The first ever virtual IPC APEX EXPO has launched!

Mar 08, 2021
| By Deanne Janda

The first ever virtual IPC APEX EXPO has launched! We’ve cut the ribbon and are thrilled to connect with attendees and exhibitors online.

IPC’s President and CEO John Mitchell highlights what is happening today at IPC APEX EXPO 2021.

 There is still time to join us for a jam-packed week of professional development courses, cutting-edge technical conference sessions, inspiring keynotes, exciting networking opportunities, and chances to win participation prizes!

What makes the IPC APEX EXPO virtual experience unique?

  • Live Q+A sessions after each educational presentation. Have your questions ready!
  • Three thought-provoking keynotes that will provide a glimpse into the future of our industry. (FREE with the Event Essentials Pass)
  • The IPC Annual Meeting and Awards Ceremony, offering a chance to celebrate the accomplishments of your peers. (FREE with the Event Essentials Pass)
  • On-demand access to technical conference sessions and professional development courses until June 13, 2021.
  • Networking opportunities that can’t be beat: an escape room, trivia, and Name That Tune – you know you want to participate! (FREE with the Event Essentials Pass)

We’ve saved you a seat – come join us for the first virtual IPC APEX EXPO!

REGISTER NOW

NEW PRODUCTS. NEW EQUIPMENT. NEW SERVICES.

Learn what’s new from EXHIBITORS during their 30-minute New Product Presentations, allowing you to access new equipment, products, and services from a variety of exhibitors. Set up one-on-one meetings to learn more about what might work to create your own factory of the future. View the Exhibitor New Product Presentation schedule.

Stay up-to-date at ipcapexexpo.org

IPC Presents Wide-Ranging Policy Priorities to Biden Administration, Notes Synergies Between “Build Electronics Better” and “Build Back Better”

In a letter to U.S. President Joe Biden, IPC applauds the Biden administration’s early directions on manufacturing policy and maps a detailed policy agenda to drive growth and resilience in electronics manufacturing.

“Your call for a resurgence in U.S. manufacturing signals a federal commitment that is sorely needed and long overdue,” wrote IPC President and CEO John Mitchell. “The U.S. Government needs to move beyond rhetorical support and provide meaningful and tangible programs that collectively constitute a coordinated, bipartisan vision for the future of manufacturing.” 

The letter outlines policy recommendations in five key areas, including:

  1. Strengthen the defense electronics industrial base.
    1. Implement Section 841 of the FY21 National Defense Authorization Act, which will bolster the security and resiliency of the U.S. defense electronics supply chain.
    2. Address concerns with the government’s Cybersecurity Maturity Model Certification (CMMC).
  2. Develop and implement a strategy to promote the factories of the future.
    1. Establish an interagency manufacturing policy lead.
    2. Invest in R&D for the entire electronics ecosystem.
    3. Bring back the U.S. supply chain.
  3. Expand and upskill the workforce.
    1. Support industry-recognized worker credentials.
    2. Reduce the burden for apprenticeship program implementation.
  4. Rebuild trade relationships.
    1. Revive multilateral trade pacts and dispute-resolution bodies.
    2. Endorse and implement a North American Manufacturing Initiative.
  5. Protect human health and the environment via practical policies and regulations.
    1. Structure regulations to build on industry best practices.
    2. Work with industry to ensure policies and regulations are based on existing data and information.

“IPC works with industry to ‘Build Electronics Better,’” Mitchell writes. “Your administration aims for the U.S. to ‘Build Back Better.’ Our shared language suggests we have a shared vision of creating skilled, well-paying jobs in a cleaner economy that renews and extends U.S. leadership in electronics manufacturing.”

View full letter here.

Solving the Surface Finish Selection Paradox for Next Generation PCB Technologies

Mar 03, 2021

Surface finish is applied on to copper (Cu) integration scheme on printed circuit boards (PCBs). Choice of surface finish is critical especially for next generation HDI, high frequency PCBs because the performance and reliability of the electronic assemblies depends on the right selection. I hope you will join me for my professional development course, PD05: Role and Selection Criteria of Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-Microwave, High Frequencies, March 11, at IPC APEX EXPO 2021, where I will discuss this in detail.  

There are several surface finish options available on the market and one (OEM, PCB manufacturers, PCB designers, EMS) needs to consider the following critical selection criteria,

  • Insertion loss: Next generation electronic assemblies require HDI, high frequency PCBs. Right choice of surface finish is critical to attain optimum signal integrity with minimal insertion loss. 
  • Solder joint reliability: Few surface finishes options (i.e., ENIG, etc.) tend to form brittle solder joints with lead-free solder. Also, Ni based surface finishes form Sn-Ni intermetallics/solder joints which are less strong to Sn-Cu intermetallics. Can the surface finish participate in ensuring smaller intermetallics and robust solder joints? The choice of the surface finish is critical in ensuring robust solder joints in your final assembly.
  • Shelf life: Looking at the current pandemic situation going on around the world, longer shelf life is critical due to supply chain disruptions across the world. 
  • Reflow cycles during assembly: With ever-increasing complexity of the electronic assemblies, it is paramount to have the surface finish that can withstand multiple reflow cycles (3+). 
  • Cost-effective: It is also critical to review cost during the selection of the surface finish. There are few options that involve use of precious metals, i.e., Ag, Au, Palladium (Pd). Thickness of these precious metals-based surface finishes are critical to ensure cost-effectiveness.

