Liquid Metal Enabled Soft and Stretchable Electronics
Description
This paper summarizes recent progress on utilizing liquid metals (LMs) consisting of gallium and gallium alloys for the electronics industry.
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Event
IPC APEX EXPO 2022
A Novel Epoxy Flux to Prevent Hot Tears at VIPPO Solder Joints
Description
Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences.
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Event
IPC APEX EXPO 2022
Bio-Based Encapsulation Resins: Good for the Environment, Good for Your Environment
Description
There is increasing environmental awareness within society, affecting legislation, commerce, and industry. Nature offers an abundance of macromolecules and smaller molecular weight compounds that provide renewable sources for polymers, as opposed to crude oil.
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Event
IPC APEX EXPO 2022
Massively Parallel Testing of Panelized Printed Circuit Board Assembly (PCBA)
Description
The cost of test has always been a main concern in the electronics manufacturing business. The recent proliferation of 5G, Internet of Things (IoTs) is driving the industry with smart devices on consumer products, medical products, industrial, as well as automotive industries.
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Event
IPC APEX EXPO 2022
Increasing Efficiency of Functional Test Through the Use of Modular Test Components and In-Situ Methods for Cleaning of Test Probes and Electrical Calibration
Description
Instead of using a dedicated test platform, we are presenting methods of using modular and highly scalable components to perform functional testing on a printed circuit board assembly (PCBA).
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Event
IPC APEX EXPO 2022
Cyber Attack Response Business Continuity Plan: Trying to Make the Incident Response for the Factory
Description
Today, more than 40% of cyber-attacks target IoT devices, and where attacks themselves are commercialized, it is becoming essential to take countermeasures against cyber-attacks, not only for defense but also for intrusion.
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Event
IPC APEX EXPO 2022
IPC APEX Secure Data Exchange Between Design And Manufacturing With IPC-2581 (DPMX) and IPC-2591 (CFX)
Description
For many years, the focus of the exchange of design and manufacturing data has been related to the reduction of lead-time in getting products to market, with the reduction of design-turns, engineering effort, and the number of inevitable mistakes associated with any manual manipulation of data.
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Event
IPC APEX EXPO 2022
Cyber Security and Export Compliance in the PCB Supply Chain
Description
What went wrong, when did it happen and what have we learned? How often have we been confronted with these simple and direct words describing a situation where the outcome is undesirable!
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Event
IPC APEX EXPO 2016
PFAS Chemistries and Materials: Their Essential Uses in Semiconductor and Electronic System Manufacturing, Pending Regulatory Restrictions, and an Electronics Industry Call to Action
Description
Per- and polyfluoroalkyl substances (PFAS) is a class of fluoro-organic materials that is both ubiquitous and essential to the semiconductor manufacturing process as well as the downstream consumer electronics that semiconductors are incorporated into.
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Event
IPC APEX EXPO 2022
Eco-design for a Circular Economy: Best Practices in the Electronics Industry
Description
In this paper, we highlight the best practices for eco-design in electronics as presented during a multi-part learning series.
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Event
IPC APEX EXPO 2022
SMT Assembly of LGA Components and SMT Rework with Low Temperature Solder Alloy
Description
Low Temperature Solder (LTS) is increasingly being used as a replacement for SAC305 solder alloy.
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Event
IPC APEX EXPO 2022
Lead-Free, Low-Temperature Solder Paste for Drop Shock Critical Applications
Description
The 2017 International Electronics Manufacturing Initiatives (iNEMI) Board and Assembly Roadmap had forecast a 20% adoption rate of low-temperature solders (LTS) for board assembly by 2027. BiSn solders are the leading low-temperature candidates.
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Event
IPC APEX EXPO 2022
Acid Copper Plating Process for IC Substrate Applications
Description
Two challenges that advanced packaging suppliers are faced with during IC substrate fabrication are meeting the copper plating performance requirements and reducing manufacturing process costs.
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Event
IPC APEX EXPO 2022
A Production Viable, Palladium Free Activation Process for Electroless Copper Deposition
Description
For many years, the electroless copper process has been widely used by the PCB and package substrate industries, where a wide process window and proven product reliability has led to it being considered as the “industry standard” as a means of facilitating multilayer PCBs.
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Event
IPC APEX EXPO 2022
Backdrill Under BGAHigh Density Packaging User Group (HDP) Project
Description
The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA sites are characterized by high density routing channels and finer pitch arrays of BGA escape vias.
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Event
IPC APEX EXPO 2022
Solder Alloy Contribution to Robust Selective Soldering Process
Description
The number of components and functionality on a printed circuit board increases continuously. Surface mount device (SMD) components become smaller, pitch dimensions shrink, but there are still some through-hole components used on most assemblies.
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Event
IPC APEX EXPO 2022
Reliability of Soler Joints: Will Void Free Vacuum Soldering Help?
Description
Rapid incorporation of low cost, small footprint, and high efficiency BTC components with a large thermal plane and leadless terminations presents numerous challenges to the PCB manufacturers.
