Prediction of Whisker Growth Positions at Press-Fit Connections Using Finite Element Analysis
Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of
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Event
IPC APEX EXPO 2022
Study of the Growth of Sn-Cu Intermetallic Compounds Using XRF Coulometric Stripping (XRF-CS) Method
The method to measure intermetallic compound layer thickness is discussed in a paper recently published by the author[1]. The method uses voltage/current sources, voltmeters, and electrolyte
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Event
IPC APEX EXPO 2022
Corrosion Failure Risk Assessment of SMT LEDs to Sulfur Bearing Gas Environments
Light emitting diodes (LEDs) are widely used throughout the electronics industry due to their high efficiency, lumen output, and expected lifetime. LEDs are semiconductor devices that are co
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Event
IPC APEX EXPO 2022
Ammonia Gas Effect on Metal Corrosion of PCB Surface Finish-in Acid-Gases Based Mixed Flowing-Gas Test
The proliferation of Artificial Intelligence (AI), big data, 5G, electric vehicles, Internet of Things (IoT), Edge Computing,High Performance Computing (HPC) and Electric Vehicle (EV) in rec
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Event
IPC APEX EXPO 2022
Anti-Slump SiP Solder Paste Enables Further Miniaturization
In this study, a patent-pending new solder paste material has been developed for assembly of System in Package (SiP) with outstanding slump resistance without compromising the paste volume p
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Event
IPC APEX EXPO 2022
Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs
Use of low-cost Aluminum based flexible printed circuit boards or Al-PCBs has been growing in popularity. Integrating them with conventional Copper based PCBs or Cu-PCBs is essential for the
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Event
IPC APEX EXPO 2022
Active Alignment Adhesive Technology
The assembly of complex optical systems such as objective lenses for smartphone cameras, autonomous driving sensors / cameras, and light detection and ranging (LiDAR) require precise alignme
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Event
IPC APEX EXPO 2022
Printed Circuit Structures: Past, Present, and Future
Printed Circuit Structures (PCSs) have the potential to revolutionize next generation printed circuit boards (PCBs) and electronics packaging. Almost every product available today contains s
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Event
IPC APEX EXPO 2022
Digital and Environmental Circuit Board Manufacturing Based on Continuous Laser Assisted Deposition
In the LIFT (Laser Induced Forward Transfer) technology, a material, evenly coated on a transparent carrier film, passes under a laser. The laser applies a short burst of energy to it. This
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Event
IPC APEX EXPO 2022
HDI Build-Up Layers for Reliability
In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mand
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Event
IPC APEX EXPO 2022
Recrystallisation and the Resulting Crystal Structures in Plated Microvias
Plated and filled microvias are a common feature in modern PCBs, so much so, that they are now considered as the industry norm as a means of achieving high-density designs for modern mobile
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Event
IPC APEX EXPO 2022
Evaluation of Transient Phase Conductive Material and Copper PCB Construction
Traditional PCB fabrication technology incorporates copper-plated vias after each press lamination connecting with microvias or mechanical vias. Conductive epoxy or transient phase conductiv
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Event
IPC APEX EXPO 2022
Design And Testing of Three Levels of Microvias for High-Reliability PCBs
Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very
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Event
IPC APEX EXPO 2022
Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
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Event
IPC APEX EXPO 2022
Next Progression in Microvia Reliability Validation – Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the PCB Design Process
As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly
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Event
IPC APEX EXPO 2022
Functional Test on RF And High-Speed Connectors on PCBA's And Cable Harness Assemblies for Automotive Applications
This paper presents test methods to effectively perform conducted testing on RF and high-speed data connectors for automotive applications. In almost any modern vehicle there are numerous hi
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Event
IPC APEX EXPO 2022
Rapid Assessment of Solder Resist-Related Electrochemical Reliability Issues
In comprehensive humidity tests for the release of materials and processes for the assembly and interconnect technology of PCBAs of the automotive industry, the solder resist has emerged as
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Event
IPC APEX EXPO 2022
Application of Dielectric Spectroscopy (Ds) for Quality Control of Solvent-Borne Conformal Coatings
