IPC Conference Paper Archive

Printing solder paste for very small components like .3mm pitch CSP’s and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields,SMT Connecto .. weiterlesen

The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing pro .. weiterlesen

It is frequently noted in surface mount printed circuit board assembly that most solder defects can be traced back to the stencil printing process. In addition,continuous miniaturization trends .. weiterlesen

The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material .. weiterlesen

Pad cratering in the PCB is a new failure mode encountered in electronic assemblies,particularly in lead-free products. The failure mechanisms and root causes are not yet fully understood,and l .. weiterlesen

The reliability of an embedded planar capacitor laminate under a variety of environmental stress and bias conditions was investigated. The dielectric consisted of a composite of BaTiO3 particle .. weiterlesen

The motivation for developing higher density IC packaging continues to be the market and the consumers’ expectation that each new generation of products furnish greater functionality. The minia .. weiterlesen

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure devi .. weiterlesen

Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensiv .. weiterlesen

Recently,the industry has seen the development of a wide range of new Pb-free alloys. A significant element of uncertainty within the industry regarding these new alloys is the lack of defined .. weiterlesen

Pad cratering in Printed Circuit Boards (PCBs) is typically associated with lead-free products. This paper addresses laminate materials and the failures associated with the higher Pb-Free reflo .. weiterlesen

Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec .. weiterlesen

For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev .. weiterlesen

Constitutive and failure descriptions of SnAgCu solder alloys are of great interest at the present. Commonly,constitutive models that have been successfully used in the past for Sn-Pb solders a .. weiterlesen

This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the .. weiterlesen

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In this presentation,numerous examples of counterfeited parts are provided along with the means of identification for the respective technique utilized in production. .. weiterlesen

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This paper will explore the most common alternatives to hot air-leveled solder (HASL) as a finish for flex circuits and some of the issues one may want to be aware of when converting. Whether t .. weiterlesen

- History & Importance of PCB - Environmental Initiatives - Reliability Consideration With High Temp Processing - Reliability Considerations for Materials to withstand Lead-Free Assembly .. weiterlesen

Cracking and delamination defects in printed circuit boards (PCBs) during elevated thermal exposure have always been a concern for the electronics industry. However,with the increasing spread o .. weiterlesen

Although lead free assembly is now widely adopted the industry is still exploring a variety of options for lead free alloys. Attempts to standardize on a single alloy for either reflow or wave .. weiterlesen

At present there are a large number of materials that have been proposed as replacements for lead containing solder for reflow and wave and selective soldering. Unlike solder paste in a reflow .. weiterlesen

Little data has been generated on the performance of lead-free solders under vibration and mechanical shock. What data exists suggests that lead-free solders may be less reliable than eutectic .. weiterlesen

Many will look to IPC standards for advice or workmanship requirements for electronic assemblies. Some will find a copy of IPC-A-610 Acceptability of Electronic Assemblies and stop there. But I .. weiterlesen

This presentation attempts to convince the reader that while all the logistical,equipment,financial and process aspects of any business are important,the high performance work team is the criti .. weiterlesen

As more electronic assembly moves from OEM to EMS providers,a number of key issues arise in the overall value stream of production. This presentation will provide a comprehensive look at qualit .. weiterlesen

Recent increases in assembly temperatures in response to removing lead from solder used in printed circuit boards (PCBs) assembly has increase the strain and stress on interconnect structures. .. weiterlesen

This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r .. weiterlesen

Excessive moisture entrapped/absorbed within printed board laminates can expand during soldering operations,causing delamination or other damage. While moisture absorption data is available for .. weiterlesen

Electroless nickel immersion gold (ENIG) has captured the major share of the lead free final finish market globally even though it’s not the least expensive. ENIG not only provides a robust met .. weiterlesen

With increasing use of portable appliances such as PDA and cellular phone,changing environment of application requires higher solder joint reliability. The Cu-OSP process has been widely used f .. weiterlesen

The formation during the soldering process of the layer of intermetallic compound Cu6Sn5 at the solder substrate interface provides the essential evidence that a metallurgical bond that is the .. weiterlesen

Restrictions on the use of chemicals in began 30 years ago in the US with the passage of the Toxic Substances Control Act. Over the last five years we have seen a logarithmic increase in produc .. weiterlesen

Industry associations,such as IPC,were quick to develop standards to help the electronics industry deal with emerging environmental regulations; however,for regulatory compliance,smooth interna .. weiterlesen

This presentation will examine materials declaration from a practical point of view,identify the role of materials declaration in the product lifecycle analysis and thus hone in on the practica .. weiterlesen

Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There are several attributes of these materials that are very unique wh .. weiterlesen

The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide move towards lead-free manufacturing,has initiated a closer assessment of eff .. weiterlesen

The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c .. weiterlesen

The use of flexible circuit boards in the design and manufacture of electronic products has experienced a consistent and rapid growth over the last 15 years because their light weight and physi .. weiterlesen

Two major trends in printed wiring boards electronics are applications that require higher operating frequency,often in the radio frequency range (GHz),and the use of lead free solder assembly. .. weiterlesen

For many critical electronic applications,there is a need for dielectric systems that exhibit better electrical insulation performance than epoxies and other conventional materials. In the prod .. weiterlesen

The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo .. weiterlesen

The handheld wireless product market place demands products that are small,thin,low-cost and lightweight and improved user interfaces. In addition,the convergence of handheld wireless phones wi .. weiterlesen

Imagine that you were choosing a camera for your AOI system. Should you opt for a black and white camera or a color camera? This seems like a no-brainer. Most of us would go for a color camera. .. weiterlesen

RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be .. weiterlesen

The European Union list of Substances of Very High Concern (SVHCs) published in the Registration,Evaluation,Authorization and Restriction of Chemicals (REACH) regulation,requires producers of A .. weiterlesen

Portable Electronics devices are having more functionality but the size is getting smaller. What it means to SMT is to place more,smaller and ultra fine pitch devices on PC board. This makes SM .. weiterlesen

Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in .. weiterlesen

Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde .. weiterlesen