IPC Commends President Biden for Executive Order on Industrial Supply Chains

IPC commends President Biden for ordering a review of industrial supply chains critical to U.S. economic growth, innovation, and security.

The crippling shortage of semiconductor chips underscores the economic and national security importance of restoring U.S. leadership in electronics manufacturing.       

The U.S. printed circuit board industry, which once accounted for more than 30 percent of total global production, today accounts for less than 5 percent. Only four of the top 20 electronics manufacturing services (EMS) companies are based in the United States.                                                                                  

Since around 2000, the drive for low-cost electronics has pushed hardware manufacturing offshore, often to countries that understood the strategic importance of electronics manufacturing and heavily promoted and subsidized the growth of their domestic industries.                                                                                 

But this drawdown in American manufacturing has increased volatility and undermined the supply chains that are critical for electronics manufacturing and other sectors to operate smoothly. And this isn’t the first time that we’ve experienced shortages as a result. During the pandemic, a shortage in printed circuit boards slowed the production of ventilators when hospitals around the world were in desperate need.    

As the Biden administration undertakes its review of U.S. supply chains, IPC urges it to recognize two important realities about electronics manufacturing:

  1. Electronics manufacturing is a foundation for the manufacturing sector across the U.S. economy. Virtually every other sector relies on electronics to greater or lesser extent.
  2. U.S. leaders must see the electronics supply chain as an ecosystem. All segments of the electronics industry must be strong for the entire ecosystem to thrive. Semiconductor fabrication is just one segment in a sophisticated, global supply chain for electronics.

The good news is that the time is ripe for greater U.S. government support of manufacturing. The industry is on the cusp of transformation, powered by artificial intelligence, automation, quantum computing, and blockchain technologies. With U.S. government support, American companies will find new opportunities to compete in the global marketplace while creating new, skilled jobs for American workers.                             

The review ordered by President Biden should assess electronics manufacturing holistically. Praiseworthy investments in semiconductor manufacturing (including those envisioned in the CHIPS for America Act) also require investments in other segments of the industry. The government should support the industry’s migration to the factory of the future by creating and sustaining programs to drive capital expenditures, workforce education and credentialing, research and development of core technologies, and more robust domestic availability of raw materials. 

A New Trade Policy for Europe in a Changed World

Feb 22, 2021

The European Commission on February 18 released its new Trade Policy Review, outlining policy directions for an EU that is open to trade and investment, focused on climate and labor rights, assertive against unfair practices, and determined to remain globally competitive. The communication fleshes out an EU trade policy strategy called “open strategic autonomy” – open where possible, autonomous where needed, and adapted to reflect the challenges of our times.

Fortunately, the EC’s approach aligns well with IPC’s comments to EC officials during our IMPACT advocacy event in Brussels in November, as well as the written comments we submitted during the consultation phase of the review. Specifically, IPC welcomes the emphasis on striking a balance between a market that is open for trade and investment and one that protects European interests in strategic areas. IPC also supports the document’s call for strengthening the multilateral trading system and the World Trade Organization (WTO); ensuring supply chain resiliency; and building strategic partnerships with like-minded partners.

The communication also reflects IPC’s call for a strong but mature EU-China relationship. With the EU-China Comprehensive Agreement on Investment (CAI) agreed in principle at the end of 2020, the focus is now on ensuring effective implementation of the agreement, including market access and ensuring a level playing field for European companies in the Chinese market. Meanwhile, the EC has prioritized the reset of the transatlantic relationship as well.

Of additional note for electronics manufacturers, the commission will continue working towards harmonizing preferential rules of origin in EU free trade agreements. This move would alleviate the administrative burden on companies affected by various requirements under existing agreements.  The commission will also propose legislation for the enforcement of trade-related provisions of the EU-UK Trade and Co-operation Agreement. To ensure resiliency and diversification, the EU is also looking to forge closer ties with its neighbors in the region and in Africa.

Finally, with resiliency as a compass for EU policy going forward, the review highlights the promotion of sustainable and responsible value chains pending the commission’s proposal on mandatory due diligence as part of a broader focus on sustainable corporate governance. IPC has submitted comments to the EC consultation on this topic in February, and we will continue to work collaboratively as the proposal moves forward.  In the interim, pressure is building to ensure that forced labor does not find a place in the value chains of EU companies.

