IPC Conference Paper Archive

Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode .. weiterlesen

It is widely known and understood that the overall cost and quality of a product is most influenced by decisions made early in the design stage. Finding and correcting design flaws later in the .. weiterlesen

Circuit housings used in industrial and utility applications have requirements often not needed in the commercial or consumer electronics industries. The device may be used in locations as dive .. weiterlesen

In today’s PCB industry,the challenges are no longer just on how to control and improve the manufacturing processes,but also to ensure the fabricated product is compliant to the industry standa .. weiterlesen

•iNEMI Environmental Vision •Highlights of Environmental Conscious Electronics Chapter of iNEMI Roadmap •Key iNEMI Projects •Environmental Impact of Electronics –Products –Services •Concluding .. weiterlesen

Test and quality coverage for an assembled printed circuit board is becoming increasingly more expensive and complex as digital electronics moves well into the gigahertz era. Traditional tools .. weiterlesen

Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has .. weiterlesen

For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si .. weiterlesen

Several U.S. Government (USG) regulations require parties engaged in import activities to maintain records of transaction processes. By using formal documented tools integrating these regulatio .. weiterlesen

Counterfeit electronic parts have become a significant cause of worry in the electronics part supply chain. Most of the counterfeit parts detected in the electronics industry are either new or .. weiterlesen

DNA is a form of forensic evidence trusted by law enforcement and recognized by international courts around the world. This abstract provides an introduction to the utility of botanical DNA tag .. weiterlesen

Counterfeiting is a widespread problem that affects every industry and which has the potential to significantly erode a company’s bottom line. According to the International Anti-Counterfeiting .. weiterlesen

- COMPONENTS - Risk Mitigation Testing Strategies Examples - Risk Mitigation Testing Affiliations - IDEA – 1010 - AS5553 - Mil-Std-1580 .. weiterlesen

Accelerated testing of plated hole life is necessary for economic reasons due to the long time to failure during field operating conditions. One difficulty in performing accelerated testing on .. weiterlesen

An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater .. weiterlesen

The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring .. weiterlesen

This paper details the Alcatel-Lucent Pb-free Material Reliability Test board (MRT) used in two different High Density Packaging User Group tests covering 56 different constructions and in nume .. weiterlesen

The process cleaning rate theorem holds that the static rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) equals the process cleaning rate. New lead-free flux residues r .. weiterlesen

Our insatiable desire for smaller,faster and highly functional electronic devices presents numerous challenges for package designers and manufacturers. Current day popular approaches include st .. weiterlesen

Because of the phase out of CFC’s and HCFC’s,standard solder pastes and fluxes evolved from RA and RMA fluxes,to No-Clean,to low residue No-Clean,to very low residue No-Clean. Many companies ca .. weiterlesen

Consider defluxing at the design stage. This involves determining how product design may impact the assembly process. It also involves selecting the most effective,rugged defluxing option relat .. weiterlesen

• 2010 turned out to be an unexpectedly strong year: > 130% growth in both cell production and installations over 2009 • 24GWp cell production • All leading suppliers are expanding production c .. weiterlesen

•The 2011 iNEMI Solar PV roadmap •Involvement of the electronics supply chain •Example of an electronics opportunity – micro-inverters .. weiterlesen

•A vision of a solar-powered world •Importance of reliability to success of solar •Working together to establish reliability •R&D issues related to: •Product Development •Quality Assurance duri .. weiterlesen

- Solar Module Assembly vs. PCBA - Crystalline Silicon Module (c-Si) Construction - Module Assembly Process (c-Si) - PV Cells – String - Array - Module - Tab & String Process - Lamination Proce .. weiterlesen

Modern flexible printed circuits demand improved signal integrity due to increasing data rate requirements for interconnects. At the same time,form factors available to designers are becoming s .. weiterlesen

From the first time we heard of new thin,low Dk,flex laminate material from DuPont we were excited. The material is what is now known,and commercially available,as DuPont’s Pyralux TK®. Working .. weiterlesen

This paper will discuss the environmental and financial cost of operating both batch cleaners and small inline aqueous cleaners. It is not the goal of this paper to endorse one type of cleaner .. weiterlesen

Since the European Union (EU) first published the Restriction on the use of Certain Hazardous Substances in electrical and electronic equipment directive (RoHS) in 2003,the document required up .. weiterlesen

Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so .. weiterlesen

The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids .. weiterlesen

Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes which severely stress the mecha .. weiterlesen

As the assembly of electronic products becomes more automated the collection,storage and retrieval of electronic data demands additional software tools to manage data. The wide spread use of we .. weiterlesen

In high mix (250+ Assemblies) environments,ensuring small batches are delivered in a timely yet flexible manner without large levels of safety stock and WIP requires the very best of LEAN Manuf .. weiterlesen

In high frequency circuit boards PTFE is widely used as a substrate material. It offers very low dielectric constant and low losses. However,it is relatively expensive to fabricate,making the c .. weiterlesen

With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems. Insertion loss can be separated into dielectric loss and copper loss. While dielectric l .. weiterlesen

Properties of printed circuit board laminates are a function of the type and levels of its components. Endeavors to a balance various performance criteria involve balancing the types and amount .. weiterlesen

With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010 .. weiterlesen

Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free solder ball alloys based on the improved mechanical shock resistance. Althou .. weiterlesen

Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are .. weiterlesen

High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur .. weiterlesen

In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w .. weiterlesen

The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st .. weiterlesen

We describe a coupon design that makes available,in an elegant and efficient way,information unattainable even from multiple-coupon vertical cross-sections. The new design allows quantitative d .. weiterlesen

The challenges of successful solder printing in the High Volume / Low Mix cell phone environment,which is linked with the continuing trend to miniaturize electronic assemblies,requires a new ap .. weiterlesen

Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical .. weiterlesen

In electronics design,Computer Aided Design (CAD) tools manage part data in a logical schematic view (a part symbol) and a physical PCB view (a part footprint). Yet,a part has a third view,whic .. weiterlesen

High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase,so do the challenges of maintaining a successfu .. weiterlesen

Sculpted Flex Circuits are a very cost effective,low profile termination solution that is not very well known. These Flex Circuit hybrids can provide the user a simple interconnection between c .. weiterlesen

Entrapped moisture within printed boards can expand during soldering operations,causing delamination or other damage. Available methods for determining moisture content may be destructive or no .. weiterlesen