Welcome to IPC's collection of technical papers presented at conferences since 2002. You can search by author, title and keyword. You can also search for keywords and topics in the Tag field. Access to the papers is reserved for IPC members.

Conformal Coating Evaluation Test Development

The purpose of conformal coatings is to protect printed circuit boards and components mounted on them from the deleterious effects of moisture, particulate matter and corrosive gases. The co .. read more
Author(s)
Prabjit Singh and Larry Palmer
Event
IPC APEX EXPO 2021

A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop Shock Resistance

DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock pe .. read more
Author(s)
Hongwen Zhang, Samuel Lytwynec, Huaguang Wang, Jie Geng, Francis Mutuku
& Ning-Cheng Lee
Event
IPC APEX EXPO 2021

Evaluating Solder Joint Failures and Solder Joint Reliability: A Side-by-Side Comparison of Direct Current and Microwave Based Monitoring Techniques

Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circ .. read more
Author(s)
Yaw S. Obeng, Joe Smetana, Richard Coyle, Julie Silk; Morgan Allison, Karl Sauter, Tony Senese, David Backen, Robert Pennings, Bev Christian
Event
IPC APEX EXPO 2021

Use of Photonic Soldering to Rework Chip Components

Rework of assembled boards is often a necessary but difficult proposition. The complexity of the rework increases with the number of components to be reworked. A specific case involves where .. read more
Author(s)
Vahid Akhavan, Rudresh Ghosh, Thilo Sack, Harry Chou, Ara Parsekian, Mike Berry,
Bev Christian
Event
IPC APEX EXPO 2021

Board Thickness Effect on Accelerated Thermal Cycle Reliability

This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehi .. read more
Author(s)
Joe Smetan, Richard Coyle, Eric Lundeen, Iulia Muntele, Scott Danko, Neil Hubble, Bev Christian
Event
IPC APEX EXPO 2021

Powering The Internet of Things

This Slide Show Utilizes the Cover Paper from the session.   This slide show discusses the use Power harvesting in conjunction with a typical battery and the efforts .. read more
Author(s)
Mike Hayes
Event
IPC APEX EXPO 2021

Wide Bandgap (WBG) Power Electronics for Heavy-Duty Vehicles

This slide show discusses inverters and power electronics for Heavy Machinery.  There is discussion of Wide Band Gap Powered Devices.  The purpose is increased efficiency gains.&nb .. read more
Author(s)
Brij Singh
Event
IPC APEX EXPO 2021

Wide Bandgap (WBG) Power Electronics for Heavy-Duty Vehicles

This Paper utilizes the introduction from the session as its paper then discusses Wide Bandgap Power Electronics    All electronics products need a power source .. read more
Author(s)
Brian Zahnstecher
Event
IPC APEX EXPO 2021

Packaging and Manufacturability Considerations for Strategic Power Applications

All electronics products need a power source. Thereby power electronics has a fundamental impact on their design and integration, from materials and device up to systems and the applications .. read more
Author(s)
Brian Zahnstecher
Event
IPC APEX EXPO 2021

Adhesion Enhancement System for Next Generation High Speed IC Substrate

Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec .. read more
Author(s)
Thomas Thomas, Neal Wood, Carrick Chan, Wonjin Cho, Patrick Brooks
Event
IPC APEX EXPO 2021

TLPS Z-Axis Interconnect Solutions for Thermal Transfer and Electrical Connection in PCBs

The electronic packaging industry is undergoing a revolutionary convergence between the printed circuit board segment and the semiconductor packaging segment. New, streamlined and hybrid pac .. read more
Author(s)
Catherine Shearer, Gary Legerton
Event
IPC APEX EXPO 2021

Thermally Conductive and Electrically Insulative Multi-functional Film Adhesives for Assembling High-power Density Devices

In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but .. read more
Author(s)
Yuan Zhao, Bruno Tolla, Doug Katze, John Wood, Ana Pre and Junbo Gao
Event
IPC APEX EXPO 2021

Thermal Materials for Packaging Power Electronics

Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup .. read more
Author(s)
Sanjay Misra
Event
IPC APEX EXPO 2021

Solid Liquid Hybrid TIMs

For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solutio .. read more
Author(s)
Miloš Lazić
Event
IPC APEX EXPO 2021

Round Robin Testing of HDI Technology from Space-Qualified PCB Manufacturers

Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion. The introduction of H .. read more
Author(s)
Maarten Cauwe, Stan Heltzel, Jason Furlong, Chinmay Nawghane, Marnix Van De Slyeke, Alexia Coulon,
Event
IPC APEX EXPO 2021

Enig – Corrosion: The Status, The Risks and The Solutions

The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is th .. read more
Author(s)
Britta Schafsteller
Event
IPC APEX EXPO 2021

PCB Reliability Evaluation for 0.92 mm Pitch Field Programmable Gate Array (FPGA) Applications

Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provid .. read more
Author(s)
Antonio Caputo
Event
IPC APEX EXPO 2021

Emerging Supply Chain Cybersecurity Requirements, Government Acronyms, and Actual Security