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Event
IPC APEX EXPO 2022
Reliability and IMC Layer Evolution of Homogenous Lead-Free Solder Joints During Thermal Cycling
Description
Many leading solder paste manufacturers are currently developing solder alloys for high reliability applications. These solder alloys are doped with elements such as bismuth (Bi), indium (In), and antimony (Sb), which improves the fatigue life and reduces the adverse effects of thermal cycling.
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Event
IPC APEX EXPO 2022
Investigation Into the Impact of Atmospheric Plasma Surface Preparation on Soldering & Cleaning Process Steps
Description
The soldering (wave, reflow, and selective) along with flux removal (cleaning) processes have for years been optimized to yield the best result possible. Today more than ever these processes are stressed by the continued trend toward miniaturization and increased power capability.
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Event
IPC APEX EXPO 2022
Defluxing of Copper Pillar Bumped Flip-Chips
Description
Flip-chip technology has become increasingly prevalent within the electronics industry due to its lower cost, increased package density, improved performance while maintaining or improving circuit reliability, and increased I/O density.
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Event
IPC APEX EXPO 2022
Evaluation of Solder Pastes for Flux Residue Mitigation in Cleaning Machines*
Description
Recently new semi-aqueous in-line cleaning machines (CM) were installed; however, the associated increased volumes of circuit card assemblies (CCAs) being cleaned after SMT surface mount technology assembly resulted in correspondingly more solder paste residue or “goo” building-up on cleaning mac
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Event
IPC APEX EXPO 2022
Applications of Semi-Additive Process Technology to PCB Design and Production
Description
Traditional Subtractive Etch (SE) processes used to manufacture Printed Circuit Boards (PCBs) are adequate for many of today’s circuit designs.
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Event
IPC APEX EXPO 2022
ULTRA HDI Printed Boards
Description
This paper will discuss the evolution of the printed board design to date, how process improvements and new manufacturing technologies and chemistry have enabled the new step down in miniaturization.
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Event
IPC APEX EXPO 2022
ULTRA HDI/SLP Production
Description
This paper will discuss the difference between traditional advanced any layer HDI PCB with subtractive process and Ultra High-Density Interconnect (Ultra HDI) or substrate-like-PCB (SLP) with modified Semi-Additive Process (mSAP).
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Event
IPC APEX EXPO 2022
Impacts and Challenges of AME, from Design to Data
Description
Complex geometries, customized parts and new processes; these are characteristics that are readily associated with additive manufacturing (AM). At the same time, they are often associated with high hurdles in terms of mass production, suitability for series production and reliability.
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Event
IPC APEX EXPO 2022
Advances in Multi-level and Multi-materialAdditively Manufactured Electronic (AME) Circuits and Devices
Description
Multilevel Additively Manufactured (AME) circuits and devices have been enabling circuit design and implementation that is not possible or is very expensive using traditional methods such as PCB production.
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Event
IPC APEX EXPO 2022
Conformal Printed Circuit Structures
Description
Surface mounted passive electrical components are beginning to reach hard limits for further reduction in size of their packages. Performance of the raw materials used have set capabilities for their volumes.
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Event
IPC APEX EXPO 2022
Additive Manufacturing and Multiphysics Analysis for Single-Phase and Two-Phase Cooling
Description
Thermal management must advance with the military’s requirements for increased performance, lower costs, and rapid technology changes.
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Event
IPC APEX EXPO 2022
Surface Mounting in Smart Molded Structures Made with Polypropylene
Description
Structural electronics enables design innovation by adding electronic functions to smart surfaces with 3-dimensional form factors. This paper describes the making of a structural electronics technology demonstrator that uses polypropylene (PP) film and injection molding (IM) resin.
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Event
IPC APEX EXPO 2022
A Comparative Life Cycle Assessment of Stretchable and Rigid Electronics: A Case Study of Cardiac Monitoring Devices
Description
Stretchable electronics is a new innovation and becoming popular in various fields, especially in the health care sector.
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Event
IPC APEX EXPO 2022
The Journey into The Digital Unknown: How Digital Transformation and Connected Factory Are Changing Our Factory Landscape and Our Lessons Learned
Description
The journey to creating a connected factory can be a scary and arduous task, with some not even knowing where to start.
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Event
IPC APEX EXPO 2022
MTC Journey to Digitalisation for Smart Factory Using Legacy Equipment
Description
Specialists in IIoT and Industry 4.0 at the Manufacturing Technology Centre have developed the first stage of Europe's first smart factory demonstrator for the manufacture of electronic assemblies, helping electronics manufacturers “go digital”, transforming their businesses, and meeting the dema
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Event
IPC APEX EXPO 2022
Improving Productivity with Automated Component Delivery
Description
Automation is growing in nearly every sector. Self-driving cars, touchless soft-drink dispensing machines that deliver over 100 different drinks, and robots doing everything from food sorting to helping pack packages.