Overall performance and reliability of electronic assemblies depends on the right material selection of every component involved. The surface finishes on the PCBs are critical piece to ensure the optimum performance and reliability of the electronic assemblies. Pay attention while selecting surface finishes for next generation PCB technologies.

What you will learn from my PD course:

  • Role of surface finish for next generation PCB technologies
  • 5G, HDI, RF-Microwave, High Frequencies
  • Selection criteria of surface finish for next generation PCB technologies
  • 5G, HDI, RF-Microwave, High Frequencies
  • Currently available surface finish options in the market and their pros and cons


 

IPC Issues Industry Alert to Members Regarding U.S. EPA Prohibition of PIP (3:1) in Electronics

IPC alerted members about the U.S. Environmental Protection Agency’s (EPA) final risk management rules to reduce exposure to five persistent, bioaccumulative, and toxic chemicals (PBTs). The alert calls attention to the rules, which went into effect February 5, 2021, and to one of the five PBTs with a history of use in electronics: phenol, isopropylated, phosphate (3:1) (known as PIP (3:1)).

The final rule for PIP (3:1) prohibits the processing and distribution of this chemical substance and products containing this chemical substance as of March 8, 2021. There are some exceptions to the prohibition, for example, for new and replacement parts for automotive and aerospace industries, however, there are no electronics industry exceptions.

As a chemical that can perform several functions simultaneously, sometimes under extreme conditions, PIP (3:1) has several distinctive applications: It is used as a plasticizer; a flame retardant; an anti-wear additive; or an anti-compressibility additive in hydraulic fluid, lubricating oils, lubricants and greases, various industrial coatings, and in adhesives and sealants. PIP (3:1) is also used in plastic-containing materials that are used to form tubes, harnesses, cables, sleeves, gaskets, and covers of parts – parts that are used in electrical or electronic products.

IPC seeks out member input on the EPA final rule, requesting information on how the final rule may adversely affect supply chains for electronics manufacturers. To provide input, contact Kelly Scanlon, EHS policy and research director, at KellyScanlon@ipc.org. To view news on EPA’s final PIP (3:1) ruling and other advocacy and EHS-related information, visit www.ipc.org/ipc-advocacy.

PIP (3:1) Implications: IPC Issues Industry Alert on Prohibition of PIP (3:1)

Mar 01, 2021

The U.S. Environmental Protection Agency’s (EPA) final risk management rules to reduce exposure to persistent, bioaccumulative, and toxic chemicals (PBTs) went into effect on February 5, 2021. Some of the five PBTs listed have a history of use in electronics, including phenol, isopropylated, phosphate (3:1) (known as PIP (3:1)).

The final rule for PIP (3:1) prohibits the processing and distribution of this chemical substance or products containing this chemical substance as of March 8, 2021. There are some exceptions to the prohibition, for example, for new and replacement parts for automotive and aerospace industries, however, there are no electronics industry exceptions.

As a chemical that can perform several functions simultaneously, sometimes under extreme conditions, PIP (3:1) has several distinctive applications: It is used as a plasticizer; a flame retardant; an anti-wear additive; or an anti-compressibility additive in hydraulic fluid, lubricating oils, lubricants and greases, various industrial coatings, and in adhesives and sealants. PIP (3:1) is also used in plastic-containing materials that are used to form tubes, harnesses, cables, sleeves, gaskets, and covers of parts – parts that are used in electrical or electronic products.

If the March 8 prohibition will have adverse impacts on your supply chain or if you have information regarding the function of PIP (3:1) in electronics and the types and quantity of products affected, please contact Kelly Scanlon, IPC’s director of environmental policy and research as soon as possible.

in4ma Releases Annual Analysis of European EMS Industry

Mar 01, 2021

in4ma’s 2020 European EMS industry report, published last week, shows that EMS revenue in Europe decreased by 5.4 percent in 2020. The survey and subsequent report, led by in4ma CEO Dieter Weiss, includes detailed information from nearly 200 EMS companies, a 20 percent increase in participation from 2019.

