IPC Conference Paper Archive

Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure an .. weiterlesen

For the last couple of years,the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently,the need to reduce insertion loss came .. weiterlesen

Silicone contamination is known to have a negative impact on assembly processes such as soldering,adhesive bonding,coating,and wire bonding. In particular,silicone is known to cause de-wetting .. weiterlesen

Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials,water soluble salts,organic materials,and a sma .. weiterlesen

- DD Detector is State of the Art - Software: Addressing all measurement challenges; Measurement Results for Au,Pd and Ni(P),independent of substrate material - Traceability and Reproducibility .. weiterlesen

•What is Digital Printing •Ink Jet Technology •Printing SM using Ink Jet - Highlights - Zero clearance technology - Product improvements - PCB shops,end users and designers .. weiterlesen

The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin .. weiterlesen

With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer powder mesh sizes for package-on-package (PoP) assemblies has become imper .. weiterlesen

Considering technological advances in multi-depth cavities in the PCB manufacturing industry,various subtopics have materialized regarding the processing and application of such features in dev .. weiterlesen

The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: “faster and smaller” it is necessary to place components with different .. weiterlesen

Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled,un-powered,vectorless in-circu .. weiterlesen

Testing DDR memories on Printed Circuit Boards has steadily gotten more difficult. Most such memories do not have any on-chip Design-for-Test features. Adequate test access is a disappearing lu .. weiterlesen

Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field failures and huge losses,which annually total several billion U.S. doll .. weiterlesen

Creep corrosion normally happens in the end system,PCB,connectors and components are widely noted due to the exposure of high sulfur environments under elevated humidity. In this study,the majo .. weiterlesen

With the emergence of high speed,controlled impedance circuits requiring increasingly tight tolerances,there is a realization among designers and fabricators that more precise data is needed th .. weiterlesen

As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest .. weiterlesen

The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes,are commonly fil .. weiterlesen

Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not d .. weiterlesen

- What is Pad Cratering? - Pad Craters - Pad Cratering… Opens Circuits - How is the Electronics Industry dealing with this Defect Mode? - What does this have in common with a Pad Cratering solu .. weiterlesen

Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space .. weiterlesen

Accelerated temperature cycling was used to evaluate the thermal fatigue reliability for the case of backward compatible assembly (mixed alloy,Pb-free BGA/SnPb paste) of a 3162 pin count,extrem .. weiterlesen

Due to the obsolescence of SnPb BGA components,electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball these components w .. weiterlesen

Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a .. weiterlesen

With the advent of larger packages and higher densities/pitch the Industry has been concerned with the co -planarity of both the substrate package and the PCB motherboard. The iNEMI PCB Co-Plan .. weiterlesen

There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices,the emergence of lead-free processing,and chang .. weiterlesen

As a surface finish,electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention for both packaging/IC-substrate and PWB applications. With a lower gold .. weiterlesen

This paper will discuss a new approach to the final finishing for the PCB industry which is based on the use of an ultra-thin fluoropolymer film as a protective coating to preserve solderabilit .. weiterlesen

We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electrole .. weiterlesen

Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In this application,the TBBPA is fully reacted into the epoxy resins that form t .. weiterlesen

Consumption electronic devices are becoming much smaller,lighter and multifunctional,and high CTI application has already been not satisfied with double sided design and requested thinner & mul .. weiterlesen

There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be .. weiterlesen

Printed Electronics is considered by many international technologists to be a platform for manufacturing innovation. Its rich portfolio of advanced multi-functional nano-designed materials,scal .. weiterlesen

– Define Printed Electronics – Provide general market information & Applications – Provide performance information on a wide variety of thermoplastic films – Provide processing considerations f .. weiterlesen

Printed Electronics is generally defined as the patterning of electronic materials,in solution form,onto flexible substrates,omitting any use of the photolithography,etching,and plating steps c .. weiterlesen

• Summary of some new and existing technologies for printed electronics outside of traditional membrane switch manufacturing • Discussion of requirements for understanding the technology of the .. weiterlesen

Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology. .. weiterlesen

The breadth of materials and processes used in today’s electronic assemblies may make it impossible to predict SIR/ECM performance without adequate testing of material and process combinations. .. weiterlesen

Counterfeit and substandard parts and components have been a recurring theme in practically every market. For the last several years,the largest concern has been in the military and aerospace i .. weiterlesen

In this evaluation we will show an ionic residue comparison using Umpire 2 boards that were top and bottom surface mounted with standard reflow and selective wave soldered on the connector and .. weiterlesen

Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin .. weiterlesen

Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo .. weiterlesen

Board-level designers are constantly expected to cram more computational power,into a smaller space,at lower cost,and accomplish this task in less time and with fewer resources. In this rush to .. weiterlesen

The IPC Solder Products Value Council,in cooperation with iNEMI and a group of industry experts,has developed a protocol for testing the physical properties of lead free solder alloys. This pre .. weiterlesen

There is no issued industry standard for the workmanship of underfills – either from the perspective of visual examination (a la A-610) or by more intrusive techniques like cross-sectioning. Th .. weiterlesen

Vern Solberg is an independent consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the industry for more than twenty-five years in areas relat .. weiterlesen

Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si .. weiterlesen

With the release of IPC 7093,"Design and Assembly Process Implementation for Bottom Termination SMT Components," earlier this year,the term BTC is the newest acronym to enter the world of SMT. .. weiterlesen

SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements .. weiterlesen

The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon .. weiterlesen

The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon .. weiterlesen