Outgassing Behaviour of SMT Flux Residue During Reflow Soldering
SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. This work shows how the amount of no clean flux residues can
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Event
IPC APEX EXPO 2019
How to Manage Material Outgassing in Reflow Oven
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-pa
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Event
IPC APEX EXPO 2019
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. EPIG, electroless palladium immersion gold, is a new
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Event
IPC APEX EXPO 2019
Designing a High Performance Electroless Nickel and Immersion Gold to Maximize Highest Reliability
The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with referen
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Event
IPC APEX EXPO 2019
Multilayered Flexible Hybrid Screen Printed Circuits on Disposable Medical Grade Substrates
This paper details the realization of a multi-layered, printed, conformable hybrid circuit. The circuit was created using silver(Ag) flake ink as a conductive layer and UV acrylic-based ink
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Event
IPC APEX EXPO 2019
Printed Electronics for Medical Devices
As is the case with many other markets where faster, highly capable technologies have resulted in more intelligent processes and products, the medical device sector is also undergoing a “sma
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Event
IPC APEX EXPO 2019
Development for Next Generation Halogen Free Ultra Low Loss Material
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Event
IPC APEX EXPO 2019
Fabric Weaving and Circuit Orientations Impact for Skew / Signal Integrity
This Presentation discusses Improvements for signal integrity. Signal integrity is based on the copper surface roughness, the oxides on the copper, and the Dielectric constant of the D
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Event
IPC APEX EXPO 2019
Innovations for future RF designs
This Slide show presents RF Cap Layers to normal FR4 Dielectric materials. This material can be used in multiple configurations including Single sided, Double sided, and Hybrid.&n
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Event
IPC APEX EXPO 2019
Higher Defluxing Temperature and Low Standoff Component Cleaning-A Connection?
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remai
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Event
IPC APEX EXPO 2019
Methodology for Developing Cleaning Process Parameters
Electronic assembly processes range from simple to complex and involve a wide range of materials to produce. Each step in the process and each assembly material used will have some impact on
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Event
IPC APEX EXPO 2019
IPC-J-STD-001 Rev G, Amendment 1, Section 8 Cleanliness SectionSIR Test Method for Developing Objective Evidence for the Production Assembly
Since the 1970s, ROSE testing was used to determine “clean enough.” In 2015, the J-STD-001 committee assigned a team to develop the next generation of “cleanliness” requirements. Section 8 d
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Event
IPC APEX EXPO 2019
Oxidation Resistant Nano-Cu Sintering Paste for Die Attach Applications
A nano-Cu pressureless sinterable paste was developed for joint formation applications. The material was further engineered in both chemistry and process for enhanced oxidation resistance. T
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Event
IPC APEX EXPO 2019
Fluxes Suppressing Non-Wet-Open at BGA Assembly
With the advancement in miniaturization, the die is getting thinner and the solder balls are getting smaller for BGAs. Consequently, the thermal warpage is getting more severe due to the mis
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Event
IPC APEX EXPO 2019
Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is “when we should switch from Ty
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Event
IPC APEX EXPO 2014
Interconnect Reliability Correlation with System Design and Transportation Stress
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping c
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Event
IPC APEX EXPO 2019
Multiphysics Design for Thermal Management to Increase Radar Capabilities
Increased demand for radar capabilities has required increasingly more efficient thermal management techniques. Simple cold plates using tubes or channels are frequently used to cool high po
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Event
IPC APEX EXPO 2019
Realization of a New Concept for Power Chip Embedding
Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top
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Event
IPC APEX EXPO 2019
Stretchable Hybrid Electronics (S.H.E.) Constructions Based on a Novel Thermosetting Polymer System
This presentation covers Stretchable hybrid electronics. Stretchable electronics have the most industry uses in wearable technology and for mobile sensing and response devices. T
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Event
IPC APEX EXPO 2019
Next-Generation Additive Electronics -Precise Multi-Material Deposition for Circuits, Electro-Mechanical Parts and Antennas
This presentation covers additive manufacturing and the direct deposit of multiple metals. This additive capability is best utilized for the production of complicated circuits such as
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Event
IPC APEX EXPO 2019
Additive Manufacturing of a Heat Exchanger for a Radar System
The defense industry has realized the importance of Additive Manufacturing (AM) and how this technology can be utilized where parts can be fabricated inexpensively with reduction in lead tim
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Event
IPC APEX EXPO 2019
The Effects of Filler Morphology on The Fracture Toughness of Thermally Conductive Adhesives
Thermally conductive adhesives are widely implemented in a variety of electronic assemblies. These adhesives combine the function of mechanical fasteners and thermal interface materials into
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Event
IPC APEX EXPO 2019
Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies
The trend of incorporating more and more electronic devices into our daily life is bringing challenges for the industry. The need for smaller and more powerful devices is also facing one pro
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Event
IPC APEX EXPO 2019
High and Matched Refractive Index Liquid Adhesives for Optical Device Assembly
There is an increase in the number of optical sensors and cameras being integrated into electronics devices. These go beyond cell phone cameras into automotive sensors, wearables, and other
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Event
IPC APEX EXPO 2019
Optimising Solder Paste Volume for Low Temperature Reflow of BGA Packages
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower proc
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Event
IPC APEX EXPO 2019
Low Temperature SMT Solder Evaluation
