Welcome to IPC's collection of technical papers presented at conferences since 2002. You can search by author, title and keyword. You can also search for keywords and topics in the Tag field. Access to the papers is reserved for IPC members.

Liquid Metal Enabled Soft and Stretchable Electronics

Description This paper summarizes recent progress on utilizing liquid metals (LMs) consisting of gallium and gallium alloys for the electronics industry. .. read more
Author(s)
Michael D. Dickey, Man Hou Vong, Jinwoo Ma, Lee Kresge, Christine LaBarbera, Amy Schultz, Benjamin Rolewicz, Miloš Lazić, Tim Jensen, Andy Mackie, Bob Jarrett, David Socha
Event
IPC APEX EXPO 2022

A Novel Epoxy Flux to Prevent Hot Tears at VIPPO Solder Joints

Description Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. .. read more
Author(s)
Lee Kresge, Elaina Zito, Chris Nash, and David Bedner
Event
IPC APEX EXPO 2022

Bio-Based Encapsulation Resins: Good for the Environment, Good for Your Environment

Description There is increasing environmental awareness within society, affecting legislation, commerce, and industry. Nature offers an abundance of macromolecules and smaller molecular weight compounds that provide renewable sources for polymers, as opposed to crude oil. .. read more
Author(s)
Beth Turner
Event
IPC APEX EXPO 2022

Massively Parallel Testing of Panelized Printed Circuit Board Assembly (PCBA)

Description The cost of test has always been a main concern in the electronics manufacturing business. The recent proliferation of 5G, Internet of Things (IoTs) is driving the industry with smart devices on consumer products, medical products, industrial, as well as automotive industries. .. read more
Author(s)
Jun Balangue
Event
IPC APEX EXPO 2022

Increasing Efficiency of Functional Test Through the Use of Modular Test Components and In-Situ Methods for Cleaning of Test Probes and Electrical Calibration

Description Instead of using a dedicated test platform, we are presenting methods of using modular and highly scalable components to perform functional testing on a printed circuit board assembly (PCBA). .. read more
Author(s)
Matthias Zapatka
Event
IPC APEX EXPO 2022

Cyber Attack Response Business Continuity Plan: Trying to Make the Incident Response for the Factory

Description Today, more than 40% of cyber-attacks target IoT devices, and where attacks themselves are commercialized, it is becoming essential to take countermeasures against cyber-attacks, not only for defense but also for intrusion. .. read more
Author(s)
Hiroyuki Watanabe
Event
IPC APEX EXPO 2022

IPC APEX Secure Data Exchange Between Design And Manufacturing With IPC-2581 (DPMX) and IPC-2591 (CFX)

Description For many years, the focus of the exchange of design and manufacturing data has been related to the reduction of lead-time in getting products to market, with the reduction of design-turns, engineering effort, and the number of inevitable mistakes associated with any manual manipulation of data. .. read more
Author(s)
Hemant Shah
Event
IPC APEX EXPO 2022

Cyber Security and Export Compliance in the PCB Supply Chain

Description What went wrong, when did it happen and what have we learned? How often have we been confronted with these simple and direct words describing a situation where the outcome is undesirable! .. read more
Author(s)
Didrik Bech
Event
IPC APEX EXPO 2016

PFAS Chemistries and Materials: Their Essential Uses in Semiconductor and Electronic System Manufacturing, Pending Regulatory Restrictions, and an Electronics Industry Call to Action

Description Per- and polyfluoroalkyl substances (PFAS) is a class of fluoro-organic materials that is both ubiquitous and essential to the semiconductor manufacturing process as well as the downstream consumer electronics that semiconductors are incorporated into. .. read more
Author(s)
Kevin Wolfe
Event
IPC APEX EXPO 2022