Clearly, the commission is pursuing an ambitious, integrated trade policy agenda, and there is much at stake for our industry. The coming decade will provide the contours of a new agenda shaping industrial competitiveness in a greener and fairer world.  IPC’s aim is to contribute to this agenda and advocate for a policy framework that enables our members to compete and thrive.

For more information, please contact me at AlisonJames@ipc.org.

 

 

 

IPC MITs to Utilize IPC APEX EXPO Professional Development Courses to Earn Continuing Education Points Toward Recertification

Master IPC Trainers (MITs) working to renew certification through continuing education now have an additional 29 opportunities via professional development courses offered at IPC APEX EXPO 2021.    

An MIT certificant seeking to renew their certification must obtain a minimum of 25 points during their two-year period of certification. All 29 IPC APEX EXPO professional development courses offered both live and on-demand provide one point per one contact hour and are applicable toward continuing education requirements.         

Certificates of attendance will be e-mailed to all registered professional development course participants who complete one or more courses.                        

“Professional development is an integral component to IPC certification, as it allows a certificant to enhance their professional education while keeping them up to date on key topics within the industry,” said Dave Hernandez, IPC vice president of education. “IPC APEX EXPO’s professional development course offerings are perfect for a Master IPC Trainer who wants to take an advanced course on assembly processes, PCB fabrication, circuit design and component technologies, and more.”

For more information on professional development courses at IPC APEX EXPO 2021, visit www.ipcapexexpo.org.         

IPC Releases IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)

The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs) is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.              

IPC-7093A includes a step-by-step process on how to design and incorporate BTCs into any card layout. Comprehensive descriptions on how to successfully implement robust designs and assembly processes and troubleshooting guidance for common anomalies which can occur during BTC assembly are included.               

Revision A adds state-of-the-art guidance on critical elements for thermal pad design, thermal via usage, stencil design, assembly recommendations, reliability considerations, known issues/ defects to avoid. The standard’s multiple design point options enable reliable BTC designs.                                                                               

The standard is ideal for anyone involved with physical design, process and reliability engineers or managers who are responsible for design, assembly, inspection, and repair processes.                                                                                                          

“BTCs are in integral part of electronic designs today,” stated Matt Kelly, IPC chief technologist. “With increased product functionality, device miniaturization, and increased power consumption the need for optimized thermal management has never been higher.”                                           

For more information or to purchase IPC-7093A, visit the IPC Online Store.

Executives to Discuss Managing Challenges in Periods of Transition at IPC APEX EXPO 2021 Managers Forum

New and experienced managers will gather at the Managers Forum at IPC APEX EXPO on March 8 to discuss strategies for thriving during times of crisis.

Internationally recognized executives and technologists will offer lessons learned during past disruptions such as transportation interruption, trade restriction, labor shortages, lockdowns, and technology innovation. Attendees will gain insight into how to solve problems with applications that lead to factory of the future implementation, including information on employee upskilling, materials, analytics, artificial intelligence, and robotics.

Industry experts and innovators will lead discussions on a wide range of topics for managing in times of transition, and emerging stronger. Representatives from FTG Corporation, Rogers Corporation, Cirtronics, Atotech Group, American Standards Circuits, Germany Industry 4.0 Campus, Luminovo GmbH, General Dynamics, GreenSource Fabrication & GreenSource Engineering, Schweitzer Engineering Laboratories, Vicor Corporation, Green Circuits, and IPC will provide critical insight on how best to move forward when presented with industry’s toughest challenges.

“Our industry has weathered many tough periods and learned from them every time,” said Tracy Riggan, senior director, business development at IPC. “This past year has yielded more than its share of disruption with the pandemic complicating existing geopolitical tensions, labor shortages and speeding up already increased technology advancement and causing logistics interruption and part shortages. These challenges continue and our early responses inform our success at meeting them now and being better prepared for the next big impact.”

“The purpose of the Managers Forum is to give managers of all experience levels the opportunity to gain new insights and learn firsthand how peers are achieving their goals and strengthening their organizations to ensure growth, especially during periods of uncertainty,” said Gene Weiner, president, Weiner International Associates and IPC Hall of Fame Council Program Chair, responsible for Managers’ Forum programming.

