Welcome to IPC's collection of technical papers presented at conferences since 2002. You can search by author, title and keyword. You can also search for keywords and topics in the Tag field. Access to the papers is reserved for IPC members.

Prediction of Whisker Growth Positions at Press-Fit Connections Using Finite Element Analysis

Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of .. read more
Author(s)
Marius Tarnovetchi, Vitesco Technologies, Timisoara, Romania, marius.tarnovetchi@vitesco.com,Hans-Peter Tranitz
Event
IPC APEX EXPO 2022

Study of the Growth of Sn-Cu Intermetallic Compounds Using XRF Coulometric Stripping (XRF-CS) Method

The method to measure intermetallic compound layer thickness is discussed in a paper recently published by the author[1]. The method uses voltage/current sources, voltmeters, and electrolyte .. read more
Author(s)
J. Servin
Event
IPC APEX EXPO 2022

Corrosion Failure Risk Assessment of SMT LEDs to Sulfur Bearing Gas Environments

Light emitting diodes (LEDs) are widely used throughout the electronics industry due to their high efficiency, lumen output, and expected lifetime. LEDs are semiconductor devices that are co .. read more
Author(s)
Eric Campbell, Jennifer Bennett, Jim Bielick, Curtis Grosskopf, and Jiayu Zheng
Event
IPC APEX EXPO 2022

Ammonia Gas Effect on Metal Corrosion of PCB Surface Finish-in Acid-Gases Based Mixed Flowing-Gas Test

The proliferation of Artificial Intelligence (AI), big data, 5G, electric vehicles, Internet of Things (IoT), Edge Computing,High Performance Computing (HPC) and Electric Vehicle (EV) in rec .. read more
Author(s)
Dem Lee* and Jeffrey Lee, YuanXin Li and HaiLin Tang
Event
IPC APEX EXPO 2022

Anti-Slump SiP Solder Paste Enables Further Miniaturization

In this study, a patent-pending new solder paste material has been developed for assembly of System in Package (SiP) with outstanding slump resistance without compromising the paste volume p .. read more
Author(s)
Zhengfeng Xu, Aixia Zheng, Jian Wang, Ming Wang, and Ning-Cheng Lee
Event
IPC APEX EXPO 2022

Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs

Use of low-cost Aluminum based flexible printed circuit boards or Al-PCBs has been growing in popularity. Integrating them with conventional Copper based PCBs or Cu-PCBs is essential for the .. read more
Author(s)
Divyakant Kadiwala, Nazarali Merchant, Ph.D. Benny Lam
Event
IPC APEX EXPO 2022

Active Alignment Adhesive Technology

The assembly of complex optical systems such as objective lenses for smartphone cameras, autonomous driving sensors / cameras, and light detection and ranging (LiDAR) require precise alignme .. read more
Author(s)
Dave Dworak
Event
IPC APEX EXPO 2022

Printed Circuit Structures: Past, Present, and Future

Printed Circuit Structures (PCSs) have the potential to revolutionize next generation printed circuit boards (PCBs) and electronics packaging. Almost every product available today contains s .. read more
Author(s)
Raymond C. Rumpf, C. Michael Newton, and Kenneth H. Church, Raymond C. Rumpf
Event
IPC APEX EXPO 2022

Digital and Environmental Circuit Board Manufacturing Based on Continuous Laser Assisted Deposition

In the LIFT (Laser Induced Forward Transfer) technology, a material, evenly coated on a transparent carrier film, passes under a laser. The laser applies a short burst of energy to it. This .. read more
Author(s)
Ralph Birnbaum, Guy Nesher, Alex Stepinski, Michael Zenou
Event
IPC APEX EXPO 2022

HDI Build-Up Layers for Reliability

In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mand .. read more
Author(s)
Thomas McCarthyPaul CookeSteve Schow
Event
IPC APEX EXPO 2022

Recrystallisation and the Resulting Crystal Structures in Plated Microvias

Plated and filled microvias are a common feature in modern PCBs, so much so, that they are now considered as the industry norm as a means of achieving high-density designs for modern mobile .. read more
Author(s)
T. Bernhard, R. Massey, K. Klaeden, S. Zarwell, S. Kempa, E. Steinhaeuser,S. Dieter, F. Brüning
Event
IPC APEX EXPO 2022

Evaluation of Transient Phase Conductive Material and Copper PCB Construction

Traditional PCB fabrication technology incorporates copper-plated vias after each press lamination connecting with microvias or mechanical vias. Conductive epoxy or transient phase conductiv .. read more
Author(s)
Eric Haakenson
Event
IPC APEX EXPO 2022