Eco-design for a Circular Economy: Best Practices in the Electronics Industry

Description In this paper, we highlight the best practices for eco-design in electronics as presented during a multi-part learning series. .. read more
Author(s)
Karsten Schischke, Julio Vargas, Mark Schaffer, Thomas A. Okrasinski, Grace O’Malley, Sanghoon Lee, Kelly Scanlon,
Event
IPC APEX EXPO 2022

SMT Assembly of LGA Components and SMT Rework with Low Temperature Solder Alloy

Description Low Temperature Solder (LTS) is increasingly being used as a replacement for SAC305 solder alloy. .. read more
Author(s)
M. Burmeister, D. Geiger
Event
IPC APEX EXPO 2022

Lead-Free, Low-Temperature Solder Paste for Drop Shock Critical Applications

Description The 2017 International Electronics Manufacturing Initiatives (iNEMI) Board and Assembly Roadmap had forecast a 20% adoption rate of low-temperature solders (LTS) for board assembly by 2027. BiSn solders are the leading low-temperature candidates. .. read more
Author(s)
Hongwen Zhang, Samuel Lytwynec, Tyler Richmond, Tybarius Harter Jie Geng, Huaguang Wang, and Francis Mutuku
Event
IPC APEX EXPO 2022

Acid Copper Plating Process for IC Substrate Applications

Description Two challenges that advanced packaging suppliers are faced with during IC substrate fabrication are meeting the copper plating performance requirements and reducing manufacturing process costs. .. read more
Author(s)
Sean Fleuriel, Bill DeCesare, Todd Clark, Saminda Dharmarathna, Kesheng Feng
Event
IPC APEX EXPO 2022

A Production Viable, Palladium Free Activation Process for Electroless Copper Deposition

Description For many years, the electroless copper process has been widely used by the PCB and package substrate industries, where a wide process window and proven product reliability has led to it being considered as the “industry standard” as a means of facilitating multilayer PCBs. .. read more
Author(s)
André Beyer, Josef Gaida, Laurence J. Gregoriades, Stefan Kempa, Andreas Kirbs, Jan Knaup, Julia Lehmann, Lutz Stamp, Yvonne Welz, Sebastian Zarwell R. Massey, F. Brüning
Event
IPC APEX EXPO 2022

Backdrill Under BGAHigh Density Packaging User Group (HDP) Project

Description The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA sites are characterized by high density routing channels and finer pitch arrays of BGA escape vias. .. read more
Author(s)
Karl Sauter, Gary Brist
Event
IPC APEX EXPO 2022

Solder Alloy Contribution to Robust Selective Soldering Process

Description The number of components and functionality on a printed circuit board increases continuously. Surface mount device (SMD) components become smaller, pitch dimensions shrink, but there are still some through-hole components used on most assemblies. .. read more
Author(s)
Gerjan Diepstraten
Event
IPC APEX EXPO 2022

Reliability of Soler Joints: Will Void Free Vacuum Soldering Help?

Description Rapid incorporation of low cost, small footprint, and high efficiency BTC components with a large thermal plane and leadless terminations presents numerous challenges to the PCB manufacturers. .. read more
Author(s)
Anna Lifton, Alan Plant, Paul Salerno, and Ranjit Pandher
Event
IPC APEX EXPO 2022

Reliability and IMC Layer Evolution of Homogenous Lead-Free Solder Joints During Thermal Cycling

Description Many leading solder paste manufacturers are currently developing solder alloys for high reliability applications. These solder alloys are doped with elements such as bismuth (Bi), indium (In), and antimony (Sb), which improves the fatigue life and reduces the adverse effects of thermal cycling. .. read more
Author(s)
Mohamed El Amine Belhadi, Xin Wei, Palash Vyas, Rong Zhao, Sa’d Hamasha, Haneen Ali, Jeff Suhling, Pradeep Lall, Barton C. Prorok
Event
IPC APEX EXPO 2022

Investigation Into the Impact of Atmospheric Plasma Surface Preparation on Soldering & Cleaning Process Steps

