IPC Conference Paper Archive

This paper summarizes recent progress on utilizing liquid metals (LMs) consisting of gallium and gallium alloys for the electronics industry. While gallium is a component of existing electro .. read more

Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. At VIPPO locations, with or without a solid copper-filled hole, the coe .. read more

There is increasing environmental awareness within society, affecting legislation, commerce, and industry. Nature offers an abundance of macromolecules and smaller molecular weight compounds .. read more

The cost of test has always been a main concern in the electronics manufacturing business. The recent proliferation of 5G, Internet of Things (IoTs) is driving the industry with smart device .. read more

Instead of using a dedicated test platform, we are presenting methods of using modular and highly scalable components to perform functional testing on a printed circuit board assembly (PCBA) .. read more

Today, more than 40% of cyber-attacks target IoT devices, and where attacks themselves are commercialized, it is becoming essential to take countermeasures against cyber-attacks, not only fo .. read more

For many years, the focus of the exchange of design and manufacturing data has been related to the reduction of lead-time in getting products to market, with the reduction of design-turns, e .. read more

What went wrong, when did it happen and what have we learned? How often have we been confronted with these simple and direct words describing a situation where the outcome is undesirable! To .. read more

Per- and polyfluoroalkyl substances (PFAS) is a class of fluoro-organic materials that is both ubiquitous and essential to the semiconductor manufacturing process as well as the downstream c .. read more

In this paper, we highlight the best practices for eco-design in electronics as presented during a multi-part learning series. The learning series was established as an interactive webinar-b .. read more

Low Temperature Solder (LTS) is increasingly being used as a replacement for SAC305 solder alloy. Processing with LTS can reduce energy costs and impact on the environment while also reducin .. read more

The 2017 International Electronics Manufacturing Initiatives (iNEMI) Board and Assembly Roadmap had forecast a 20% adoption rate of low-temperature solders (LTS) for board assembly by 2027. .. read more

Two challenges that advanced packaging suppliers are faced with during IC substrate fabrication are meeting the copper plating performance requirements and reducing manufacturing process cos .. read more

For many years, the electroless copper process has been widely used by the PCB and package substrate industries, where a wide process window and proven product reliability has led to it bein .. read more

The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA si .. read more

The number of components and functionality on a printed circuit board increases continuously. Surface mount device (SMD) components become smaller, pitch dimensions shrink, but there are sti .. read more

Rapid incorporation of low cost, small footprint, and high efficiency BTC components with a large thermal plane and leadless terminations presents numerous challenges to the PCB manufacturer .. read more

Many leading solder paste manufacturers are currently developing solder alloys for high reliability applications. These solder alloys are doped with elements such as bismuth (Bi), indium (In .. read more

The soldering (wave, reflow, and selective) along with flux removal (cleaning) processes have for years been optimized to yield the best result possible. Today more than ever these processes .. read more

Flip-chip technology has become increasingly prevalent within the electronics industry due to its lower cost, increased package density, improved performance while maintaining or improving c .. read more

Recently new semi-aqueous in-line cleaning machines (CM) were installed; however, the associated increased volumes of circuit card assemblies (CCAs) being cleaned after SMT surface mount tec .. read more

Traditional Subtractive Etch (SE) processes used to manufacture Printed Circuit Boards (PCBs) are adequate for many of today’s circuit designs. However, certain parts of PCBs, and more gener .. read more

This paper will discuss the evolution of the printed board design to date, how process improvements and new manufacturing technologies and chemistry have enabled the new step down in miniatu .. read more

This paper will discuss the difference between traditional advanced any layer HDI PCB with subtractive process and Ultra High-Density Interconnect (Ultra HDI) or substrate-like-PCB (SLP) wit .. read more

Complex geometries, customized parts and new processes; these are characteristics that are readily associated with additive manufacturing (AM). At the same time, they are often associated wi .. read more

Multilevel Additively Manufactured (AME) circuits and devices have been enabling circuit design and implementation that is not possible or is very expensive using traditional methods such as .. read more

Surface mounted passive electrical components are beginning to reach hard limits for further reduction in size of their packages. Performance of the raw materials used have set capabilities .. read more

Thermal management must advance with the military’s requirements for increased performance, lower costs, and rapid technology changes. Combining multiphysics analysis and additive manufactur .. read more

Structural electronics enables design innovation by adding electronic functions to smart surfaces with 3-dimensional form factors. This paper describes the making of a structural electronics .. read more

Stretchable electronics is a new innovation and becoming popular in various fields, especially in the health care sector. Since stretchable electronics use less Printed Circuit Boards (PCBs) .. read more

The journey to creating a connected factory can be a scary and arduous task, with some not even knowing where to start. Our roles as engineers supporting the factories have historically been .. read more

Specialists in IIoT and Industry 4.0 at the Manufacturing Technology Centre have developed the first stage of Europe's first smart factory demonstrator for the manufacture of electronic asse .. read more

Automation is growing in nearly every sector. Self-driving cars, touchless soft-drink dispensing machines that deliver over 100 different drinks, and robots doing everything from food sortin .. read more

Companies that place products onto the marketplace, whether they are internally manufactured or sourced from a supply chain, are often faced with ever increasing demands for data from a dive .. read more

Traditionally sourcing strategies are resolved by a “make or buy” process where companies evaluate if it is more cost effective to make or buy a product. This presentation will explain the s .. read more

The challenge of decrease PCB manufacturing environmental impact is here to stay. The rate at which a company can process change is key to strategical advantage. Any increase of the change r .. read more

The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their pro .. read more

Electroless palladium plating has been present in the PCB industry for over 20 years providing highly reliable finishes for high end applications in combination with nickel and gold plating. .. read more

Purpose One of the challenges of larger parylene chemical vapor deposition (CVD) chambers is what seems to be unpredictable material behavior throughout the working volume. The tig .. read more

The growing use of electronics in every area of our lives around the world has resulted in an increased awareness of potential environmental issues related to their use and disposal. Halogen .. read more

The excellent IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ delivers the results of a recent major study on conformal coating .. read more

A surface insulation resistance study is presented on coated B52-like test boards where a large number of QFN components of different package designs are coated with non-optimal conformal co .. read more

A supplier was experiencing laminate cracks in an FR4 dielectric constructed material product after successfully producing this Printed Circuit Board (PCB) for a number of years. The issue w .. read more

This paper documents an investigation of printed circuit board (PCB) failures due to edge burn outs. Electrical shorts were observed at late-stage environmental stress screening and electric .. read more

A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. The purpose of the t .. read more

Miniaturization and harsh environment market drivers within the electronics industry are presenting new challenges in terms of predictive reliabilities of control standards. As consumers dem .. read more

In 2017, the Society of Automotive Engineers (SAE) G-24 committee approved revision activity for GEIA-STD-0005-1A, “Standard for Managing the Risks of Pb-free Solders and Finishes in ADHP El .. read more

Electrical contacts, although critically important for a wide range of applications, are susceptible to degradation due to fretting corrosion, especially when sliding and vibrations occur. T .. read more

This work provides analytical solutions to the temperature rise of one-dimensional conductors such as whiskers and wires. Whisker growth from metal surfaces of electrical connectors and othe .. read more

The FIDES guide 2009 (Edition A) proposes a methodology for the reliability assessment of electronic to evaluate and control product reliability progress throughout life cycle. The reliabili .. read more