To register for the Managers’ Forum, or for more information on all the activities taking place at IPC APEX EXPO, including the technical conference, professional development courses, networking activities and online exhibition, visit www.ipcapexexpo.org.

New Rules on PBTs Took Effect on February 5

Feb 10, 2021
| By Kelly Scanlon

The U.S. Environmental Protection Agency (EPA) has finalized five rules for persistent, bioaccumulative, and toxic (PBT) chemicals to reduce risks and exposures to the extent practicable. The final risk management rules became effective on February 5. Some of the PBTs have a history of use in the electronics industry. Here are two examples:

  • Decabromodiphenyl-ether (decaBDE) is a flame retardant in plastic enclosures for electronics products and in wire and cables for electronic equipment. The final rule prohibits the manufacture, import, and processing of decaBDE; prohibits its use in products and articles effective 60 days after publication of the final rule; and prohibits distribution in commerce of products and articles containing decaBDE one year after the effective date of the rule.
  • Phenol, isopropylated phosphate (3:1) (PIP (3:1)) is a plasticizer, flame retardant, anti-wear additive, or anti-compressibility additive in hydraulic fluid, lubricating oils, lubricants and greases, various industrial coatings, adhesives, sealants, and plastic articles. As a chemical that can perform several functions simultaneously, sometimes under extreme conditions, it has several distinctive applications. The final rule for PIP (3:1) has particularly restrictive risk management actions including the complete prohibition of processing and distribution in commerce of this substance or products containing this substance as of March 8, 2021. There are some exceptions to the prohibition, for example for new and replacement parts for automotive and aerospace industry applications, however, there are no electronics industry exceptions. It is important that persons manufacturing, processing, and distributing in commerce PIP (3:1) and PIP (3:1)-containing products or articles be notified of these restrictions and the effective date of March 8, 2021.

If these new rules will affect the electronics products that you manufacture, please contact the IPC Government Relations team. The team facilities industry responses and communications with policymakers and we can help you to share your knowledge and expertise with the EPA. 

 

 

 

Failure Analysis Case Studies on Solder De-Wetting for Electronics Products

An IPC APEX EXPO Technical Conference Session
Feb 09, 2021
| By Jasbir Bath

Failure analysis case studies on solder de-wetting for electronics products will be covered during IPC APEX EXPO technical conference session 03 on Wednesday, March 10. Koki Solder America has used defect analysis to determine the root cause of various defects experienced in the field. Over the many years of defect analysis, it has been determined that approximately 25 percent of all case studies have been due to de-wetting issues.

De-wetting is an issue with the solder joint where the molten solder and the substrate/component repel each other during the soldering process. Due to this, a very weak intermetallic bond (or no bond at all) is formed at the interface after reflow leading to defective and unreliable solder joints.

Case studies will be reviewed based on root cause analysis and countermeasures to prevent these defects. These case studies are related to inferior component/board plating quality, contaminated plating on both the PCB as well as the component, Foreign Object Debris (FOD) as a cause of the de-wetting of solder, damaged component plating and improper off-set solder paste printing.

For the Inferior board plating/ surface finish quality case study, solder de-wetting occurred on the pad substrate. The surface and cross-sectional observation of the HAL (Hot air solder level) board surface finish treatment was performed using an optical microscope and a SEM (Scanning Electron Microscope).

For the Contaminated plating case study, solder de-wetting occurred on the pad substrate which had an OSP (Organic Solderability Preservative) board surface finish. SEM (Scanning Electron Microscope) with EDX (Energy Dispersive X-ray) analysis and X-ray observation was performed on the pad substrate for both good and poor solder wetting.

For the Foreign Object Debris (FOD) case study, de-wetting occurred at the SOT (Small Outline Transistor) component lead. By observing the SOT solder joint having de-wetting issues by optical microscope the foreign object debris was found. FT-IR (Fourier Transform Infra-Red) analysis was performed on the foreign object debris to identify it.

For the Damaged plating case study, solder de-wetting occurred on the tin (Sn)-plated component. The plated surface of the good and inferior solder wetted components was observed by SEM (Scanning Electron Microscope) with EDX (Energy Dispersive X-ray) analysis.

For the improper process condition setting case study, solder de-wetting occurred on the nickel-gold (NiAu) board pad substrate. Pad substrates with good and poor solder wetting were observed by optical microscope.