Description The soldering (wave, reflow, and selective) along with flux removal (cleaning) processes have for years been optimized to yield the best result possible. Today more than ever these processes are stressed by the continued trend toward miniaturization and increased power capability. .. read more
Author(s)
Mark McMeen, Mike Bixenman, Richard Burke & Michael McCutchen
Event
IPC APEX EXPO 2022

Defluxing of Copper Pillar Bumped Flip-Chips

Description Flip-chip technology has become increasingly prevalent within the electronics industry due to its lower cost, increased package density, improved performance while maintaining or improving circuit reliability, and increased I/O density. .. read more
Author(s)
Ravi Parthasarathy, Umut Tosun
Event
IPC APEX EXPO 2022

Evaluation of Solder Pastes for Flux Residue Mitigation in Cleaning Machines*

Description Recently new semi-aqueous in-line cleaning machines (CM) were installed; however, the associated increased volumes of circuit card assemblies (CCAs) being cleaned after SMT surface mount technology assembly resulted in correspondingly more solder paste residue or “goo” building-up on cleaning mac .. read more
Author(s)
Norman J. Armendariz
Event
IPC APEX EXPO 2022

Applications of Semi-Additive Process Technology to PCB Design and Production

Description Traditional Subtractive Etch (SE) processes used to manufacture Printed Circuit Boards (PCBs) are adequate for many of today’s circuit designs. .. read more
Author(s)
Paul A. Dennig, Mike Vinson
Event
IPC APEX EXPO 2022

ULTRA HDI Printed Boards

Description This paper will discuss the evolution of the printed board design to date, how process improvements and new manufacturing technologies and chemistry have enabled the new step down in miniaturization. .. read more
Author(s)
Jan Pedersen
Event
IPC APEX EXPO 2022

ULTRA HDI/SLP Production

Description This paper will discuss the difference between traditional advanced any layer HDI PCB with subtractive process and Ultra High-Density Interconnect (Ultra HDI) or substrate-like-PCB (SLP) with modified Semi-Additive Process (mSAP). .. read more
Author(s)
Clay Zha
Event
IPC APEX EXPO 2022

Impacts and Challenges of AME, from Design to Data

Description Complex geometries, customized parts and new processes; these are characteristics that are readily associated with additive manufacturing (AM). At the same time, they are often associated with high hurdles in terms of mass production, suitability for series production and reliability. .. read more
Author(s)
Michael Schleicher
Event
IPC APEX EXPO 2022

Advances in Multi-level and Multi-materialAdditively Manufactured Electronic (AME) Circuits and Devices

Description Multilevel Additively Manufactured (AME) circuits and devices have been enabling circuit design and implementation that is not possible or is very expensive using traditional methods such as PCB production. .. read more
Author(s)
Jaim Nulman
Event
IPC APEX EXPO 2022

Conformal Printed Circuit Structures

Description Surface mounted passive electrical components are beginning to reach hard limits for further reduction in size of their packages. Performance of the raw materials used have set capabilities for their volumes. .. read more
Author(s)
Jason Benoit, Nicholas Willey, Josh Goldfarb, Kenneth Church
Event
IPC APEX EXPO 2022

Additive Manufacturing and Multiphysics Analysis for Single-Phase and Two-Phase Cooling

Description Thermal management must advance with the military’s requirements for increased performance, lower costs, and rapid technology changes. .. read more
Author(s)
Paul W Bratt
Event
IPC APEX EXPO 2022

Surface Mounting in Smart Molded Structures Made with Polypropylene

Description Structural electronics enables design innovation by adding electronic functions to smart surfaces with 3-dimensional form factors. This paper describes the making of a structural electronics technology demonstrator that uses polypropylene (PP) film and injection molding (IM) resin. .. read more
Author(s)
Dr. Outi Rusanen, Topi Wuori, Pasi Raappana, Paavo Niskala and Martti Karjalainen
Event
IPC APEX EXPO 2022

