IPC Conference Paper Archive

The control of moisture-sensitive devices (MSDs) prior to SMT reflow is a critical assembly issue that has a direct impact on final product reliability and customer satisfaction as well as manu .. weiterlesen

Many papers and articles are claiming that a majority of the defects detected after reflow are coming from the solder paste application process. However,very little real data seems to be availa .. weiterlesen

Application of solder paste by using stencil-printing process is a commonly used method for high volume electronics circuits manufacturing. This process has proved to be the fastest and most co .. weiterlesen

The purpose of this study is to understand the capability of both AOI and AXI machines and where the two could be combined to increase the inspection coverage,reduce the overall cycle time of t .. weiterlesen

Three epoxy systems were evaluated for physical and optical properties. The three systems chosen for the study were selected on the basis of their optical clarity,color and chemistry. Three dis .. weiterlesen

Automated X-ray inspection (AXI) is more often a part of an effective test strategy for today's PCBAs1 because of the benefits it provides manufacturers in meeting challenges resulting from2: • .. weiterlesen

The use of Chip Scale Packaging (CSP) is rapidly expanding,particularly in portable electronic products. Many CSP designs will meet the thermal cycle or thermal shock requirements for these app .. weiterlesen

In-line inspection equipment has become common place in the PCB assembly industry. This equipment is intended to both eliminate defects at an early stage of production and to be used as a proce .. weiterlesen

Lead-free wave soldering was studied in this work using Sn/Ag/Cu alloy. A process DOE was developed,with three variables (solder bath temperature,conveyor speed,and soldering atmosphere),using .. weiterlesen

Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller,lighter,and less expensive packages,and flip chip is an important enabling tec .. weiterlesen

Vapor phase soldering is in discussion of the recent past. Some of the topics of our own work are presented in this paper,like the combination of vapor phase reflow soldering with wave solderin .. weiterlesen

Surface Insulation Resistance (SIR) Testing,has been used traditionally to characterise process materials, particularly solder fluxes. Existing Surface Insulation resistance (SIR) test methods .. weiterlesen

Group technology (GT) concepts can be applied in printed circuit board (PCB) assembly when determining a setup strategy for a single machine. In the group setup strategy,PCBs,which have similar .. weiterlesen

Residue left behind from no-clean assembly is a visually obvious artifact of the manufacturing process that can cause concern to those with RF circuit assemblies. This paper describes a test ve .. weiterlesen

The formation of underfill voids is an area of concern in the low cost,high throughput,or “no-flow” flip chip assembly process. This assembly process involves placement of a flip chip device di .. weiterlesen

Conductive anodic filament (CAF) formation is a failure mode associated with electronic circuits which operate at high voltage gradients and which are stored under high humidity conditions. Cer .. weiterlesen

Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the industry. It is expected that soldering in a nitrogen atmosphere might over .. weiterlesen

Two new electrolytically plated lead-free surface finishes,satin bright tin on nickel and palladium-cobalt on nickel followed by gold flash coating,are evaluated for their wettability,bond stre .. weiterlesen

Optical connectors are used to connect optical devices to other optical devices or systems. The presence of these optical connectors makes it possible to switch conveniently from one device or .. weiterlesen

To successfully navigate the transition from an entrenched Pb-based electronics manufacturing model to a fully integrated Pb-free manufacturing operation will require significant and coordinate .. weiterlesen