Design And Testing of Three Levels of Microvias for High-Reliability PCBs

Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very .. read more
Author(s)
Maarten Cauwe, Chinmay Nawghane, Marnix Van De Slyeke, Stan Heltzel, Jason Furlong, Bob Neves, Kevin Knadle
Event
IPC APEX EXPO 2022

Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice

As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage, .. read more
Author(s)
Kevin Kusiak, Scott Bowles
Event
IPC APEX EXPO 2022

Next Progression in Microvia Reliability Validation – Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the PCB Design Process

As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly .. read more
Author(s)
Gerry Partida
Event
IPC APEX EXPO 2022

Functional Test on RF And High-Speed Connectors on PCBA's And Cable Harness Assemblies for Automotive Applications

This paper presents test methods to effectively perform conducted testing on RF and high-speed data connectors for automotive applications. In almost any modern vehicle there are numerous hi .. read more
Author(s)
Matthias Zapatka
Event
IPC APEX EXPO 2022

Rapid Assessment of Solder Resist-Related Electrochemical Reliability Issues

In comprehensive humidity tests for the release of materials and processes for the assembly and interconnect technology of PCBAs of the automotive industry, the solder resist has emerged as .. read more
Author(s)
Lothar Henneken
Event
IPC APEX EXPO 2022

Application of Dielectric Spectroscopy (Ds) for Quality Control of Solvent-Borne Conformal Coatings

The viscosity of conformal coatings is critical in producing consistent and reliable applications of coating onto a printed circuit board (PCB). A conformal coating that has experienced mois .. read more
Author(s)
Wilson Chen, Morgan Miller, Ian Miske, Christopher Frederickson, and Dongkai Shangguan
Event
IPC APEX EXPO 2022

Comprehensive SIR Testing for Platform Release in the Automotive Industry

A comprehensive SIR test-protocol for the release of materials and processes in the automotive industry is presented. In this way, by a combination of comprehensive SIR testing and intensive .. read more
Author(s)
Dr. Lothar Henneken, Robert Bosch
Event
IPC APEX EXPO 2022

A Critical Analysis of CAF Testing-- Temperature, Humidity, and the Reality of Field Performance

As Conductive Anodic Filament (CAF) testing on Printed Circuit Boards (PCBs) approaches 50 years of industry attention, the chemistry of formation in the lab environment is well documented, .. read more
Author(s)
Kevin Knadle
Event
IPC APEX EXPO 2022

Using Machine Learning for Anomaly Pattern Recognition in Manufacturing Processes

As the manufacturing sector is under constant pressure to satisfy customers’ demands in a competitive market by applying complex processes to meet manufacturing cost and schedule goals, the .. read more
Author(s)
Shadi Kuo, Richard Witmer and Martin Goetz
Event
IPC APEX EXPO 2022

Towards Artificial Intelligence in SMT inspection processes

To ensure the highest possible quality standards in automotive electronics production, an extensive implementation of testing and inspection systems throughout production is mandatory. In SM .. read more
Author(s)
Mario Peutler, Michael Boesl, Johannes Brunner, Dr. Thomas Kleinert
Event
IPC APEX EXPO 2022

AI for Electronics Manufacturing – An Industry 4.0 Architecture and ConditionMonitoring Framework for Printed Circuit Board Assemblies

The key challenge for industry in adopting AI into their manufacturing processes surrounds the accessibility of their data. Many manufacturing industries, especially electronics manufacturin .. read more
Author(s)
Jay Taylor, Naim Kapadia, Mohammed Begg
Event
IPC APEX EXPO 2022

AI Model Benchmarking at the Edge for Quality Inspection in Manufacturing

Neural network based deep learning models increasingly demonstrates high accuracy in object detection and image classification in digital image processing. The manufacturing industry is adap .. read more
Author(s)
Feng Xue
Event
IPC APEX EXPO 2022

In-Line Implementation of Photonic Soldering

Photonic soldering utilizes high intensity flashes of visible light to achieve wide area heating with exceptional uniformity. Solder paste is heated to its liquidus temperature using radiati .. read more
Author(s)
Vahid Akhavan,* Ara Parsekian, Harry Chou, Ian Rawson, Nikhil Pillai, Rudy Ghosh
Event
IPC APEX EXPO 2022