Assessment of the cause of the defects was based on company experience and knowledge with soldering defects, soldering materials and background/ experience with failure analysis work with discussion on possible solutions to defects observed. 

For more information on this technical conference session, visit the IPC APEX EXPO agenda planner.

Get Engaged with Sustainable Electronics

Feb 09, 2021
| By Kelly Scanlon

The electronics industry comprises experts in design and manufacturing of some really amazing products and we want to make sure that these experts know that there are many rewarding opportunities to elevate their knowledge and drive to build electronics better.

IPC and iNEMI are calling on these experts to participate in the development of a roadmap for sustainable electronics, provide insights in a technology integration group, and advance research projects that address recognized technology gaps.  You can collaborate with peers to identify gaps and then resolve them through research projects on topics such as materials efficiency, design criteria, extended reliability, and value recovery.

Join Kelly Scanlon, IPC’s director for environmental policy and research, as she talks with Mark Schaffer, iNEMI’s project manager sustainable electronics.  After you watch this short presentation, you will know about the rich opportunities for you as a future participant in sustainable electronics activities at iNEMI.

IPC Releases IPC-2551, International Standard for Digital Twins

IPC announces the release of IPC-2551, International Standard for Digital Twins. This first international standard is comprised of digital twin product, manufacturing, and lifecycle frameworks. Using this standard, any manufacturer, design organization or solution provider can initiate application interoperability to create smart value chains.                                                   

Of significant use to any company, IPC-2551 provides a comprehensive self-assessment mechanism for companies to determine their current digital twin readiness level and roadmap the steps they will need to take to achieve a full digital twin approach. This comprehensive approach provides real value to companies that are in the planning stages for applying a digital twin framework to their operations.                  

The standard enables interoperability of all forms of processing of digital data that precisely match and represents the physical capabilities. The standard does this by defining and precisely laying out a digital twin cell-based architecture. This enables any manufacturer to create and utilize the IPC digital twin standard to represent every process and possible actions taken on a product within the manufacturing and lifecycle environment, for engineering, modeling, planning, quality and reliability analysis, simulations, and much more, allowing critical decisions for product, process, and material design to be optimized. 

“Benefits of establishing a digital twin framework and the tools that work within the framework will ensure that the physical expectations will be met without the need for a physical prototype,” stated Matt Kelly, IPC chief technologist. “IPC-2551 will help with optimization of processes reducing losses associated with manufacturing and logistics, increasing productivity, efficiency and cost performance,” Kelly added.                          

For more information or to purchase IPC-2551, visit the IPC Online Store.

IPC Supports U.S. House Passage of National Apprenticeship Act

IPC welcomes the U.S. House vote today on H.R. 447, the National Apprenticeship Act of 2021. This bill would invest nearly $3.5 billion over five years to scale-up apprenticeship opportunities, streamline access to apprenticeships for workers and employers, and expand apprenticeships into new, in-demand industry sectors and occupations. 

One of the most difficult challenges facing the U.S. electronics manufacturing industry is a chronic shortage of adequately skilled workers. More than two-thirds of IPC’s U.S. members report that an inability to find and retain skilled workers is limiting their growth and competitiveness. The pressure is on our industry to tap the institutional and technical knowledge of an aging workforce to train the next generation of workers, even as younger workers also learn the skills required for the factories of the future. IPC believes that the private sector is best suited to identify the occupational skills that workers need to succeed, which is why IPC works with industry to develop and provide industry training and credentialing programs.

IPC agrees with workforce experts that well-crafted apprenticeship programs offer individuals, especially those not planning to pursue higher education, an effective means of gaining the skills and mentoring necessary to thrive in certain fields, including electronics. However, the United States has failed to cultivate an environment in which apprenticeship programs flourish, except in a few industries. The current structure of the existing apprenticeship program in the United States is onerous for employers, which is a key reason why apprenticeships are not as popular in the U.S. as they are in Europe. H.R. 447 would streamline some reporting requirements, improve the registration system, and allow various program costs, including new machinery and equipment, to be included as allowable costs for all grant dollars. For these reasons, IPC supports H.R. 447, and we welcome the opportunity to work with policy makers to improve and expand industry-led education and training programs.

 

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