Emerging Supply Chain Cybersecurity requirements, government acronyms, and actual security. Learn about the current state of mandates such as Cybersecurity Maturity Model Certification (CMMC .. read more
Author(s)
Scott Armstrong
Event
IPC APEX EXPO 2021

IPC-1791, Cybersecurity Maturity Model Certification (CMMC), and the Printed Circuit Board Design, Fabrication, and Assembly Industry

This paper presents the concerns on trustworthiness for printed circuit board (PrCB) design, fabrication, and assembly sources for national defense systems, specifically products on the Unit .. read more
Author(s)
Richard Snogren
Event
IPC APEX EXPO 2021

CyberSecurity Concerns for the Printed Circuit Board Industry

This slide show discusses the cybersecurity risks associated with network integration.  The supply chain is the most vulnerable, especially sub suppliers.  A particular risk is whe .. read more
Author(s)
Brian S. Cohen
Event
IPC APEX EXPO 2021

Present Company Not Excluded – New Cybersecurity Regulations Will Affect Your Business (and make it safer)

Current policies and regulations intended to protect supply chains from cyber threats, especially the supply chain to the US DoD, have proven ineffective. Nearly $1 trillion in intellectual .. read more
Author(s)
Stuart Itkin
Event
IPC APEX EXPO 2021

Circuit Board Security Vulnerabilities and Counteractions

Published stories in 2015 of a maliciously altered server motherboard have made clear that the circuit board is vulnerable to hardware attacks. To demonstrate their vulnerability, a circuit .. read more
Author(s)
Samuel H. Russ
Event
IPC APEX EXPO 2021

DoD Cybersecurity: Where We Are Now and What Needs to Be Done to Be Compliant

This paper will discuss from an operational perspective what companies are or aren’t doing now and what steps companies can take to secure their overall IT enterprise which will logically he .. read more
Author(s)
Samuel P. Morthland
Event
IPC APEX EXPO 2021

Microvia Process Guidelines

High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circ .. read more
Author(s)
Stan Heltzel, Pierre Emmanuel Goutorbe, Jean-Marc Guiraud, Thomas Rohr
Event
IPC APEX EXPO 2021

IPC/IMEC/ESA Microvia TV IST Test Results

This slide show discusses Automation of IST testing.  It utilizes Dielectric estimation laminate assessment method (DELAM).  The slides utilizes thermo-graphics to locate the failu .. read more
Author(s)
Jason Furlong
Event
IPC APEX EXPO 2021

Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction

The push for faster data rates and increased signal density in printed circuit boards (PCBs) increases the risk of signal crosstalk on high-speed communication busses which can be highly det .. read more
Author(s)
Sarah Czaplewski, Roger Krabbenhoft, and Junyan Tang
Event
IPC APEX EXPO 2021

Solve BGA VIPPO Failures with Advanced Materials

Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke .. read more
Author(s)
Naji Norder, Brian Flemming
Event
IPC APEX EXPO 2021

Semi-AdditivePCBProcessing: Process, Reliability Testing andApplications

The continued miniaturization of both packaging and component size in next-generation electronics presents a significant challenge for PCB designers and PCB fabricators. To effectively navig .. read more
Author(s)
Mike Vinson
Event
IPC APEX EXPO 2021

Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias

The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. The benefits of embedding active die .. read more
Author(s)
Manoj Kakade, Richard Dowling, Mumtaz Bora, Jake Tubbs, and Ahmed Maghawri
Event
IPC APEX EXPO 2021

FIDES, Reliability Assessment of Electronics: A New Approach to the LeadFree Process Factor

The reliability control in airborne electronics products is essential due to safety and business reasons. As users do not have confidence in raw results provided by previous reliability pred .. read more
Author(s)
Murilo Levy Casotti, José Carlos Boareto, Orestes Estevam Alarcon, Andre Oliveira,
Event
IPC APEX EXPO 2021

Failure Analysis Cases Studies on Solder De-Wetting For Electronics Products

Over many years defect analysis has been used at the company to determine the root cause of various defects experienced in the field on electronic products from customers. Based on this work .. read more
Author(s)
Jasbir Bath, Kentaro Asai, Shantanu Joshi, Jack Harris, Roberto Segura
Event
IPC APEX EXPO 2021

Analyzing Printed Circuit Board Voiding and other Anomalies when Requirements Covering the Anomalies are Vague

Two independent Printed Circuit Board (PCB) suppliers found unusually high voiding anomalies in multiple manufacturing lots of PCBs that were processed over a 5 month period. The issue was n .. read more
Author(s)
Wade Goldman, Hailey Jordan, Curtis Leonard
Event
IPC APEX EXPO 2021

A Framework for Large-Scale AI-Assisted Quality Inspection Implementation in Manufacturing Using Edge Computing

In recent years, neural network based deep learning models has demonstrated high accuracy in object detection and classification in the area of digital image processing. Manufacturing indust .. read more
Author(s)
Feng Xue, Charisse Lu, Christine Ouyang, James Hoey, Rogelio Fernando Gutierrez Valdez, Richard B Finch
Event
IPC APEX EXPO 2021