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional
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Event
IPC APEX EXPO 2019
Developments in Electroless Copper Processes to Improve Performance in am SAPMobile Applications
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnec
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Event
IPC APEX EXPO 2019
Semi-Additive Process (SAP) Utilizing Very Uniform Ultrathin Copper by A Novel Catalyst
The demand for miniaturization and higher density electronic products has continued steadily for years and this trend is expected to continue, according to various semiconductor techno
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Event
IPC APEX EXPO 2019
Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wire bond pads when
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Event
IPC APEX EXPO 2019
Development and Classification of Conductive Circuitry for E-textiles
This paper examines the development and classification of flexible and stretchable conductive pathways to carry power and data and details the technical challenges as well as the methodologi
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Event
IPC APEX EXPO 2019
Bladder Inflation Method for Mechanical Testing of Stretchable Electronics and Wearable Devices
The advent of electronic materials with the potential to undergo extreme deformation while maintaining conductivity has led to the development of advanced stretchable electronic systems. The
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Event
IPC APEX EXPO 2019
Additive Manufacturing for Next Generation Microwave Electronics and Antennas
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkj
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Event
IPC APEX EXPO 2019
Insertion Loss Performance Differences Due to Plated Finish and Different Circuit Structures
Many different final plated finishes are used in the PCB industry, each with its own influence on insertion loss. The impact of an applied finish on insertion loss is generally dependent upo
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Event
IPC APEX EXPO 2019
A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Robust Solder Joints and Better Reliability of Electronic Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to brittle solder joints failures. Due to these reasons, there are field failures and reliabi
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Event
IPC APEX EXPO 2019
Surface Treatment Enabling Low Temperature Soldering to Aluminum
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular
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Event
IPC APEX EXPO 2019
Approaching FCT with Low-Cost Modular and Fully Integrated Test Fixtures
Constant increases in feature density of printed circuit board assemblies (PCBA) has highlighted the importance of functional circuit test (FCT) systems in a manufacturing process. Automated
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Event
IPC APEX EXPO 2019
The Next RF Probing Challenge: IoT and 5G
IoT and 5G applications have theirchallenges when it comes to functional testing –especially for the probing part inside a functional test fixture(hereinafter referred to as “FCT” fixture).I
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Event
IPC APEX EXPO 2019
Creating Reusable Manufacturing Tests for High-Speed I/O with Synthetic Instruments
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second(Gbps) to several hundred Gbps. While manufacturing te
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Event
IPC APEX EXPO 2019
Copper Filled Microvias - The New Hidden Threat Links of Faith Are Not Created Equally
Microvias connect adjacent copper layers to complete electrical paths. Copper-filled microvias can be stacked to form connections beyond adjacent copper layers. Staggered microvias stitch ad
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Event
IPC APEX EXPO 2019
Impact of Assembly Cycles on Copper Wrap Plating
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predic
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Event
IPC APEX EXPO 2019
Smart Molded Structures Bring Surfaces to Life
This paper introduces structural electronics technology enabling smart molded structures. It also presents a case for developing industry standards specific to structural electronics materia
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Event
IPC APEX EXPO 2019
Development of Flexible Hybrid Electronics
Flexible hybrid electronics (FHE) refer to a category of flexible electronics that are made through a combination of traditional assembly process of electronic components with the high-preci
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Event
IPC APEX EXPO 2019
Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics for Brain-Machine Interfaces
Inherent variation among human brains causes difficulty in the design of electroencephalography (EEG)-enabled universal brain-machine interfaces (BMI). Existing EEG systems suffer from incon
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Event
IPC APEX EXPO 2019
Low Temperature Soldering: Thermal Cycling Reliability Performance
The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu
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Event
IPC APEX EXPO 2019
New-Generation, Low-TemperatureLead-Free Solder for SMT Assembly
Sn3Ag0.5Cu (SAC305)is the major solder alloy after RoHS was adopted by the European Union. Since its melting temperature is relatively higher than eutectic SnPb alloy, the peak reflow temper
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Event
IPC APEX EXPO 2019
PCB Manufacturing for Electronics Megatrends
The world as we know it is changing. Electronic megatrends are impacting the world and rapidly changing the way we experience day-to-day life. The imminent 5Gwireless infrastructure will be
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Event
IPC APEX EXPO 2019
Assembly Challenges of Die and Die-Size BGAs
This paper presents assembly challenges of mixed area array technologies covering Very Thin ChipArray® Ball Grid Array (CVBGA) and its Land Grid Array version (CV-LGA), embedded Wafer Level
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Event
IPC APEX EXPO 2022
Board Level Reliability Testing of RF Packages
Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a suppli
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Event
IPC APEX EXPO 2022
High Temperature Thermal Cycling Reliability Testing of a High Reliability Lead-free Solder Alloy
In recent years there has been an increased demand for electronic products with high reliability solder alloys having improved performance in thermal cycle resistance for harsh working envir
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Event
IPC APEX EXPO 2022
Sputtered Seed Layer on Substrates with High Organic Load to enable Advanced L/S Densities and more Precise Feature Geometries
Advanced Packaging is one of the key growing segments with high adoption rates and strong technology advantages and offersa pathway moving forward to support industry roadmaps. Sputtered see
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Event
IPC APEX EXPO 2022