposition (if applicable) for each committee: 7-31BT – 610 Training, 5-22BT – 001 Training, 7-31FT- 620 Training, 7-34T – 7711/7721 Training, D-33AT &7-31AT – 6012 & 600 Training, V-TPTG – Training Programs Translation Group. Attendees will learn how they can join a training committee and participate in any of these activities.

9:00 am–12:00 pm
D-83A: In-Mold Electronics Interconnection Task Group
The D-83A Task Group is responsible for the development of IPC-8411 Guidelines for In-Mold Electronics, to enable users to specify a standardized set of guidelines for the integration of printed electronics and electrical components into injection molded plastics to form 3D plastronic parts.

During this meeting, the task group will continue to review the working draft focusing on new and pending comments for resolution to go into Final Draft for Industry Review (FDIR) after this meeting as planned by the leadership.

9:00 am-12:00 pm
2-40: Documentation Committee

This meeting of the 2-40 Documentation Committee is to review proposed changes to the IPC-261x series of documentation documents, including a proposed new document that synthesizes the content of IPC-2611, IPC-2612, IPC-2612-1, IPC-2614, and IPC-2615, and IPC-D-325.

12:00 pm–1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:15 pm
5-21JND: Solder Paste Printing Task Group
This task group is responsible for the maintenance of IPC-7527 Requirements for Solder Paste Application.

During this meeting, the task group will review the updates on the working draft for Revision A in preparation for going into Final Draft for Industry Review (FDIR) after the meeting.

1:30 pm–5:30 pm
5-33C: Conformal Coating Handbook Task Group
The 5-33C task group is responsible for the maintenance of the IPC-HDBK-830 Guidelines for Design, Selection, and Application of Conformal Coatings.

The group is in the inception of the review of IPC-HDBK-830 handbook, the committee is collecting new content that is not currently available to the industry. In addition, technical support and guidance is needed to complete the current actions that are open and will be discussed during these meetings.

3:15 pm-5:30 pm
7-31N: Manual Magnification Aides Task Group

The 7-31N task group is responsible for IPC-9904 providing guidelines for manual magnification.

During this meeting, the group will be developing content for IPC-9904.

Event Venue: World Trade Center Barcelona

Moll de Barcelona S/N
South Building
08039 Barcelona
Spain

World Trade Center Barcelona Website

World Trade Center Barcelona

Moll de Barcelona S/N
South Building
08039 Barcelona Barcelona
Spain

World Trade Center Barcelona

World Trade Center Barcelona
Moll de Barcelona S/N
Barcelona, B 08039
Spain

Registration Closed
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