The Case for an Electronics Supply Chain Blockchain

Blockchain technology has a lot of publicity in the electronics industry because of the way it has been used to address issues with sharing data across distributed networks and is recognized .. read more
Author(s)
Michelle Lam, Dave Verburg, Curtis Grosskopf
Event
IPC APEX EXPO 2021

Enriching Test Equipment Analytics with Structured Logging

Automated test equipment plays a large role in the manufacturing process at the Kansas City National Security Campus (KCNSC). Every test run generates data which is used to determine if a pa .. read more
Author(s)
Jack Savage, Mike Tohlen, Alex Czarnick
Event
IPC APEX EXPO 2021

A Guide to Manufacturing Data Analytics

Data is the New Oil Clive Humby, UK Mathematician and architect of Tesco’s Clubcard is widely credited as the first to coin the phrase in 2006: “Data is the new oil. It’s valuable, .. read more
Author(s)
Francisco Almada Lobo & Dave Trail
Event
IPC APEX EXPO 2021

Advanced, Non-Real-Time Uses of Machine Data for Factory Operational Improvement

EMS factories have collected and used machine data for many decades. Over that time, much of the value derived from machine data collection has come from three operational use cases: allowin .. read more
Author(s)
Timothy M Burke
Event
IPC APEX EXPO 2021

A Structured Approach for Providing well-formed Maintenance Data for SMT Machines

Smart Factories require continuous and reliable operation of all equipment. Therefore, equipment maintenance is becoming more and more important. A simple approach for equipment maintenance, .. read more
Author(s)
Thomas Marktscheffel
Event
IPC APEX EXPO 2021

IPC/IMEC/ESA Microvia TV Introduction

This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu .. read more
Author(s)
Maarten Cauwe
Event
IPC APEX EXPO 2021

Implementing a Global Machine Data Collection System Across Many EMS Factories

As EMS Providers such as Contract Manufacturers look forward to Industry 4.0, their need for complex data analysis to inform manufacturing decisions takes on even more significance. Managing .. read more
Author(s)
Myckel Haghnazari
Event
IPC APEX EXPO 2021

Implementation of IPC CFX Using Surface Mount Legacy Equipment

The smart factory project for Electronics Manufacturing initiative was developed to create a sandpit to carry out industry 4.0 use cases working with industrial members and partners. The Man .. read more
Author(s)
Naim Kapadia, Joel Kellam, and Jay Taylor
Event
IPC APEX EXPO 2021

The Role for Automation and Robotics in Electronics Manufacturing

Why use robotics? Precision -> improved quality Consistency -> improved quality Traceability -> improved quality Dexterity -> to handl .. read more
Author(s)
Mike Wilson
Event
IPC APEX EXPO 2021

Working with Augmented Realityin Electronics Manufacturing

This paper discusses the automation of inspection using Augmented Reality (AR).   Machine vision is used to find small components since it reduces the amount of time needed for ins .. read more
Author(s)
David Varela, Thomas Barclay, Mohammad Ahmed
Event
IPC APEX EXPO 2021

IPC/IMEC/ESA MICROVIA TV INTRODUCTION

This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu .. read more
Author(s)
Maarten Cauwe
Event
IPC APEX EXPO 2021

IPC/IMEC/ESA Microvia TV CITC Test Results

IPC/IMEC/ESA Microvia TV CITC Outline  CITC Coupon and Test Plan Overview  CITC Test Introduction  Temperature Coefficient of Resistance (TCR) Test and Resul .. read more
Author(s)
Kevin Knadle
Event
IPC APEX EXPO 2021

Process Improvement Strategies for Weak Microvia Interfaces

The industry has been openly discussing the concern about weak microvia interfaces after IR reflow and the potential for an undetected open or latent defect that can escape after expensive c .. read more
Author(s)
William Bowerman, Jordan Kologe, Rich Bellemare and Warren Kenzie
Event
IPC APEX EXPO 2021

The Complete Path to Least Resistance

The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on P .. read more
Author(s)
Jerry Magera
Event
IPC APEX EXPO 2021

Microvia Weak Interfacial Fracture of Microvia Designs-Comparing the Reliability of Graphite-based Direct Metallization and Conventional Electroless Copper-Phase 1

Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface betwee .. read more
Author(s)
Gerry Partida, Daniel Heitner, Jay Sturgeon, Michael Carano
Event
IPC APEX EXPO 2021

Technology Verification for Reliable Smart Surfaces

The Company has developed and industrialized an advanced technology of plastic-integrated structural electronics. Key benefits are 3-dimensional shapes, reduced thickness and weight as well .. read more
Author(s)
Outi Rusanen, Janne Asikkala, Paavo Niskala and Tomi Simula
Event
IPC APEX EXPO 2021

Addressing the Changing Landscape of Automotive Electronic Designs: Improving Performance and Robustness Through Proper Material Choice

The automotive industry is experiencing significant change in design and performance expectations as it moves to the future. Synonymous with high reliability in harsh conditions, today the a .. read more
Author(s)
Lenora Clark, Senthil Kanagavel, Richard Bellemare, Paul Salerno
Event
IPC APEX EXPO 2021