IPC-HERMES-9852 Lays the Foundation for Automated Flexible Production

IPC-HERMES-9852 as the smart replacement for the long-used IPC-SMEMA-9851 provides machine-to-machine (M2M) communication that ensures consistency of each PCB and its individual data while t .. read more
Author(s)
Dr. Thomas Marktscheffel
Event
IPC APEX EXPO 2022

A Study of Data Driven Quality Management Across EMS Smart Factory

With the advancement of emerging technologies such as AI, Cloud and Block Chain, the electronics manufacturing industry is entering a new era of smart manufacturing. More and more Electronic .. read more
Author(s)
Robin Hou, Wayne Zhang, Feng Xue, Way Guo, Jung Yoon, Blue Wang, Johnny Zhao
Event
IPC APEX EXPO 2022

SMT Printer Changeover Automation

The Factory of the Future or a Lights out Factory will require significant automation, including many functions that are challenging and are still performed manually due to the complexity an .. read more
Author(s)
Wayne Wang, Matthew Schumacher, Bruce Seaton, James Lynch,
Event
IPC APEX EXPO 2022

IPC-CFX Open-Source Hardware Initiative

The IPC Connected Factory Exchange (IPC-CFX) standard provides genuine plug-and-play IIoT data exchange between machines and supervisory systems across the shop floor. To realise the benefit .. read more
Author(s)
Naim Kapadia
Event
IPC APEX EXPO 2022

Single Source of Truth (PathWave Manufacturing Analytics)

With the Industry 4.0 transformation going full steam ahead, analytics have transformed the industry from being process-driven to now data-driven, where data speaks for itself. Conventionall .. read more
Author(s)
Juliann Forbes, Yee Bing Hong, Beng Chye Tan
Event
IPC APEX EXPO 2022

48V 250A FET PCB Thermal Profile - A Thermal Simulation Using 2D And CFD Airflow Analysis

This case analysis evaluates the thermal profile of 10 FETs rated at 48V, 250A under 100 secs soak time with all the thermally enhanced mechanical attachments installed. The goal was for the .. read more
Author(s)
Marcus Miguel V. Vicedo, Richard V. Legaspino , Kristian Joel S. Jabatan
Event
IPC APEX EXPO 2022

Dispensing Performances of Liquid Metal Alloys Containing Organic Compound Additives as Thermal Interface Materials for IC module Applications

Liquid metal alloys (LMAs), GaIn, and Galinstan, have been paid considerable attention as thermal interface materials (TIM) for usage of thermal management in microprocessor packages, includ .. read more
Author(s)
Guangyu Fan, Kevin Brennan, Ross Berntson
Event
IPC APEX EXPO 2022

Thermally Conductive, EMI Shielding Materials for High Frequency Radio Waves

Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniatu .. read more
Author(s)
Bongjoon Lee, Michael Trebisovsky, Neil Poole, John Timmerman
Event
IPC APEX EXPO 2022

Silicone Migration Concerns in Thermal Materials – How Real are They?

Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in industrial, automotive and consumer electronics [1]. These materials are typical .. read more
Author(s)
Dr. Sanjay Misra
Event
IPC APEX EXPO 2022

Solid Liquid Hybrid TIMs - Part II The Power of Liquid Metal Composites

In a previous paper [8], solid liquid hybrids (SLHs) were presented as a combination of metals that are solid at room temperature with ones that are liquid at room temperature. Those materia .. read more
Author(s)
Miloš Lazić, Andy Mackie, Tim Jensen, Ben Rolewicz, and Bob Jarrett
Event
IPC APEX EXPO 2022

Study Of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials

In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5 .. read more
Author(s)
Kevin Brennan, Guangyu Fan, Ross Berntson
Event
IPC APEX EXPO 2018

Conformable, Light-Weight Power Harvesting Textiles

Light weight, conformal and portable standalone power solutions are becoming increasingly important for powering wearable electronics including .. read more
Author(s)
Siddhant Iyer, Zhiyu Xia, Lian Li, Claire Lepont, Ravi Morsukal, Jayant Kumar, Ramaswamy Nagarajan
Event
IPC APEX EXPO 2021

Wireless Wearable ElectroMyography Monitoring System Utilizing Reduced Graphene Oxide Coated Textiles

Wearable devices for biomedical applications have become more popular due to the increasing demand on health monitoring for both consumer and medical fields. In this work, we describe a nove .. read more
Author(s)
Le-Lan Tran, Huy-Dung Han, Nhung Nguyen-Hong, Loan Pham-Nguyen, Linh T. Le
Event
IPC APEX EXPO 2021