The viscosity of conformal coatings is critical in producing consistent and reliable applications of coating onto a printed circuit board (PCB). A conformal coating that has experienced mois
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Event
IPC APEX EXPO 2022
Comprehensive SIR Testing for Platform Release in the Automotive Industry
A comprehensive SIR test-protocol for the release of materials and processes in the automotive industry is presented. In this way, by a combination of comprehensive SIR testing and intensive
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Event
IPC APEX EXPO 2022
A Critical Analysis of CAF Testing-- Temperature, Humidity, and the Reality of Field Performance
As Conductive Anodic Filament (CAF) testing on Printed Circuit Boards (PCBs) approaches 50 years of industry attention, the chemistry of formation in the lab environment is well documented,
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Event
IPC APEX EXPO 2022
Using Machine Learning for Anomaly Pattern Recognition in Manufacturing Processes
As the manufacturing sector is under constant pressure to satisfy customers’ demands in a competitive market by applying complex processes to meet manufacturing cost and schedule goals, the
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Event
IPC APEX EXPO 2022
Towards Artificial Intelligence in SMT inspection processes
To ensure the highest possible quality standards in automotive electronics production, an extensive implementation of testing and inspection systems throughout production is mandatory. In SM
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Event
IPC APEX EXPO 2022
AI for Electronics Manufacturing – An Industry 4.0 Architecture and ConditionMonitoring Framework for Printed Circuit Board Assemblies
The key challenge for industry in adopting AI into their manufacturing processes surrounds the accessibility of their data. Many manufacturing industries, especially electronics manufacturin
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Event
IPC APEX EXPO 2022
AI Model Benchmarking at the Edge for Quality Inspection in Manufacturing
Neural network based deep learning models increasingly demonstrates high accuracy in object detection and image classification in digital image processing. The manufacturing industry is adap
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Event
IPC APEX EXPO 2022
In-Line Implementation of Photonic Soldering
Photonic soldering utilizes high intensity flashes of visible light to achieve wide area heating with exceptional uniformity. Solder paste is heated to its liquidus temperature using radiati
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Event
IPC APEX EXPO 2022
IPC-HERMES-9852 Lays the Foundation for Automated Flexible Production
IPC-HERMES-9852 as the smart replacement for the long-used IPC-SMEMA-9851 provides machine-to-machine (M2M) communication that ensures consistency of each PCB and its individual data while t
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Event
IPC APEX EXPO 2022
A Study of Data Driven Quality Management Across EMS Smart Factory
With the advancement of emerging technologies such as AI, Cloud and Block Chain, the electronics manufacturing industry is entering a new era of smart manufacturing. More and more Electronic
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Event
IPC APEX EXPO 2022
SMT Printer Changeover Automation
The Factory of the Future or a Lights out Factory will require significant automation, including many functions that are challenging and are still performed manually due to the complexity an
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Event
IPC APEX EXPO 2022
IPC-CFX Open-Source Hardware Initiative
The IPC Connected Factory Exchange (IPC-CFX) standard provides genuine plug-and-play IIoT data exchange between machines and supervisory systems across the shop floor. To realise the benefit
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Event
IPC APEX EXPO 2022
Single Source of Truth (PathWave Manufacturing Analytics)
With the Industry 4.0 transformation going full steam ahead, analytics have transformed the industry from being process-driven to now data-driven, where data speaks for itself. Conventionall
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Event
IPC APEX EXPO 2022
48V 250A FET PCB Thermal Profile - A Thermal Simulation Using 2D And CFD Airflow Analysis
This case analysis evaluates the thermal profile of 10 FETs rated at 48V, 250A under 100 secs soak time with all the thermally enhanced mechanical attachments installed. The goal was for the
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Event
IPC APEX EXPO 2022
Dispensing Performances of Liquid Metal Alloys Containing Organic Compound Additives as Thermal Interface Materials for IC module Applications
Liquid metal alloys (LMAs), GaIn, and Galinstan, have been paid considerable attention as thermal interface materials (TIM) for usage of thermal management in microprocessor packages, includ
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Event
IPC APEX EXPO 2022
Thermally Conductive, EMI Shielding Materials for High Frequency Radio Waves
Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniatu
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Event
IPC APEX EXPO 2022
Silicone Migration Concerns in Thermal Materials – How Real are They?
Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in industrial, automotive and consumer electronics [1]. These materials are typical
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Event
IPC APEX EXPO 2022
Solid Liquid Hybrid TIMs - Part II The Power of Liquid Metal Composites
In a previous paper [8], solid liquid hybrids (SLHs) were presented as a combination of metals that are solid at room temperature with ones that are liquid at room temperature. Those materia
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Event
IPC APEX EXPO 2022
Study Of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials
In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5
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Event
IPC APEX EXPO 2018
Conformable, Light-Weight Power Harvesting Textiles
Light weight, conformal and portable standalone power solutions are becoming increasingly important for powering wearable electronics including
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Event
IPC APEX EXPO 2021
Wireless Wearable ElectroMyography Monitoring System Utilizing Reduced Graphene Oxide Coated Textiles
Wearable devices for biomedical applications have become more popular due to the increasing demand on health monitoring for both consumer and medical fields. In this work, we describe a nove
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Event
IPC APEX EXPO 2021
Contact and Non-contact Deposition Strategies for Liquid Metal Alloys (LMA)
SINTEC is the project name for a Liquid metal alloy technology with the goal of creating flexible and stretchable electronics. These stretchable electronics are applicable to wearable
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Event
IPC APEX EXPO 2021
Textile Capacitive Touch sensing: Real-Time Localization using Manifold Space Particle Tracking
Textile-based touch sensing offers a novel solution towards creating flexible and robust tactile interfaces that fit within an existing manufacturing ecosystem. Current fabric-based to
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Event
IPC APEX EXPO 2021
Pushing New Frontiers in Advanced Fibers and Fabrics
Event
IPC APEX EXPO 2021
Smart Fabrics For Physiological Status Monitoring
The research presented in this slide show utilizes E-Textiles.
The applications include:
Physiological Status Monitoring
Cognitive Status Monitor
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Event
IPC APEX EXPO 2021
The Impacts Of the COVID-19 Pandemic On the US Printed Circuit Board Industry: Lessons From Recent Survey Research
The DoD conducted a survey of PCB companies and the effects of COVID19. The survey results showed that:
Some U.S PrCB manufacturing facilities were significantly impa
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Event
IPC APEX EXPO 2021
Utilizing Quilt Packaging of PCB "Boardlets" to Enable Secure, Affordable, Modernized systems
Indiana Integrated Circuits has developed "Quilted" modular PCBs. They consist of multiple small "boardlets" with traces or pads on rough edges of the boards. These rough edges f
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Event
IPC APEX EXPO 2021
DoD Executive Agent for Printed Circuit Board and Interconnect Technology: State of the Industrial Base
The Dod Executive Agent For Printed Circuit Board and Interconnect Technology (PrCB EA) has a vested interest in the state of the electronics industrial base and its ability to sustain and i
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Event
IPC APEX EXPO 2021
Flex PCB Design for Panelization, Early Estimation for Better Utilization
This paper describes a new design approach to improve the cost efficiency of the “Flexible Printed Circuit” board (FPC also known as FPCB, “FPC” hereafter) by analyzing the impact of the boa
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Event
IPC APEX EXPO 2021
Design Optimization of SI Test Coupon to Achieve Accurate Measurement for 112Gbps/PAM-4 PCB Board
To magnify data transmission efficiency, high electrical performance of PCB boards is required for 112Gbps. The required operation frequency tends to increase, and target loss tends to decre
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Event
IPC APEX EXPO 2021
Component Packaging Technologies And Printed Board Design Driven SMT Assembly Yields Issues
This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives. The component use cases and typical challenges are ex
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Event
IPC APEX EXPO 2021
Provenance and Traceability in the Electronics Supply-Chain A Look at the IPC-1782A Standard and Beyond
The lack of material provenance in today’s supply-chain allows the undetected ingress of counterfeit materials to increase at alarming levels. Chemicals, components, including critical ICs,
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Event
IPC APEX EXPO 2021
The IPC-2551 Digital Twin Standard
One of the most important aspects of the IPC Digital Twin standard, is the enablement of interoperability between many digital twin-based solutions across many facets of the holistic manufac
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Event
IPC APEX EXPO 2021