IPC Conference Paper Archive

RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be .. weiterlesen

This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit Assembly (PCA) testing utilizing the test access port (TAP) defined in .. weiterlesen

Large printed wiring assemblies (PWB) exceeding 7000 circuit nets create significant quality,cycle time and cost issues at structural test in the new product introduction (NPI) phase. Tradition .. weiterlesen

“Unprecedented” is a word often used to describe the events caused by the economic downturn and its impact on the automotive electronics industry. The result has been numerous plant closings an .. weiterlesen

One of the effects of the ever increasing mountain of regulatory requirements and the globalization of markets is the need to disseminate and collect information across the shop floor and the e .. weiterlesen

One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.” Head-in-Pillow (HnP) defects occur on the blind solder joints of area .. weiterlesen

The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies,generating much concern. A head-in-pillow defect is the in .. weiterlesen

Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l .. weiterlesen

Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic .. weiterlesen

Using embedded structures in printed circuit boards,changes in moisture content have been monitored using route-impulse-energy measurement,capacitance measurement and weight gain. All three met .. weiterlesen

Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ significantly from those stated by the solder material provider. The .. weiterlesen

Electrochemical migration (ECM) is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM can cause a reduction i .. weiterlesen

Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00 .. weiterlesen

Photochemical machining (PCM) is an excellent method for manufacturing both simple and complex parts in a wide range of engineering materials. In the harsh economic climate facing manufacturing .. weiterlesen

Examples of various parts machined by PCM processes are featured. .. weiterlesen

Examples of various types of parts machined through PCM processes are described. .. weiterlesen

- 3D Manufacturing solutions: Flexible integration - 3D/SiP Cost of Ownership - Die vs. Package Stack Analysis - Smartphone - Package evolution - Handheld Processor Roadmap - PoP - TMV - Future .. weiterlesen

Consideration and selection of dip transfer flux and solder paste for PoP assembly are described,based on process consideration. The crucial properties vital for successful dip transfer include .. weiterlesen

Traditional SMT assembly is a two dimensional process. Each component is placed on the same horizontal plane in different X and Y locations. In Package on Package (PoP) assembly,components are .. weiterlesen

As the electronics industry moves toward smaller form and fit factors,advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are no .. weiterlesen

Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play important role for developing advanced printable technology. Ad .. weiterlesen

Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher frequency and higher power requirements. These power and frequency demands .. weiterlesen

Printed circuit board laminate datasheets provide permittivity (dielectric constant,Dk) and loss tangent (dissipation factor,Df) values that are used for specification and board design. But pas .. weiterlesen

In this paper,ITEQ demonstrates outstanding performance of new halogen-free and low loss laminates,IT-258GA,IT-168G,and IT-150D,for the coming halogen free generation,and higher frequency appli .. weiterlesen

This paper will focus on understanding the dielectric constant (dk) of high frequency laminate materials. The dissipation factor (df) and other electrical properties will be discussed as well,h .. weiterlesen

• The Information Process • Knowing the jargon (terms & definitions) • Defining the requirements • Expansion of Documentation standards • Document Grade and Completeness • Relationship of CAD/C .. weiterlesen

• The standard covers marking and labellingof both tin-lead and lead-free components,boards and solders used in 2ndlevel assembly. • Other areas covered include board base material type and sur .. weiterlesen

Current carrying capacity in printed board design is technology dependent and an element of printed circuit board thermal management. Conductor temperature rise as a function of current is depe .. weiterlesen

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Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed .. weiterlesen

In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains .. weiterlesen

Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to .. weiterlesen

- Production Processes - Manual Production Line (2000) - Fully Automated System (today) - Cell Interconnection - Encapsulation Materials - Encapsulation Process - Influence of Temperature - Enc .. weiterlesen

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With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive environments,the electronics industry is observing increased occurrences o .. weiterlesen

As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us .. weiterlesen

Microvia technology has many advantages: it requires a smaller designed area,which saves the board size and weight,using less space,allowing for a smaller PCB,which can results in lower costs,a .. weiterlesen

The European REACH regulation (Regulation (EC) No 1907/2006) imposes requirements to declare and sometimes restrict the use of Substances of Very High Concern (SVHC). REACH affects all product .. weiterlesen

This paper will present the results of a round robin study of sample combustion followed by ion chromatography (CIC) to measure the concentration of bromine and chlorine in electronic materials .. weiterlesen

Stencil printing technology has come a long way since the early 80’s when SMT process gained importance in the electronics packaging industry. In those early days,components were fairly large,m .. weiterlesen

Future handheld electronic products will be slimmer than today and deliver more functions,enabled by innovative electronics packaging design using smaller components with greater I/Os assembled .. weiterlesen

Most electronic assemblies comprise a number of chips,packages and similar components that are attached to Printed Circuit Boards (PCBs) or similar substrates,usually using solder joints. Also .. weiterlesen

Under cycling loading conditions,solder joints are susceptible to fatigue cracking,which often initiates at the surface where the strain range is maximized. Event detectors have been widely use .. weiterlesen

Doing more with less has been the standard operating procedure in manufacturing over the past ten years. Everyone is looking for areas where they can cut corners,maintain quality,and improve pr .. weiterlesen

The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the .. weiterlesen

The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application o .. weiterlesen

One of the solder joint failures encountered frequently during Printed Circuit Board Assembly (PCBA) is due to Head-in-Pillow (HiP) defects. The primary cause of HiP defect is due to the warpag .. weiterlesen

The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro .. weiterlesen

The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f .. weiterlesen

An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame retardant epoxy resins use bromine-containing flame-retardants. In t .. weiterlesen