IPC Promotes Sydney Xiao to President of Asia Operations

Effective January 1, 2021, IPC has promoted Sydney Xiao to president of Asia Operations. Xiao succeeds Philip Carmichael, who served as president of IPC’s Asia Operations from July 2015 to his retirement in December 2020.

In her new role, Xiao will lead IPC’s globalization initiative to expand the association’s member, standards, education and advocacy support to Greater China, Japan, Korea, Thailand and Vietnam. In addition, she will lead the organization’s Asian operations and staff and will lead strategy development and execution. She will remain at IPC’s China office in Shanghai.

Most recently, Xiao served as vice president of Asia Pacific Operations, overseeing the marketing, customer service, member success, finance, human resources and IT teams and working alongside Carmichael, supported IPC’s member service expansion in Japan, Korea and Southeast Asia. Prior to her vice president position, Xiao served as finance director, IPC Asia Pacific Operations and has been with IPC full time since 2012. 

“Sydney is well versed in all aspects of IPC’s business, its products, services, and offerings,” said John Mitchell, IPC president and CEO. “For the past few years, Sydney has worked alongside Phil Carmichael charting a course for success for IPC in Asia. Successes include growth in membership and standards and training participation. We look forward to Sydney’s leadership in expanding IPC’s services further into Asia.”

Xiao has a master’s degree in International Business Administration from Tongji University in Shanghai and a bachelor’s degree in Accounting from Shanghai University. She can be reached at SydneyXiao@ipc.org or + +86 21 2221 0008.

John Deere Electronic Solutions Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing Recertification

IPC's Validation Services Program announces that John Deere Electronic Solutions, a manufacturer of custom, integrated electronics components based in Fargo, N.D., has become the first OEM company to be recertified a second time to the IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML). John Deere Electronic Solutions, achieved the QML certification six years ago and this year successfully demonstrated the Class 3 level work required for recertification on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.

Kamal Verma, JDES factory engineering manager stated, “John Deere Electronic Solutions is part of Intelligent Solutions Group of John Deere where we design, develop and manufacture electronic components for John Deere equipment and other OEM customers. Quality is one of the four core values of John Deere and customer is at the focus when we talk about quality. Having been certified by IPC to J-STD-001/IPC-A-610 Class 3 QML program, it gives me great confidence that we are meeting or exceeding the standards we uphold ourselves to and that we will supply our customers with products that they can rely on for their long-term intended end use.”

“Their dedication to high reliability and meeting the requirements of Class 3 level work was demonstrated during the audit process,” stated Randy Cherry, IPC director of Validation Services.

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products, and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes in accordance with IPC standards," added Cherry. "We are pleased to recognize John Deere Electronics Solutions for continuing to be a member of IPC's network of trusted QML suppliers."

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.  

IPC Promotes Sanjay Huprikar to President of Europe and South Asia Operations

Effective January 1, 2021, IPC has promoted Sanjay Huprikar to president of Europe and South Asia Operations.

In his new role, Huprikar will lead IPC’s globalization initiative to expand the association’s standards, education and advocacy support to Europe, the United Kingdom, India, and several countries in Southeast Asia including Malaysia, Singapore, Indonesia, and the Philippines.

Huprikar has served as vice president of Solutions since 2017 directing global teams to develop new products and services for the electronics manufacturing industry. Prior to leading the Solutions team, Huprikar served as vice president of the member success team, overseeing IPC membership, events, industry programs and market research functions and has been with IPC since 2012.  

A highly experienced business and engineering professional, Huprikar has served numerous multi-national companies in the technology space since 1989. He has strong cross-cultural leadership skills and vast knowledge of both the key influencers in the global community and the important challenges facing the industry.

“Sanjay has great skill in engaging the electronics community – keeping his ears to the ground and identifying new opportunities that add value to our industry. Examples include his leadership in automotive electronics, Europe expansion, e-textiles, factory of the future initiative and IPC’s video library subscription offerings,” said John Mitchell, IPC president and CEO. “We’re looking forward to Sanjay applying his talents to furthering IPC’s mission in Europe and South Asia.”

Huprikar has a master’s degree in Business Administration from the Stuart School of Business - Illinois Institute of Technology and a Bachelor of Science degree in Electrical Engineering from the University of Illinois at Urbana-Champaign.  He can be reached at SanjayHuprikar@ipc.org or +1 847-597-2837.

North American PCB Industry Sales up 1 Percent in November

IPC Releases PCB Industry Results for November 2020

IPC announced today the November 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.05.

Total North American PCB shipments in November 2020 were up 1.0 percent compared to the same month last year. Compared to the preceding month, November shipments fell 2.5 percent.

PCB bookings in November rose 17.1 percent year-over-year and increased 13.6 percent from the previous month.

“PCB shipments and orders continue to be somewhat volatile but remain in line with recent trends,” said Shawn DuBravac, IPC’s chief economist. “While shipments slipped slightly below the recent average, orders rose above their respective average and are 17 percent higher than a year-ago.”

November 2020 book to bill graph 1
November 2020 book to bill graph 2

View charts in pdf

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

 

 

IPC Praises U.S. Government Actions to Bolster Security and Resiliency of Defense Electronics Supply Chain

The following is a statement by Chris Mitchell, vice president of global government relations at IPC, the global electronics manufacturing association, on recent actions by the U.S. Government to bolster the security and resiliency of the U.S. defense electronics supply chain.

Regarding votes this past week in the U.S. House of Representatives and U.S. Senate to override President Trump’s veto of the Fiscal 2021 National Defense Authorization Act (NDAA), “We commend the U.S. Congress for keeping this vitally important legislation on track. Among the bill’s policy prescriptions for U.S. military operations are provisions that will require the U.S. Defense Department (DoD) to implement new sourcing requirements and restrictions on bare printed circuit boards (PCBs) and PCB assemblies (PCBAs). Section 841 reflects the recommendations of many experts – including the DoD’s Executive Agent for PCBs – to redouble U.S. Government support for this long-neglected but critically important segment of the electronics manufacturing industry.

“IPC also appreciates that President Trump set aside his veto threat and signed the FY 2021 Consolidated Appropriations Act, which includes $10 million for research into the issues surrounding lead-free electronics in mission-critical applications. The migration of the commercial electronics industry to lead-free technology has created supply-chain concerns for the ADHP sectors that can only be overcome through public-private R&D. These funds will support a collaborative research effort that will help ensure that mission-critical systems have full access to cutting-edge electronics from a robust global supply chain.”