Contact and Non-contact Deposition Strategies for Liquid Metal Alloys (LMA)

SINTEC is the project name for a Liquid metal alloy technology with the goal of creating flexible and stretchable electronics.  These stretchable electronics are applicable to wearable .. read more
Author(s)
Gustaf Mårtensson, Jan Maslik, Jeff Leal, Klara Björnander Rahimi, and Klas Hjort
Event
IPC APEX EXPO 2021

Textile Capacitive Touch sensing: Real-Time Localization using Manifold Space Particle Tracking

Textile-based touch sensing offers a novel solution towards creating flexible and robust tactile interfaces that fit within an existing manufacturing ecosystem.  Current fabric-based to .. read more
Author(s)
Richard Vallett, Denisa Qori McDonald, Genevieve Dion, Ali Shokoufandeh
Event
IPC APEX EXPO 2021

Pushing New Frontiers in Advanced Fibers and Fabrics

Author(s)
Michael Rein and Colleagues from AFFOA, Virginia tech, and MIT, and University of Central Florida.
Event
IPC APEX EXPO 2021

Smart Fabrics For Physiological Status Monitoring

The research presented in this slide show utilizes E-Textiles.  The applications include: Physiological Status Monitoring Cognitive Status Monitor .. read more
Author(s)
Bethany Bracken, Michael Rein, Jimmy Nguyen, Kristina McCarthy, Charlotte Fairless, Jason Cox, Aaron Winder, Sean Tobyne, Stan German, Shashank Manjunath
Event
IPC APEX EXPO 2021

The Impacts Of the COVID-19 Pandemic On the US Printed Circuit Board Industry: Lessons From Recent Survey Research

The DoD conducted a survey of PCB companies and the effects of COVID19.  The survey results showed that: Some U.S PrCB manufacturing facilities were significantly impa .. read more
Author(s)
Stephanie Hayes Richards
Event
IPC APEX EXPO 2021

Utilizing Quilt Packaging of PCB "Boardlets" to Enable Secure, Affordable, Modernized systems

Indiana Integrated Circuits has developed "Quilted" modular PCBs.  They consist of multiple small "boardlets" with traces or pads on rough edges of the boards.  These rough edges f .. read more
Author(s)
Jason Kulick
Event
IPC APEX EXPO 2021

DoD Executive Agent for Printed Circuit Board and Interconnect Technology: State of the Industrial Base

The Dod Executive Agent For Printed Circuit Board and Interconnect Technology (PrCB EA) has a vested interest in the state of the electronics industrial base and its ability to sustain and i .. read more
Author(s)
Craig Herndon
Event
IPC APEX EXPO 2021

Flex PCB Design for Panelization, Early Estimation for Better Utilization

This paper describes a new design approach to improve the cost efficiency of the “Flexible Printed Circuit” board (FPC also known as FPCB, “FPC” hereafter) by analyzing the impact of the boa .. read more
Author(s)
Naoyuki Sugaya, Tetsuya Asano and Steve Watt
Event
IPC APEX EXPO 2021

Design Optimization of SI Test Coupon to Achieve Accurate Measurement for 112Gbps/PAM-4 PCB Board

To magnify data transmission efficiency, high electrical performance of PCB boards is required for 112Gbps. The required operation frequency tends to increase, and target loss tends to decre .. read more
Author(s)
Kyoungsoo Kim, Simon Kim, Juhee Lee, Kiseop Kim and Kyungsoo Lee
Event
IPC APEX EXPO 2021

Component Packaging Technologies And Printed Board Design Driven SMT Assembly Yields Issues

This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives.  The component use cases and typical challenges are ex .. read more
Author(s)
Dale Lee
Event
IPC APEX EXPO 2021

Provenance and Traceability in the Electronics Supply-Chain A Look at the IPC-1782A Standard and Beyond

The lack of material provenance in today’s supply-chain allows the undetected ingress of counterfeit materials to increase at alarming levels. Chemicals, components, including critical ICs, .. read more
Author(s)
Radu Costin Diaconescu, Michael Ford
Event
IPC APEX EXPO 2021

The IPC-2551 Digital Twin Standard

One of the most important aspects of the IPC Digital Twin standard, is the enablement of interoperability between many digital twin-based solutions across many facets of the holistic manufac .. read more
Author(s)
Radu Diaconescu, Michael Ford, Thomas Marktscheffel, Hemant Shah
Event
IPC APEX EXPO 2021