A Comparative Life Cycle Assessment of Stretchable and Rigid Electronics: A Case Study of Cardiac Monitoring Devices

Description Stretchable electronics is a new innovation and becoming popular in various fields, especially in the health care sector. .. read more
Author(s)
Gustaf Mårtensson, Samruddha Kokare, Farazee Asif, Sayyed Shoaib-ul-Hasan, A. Rashid, Malvina Roci, and Niloufar Salehi
Event
IPC APEX EXPO 2022

The Journey into The Digital Unknown: How Digital Transformation and Connected Factory Are Changing Our Factory Landscape and Our Lessons Learned

Description The journey to creating a connected factory can be a scary and arduous task, with some not even knowing where to start. .. read more
Author(s)
Sharissa Johns, Jarrod Webb & Josh Goolsby
Event
IPC APEX EXPO 2022

MTC Journey to Digitalisation for Smart Factory Using Legacy Equipment

Description Specialists in IIoT and Industry 4.0 at the Manufacturing Technology Centre have developed the first stage of Europe's first smart factory demonstrator for the manufacture of electronic assemblies, helping electronics manufacturers “go digital”, transforming their businesses, and meeting the dema .. read more
Author(s)
Naim Kapadia
Event
IPC APEX EXPO 2022

Improving Productivity with Automated Component Delivery

Description Automation is growing in nearly every sector. Self-driving cars, touchless soft-drink dispensing machines that deliver over 100 different drinks, and robots doing everything from food sorting to helping pack packages. .. read more
Author(s)
Gerry Padnos, Christoph Wimmer
Event
IPC APEX EXPO 2022

Empowering Digital Supply Chain Transformation by Utilizing Industry 4.0, Smart Factories, Standards, Smart Contracts and Blockchains

Description Companies that place products onto the marketplace, whether they are internally manufactured or sourced from a supply chain, are often faced with ever increasing demands for data from a diverse set of stakeholders, requiring a multitude of different data reporting needs to be identified and reque .. read more
Author(s)
Raj Takhar
Event
IPC APEX EXPO 2022

Strategic Sourcing within an Evolving Aerospace & Defense Industry

Description Traditionally sourcing strategies are resolved by a “make or buy” process where companies evaluate if it is more cost effective to make or buy a product. .. read more
Author(s)
Kevin McGrath, Jim Becker, and Martin Goetz
Event
IPC APEX EXPO 2022

Evaluation of Compatibility of EnvironMentally Friendly PCB Manufacturing Processes: Additive Inkjet Coating & Surface Finishes

Description The challenge of decrease PCB manufacturing environmental impact is here to stay. The rate at which a company can process change is key to strategical advantage. Any increase of the change rate requires resources in R&D. .. read more
Author(s)
Kunal Shah, Luca Gautero
Event
IPC APEX EXPO 2022

Thermally Conductive Polymeric Material (TCPM)

Description The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their processing speed compared to the previous system (4G) in order to support data transfer rates. .. read more
Author(s)
Jesse W. Session
Event
IPC APEX EXPO 2022

Electroless Palladium Plating – Correlating Plating Solution and Deposit Properties

Description Electroless palladium plating has been present in the PCB industry for over 20 years providing highly reliable finishes for high end applications in combination with nickel and gold plating. .. read more
Author(s)
Britta Schafsteller
Event
IPC APEX EXPO 2022

A New Halogen-Free Vapor Phase Coating for High Reliability & Protection of Electronics in Corrosive and Other Harsh Environments

Description The growing use of electronics in every area of our lives around the world has resulted in an increased awareness of potential environmental issues related to their use and disposal. .. read more
Author(s)
Rakesh Kumar, Frank Ke, Dustin England, Angie Summers & Lamar Young
Event
IPC APEX EXPO 2022

