IPC Conference Paper Archive

European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig .. weiterlesen

Continental is using the IPC solder spread coupon (adopted from NPL) to evaluate Pb-free solder pastes and PCB surface finishes for Solderability. This presentation will compare and contrast so .. weiterlesen

Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode .. weiterlesen

The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc .. weiterlesen

Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg,absorbed during the wet processes in printed .. weiterlesen

As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on .. weiterlesen

High levels of residual moisture in PCBs are problematic and can result in delamination during soldering and rework. Moisture accumulates during storage and industry practice recommends specifi .. weiterlesen

Coating adhesion has been a difficult property to measure,and the industry has made do with a scratch test that is only capable of qualitative tests. NPL with industrial partners,have developed .. weiterlesen

The most common epoxy encapsulation compounds available on the market utilise specialised fillers,such as Alumina trihydrate (ATH),to provide a high level of flame retardancy. Such fillers deco .. weiterlesen

Silicones have been used in the electronics industry as protective/assembly materials for operations that will have a wide temperature variation. A large variety of silicone products are availa .. weiterlesen

Although many have predicted the demise of through-hole components,they are alive and well with tens of billions assembled each year. In many cases these components are assembled by wave solder .. weiterlesen

Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si .. weiterlesen

The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad .. weiterlesen

Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially .. weiterlesen

As technology becomes increasingly reliant on electronics,understanding the longevity of lead-free solder also becomes imperative. This research project focused on phase transformation kinetics .. weiterlesen

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•Overview •Test Method Considerations •Proposed Test Methodology •PCB,Stencil & Part Information •Pick-up Adapter Design •Test Setup Overview •Head-in-Pillow Defect Detection •Test Parameters • .. weiterlesen

•Background and Objective •Head-in-Pillow (HiP) Defect •In Circuit Test (ICT) Testability •Evaluation Steps - Solder Paste Selection - Head-in-Pillow Test - Printability & Solderability Test .. weiterlesen

In recent years the PCB industry has increasingly turned to digital,or maskless,imaging techniques in order meet demands for tighter registration between layers. Many of these techniques,includ .. weiterlesen

After the implementation of RoHS and the discontinued use of lead bearing products and the introduction of lead free (LF) solders,tin and its alloys have come to the forefront as the first choi .. weiterlesen

3D is the shorthand term for the three dimensions of Cartesian coordinate space X,Y and Z. With that definition in mind,one will find with little or no stretching of the imagination,that the fi .. weiterlesen

A PCB fails final test. Why? Was it the solder paste? The screen printer? The PCB assembly machine? The reflow oven or none of the above? Unplanned downtime is a costly fact of life. In order t .. weiterlesen

Typical SMT production lines are a collection of disconnected machines performing various tasks. Errors can occur at any step during this process,but often go undetected until the PWB is comple .. weiterlesen

In PCB industry,AOI (Automated Optical Inspection) has been grown rapidly in past decades. It is now playing an important role in manufacturing process. Most manufacturers are now using AOI m .. weiterlesen

There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing,electroplating,or sphere dropping [1]. The choice between t .. weiterlesen

It is well known that nitrogen inerting in wave soldering can significantly reduce dross formation and improve solder wetting. For lead-free wave soldering,the benefits of N2 inerting are even .. weiterlesen

To help address the environmental requirements driven by the European Union RoHS Directive,consumer applications have changed the solder alloys for the manufacturing of printed circuit board as .. weiterlesen

Today,the metal core printed circuit board (MCPCB) business is booming thanks to the rising popularity of LED TV. The majority of MCPCB is single sided. However,the demand for multi-layer board .. weiterlesen

The reader may wonder why „PCB? in the title is between quotes. The original objective of the paper was to lay a firm base for people who are involved in printed circuit board (PCB) design for .. weiterlesen

-BA flux: Water soluble BA flux has a higher HiP risk relative to NC BA flux,likely due to higher surface oxidation risks. -Deflux: Washing process using water or DIW in combination with other .. weiterlesen

Base on our experience,HiP defect comes in various shapes and forms. Some of the HiP looks like an ordinary open joint,while others have an eclipse profile. The tough ones to detect are those t .. weiterlesen

Metal plating of epoxy polymer has been widely applied for industrial products for a long time,especially in the field of Printed Circuit Boards (PCB’s). This technique is one of the most impor .. weiterlesen

This paper reports on further developments for an innovative copper deposition technology that was presented two years ago at this conference. At that time,the innovative technology was describ .. weiterlesen

As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu .. weiterlesen

Over the last few years,there has been an increase in the Evaluation and use of halogen-free soldering materials. In addition, there has been increased scrutiny into the level of halogens and r .. weiterlesen

Spontaneously forming tin whiskers,which emerge unpredictably from pure tin surfaces,have regained prevalence as a topic within the electronics research community. This has resulted from the RO .. weiterlesen

Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for component leads,especially wire-bondable high frequency packages,where the gold thickness requirement for wi .. weiterlesen

Convection soldering remains the most common reflow process in electronic assembly,mostly in air,but sometimes using a nitrogen atmosphere to reduce oxidation. On the other hand,vapor phase sol .. weiterlesen

With the predominance of no-clean soldering processes and ever decreasing component standoff,the industry has had to consider the reliability of,what may be,partially activated or “gooey” flux .. weiterlesen

As Original Design Manufacturers (ODM) adopt the use of finer pitch connectors,with increased pin count on PCB assemblies. It becomes challenging for Electronic Contract Manufacturing Services .. weiterlesen

Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package mi .. weiterlesen

Pad cratering refers to the initiation and propagation of fine cracks beneath BGA pads in organic substrates or printed circuit boards. These cracks,which usually initiate under the application .. weiterlesen

The propensity of printed circuit boards to electrochemical migration has been assessed traditionally by using surface insulation resistance technique with a DC bias on standard comb structures .. weiterlesen

This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir .. weiterlesen

The CAD library is the starting point that affects every process from PCB layout through PCB manufacturing and assembly. There are dozens of things to consider when creating a CAD library that .. weiterlesen

Although many of the QFN and bottom termination products are small in outline and utilize a plastic encapsulated copper lead-frame structure they do not resemble the more traditional small outl .. weiterlesen

Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in pa .. weiterlesen

As consumers the expectation of increased functionality within new products is a given. However there comes a time where this tireless demand for product efficiency starts to stretch the design .. weiterlesen

The demand for product miniaturization,especially in the handheld device area,continues to challenge the board assembly industry. The desire to incorporate more functionality while making the p .. weiterlesen

Cost reduction in electronic assembly and soldering is a key issue for economic survival in the global market. Very promising ways to reduce failure costs and increase productivity are: reduce .. weiterlesen