On an annual basis, EMS companies in Europe report their numbers into in4ma’s market survey. Evaluations are done by country as well as by market segment. In addition to EMS revenue decreasing in Europe, key takeaways from the report include:

  • 69% of EMS companies surveyed experienced a revenue decrease from 2019 to 2020
  • EMS revenue loss was correlated with exposure to the auto industry supply chain, though some companies with high auto industry exposure did see revenue increases
  • Larger EMS companies experienced a V-shaped recovery in the second half of 2020, whereas medium and small EMS companies experienced a U-shaped recovery (see note below on the definitions of recovery)  
  • EMS revenue in Europe is forecasted to increase by 6.5% in 2021

The full report can be purchased directly from in4ma. Please contact Mr. Weiss at weiss@in4ma.de for additional information.

IPC fully supports Europe’s EMS industry by focusing on standards, education, advocacy, solutions, industry intelligence, and networking events. Learn more about how to participate in these initiatives by contacting Philippe Leonard, IPC director, Europe at PhilippeLeonard@ipc.org.

Note: V-shaped is defined as a sharp decline, short bottoming out period at about minus 4.5%, and a sharp increase, in general, over a shorter period of time. U-shaped is defined as a slower decline, but deeper bottoming out period of more than 9%, lasting longer, and a slower increase. In general, the U-shaped cycle is twice as long as the V-shaped cycle.

The Global Economy Continues to Improve

IPC Releases February 2021 Economic Outlook

Good news! The global economy continues to improve, in many ways recovering better than anticipated. In the United States, our current forecast is for nearly three percent growth in the first quarter and there’s a good chance that our forecast for the first quarter, and all of 2021, will increase in the coming months. Incoming data has been solid.

In this month’s report, you will find U.S. and European data on economic growth, employment, Manufacturer’s Sentiment (PMI) and end markets for electronics.

READ FEBRUARY REPORT

North American PCB Industry Sales Begin 2021 Up 4 Percent

IPC Releases PCB Industry Results for January 2021

IPC announced today the January 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.14.

Total North American PCB shipments in January 2021 were up 4 percent compared to the same month last year. Compared to the preceding month, January shipments decreased 16 percent.

PCB bookings in January increased 17.6 percent year-over-year. Bookings in January decreased 9.2 percent from the previous month.

“PCB shipments fell in January a bit more than expected given recent order trends,” said Shawn DuBravac, IPC’s chief economist. “The slowdown in shipments is driven in part by constraints on semiconductor availability which in turn is exerting pressure on other parts of the supply chain.”

PCB Book to Bill Chart 1 January 2021
PCB Book to Bill Chart 2 January 2021

View charts in pdf format

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

 

 

Best Technical Paper at IPC APEX EXPO 2021 Selected

The best technical conference paper of IPC APEX EXPO 2021 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will be recognized during show opening remarks on Tuesday, March 9.

Taking top honors, the winning paper is, “Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction” by Sarah Czaplewski, IBM Corporation. Her co-authors were: Roger Krabbenhoft and Junyang Tang, IBM Corporation. This paper will be presented during Technical Conference Session 14 (BF5-PCB Design - HDI and Signal Integrity Considerations) on Thursday, March 11.

This year, two papers were selected in the honorable mention category. Honorable mention goes to, “Board Thickness Effect on Accelerated Thermal Cycle Reliability” by Joe Smetana, Nokia. His co-authors included: Richard Coyle, Nokia; Eric Lundeen, BAE Systems; Iulia Muntele, Sanmina; Scott Danko, TTM; Neil Hubble, Akrometrix; and Bev Christian, HDPUG. This paper will be presented during Technical Conference Session 9 EE3 (HDP Projects Progress) on Wednesday, March 10.

Honorable mention also goes to “Analyzing Printed Circuit Board Voiding and other Anomalies when Requirements Covering the Anomalies are Vague” by Wade Goldman, The Charles Stark Draper Laboratory, Inc. His co-authors were: Hailey Jordan and Curtis Leonard, The Charles Stark Draper Laboratory, Inc. This paper will be presented during Technical Conference Session 3 EE1 (PCBA Quality, Reliability, and AI-based Inspection) on Wednesday, March 10.

The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.

To register for the IPC APEX EXPO technical conference or for more information on all the activities taking place, including professional development courses, online exhibition, keynote presentations, networking activities and more, visit www.IPCAPEXEXPO.org.

EMS North America Industry Report, January 2021

IPC Releases EMS Industry Results for January 2021

IPC announced today the January 2021 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.18.

Total North American EMS shipments in January 2021 were up 9.7 percent compared to the same month last year. Compared to the preceding month, January shipments fell 6.4 percent.

EMS bookings in January fell 5.4 percent year-over-year but increased 10.2 percent from the previous month.

EMS book to bill ratio chart January 2021

View chart in pdf format

“The EMS sector carried last year's momentum into 2021,” said Shawn DuBravac, IPC’s chief economist. “Strong January orders should help drive shipments in the coming month.”

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

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