Conformal Coatings: State of the Industry Versus State of the Art

Description The excellent IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ delivers the results of a recent major study on conformal coating, outlining an IPC study of major conformal coating types, coating application techniques, and coating cure .. read more
Author(s)
Phil Kinner
Event
IPC APEX EXPO 2022

Do Bubbles in Conformal Coatings Reduce the Electrochemical Reliability? An SIR Study of Coated QFN

Description A surface insulation resistance study is presented on coated B52-like test boards where a large number of QFN components of different package designs are coated with non-optimal conformal coating process parameters creating bubbles at the QFN leads. .. read more
Author(s)
Heiko Elsinger, Andre Hahn, Robert Bosch
Event
IPC APEX EXPO 2022

Verification of a Finite Element Analysis Model Predicting Laminate Cracks in a Printed Circuit Card

Description A supplier was experiencing laminate cracks in an FR4 dielectric constructed material product after successfully producing this Printed Circuit Board (PCB) for a number of years. .. read more
Author(s)
Wade Goldman, Hailey Jordan, Curtis Leonard
Event
IPC APEX EXPO 2022

Printed Circuit Board Edge Burn Outs – Failure Mechanism

Description This paper documents an investigation of printed circuit board (PCB) failures due to edge burn outs. Electrical shorts were observed at late-stage environmental stress screening and electrical testing. Failed boards had burn marks at edges that were absent of components or surface circuitry. .. read more
Author(s)
Tom Lesniewski, Marvin Castillo, Alan Preston, Keith Kitchens and Dave Backen
Event
IPC APEX EXPO 2022

Analysis of a Dynamic Flexed Flat Cable Harness

Description A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. .. read more
Author(s)
Bhanu Sood, Mary E. Wusk, Eric Burke, Dave Dawicke
Event
IPC APEX EXPO 2022

ABILITY OF INDUSTRY RELIABILITY METHODOLOGIES TO PREDICT LIFECYCLE APPLICATION FIELD FAILURES

Description Miniaturization and harsh environment market drivers within the electronics industry are presenting new challenges in terms of predictive reliabilities of control standards. .. read more
Author(s)
Daniel Buckland, Alejandro Sanchez, Dr Neil Poole, and Dr Mark Currie
Event
IPC APEX EXPO 2022

An Overview of Revision B of GEIA-STD-0005-1

Description In 2017, the Society of Automotive Engineers (SAE) G-24 committee approved revision activity for GEIA-STD-0005-1A, “Standard for Managing the Risks of Pb-free Solders and Finishes in ADHP Electronic Systems” (formerly known as “Performance Standard for Aerospace and High-Performance Electronic Sy .. read more
Author(s)
Anthony J. Rafanelli
Event
IPC APEX EXPO 2022

A Multiphase Model of Intermittent Contact in Lubricated Sliding Electrical Contacts

Description Electrical contacts, although critically important for a wide range of applications, are susceptible to degradation due to fretting corrosion, especially when sliding and vibrations occur. To overcome fretting corrosion and sliding wear, lubricants are often used. .. read more
Author(s)
Robert L. Jackson, Santosh Angadi
Event
IPC APEX EXPO 2022

Electro-Thermal-Mechanical Modeling of one-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc And Indium

Description This work provides analytical solutions to the temperature rise of one-dimensional conductors such as whiskers and wires. Whisker growth from metal surfaces of electrical connectors and other components has shown itself to create reliability issues. .. read more
Author(s)
Robert L. Jackson+Erika R. Crandall*
Event
IPC APEX EXPO 2022

FIDES Reliability: New Approach to the ‘Process Factor’ During Product Development

Description The FIDES guide 2009 (Edition A) proposes a methodology for the reliability assessment of electronic to evaluate and control product reliability progress throughout life cycle. .. read more
Author(s)
Murilo Levy Casotti, José Carlos Boareto, Orestes Estevam Alarcon, Andre Oliveira
Event
IPC APEX EXPO 2022