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Event
IPC APEX EXPO 2022
Empowering Digital Supply Chain Transformation by Utilizing Industry 4.0, Smart Factories, Standards, Smart Contracts and Blockchains
Description
Companies that place products onto the marketplace, whether they are internally manufactured or sourced from a supply chain, are often faced with ever increasing demands for data from a diverse set of stakeholders, requiring a multitude of different data reporting needs to be identified and reque
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Event
IPC APEX EXPO 2022
Strategic Sourcing within an Evolving Aerospace & Defense Industry
Description
Traditionally sourcing strategies are resolved by a “make or buy” process where companies evaluate if it is more cost effective to make or buy a product.
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Event
IPC APEX EXPO 2022
Evaluation of Compatibility of EnvironMentally Friendly PCB Manufacturing Processes: Additive Inkjet Coating & Surface Finishes
Description
The challenge of decrease PCB manufacturing environmental impact is here to stay. The rate at which a company can process change is key to strategical advantage. Any increase of the change rate requires resources in R&D.
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Event
IPC APEX EXPO 2022
Thermally Conductive Polymeric Material (TCPM)
Description
The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their processing speed compared to the previous system (4G) in order to support data transfer rates.
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Event
IPC APEX EXPO 2022
Electroless Palladium Plating – Correlating Plating Solution and Deposit Properties
Description
Electroless palladium plating has been present in the PCB industry for over 20 years providing highly reliable finishes for high end applications in combination with nickel and gold plating.
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Event
IPC APEX EXPO 2022
Behind Closed Doors – What You Don’t Know About Your CVD Chamber
Description
Purpose
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Event
IPC APEX EXPO 2022
A New Halogen-Free Vapor Phase Coating for High Reliability & Protection of Electronics in Corrosive and Other Harsh Environments
Description
The growing use of electronics in every area of our lives around the world has resulted in an increased awareness of potential environmental issues related to their use and disposal.
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Event
IPC APEX EXPO 2022
Conformal Coatings: State of the Industry Versus State of the Art
Description
The excellent IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ delivers the results of a recent major study on conformal coating, outlining an IPC study of major conformal coating types, coating application techniques, and coating cure
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Event
IPC APEX EXPO 2022
Do Bubbles in Conformal Coatings Reduce the Electrochemical Reliability? An SIR Study of Coated QFN
Description
A surface insulation resistance study is presented on coated B52-like test boards where a large number of QFN components of different package designs are coated with non-optimal conformal coating process parameters creating bubbles at the QFN leads.
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Event
IPC APEX EXPO 2022
Verification of a Finite Element Analysis Model Predicting Laminate Cracks in a Printed Circuit Card
Description
A supplier was experiencing laminate cracks in an FR4 dielectric constructed material product after successfully producing this Printed Circuit Board (PCB) for a number of years.
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Event
IPC APEX EXPO 2022
Printed Circuit Board Edge Burn Outs – Failure Mechanism
Description
This paper documents an investigation of printed circuit board (PCB) failures due to edge burn outs. Electrical shorts were observed at late-stage environmental stress screening and electrical testing. Failed boards had burn marks at edges that were absent of components or surface circuitry.
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Event
IPC APEX EXPO 2022
Analysis of a Dynamic Flexed Flat Cable Harness
Description
A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces.
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Event
IPC APEX EXPO 2022
ABILITY OF INDUSTRY RELIABILITY METHODOLOGIES TO PREDICT LIFECYCLE APPLICATION FIELD FAILURES
Description
Miniaturization and harsh environment market drivers within the electronics industry are presenting new challenges in terms of predictive reliabilities of control standards.
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Event
IPC APEX EXPO 2022
An Overview of Revision B of GEIA-STD-0005-1
Description
In 2017, the Society of Automotive Engineers (SAE) G-24 committee approved revision activity for GEIA-STD-0005-1A, “Standard for Managing the Risks of Pb-free Solders and Finishes in ADHP Electronic Systems” (formerly known as “Performance Standard for Aerospace and High-Performance Electronic Sy
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Event
IPC APEX EXPO 2022
A Multiphase Model of Intermittent Contact in Lubricated Sliding Electrical Contacts
Description
Electrical contacts, although critically important for a wide range of applications, are susceptible to degradation due to fretting corrosion, especially when sliding and vibrations occur. To overcome fretting corrosion and sliding wear, lubricants are often used.
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Event
IPC APEX EXPO 2022
Electro-Thermal-Mechanical Modeling of one-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc And Indium
Description
This work provides analytical solutions to the temperature rise of one-dimensional conductors such as whiskers and wires. Whisker growth from metal surfaces of electrical connectors and other components has shown itself to create reliability issues.
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Event
IPC APEX EXPO 2022
FIDES Reliability: New Approach to the ‘Process Factor’ During Product Development
Description
The FIDES guide 2009 (Edition A) proposes a methodology for the reliability assessment of electronic to evaluate and control product reliability progress throughout life cycle.
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Event
IPC APEX EXPO 2022