IPC Conference Paper Archive

Eagle Test Systems (ETS) a Teradyne Company established a team during 2009 to develop a training exercise that would bring High Density Interconnect (HDI) knowledge to new products. A digital m .. weiterlesen

The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies,generating much concern. A head-in-pillow defect is the in .. weiterlesen

- Background: What is a void? - What is a "macro" void? - What is a “planar” void? - What is a “shrinkage” void? - What is a “microvia” void? - What is a “pinhole” void? - What is a “Kirkendall .. weiterlesen

•Board-level drop shock test was performed on 9 assemblies –63 parts / board –Parts representative of military package styles •Assembled on Pb-free compatible laminate with SAC 305 solder •Sele .. weiterlesen

The lead-free directive from the EU has created a number of challenges for high reliability electronic applications. Key among those challenges is the need to address the issue of tin whiskers. .. weiterlesen

- Correlating film properties to the propensity to whisker will lead to the development of a comprehensive whisker growth model and create successful mitigation strategies. •Hillock and whisker .. weiterlesen

- Regulations are driving increasing IPC-1752 use - More restricted substances and product categories in scope - The business challenge is much bigger than “regulatory compliance” - Teams incre .. weiterlesen

In globally competitive markets,managing product quality,reliability and risk is not an option. However,it also brings its own unique set of challenges to complex organizations: - Product desig .. weiterlesen

The effects of nano-TiO particle additives on the microstructure and microhardness of the 2 Sn3.5Ag0.5Cu composite solder were studied. Results show that alloying with nano-TiO 2 particles dram .. weiterlesen

Using X-ray imaging,solder corrosion,resembling metal migration,had been observed under QFN (Quad Flat No-Lead package) devices and chip resistors on circuit boards that were processed with two .. weiterlesen

• Genesis in December 2008 • Follow-up discussions APEX 2009 • Input received from SMEs • Conference Call July 22,2009 • Discussions IPC Midwest 2009 • First white paper issued by IPC SPVC June .. weiterlesen

Like many other electronics industries,the automotive electronics industry has long been concerned about ESD. As dramatically seen in the news today,quality recalls can detrimentally affect the .. weiterlesen

BGA’s,ceramic capacitors,and similar strain sensitive components are used extensively throughout the automotive and consumer electronics industries. Unfortunately these components can be easily .. weiterlesen

High reliability applications in the military and aerospace industry require reliable solder finish identification on components within the supply system of DoD,NASA,and many other organization .. weiterlesen

As margins on electronics technology have continued to erode,an increasing number of organizations have implemented design for reliability practices to ensure device performance while meeting t .. weiterlesen

Advancing technology frequently requires an accompanying advancement in materials technology. Recently,these advances are also driven by changes in environmental legislation as well. Specifical .. weiterlesen

The growing complexity of electronic assemblies increases the cleaning challenge due to miniaturization,lower component gaps,and improved flux designs. The need to remove ionizable contaminants .. weiterlesen

As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us .. weiterlesen

Several methods exist to determine cleanliness of printed wiring assemblies. This presentation will describe the common methods used for determining cleanliness of printed wiring assemblies. Th .. weiterlesen

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Reel to reel production of flexible circuits where the substrate consists of a continuous roll is a technique commonly used in mass production. This method is an obvious solution for efficient .. weiterlesen

An overview of previous work regarding light enegine development is provided,proceeded by an in-depth overview of new technology available for solder mask imaging. .. weiterlesen

With the miniaturization of electronic devices1,the need for more versatile materials to make these devices increases. Coupled with the gradual removal of lead-based solders2,thermal stability .. weiterlesen

Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi .. weiterlesen

Electronics manufacturing process engineers are faced with significant challenges when selecting a cleaning system as a consequence of the wide ranges of cleaning processes and equipment. Curre .. weiterlesen

Miniaturization and higher functionality in electronics packaging require the use of advanced packages and small components. This trend has translated into the use of new package types such as .. weiterlesen

Manufacturers of electronic devices are always searching for new technologies that can improve processes,extend capabilities and lower costs. These drivers,along with the needs of new markets l .. weiterlesen

For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics miniaturization and densification. Numerous technologies issued from v .. weiterlesen

Even though ink jet printed circuit has many advantages over typical subtractive PWB technology such as fewer processes,less waste and labor,it has some problems. A major problem is weak adhesi .. weiterlesen

As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi .. weiterlesen

Mixing PCB Design Layout units will compromise perfection every time. PCB Design perfection starts with building CAD library parts and quickly moves to part placement,via fanout and trace routi .. weiterlesen

Predicting the electrical performance of embedded capacitor PCB designs has been a major stumbling block for the technology. In particular,one of the key questions has been how quickly can char .. weiterlesen

This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the .. weiterlesen

For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev .. weiterlesen

The use of an Organic Metal finish only a few nano-meters deposited onto copper pads of printed circuit boards provides effective protection against oxidation and preserves solderability. The N .. weiterlesen

Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a .. weiterlesen

The present work describes the use of additives in formaldehyde-free copper solutions to improve the start reaction of electroless copper deposition. Conventional electroless copper plating sol .. weiterlesen

Cleaning flux residues post soldering has been a high reliability criterion practiced by assemblers of military,aerospace,automotive,medical devices and other value offerings. Highly dense adva .. weiterlesen

While most cleaning processes in the global electronics manufacturing industry still rely on cleaning with DI-water only (for OA flux removal),recent studies suggest that water is beginning to .. weiterlesen

The effectiveness of cleaning stencils and misprinted/dirty printed circuit boards can be effectively monitored. This can be done by washing known clean circuit boards and then checking to see .. weiterlesen

Accuracy in solder balls and joint void detection is very important. If voids are incorrectly identified,board yield will be affected by incorrect scrapping and rework. Voids are difficult to d .. weiterlesen

The electronics assembly industry has long wished for and made great advancements toward developing a true,closed-loop automatic print verification and process monitoring technology. While sign .. weiterlesen

This paper details a break-through technology for automatic test equipment (ATE) fixtures. These new fixtures address the current market needs of - "faster,cheaper,and smaller". The new fixture .. weiterlesen

This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai .. weiterlesen

Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging .. weiterlesen

Wave soldering is a mature manufacturing process that metallurgically joins component and PWB termination features by passing them together across the flowing surface of a molten solder reservo .. weiterlesen

•Background information •Scope of the problem –Anecdotal –Study by International Chamber of Commerce –Recent study US Dept of Commerce •What to do about it ? –“Findings” and “Best Practices” •T .. weiterlesen

Counterfeiting is clearly a growing problem in many industries,including electronics,around the world. As the financial impact of counterfeiting has grown over the years,so has the attention th .. weiterlesen

The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic,polyurethane and parylene. The c .. weiterlesen

Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95% there has been concern about the possibility of circuit malfunctions due to whisker .. weiterlesen